JP2019194495A5 - - Google Patents

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Publication number
JP2019194495A5
JP2019194495A5 JP2019087167A JP2019087167A JP2019194495A5 JP 2019194495 A5 JP2019194495 A5 JP 2019194495A5 JP 2019087167 A JP2019087167 A JP 2019087167A JP 2019087167 A JP2019087167 A JP 2019087167A JP 2019194495 A5 JP2019194495 A5 JP 2019194495A5
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JP
Japan
Prior art keywords
gasket
region
layers
layer stack
thermal conductivity
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Pending
Application number
JP2019087167A
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English (en)
Japanese (ja)
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JP2019194495A (ja
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Publication date
Priority claimed from US15/969,664 external-priority patent/US10957572B2/en
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Publication of JP2019194495A publication Critical patent/JP2019194495A/ja
Publication of JP2019194495A5 publication Critical patent/JP2019194495A5/ja
Pending legal-status Critical Current

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JP2019087167A 2018-05-02 2019-05-02 基板支持アセンブリ用の多領域ガスケット Pending JP2019194495A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/969,664 US10957572B2 (en) 2018-05-02 2018-05-02 Multi-zone gasket for substrate support assembly
US15/969,664 2018-05-02

Publications (2)

Publication Number Publication Date
JP2019194495A JP2019194495A (ja) 2019-11-07
JP2019194495A5 true JP2019194495A5 (enExample) 2021-07-26

Family

ID=67212077

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019001560U Active JP3222163U (ja) 2018-05-02 2019-05-02 基板支持アセンブリ用の多領域ガスケット
JP2019087167A Pending JP2019194495A (ja) 2018-05-02 2019-05-02 基板支持アセンブリ用の多領域ガスケット

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2019001560U Active JP3222163U (ja) 2018-05-02 2019-05-02 基板支持アセンブリ用の多領域ガスケット

Country Status (5)

Country Link
US (1) US10957572B2 (enExample)
JP (2) JP3222163U (enExample)
KR (1) KR20190126722A (enExample)
CN (2) CN110444505A (enExample)
TW (2) TWM588356U (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10008404B2 (en) * 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
US10008399B2 (en) 2015-05-19 2018-06-26 Applied Materials, Inc. Electrostatic puck assembly with metal bonded backing plate for high temperature processes
US10249526B2 (en) 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes
US9850573B1 (en) * 2016-06-23 2017-12-26 Applied Materials, Inc. Non-line of sight deposition of erbium based plasma resistant ceramic coating
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
US11469084B2 (en) 2017-09-05 2022-10-11 Lam Research Corporation High temperature RF connection with integral thermal choke
JP7374103B2 (ja) 2018-01-31 2023-11-06 ラム リサーチ コーポレーション 静電チャック（ｅｓｃ）ペデスタル電圧分離
US11086233B2 (en) * 2018-03-20 2021-08-10 Lam Research Corporation Protective coating for electrostatic chucks
US10957572B2 (en) * 2018-05-02 2021-03-23 Applied Materials, Inc. Multi-zone gasket for substrate support assembly
US11183368B2 (en) 2018-08-02 2021-11-23 Lam Research Corporation RF tuning systems including tuning circuits having impedances for setting and adjusting parameters of electrodes in electrostatic chucks
US20230039670A1 (en) * 2020-01-13 2023-02-09 Lam Research Corporation Mixed metal baseplates for improved thermal expansion matching with thermal oxide spraycoat
US11482444B2 (en) * 2020-03-10 2022-10-25 Applied Materials, Inc. High temperature micro-zone electrostatic chuck
US11784080B2 (en) 2020-03-10 2023-10-10 Applied Materials, Inc. High temperature micro-zone electrostatic chuck
JP7561867B2 (ja) * 2020-03-31 2024-10-04 アプライド マテリアルズ インコーポレイテッド 高温マイクロゾーン静電チャック
CN215925072U (zh) * 2020-09-24 2022-03-01 株式会社国际电气 基板处理装置
JP7368343B2 (ja) * 2020-12-11 2023-10-24 日本碍子株式会社 半導体製造装置用部材及びその製法
US11881423B2 (en) * 2021-02-09 2024-01-23 Applied Materials, Inc. Electrostatic chuck with metal bond
US12112971B2 (en) * 2021-03-12 2024-10-08 Applied Materials, Inc. Multi-zone semiconductor substrate supports
JP2022143343A (ja) * 2021-03-17 2022-10-03 キオクシア株式会社 成膜装置、スパッタリングターゲット、および半導体装置の製造方法
US20220301914A1 (en) * 2021-03-22 2022-09-22 Tokyo Electron Limited Electrostatic chuck for a plasma processing apparatus
CN115142128B (zh) * 2021-03-31 2024-06-07 苏州贝莱克金刚石科技有限公司 制备mpcvd单晶金刚石用的产品载台及其应用
FI130020B (en) 2021-05-10 2022-12-30 Picosun Oy Substrate processing apparatus and method
JP7718902B2 (ja) * 2021-08-06 2025-08-05 株式会社フェローテックマテリアルテクノロジーズ ウエハ支持体
CN114658745A (zh) * 2022-03-09 2022-06-24 江苏金烨钛业有限公司 一种防松动多层金属垫片
US20240312770A1 (en) * 2023-03-16 2024-09-19 Applied Materials, Inc. Apparatus and methods for controlling substrate temperature during processing
CN116026485B (zh) * 2023-03-31 2023-06-23 无锡卓瓷科技有限公司 一种半导体设备用陶瓷加热盘的测试装置
US20250112083A1 (en) * 2023-10-03 2025-04-03 Tokyo Electron Limited Multi-material chuck
US20250118586A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Electrostatically secured substrate support assembly
WO2025244740A1 (en) * 2024-05-22 2025-11-27 Lam Research Corporation An assembly for a semiconductor processing chamber with an aluminum nitride containing gasket

