JP2019186509A5 - - Google Patents
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- Publication number
- JP2019186509A5 JP2019186509A5 JP2018101453A JP2018101453A JP2019186509A5 JP 2019186509 A5 JP2019186509 A5 JP 2019186509A5 JP 2018101453 A JP2018101453 A JP 2018101453A JP 2018101453 A JP2018101453 A JP 2018101453A JP 2019186509 A5 JP2019186509 A5 JP 2019186509A5
- Authority
- JP
- Japan
- Prior art keywords
- control panel
- column
- wheel shaft
- grinding device
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 1
Description
研削装置１は、といし軸４０と、コラム４１と、基板吸着装置１０と、テーブル２０と、制御盤５０と、を有する。といし軸４０は、コラム４１に支持されており、上下方向に移動可能に設けられている。 The grinding device 1 has a wheel shaft 40, a column 41, a substrate suction device 10, a table 20, and a control panel 50 . The wheel shaft 40 is supported by the column 41 and is provided so as to be movable in the vertical direction.
制御盤５０は、各種情報を入力するための入力部や各種情報を表示するモニター、各種演算等を行う演算部等を有する。制御盤５０は、入力された情報に基づき、各種演算を実行し、研削装置１全体における加工の監視及び制御等を行う。 The control panel 50 has an input unit for inputting various information, a monitor for displaying various information, a calculation unit for performing various calculations, and the like. The control panel 50 executes various calculations based on the input information, and monitors and controls the machining of the entire grinding device 1.
１ 研削装置
１０ 基板吸着装置
１１ 貼付ハウジング
１２ 本体部
１３ シート支持部
１４ シート
１５ 真空ライン
１６ 吸引口
１８ 外周シール
２０ テーブル
２１ 真空チャック
２１ａ 上面
２１ｂ 段差面
２１ｃ 上面
２２ 真空ライン
２３ 吸引口
２４ 内周シール
３０ 往復動装置
４０ といし軸
４１ コラム
５０ 制御盤
1 Grinding device 10 Substrate suction device 11 Attached housing 12 Main body 13 Seat support 14 Sheet 15 Vacuum line 16 Suction port 18 Outer circumference seal 20 Table 21 Vacuum chuck 21a Top surface 21b Step surface 21c Top surface 22 Vacuum line 23 Suction port 24 Inner circumference seal 30 Reciprocating device 40 Wheel shaft 41 Column
50 control panel
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018066741 | 2018-03-30 | ||
| JP2018066741 | 2018-03-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019186509A JP2019186509A (en) | 2019-10-24 |
| JP2019186509A5 true JP2019186509A5 (en) | 2021-05-20 |
| JP7108467B2 JP7108467B2 (en) | 2022-07-28 |
Family
ID=68337631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018101453A Active JP7108467B2 (en) | 2018-03-30 | 2018-05-28 | Substrate suction device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7108467B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111843572A (en) * | 2020-08-25 | 2020-10-30 | 中国工程物理研究院机械制造工艺研究所 | Negative pressure suction tool for processing circular plane sheets |
| CN115123823A (en) * | 2022-07-22 | 2022-09-30 | 深圳市持创捷宇电子科技有限公司 | PCB circuit board leak protection vacuum adsorption device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4022306B2 (en) * | 1998-03-03 | 2007-12-19 | 不二越機械工業株式会社 | Wafer bonding method and bonding apparatus |
| JP2011071472A (en) * | 2009-08-31 | 2011-04-07 | Hitachi Setsubi Eng Co Ltd | Vacuum sticking method and apparatus |
| JP2012084643A (en) * | 2010-10-08 | 2012-04-26 | Casio Comput Co Ltd | Method and apparatus of substrate sucking |
| JP6335672B2 (en) * | 2014-06-17 | 2018-05-30 | 株式会社ディスコ | Transport device |
-
2018
- 2018-05-28 JP JP2018101453A patent/JP7108467B2/en active Active
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