JP2019133976A - Liquid cooling type cooling device - Google Patents

Abstract

To improve efficiency of cooling of a plurality of electronic components by a liquid cooling type cooling device when the electronic components are mounted.SOLUTION: A liquid cooling type cooling device 10 has a plurality of slits S1-S7, hollowed away from a fin 16, formed at a bottom wall part 24 of a second casing 14. The plurality of slits S1-S7 are provided extending in a width direction orthogonal to a flow direction of a refrigerant to be between pluralities of electronic components E1a-E8a, E1b-E8b along the flow direction. Further, the slits S1-S7 are formed gradually increasing in width-directional length from an upstream to a downstream side. Then part of the refrigerant flows in the slits S1-S7 to flow out again to the side of a flow passage 28 to be thereby circulated upward by convection, and the slits S1-S7 can increase the convection quantity of the refrigerant as it flows downward.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a liquid cooling type cooling device capable of cooling a plurality of electronic components by exchanging heat with a refrigerant flowing in a plurality of flow paths.

  Conventionally, for example, a cooling device for cooling an electronic component that generates heat, such as a semiconductor, has been known. Such a cooling device includes, for example, a housing, A plurality of fins housed inside the housing, and electronic components are provided on the lower surface of the outer housing, and the fins are provided in contact with the lower surface inside the housing. On the other hand, a protrusion that protrudes toward the inside is formed on the upper surface of the casing, and a part of the refrigerant that flows between the upper surface and the fin collides with the protrusion and is deflected between the fins. As a result, the low-temperature refrigerant flowing in the vicinity of the upper surface is guided to the lower surface side of the casing on which the electronic components are mounted, thereby improving the cooling efficiency.

JP 2012-38010 A

  In the cooling device as described above, when a plurality of electronic components are arranged along the refrigerant flow direction, the refrigerant heat-exchanged with each electronic component is gradually warmed as it flows downstream, and is arranged upstream. There is a problem in that the cooling efficiency of the electronic component arranged on the downstream side is lower than that of the electronic component.

  The present invention has been made in consideration of the above-described problems, and an object of the present invention is to provide a liquid-cooled cooling device capable of improving the cooling efficiency of each electronic component when a plurality of electronic components are mounted. And

In order to achieve the above object, the present invention includes a casing having a supply port for supplying a refrigerant and a discharge port for discharging the refrigerant, and a fin housed in the casing, and is provided in the casing. In a liquid-cooled cooling device that cools a plurality of electronic components that have generated heat by heat exchange with a refrigerant,
The casing includes a first wall portion on which electronic components are mounted, and a second wall portion facing the first wall portion with the fin interposed therebetween,
On the surface facing the fin in the second wall portion, a recess is formed that is recessed in a direction away from the fin and extends in the width direction substantially orthogonal to the coolant flow direction, and a plurality of recesses are provided along the flow direction. The width direction length of at least a part of the recesses is characterized in that the recesses disposed on the downstream side are formed longer than the recesses disposed on the upstream side in the flow direction.

  According to the present invention, the casing constituting the liquid cooling type cooling device has the second wall portion facing the first wall portion on which the electronic component is mounted, and the second wall portion is separated from the fin. A plurality of recesses are provided along the flow direction of the refrigerant, and at least some of the recesses have a width direction length on the downstream side with respect to the upstream side in the flow direction. It is formed to be longer.

  Therefore, when the refrigerant supplied into the casing through the supply port flows downstream along the fins, a part of the refrigerant flows into the recess and flows back to the flow path, so that the refrigerant is In the casing, the second wall portion side can be convected from the first wall portion side, and the length in the width direction of the recess is formed to be longer on the downstream side, so that the convective flow rate of the refrigerant is increased upstream. It can be increased more on the downstream side than on the side.

  As a result, the refrigerant on the first wall side heated by heat exchange with each electronic component and the refrigerant cooled on the second wall side can be suitably mixed by convection of the refrigerant through the recess. The temperature of the refrigerant on the first wall side can be further reduced by causing more convection of the downstream refrigerant heated by heat exchange with each electronic component on the upstream side by the concave portion having a long width in the width direction. Therefore, even when a plurality of electronic components are provided, it is possible to improve the cooling efficiency including the electronic components arranged on the downstream side.

  In addition, the electronic components may be provided in at least two rows in the width direction, the recesses may be formed in a plurality of rows corresponding to the electronic components, and arranged so as to be between the plurality of electronic components.

  Further, the recesses may be formed so that the width direction length in one row of the plurality of rows is different from the width direction length in the other row.

  Furthermore, it is good to provide the deflection | deviation part which deflects the distribution direction of a part of refrigerant | coolant to an electronic component side in a casing.

  According to the present invention, the following effects can be obtained.