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4305567A (en) 1977-08-29 1981-12-15 Rockwell International Corporation Valve stem seal
US4273148A (en) 1980-04-21 1981-06-16 Litton Industrial Products, Inc. Stem seal for a fire safe ball valve
US4776602A (en) 1987-08-05 1988-10-11 Dana Corporation Thermally conductive composite gasket
US5421594A (en) 1991-02-14 1995-06-06 Marine & Petroleum Mfg., Inc. Gasket
US5297806A (en) * 1991-08-08 1994-03-29 Dana Corporation Method of making multi-density composite gaskets
US5535090A (en) 1994-03-03 1996-07-09 Sherman; Arthur Electrostatic chuck
JPH09213781A (ja) 1996-02-01 1997-08-15 Tokyo Electron Ltd 載置台構造及びそれを用いた処理装置
JPH11247998A (ja) * 1998-02-26 1999-09-14 Nippon Reinz Co Ltd 金属ガスケット
US6219219B1 (en) 1998-09-30 2001-04-17 Applied Materials, Inc. Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
US6310755B1 (en) 1999-05-07 2001-10-30 Applied Materials, Inc. Electrostatic chuck having gas cavity and method
US6409178B1 (en) 1999-06-09 2002-06-25 Dana Corporation Multiple layer gasket having selectively removable spacer layers and visual indicators
WO2001035459A1 (fr) 1999-11-10 2001-05-17 Ibiden Co., Ltd. Substrat en ceramique
KR20010111058A (ko) 2000-06-09 2001-12-15 조셉 제이. 스위니 전체 영역 온도 제어 정전기 척 및 그 제조방법
US6503368B1 (en) 2000-06-29 2003-01-07 Applied Materials Inc. Substrate support having bonded sections and method
JP3530481B2 (ja) 2000-10-31 2004-05-24 ジー・ピー・ダイキョー株式会社 樹脂製インテークマニホールド、及びその製造方法
JP2005090722A (ja) * 2003-09-19 2005-04-07 Uchiyama Mfg Corp 多機能ガスケット
JP4278046B2 (ja) 2003-11-10 2009-06-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ヒータ機構付き静電チャック
US7697260B2 (en) 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US20060096946A1 (en) 2004-11-10 2006-05-11 General Electric Company Encapsulated wafer processing device and process for making thereof
JP4783213B2 (ja) 2005-06-09 2011-09-28 日本碍子株式会社 静電チャック
US20080029032A1 (en) 2006-08-01 2008-02-07 Sun Jennifer Y Substrate support with protective layer for plasma resistance
TWI345285B (en) 2006-10-06 2011-07-11 Ngk Insulators Ltd Substrate supporting member
US8161906B2 (en) 2008-07-07 2012-04-24 Lam Research Corporation Clamped showerhead electrode assembly
US8194384B2 (en) 2008-07-23 2012-06-05 Tokyo Electron Limited High temperature electrostatic chuck and method of using
EP2321846A4 (en) 2008-08-12 2012-03-14 Applied Materials Inc ELECTROSTATIC FODDER ASSEMBLY
US8147648B2 (en) * 2008-08-15 2012-04-03 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
KR20130071441A (ko) 2010-05-28 2013-06-28 액셀리스 테크놀러지스, 인크. 정전 척을 위한 열 팽창 계수 정합
JP6195519B2 (ja) 2010-08-06 2017-09-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック及びその使用方法
US9969022B2 (en) 2010-09-28 2018-05-15 Applied Materials, Inc. Vacuum process chamber component and methods of making
US20120100379A1 (en) 2010-10-20 2012-04-26 Greene, Tweed Of Delaware, Inc. Fluoroelastomer bonding compositions suitable for high-temperature applications
US20130276980A1 (en) 2012-04-23 2013-10-24 Dmitry Lubomirsky Esc with cooling base
JP5989593B2 (ja) 2012-04-27 2016-09-07 日本碍子株式会社 半導体製造装置用部材
US9685356B2 (en) 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
JP6080571B2 (ja) 2013-01-31 2017-02-15 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP6182082B2 (ja) 2013-03-15 2017-08-16 日本碍子株式会社 緻密質複合材料、その製法及び半導体製造装置用部材
JP6182084B2 (ja) 2013-03-25 2017-08-16 日本碍子株式会社 緻密質複合材料、その製法、接合体及び半導体製造装置用部材
CN105514016B (zh) * 2014-09-23 2019-10-29 北京北方华创微电子装备有限公司 承载装置及半导体加工设备
US10008404B2 (en) * 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
JP2018071730A (ja) * 2016-11-02 2018-05-10 Nok株式会社 ガスケット
JP6343698B1 (ja) * 2017-04-19 2018-06-13 石川ガスケット株式会社 ガスケット及びその製造方法
US10957572B2 (en) * 2018-05-02 2021-03-23 Applied Materials, Inc. Multi-zone gasket for substrate support assembly

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