JP2019158516A - 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 - Google Patents
位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 Download PDFInfo
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Abstract
Description
図1は第1実施形態におけるインプリント装置100の構成を示した図である。図1を用いてインプリント装置100の構成について説明する。ここでは、基板1が配置される面をXY面、それに直交する方向をZ方向として、図1に示したように各軸を決める。インプリント装置は、基板上に供給されたインプリント材と型(モールド)と接触させ、インプリント材に硬化用のエネルギーを与えることにより、型の凹凸パターンが転写された硬化物のパターンを形成する装置である。図1のインプリント装置100は、物品としての半導体デバイスなどのデバイスの製造に使用される。ここでは光硬化法を採用したインプリント装置100について説明する。
インプリント装置を用いて形成した硬化物のパターンは、各種物品の少なくとも一部に恒久的に、或いは各種物品を製造する際に一時的に、用いられる。物品とは、電気回路素子、光学素子、MEMS、記録素子、センサ、或いは、型等である。電気回路素子としては、DRAM、SRAM、フラッシュメモリ、MRAMのような、揮発性或いは不揮発性の半導体メモリや、LSI、CCD、イメージセンサ、FPGAのような半導体素子等が挙げられる。型としては、インプリント用のモールド等が挙げられる。
30 制御部
100 インプリント装置
Claims (10)
- 型に形成された型マークと基板に形成された基板マークを用いて前記型と前記基板との位置合わせを行う位置検出装置であって、
前記型マーク、及び前記基板マークを介した光を検出する検出部と、
前記検出部の検出結果に基づいて前記基板と前記型の位置関係を得る処理部と、
を備え、
前記処理部は、前記型マーク及び前記基板マークを介した光に基づく検出信号から、前記型マークからの光に基づくノイズ成分を除去した補正信号に基づいて、前記基板と前記型との位置関係を得る、ことを特徴とする位置検出装置。 - 前記型マークからの光は、光源から発し前記基板マークを介さずに前記型マークを介して前記検出部に入射する光である、ことを特徴とする請求項1に記載の位置検出装置。
- 前記型マーク、及び前記基板マークを介した光は、光源から発し前記型マーク及び前記基板マークの両者を介して前記検出部に入射する光であり、
前記型マークからの光は、前記光源から発し前記型マークを介して、前記基板マークを介することなく前記検出部に入射する光である、ことを特徴とする請求項1又は2に記載の位置検出装置。 - 前記検出部は、前記型に形成された回折格子からなる型マークと前記基板に形成された回折格子からなる基板マークを介した光であるモアレを検出することを特徴とする請求項1乃至3の何れか1項に記載の位置検出装置。
- 前記処理部は、前記型マーク及び前記基板マークを介した光に基づく検出信号から、前記型マークからの光に基づくノイズ成分を除去する際に、
前記型マーク及び前記基板マークを介した光に基づく前記検出信号の位置に対する前記ノイズ成分の位置の位置合わせを行うことを特徴とする請求項1乃至4の何れか1項に記載の位置検出装置。 - 前記型マークに加えて補助マークが形成されており、
前記検出部は、前記型マーク及び前記基板マークを介した光に基づく検出信号に加えて前記補助マークからの光を検出し、
前記検出部は、前記型マークからの光に基づくノイズ成分に加えて、前記補助マークからの光を予め検出し、
前記処理部は、前記型マーク及び前記基板マークを介した光に基づく検出信号に加えて検出された補助マークの位置と前記ノイズ成分に加えて検出された補助マークの位置に基づいて、前記位置合わせを行うことを特徴とする請求項5に記載の位置検出装置。 - 前記補助マークは、前記検出部が検出する前記補助マークからの光がピーク信号となるような形状のマークであることを特徴とする請求項6に記載の位置検出装置。
- 型に形成された型マークと基板に形成された基板マークを用いて前記型と前記基板との位置関係を検出する位置検出方法であって、
前記型マーク及び前記基板マークを介した光を検出する工程と、
前記型マーク、及び前記基板マークを介した光に基づく検出信号から、前記型マークからの光に基づくノイズ成分を除去する工程と、
前記ノイズ成分を除去した補正信号に基づいて、前記基板と前記型の位置関係を得る工程と、を備えることを特徴とする位置検出方法。 - 型を用いて基板上にインプリント材のパターンを形成するインプリント装置であって、
前記型に形成された型マーク及び前記基板に形成された基板マークを介した光を検出する検出部と、
前記検出部の検出結果に基づいて前記基板と前記型の位置関係を得る処理部と、を備え、
前記処理部は、前記型マーク及び前記基板マークを介した光に基づく検出信号から、前記型マークからの光に基づくノイズ成分を除去した補正信号に基づいて、前記基板と前記型との位置関係を得る、ことを特徴とするインプリント装置。 - 請求項8に記載の位置検出方法を用いて前記型と前記基板との位置関係を検出し、前記位置関係に基づき前記型と前記基板の位置合わせを行って前記基板の上にパターンを形成する工程と、
前記工程でパターンが形成された前記基板を加工する工程と、を含み、
加工された前記基板から物品を製造することを特徴とする物品の製造方法。
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JP2018044355A JP7030569B2 (ja) | 2018-03-12 | 2018-03-12 | 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 |
US16/280,974 US10859929B2 (en) | 2018-03-12 | 2019-02-20 | Position detection device, position detection method, imprint apparatus, and method for manufacturing article |
KR1020190024617A KR102478974B1 (ko) | 2018-03-12 | 2019-03-04 | 위치 검출 장치, 위치 검출 방법, 임프린트 장치 및 물품의 제조 방법 |
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US20190279889A1 (en) | 2019-09-12 |
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