  That is, the second wall portion of the casing is provided with a concave portion that is recessed in the direction away from the fin and extends in the width direction, and a plurality of the concave portions are provided along the flow direction of the refrigerant. Since the downstream side is longer than the upstream side in the flow direction, a part of the refrigerant flowing along the fins in the casing is partly passed from the second wall side to the first wall by the recess. Convection to the part side and the convection flow rate can be convection so that the downstream side is larger than the upstream side.

  As a result, the refrigerant on the first wall side heated by the heat exchange with the electronic component and the refrigerant cooled on the second wall side can be suitably mixed by convection by the recess, and the upstream side Since the temperature of the refrigerant on the first wall side can be lowered by causing more convection of the downstream refrigerant heated by the heat exchange with the electronic component by the concave portion having a longer width in the width direction, the refrigerant flow direction Even if a plurality of electronic components are provided along the cooling line, the cooling efficiency including the electronic components arranged on the downstream side can be further improved.

1 is an overall cross-sectional view of a liquid cooling type cooling device according to an embodiment of the present invention. It is a disassembled perspective view of the liquid cooling type cooling device of FIG. It is a whole top view which shows the 2nd casing and fin which comprise the liquid cooling type cooling device of FIG. It is an expanded sectional view which shows the slit vicinity in FIG. It is a whole top view which shows the 2nd casing and fin of the liquid cooling type cooling device which concern on a modification.

  A preferred embodiment of the liquid cooling type cooling apparatus according to the present invention will be described below and described in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 10 indicates a liquid cooling type cooling apparatus according to an embodiment of the present invention.

  As shown in FIGS. 1 and 2, the liquid cooling type cooling apparatus 10 includes first and second casings (casings) 12 and 14 that can be divided in the vertical direction, and the first and second casings 12 and 14. And a cover plate 18 covering the lower side of the second casing 14.

  The first and second casings 12 and 14 are formed in, for example, substantially the same shape by molding a metal plate, and the first casing 12 includes a flat top wall portion (first wall portion) 20. And the first side wall portion 22 erected on the outer edge portion of the top wall portion 20, and electronic components E1a to E8a and E1b to E8b that require cooling are mounted on the upper surface of the top wall portion 20. .

  The electronic components E1a to E8a and E1b to E8b are made of, for example, a semiconductor that generates heat, and are separated from each other in the width direction (arrow A direction) of the first casing 12, as shown in FIGS. A total of 16 are arranged in 8 rows arranged at equal intervals along the longitudinal direction (arrow B1, B2 direction).

  In other words, the electronic components E1a to E8a arranged in the row on the one side in the width direction (arrow A1 direction) and the electronic components E1b to E8b arranged in the row on the other side in the width direction (arrow A2 direction) The two casings are arranged along the longitudinal direction so as to be spaced apart from each other in the width direction (arrows A1 and A2 directions) with respect to the center of the casing 12 in the width direction. Note that the electronic components E1a to E8a and E1b to E8b are not limited to the above-described quantity (16 pieces), and may be appropriately arranged in quantities as necessary.

  The second casing 14 includes a flat bottom wall portion (second wall portion) 24 and a second side wall portion 26 erected on the outer edge portion of the bottom wall portion 24. In a state in which the end portion of the second side wall portion 26 is in contact with the end portion of the first side wall portion 22 in the first casing 12, for example, Connected by brazing or the like.

  Thereby, as shown in FIG. 1, the top wall portion 20 of the first casing 12 and the bottom wall portion 24 of the second casing 14 are substantially parallel and surrounded by the first and second side wall portions 22 and 26. The internal spaces of the first and second casings 12 and 14 serve as the flow path 28 through which the refrigerant flows.

  The bottom wall 24 of the second casing 14 has a supply port 30 to which a refrigerant is supplied and a discharge port 32 from which the refrigerant that has flowed inside is opened. The supply port 30 is at a position offset from the center in the width direction to the second side wall portion 26 side (in the direction of arrow A1 in FIG. 3) on one end portion side (in the direction of arrow B1) along the longitudinal direction of the second casing 14. The discharge port 32 is formed so as to be offset from the center in the width direction on the other end side (in the direction of arrow B2) of the second casing 14 to the side opposite to the supply port 30 (in the direction of arrow A2 in FIG. 3). . That is, the supply port 30 and the discharge port 32 are not arranged in a straight line in the width direction of the second casing 14 and are offset so as to be alternated in the width direction (arrow A direction).

  Further, the bottom wall 24 is provided with a first guide wall (deflection part) 34 on the downstream side (in the direction of arrow B2) of the supply port 30, and on the upstream side (in the direction of arrow B1) of the discharge port 32. A guide wall (deflecting part) 36 is provided. The first and second guide walls 34 and 36 are formed in, for example, a plate shape fixed to the bottom wall portion 24 by brazing or the like, and are provided at the center in the width direction of the second casing 14 so that the refrigerant flows. It extends in the width direction (arrow A direction) orthogonal to the direction and is erected so as to be orthogonal to the bottom wall portion 24.

