TWD225939S - 研磨墊用修整器 - Google Patents
研磨墊用修整器 Download PDFInfo
- Publication number
- TWD225939S TWD225939S TW111303110F TW111303110F TWD225939S TW D225939 S TWD225939 S TW D225939S TW 111303110 F TW111303110 F TW 111303110F TW 111303110 F TW111303110 F TW 111303110F TW D225939 S TWD225939 S TW D225939S
- Authority
- TW
- Taiwan
- Prior art keywords
- dresser
- parts
- design
- abrasive pad
- case
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 abstract 2
Images
Abstract
【物品用途】;本設計物品係一種修整器，其係用於研磨墊之修整，該研磨墊係用於矽晶圓等之研磨加工。;【設計說明】;圖式中以實線表示者，係本案所欲主張設計之部分，圖式中所揭露之虛線部分，係本案不主張設計之部分。仰視圖與俯視圖對稱，故省略仰視圖。
Description
本設計物品係一種修整器，其係用於研磨墊之修整，該研磨墊係用於矽晶圓等之研磨加工。
圖式中以實線表示者，係本案所欲主張設計之部分，圖式中所揭露之虛線部分，係本案不主張設計之部分。仰視圖與俯視圖對稱，故省略仰視圖。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022000015F JP1730995S (ja) | 2022-01-04 | 2022-01-04 | 研磨パッド用ドレッサ |
| JP2022-000015 | 2022-01-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD225939S true TWD225939S (zh) | 2023-06-21 |
Family
ID=84228007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111303110F TWD225939S (zh) | 2022-01-04 | 2022-06-24 | 研磨墊用修整器 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1730995S (zh) |
| TW (1) | TWD225939S (zh) |
-
2022
- 2022-01-04 JP JP2022000015F patent/JP1730995S/ja active Active
- 2022-06-24 TW TW111303110F patent/TWD225939S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP1730995S (ja) | 2022-11-30 |
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