KR20190132245A - 연마 헤드를 이용하여 연마 패드의 연마면을 검출하는 방법, 및 연마 장치 - Google Patents

연마 헤드를 이용하여 연마 패드의 연마면을 검출하는 방법, 및 연마 장치 Download PDF

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Publication number
KR20190132245A
KR20190132245A KR1020190056958A KR20190056958A KR20190132245A KR 20190132245 A KR20190132245 A KR 20190132245A KR 1020190056958 A KR1020190056958 A KR 1020190056958A KR 20190056958 A KR20190056958 A KR 20190056958A KR 20190132245 A KR20190132245 A KR 20190132245A
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KR
South Korea
Prior art keywords
polishing
head
polishing head
pad
distortion sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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KR1020190056958A
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English (en)
Korean (ko)
Inventor
마사오 우메모토
류이치 고스게
슈이치 가마타
겐토 요시다
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20190132245A publication Critical patent/KR20190132245A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/22—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020190056958A 2018-05-18 2019-05-15 연마 헤드를 이용하여 연마 패드의 연마면을 검출하는 방법, 및 연마 장치 Withdrawn KR20190132245A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018096000A JP2019198938A (ja) 2018-05-18 2018-05-18 研磨ヘッドを用いて研磨パッドの研磨面を検出する方法、および研磨装置
JPJP-P-2018-096000 2018-05-18

Publications (1)

Publication Number Publication Date
KR20190132245A true KR20190132245A (ko) 2019-11-27

Family

ID=68534563

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190056958A Withdrawn KR20190132245A (ko) 2018-05-18 2019-05-15 연마 헤드를 이용하여 연마 패드의 연마면을 검출하는 방법, 및 연마 장치

Country Status (5)

Country Link
US (1) US20190351526A1 (enExample)
JP (1) JP2019198938A (enExample)
KR (1) KR20190132245A (enExample)
CN (1) CN110497307A (enExample)
TW (1) TW202003157A (enExample)

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BR112021019580A2 (pt) 2019-03-29 2021-12-14 Saint Gobain Abrasifs Sa Desempenho de soluções de retificação
CA3135979C (en) 2019-04-03 2023-12-19 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
CN111085931A (zh) * 2019-12-31 2020-05-01 浙江芯晖装备技术有限公司 一种抛光头驱动装置及抛光设备
EP3919192B1 (en) * 2020-06-04 2023-11-29 Sugino Machine Limited Cleaning apparatus
KR102762332B1 (ko) * 2020-09-02 2025-02-03 에스케이하이닉스 주식회사 기판의 평탄화 장치 및 방법
JP7709281B2 (ja) 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
CN113458972A (zh) * 2021-07-28 2021-10-01 北京烁科精微电子装备有限公司 一种抛光垫修整装置及抛光设备
CN114633206A (zh) * 2022-04-25 2022-06-17 北京烁科精微电子装备有限公司 一种修整装置及晶圆抛光系统
CN114918832B (zh) * 2022-05-20 2023-07-28 湖州师范学院 一种高精密的砂轮修整设备
CN117718876B (zh) 2024-02-07 2024-06-18 华海清科股份有限公司 用于化学机械抛光的监测方法和化学机械抛光设备

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2014097553A (ja) 2012-11-15 2014-05-29 Ebara Corp 基板保持装置および研磨装置

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FR2629746B1 (fr) * 1988-04-06 1991-01-25 Bertin & Cie Procede et dispositif de polissage d'un composant optique
US20050197045A1 (en) * 2003-11-24 2005-09-08 Novak W. T. Fine force control of actuators for chemical mechanical polishing apparatuses
US7172493B2 (en) * 2003-11-24 2007-02-06 Nikon Corporation Fine force actuator assembly for chemical mechanical polishing apparatuses
US6855032B1 (en) * 2003-11-24 2005-02-15 Nikon Corporation Fine force control of actuators for chemical mechanical polishing apparatuses
US7059939B2 (en) * 2004-09-02 2006-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing pad conditioner and monitoring method therefor
JP4597634B2 (ja) * 2004-11-01 2010-12-15 株式会社荏原製作所 トップリング、基板の研磨装置及び研磨方法
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Publication number Publication date
TW202003157A (zh) 2020-01-16
JP2019198938A (ja) 2019-11-21
CN110497307A (zh) 2019-11-26
US20190351526A1 (en) 2019-11-21

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Patent event date: 20190515

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