MY192793A - Polishing composition, composition for pad surface adjustment, and use thereof - Google Patents
Polishing composition, composition for pad surface adjustment, and use thereofInfo
- Publication number
- MY192793A MY192793A MYPI2019001327A MYPI2019001327A MY192793A MY 192793 A MY192793 A MY 192793A MY PI2019001327 A MYPI2019001327 A MY PI2019001327A MY PI2019001327 A MYPI2019001327 A MY PI2019001327A MY 192793 A MY192793 A MY 192793A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing
- composition
- polishing composition
- particle size
- pad surface
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The present invention provides a polishing composition that exhibits high processability and that allows smoothing of a polishing pad surface to be achieved at an early stage. The polishing composition is used, in polishing of a magnetic disk substrate, in order to polish a polishing object by being supplied between a polishing pad and the polishing object. The polishing composition contains silica particles as an abrasive, and water. The silica particles have a volume-average particle size, based on SEM image analysis, of 50 to 400 nm, and have a value (D90/D10), resulting from dividing a cumulative- frequency 90% particle size (D90) by a cumulative-frequency 10% particle size (D10) on a volume basis, of 2.0 or higher. The polishing composition satisfies a condition such that a roughness reduction rate of the surface of the polishing pad is 15% or higher. (Most Illustrative Drawing: Figure 1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018070141A JP7111492B2 (en) | 2018-03-30 | 2018-03-30 | Polishing composition, pad surface conditioning composition and use thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY192793A true MY192793A (en) | 2022-09-09 |
Family
ID=68277886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2019001327A MY192793A (en) | 2018-03-30 | 2019-03-13 | Polishing composition, composition for pad surface adjustment, and use thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7111492B2 (en) |
| MY (1) | MY192793A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023229009A1 (en) * | 2022-05-26 | 2023-11-30 | 花王株式会社 | Grinding liquid composition |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4251516B2 (en) * | 2000-05-12 | 2009-04-08 | 花王株式会社 | Polishing liquid composition |
| JP6138677B2 (en) * | 2013-12-27 | 2017-05-31 | 花王株式会社 | Polishing liquid composition for magnetic disk substrate |
| JP6362385B2 (en) * | 2014-04-04 | 2018-07-25 | 株式会社フジミインコーポレーテッド | Substrate manufacturing method and polishing composition |
| JP5853117B1 (en) * | 2014-06-30 | 2016-02-09 | 花王株式会社 | Polishing liquid composition for magnetic disk substrate |
| TWI723085B (en) * | 2015-11-30 | 2021-04-01 | 日商花王股份有限公司 | Polishing liquid composition for magnetic disk substrate |
-
2018
- 2018-03-30 JP JP2018070141A patent/JP7111492B2/en active Active
-
2019
- 2019-03-13 MY MYPI2019001327A patent/MY192793A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019178302A (en) | 2019-10-17 |
| JP7111492B2 (en) | 2022-08-02 |
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