JP2019155732A5 - - Google Patents

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Publication number
JP2019155732A5
JP2019155732A5 JP2018045661A JP2018045661A JP2019155732A5 JP 2019155732 A5 JP2019155732 A5 JP 2019155732A5 JP 2018045661 A JP2018045661 A JP 2018045661A JP 2018045661 A JP2018045661 A JP 2018045661A JP 2019155732 A5 JP2019155732 A5 JP 2019155732A5
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JP
Japan
Prior art keywords
pressure
closed space
mold
mold clamping
resin
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JP2018045661A
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English (en)
Japanese (ja)
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JP6845822B2 (ja
JP2019155732A (ja
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Priority claimed from JP2018045661A external-priority patent/JP6845822B2/ja
Priority to JP2018045661A priority Critical patent/JP6845822B2/ja
Application filed filed Critical
Priority to KR1020190000710A priority patent/KR102264545B1/ko
Priority to TW108105606A priority patent/TWI716820B/zh
Priority to CN201910136378.7A priority patent/CN110271169B/zh
Publication of JP2019155732A publication Critical patent/JP2019155732A/ja
Publication of JP2019155732A5 publication Critical patent/JP2019155732A5/ja
Publication of JP6845822B2 publication Critical patent/JP6845822B2/ja
Application granted granted Critical
Priority to KR1020210039443A priority patent/KR102288168B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018045661A 2018-03-13 2018-03-13 樹脂成形装置および樹脂成形品の製造方法 Active JP6845822B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018045661A JP6845822B2 (ja) 2018-03-13 2018-03-13 樹脂成形装置および樹脂成形品の製造方法
KR1020190000710A KR102264545B1 (ko) 2018-03-13 2019-01-03 수지 성형 장치 및 수지 성형품의 제조 방법
TW108105606A TWI716820B (zh) 2018-03-13 2019-02-20 樹脂成形裝置以及樹脂成形品的製造方法
CN201910136378.7A CN110271169B (zh) 2018-03-13 2019-02-25 树脂成形装置以及树脂成形品的制造方法
KR1020210039443A KR102288168B1 (ko) 2018-03-13 2021-03-26 수지 성형 장치 및 수지 성형품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018045661A JP6845822B2 (ja) 2018-03-13 2018-03-13 樹脂成形装置および樹脂成形品の製造方法

Publications (3)

Publication Number Publication Date
JP2019155732A JP2019155732A (ja) 2019-09-19
JP2019155732A5 true JP2019155732A5 (https=) 2020-05-07
JP6845822B2 JP6845822B2 (ja) 2021-03-24

Family

ID=67958184

Family Applications (1)

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JP2018045661A Active JP6845822B2 (ja) 2018-03-13 2018-03-13 樹脂成形装置および樹脂成形品の製造方法

Country Status (4)

Country Link
JP (1) JP6845822B2 (https=)
KR (2) KR102264545B1 (https=)
CN (1) CN110271169B (https=)
TW (1) TWI716820B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7073551B1 (ja) * 2021-02-12 2022-05-23 株式会社日本製鋼所 積層成形システムおよび積層成形方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0716780B2 (ja) * 1985-05-27 1995-03-01 東芝機械株式会社 金型間異物検出機能を有する型締力自動調整装置
EP0853337B1 (en) * 1996-07-12 2004-09-29 Fujitsu Limited Method for manufacturing semiconductor device
CA2220797A1 (en) * 1997-11-12 1999-05-12 Royal Ecoproducts Limited Process and tooling for decorative molded plastic products
JP4253393B2 (ja) * 1999-03-10 2009-04-08 Towa株式会社 半導体ウェーハの樹脂被覆方法及び金型
JP4607429B2 (ja) * 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP4217572B2 (ja) * 2003-09-18 2009-02-04 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
KR101457044B1 (ko) 2012-12-27 2014-10-31 엘아이지에이디피 주식회사 기판 합착장치 및 합착방법
JP6174417B2 (ja) * 2013-08-21 2017-08-02 北川精機株式会社 プレス装置
JP6525580B2 (ja) * 2014-12-24 2019-06-05 Towa株式会社 樹脂成形装置及び樹脂成形方法
JP6654861B2 (ja) * 2015-11-09 2020-02-26 Towa株式会社 樹脂封止装置及び樹脂封止方法
JP6649752B2 (ja) 2015-11-19 2020-02-19 アピックヤマダ株式会社 圧縮成形方法及び圧縮成形装置

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