JP2019186509A5 - - Google Patents

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Publication number
JP2019186509A5
JP2019186509A5 JP2018101453A JP2018101453A JP2019186509A5 JP 2019186509 A5 JP2019186509 A5 JP 2019186509A5 JP 2018101453 A JP2018101453 A JP 2018101453A JP 2018101453 A JP2018101453 A JP 2018101453A JP 2019186509 A5 JP2019186509 A5 JP 2019186509A5
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JP
Japan
Prior art keywords
control panel
column
wheel shaft
grinding device
top surface
Prior art date
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Application number
JP2018101453A
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English (en)
Japanese (ja)
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JP7108467B2 (ja
JP2019186509A (ja
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Publication of JP2019186509A publication Critical patent/JP2019186509A/ja
Publication of JP2019186509A5 publication Critical patent/JP2019186509A5/ja
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Publication of JP7108467B2 publication Critical patent/JP7108467B2/ja
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JP2018101453A 2018-03-30 2018-05-28 基板吸着装置 Active JP7108467B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018066741 2018-03-30
JP2018066741 2018-03-30

Publications (3)

Publication Number Publication Date
JP2019186509A JP2019186509A (ja) 2019-10-24
JP2019186509A5 true JP2019186509A5 (zh) 2021-05-20
JP7108467B2 JP7108467B2 (ja) 2022-07-28

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ID=68337631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018101453A Active JP7108467B2 (ja) 2018-03-30 2018-05-28 基板吸着装置

Country Status (1)

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JP (1) JP7108467B2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111843572A (zh) * 2020-08-25 2020-10-30 中国工程物理研究院机械制造工艺研究所 一种用于圆形平面薄片加工的负压吸具
CN115123823A (zh) * 2022-07-22 2022-09-30 深圳市持创捷宇电子科技有限公司 一种pcb线路板防漏真空吸附装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4022306B2 (ja) * 1998-03-03 2007-12-19 不二越機械工業株式会社 ウェーハの接着方法及び接着装置
JP2011071472A (ja) 2009-08-31 2011-04-07 Hitachi Setsubi Eng Co Ltd 真空貼付け方法及び装置
JP2012084643A (ja) 2010-10-08 2012-04-26 Casio Comput Co Ltd 基板吸着方法およびその装置
JP6335672B2 (ja) 2014-06-17 2018-05-30 株式会社ディスコ 搬送装置

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