  Further, the bottom wall portion 24 is located at a position between the first guide wall 34 and the second guide wall 36 in the longitudinal direction (arrow B1, B2 direction) of the second casing 14 that is the refrigerant flow direction. A plurality of slits S1 to S7 extending in the width direction orthogonal to the longitudinal direction (the direction of arrow A in FIGS. 2 and 3) are formed.

  The slits S1 to S7 are formed, for example, so as to penetrate the bottom wall 24 with a rectangular cross section as shown in FIGS. 1 to 4, and are arranged in the first casing 12 as shown in FIG. The electronic components E1a to E8a and E1b to E8b are provided at regular intervals along the longitudinal direction (arrow B1 and B2 directions). In other words, as shown in FIGS. 1 and 4, the slits S <b> 1 to S <b> 7 are formed to be recessed downward in the gravity direction (arrow C <b> 1 direction) with respect to the bottom wall portion 24.

  Further, as shown in FIG. 3, the slits S1 to S7 are spaced apart from each other by a predetermined distance from the center in the width direction (arrow A1, A2 direction) to be paired in the width direction (arrow A direction). It is formed.

  The plurality of slits S1 to S7 gradually increase in length L in the width direction (see FIG. 3) from the upstream side on the supply port 30 side toward the downstream side (the arrow B2 direction) on the discharge port 32 side. Formed as follows. That is, the width direction length L of the slit S1 formed on the most upstream side (arrow B1 direction) is the shortest, and the width direction length L of the slit S7 formed on the most downstream side (arrow B2 direction) is the longest. Formed as follows.

  Specifically, as shown in FIG. 3, the slits S <b> 1 to S <b> 7 are formed such that the outer ends 38 on the outer side in the width direction (arrow A <b> 1 and A <b> 2 direction) on the second side wall portion 26 side are substantially at the same position. By changing the position of the inner end 40 on the center side in the width direction, the width direction lengths L are different from each other.

  Thus, in the slits S1 to S7, the electronic components E1a to E8a and E1b to E8b and the slits S1 to S7 are alternated in the longitudinal direction (arrow B1, B2 direction) of the first and second casings 12 and 14. Electronic components E1a to E8a arranged in two rows in the width direction and formed so as to gradually become longer in the width direction from the upstream side toward the downstream side (arrow B2 direction), A pair (two rows) is formed in the width direction corresponding to E1b to E8b.

  As shown in FIGS. 1 and 2, the cover plate 18 is provided so as to come into contact with and cover the bottom wall portion 24 of the second casing 14 from below, so that the plurality of slits S <b> 1 to S <b> 7 are all covered. For example, it is fixed to the bottom wall portion 24 by brazing. Thereby, the slits S <b> 1 to S <b> 7 are brought out of communication with the outside of the second casing 14 by the cover plate 18.

  The fin 16 is bent into a corrugated cross section by forming a thin plate made of, for example, an aluminum material, and the top wall of the first casing 12 along the width direction (direction of arrow A) of the first and second casings 12 and 14. The portions 20 and the bottom wall portion 24 of the second casing 14 are arranged alternately so as to be in contact with each other, and have a wavy cross-sectional shape in the longitudinal direction of the first and second casings 12 and 14 (arrow B1 and B2 directions). It is formed so as to extend along. Further, the fin 16 is disposed so as to cover the plurality of slits S <b> 1 to S <b> 7 by being provided such that the upstream end thereof faces the first guide wall 34 and the downstream end thereof faces the second guide wall 36. (See FIG. 1 and FIG. 3).

  The refrigerant flows in the first and second casings 12 and 14 along the plurality of fins 16 in the flow path 28 along the longitudinal direction downstream (in the direction of arrow B2).

  The liquid cooling type cooling device 10 according to the embodiment of the present invention is basically configured as described above. Next, the operation, action, and effect thereof will be described.

  First, a coolant is supplied from a coolant supply means (not shown) to the supply port 30 through a pipe 42a (see FIG. 1), so that the coolant is downstream from the center in the width direction by the first guide wall 34 (in the direction of arrow B2). The flow into the flow path is interrupted, the flow is divided to the outside in the width direction (arrow A1, A2 direction), and flows in the flow path 28 along the plurality of fins 16 to the downstream side.

  The refrigerant divided by the first guide wall 34 extends along the fins 16 on the outer sides in the width direction (arrows A1 and A2 directions) of the first and second casings 12 and 14 facing the electronic components E1a to E8a and E1b to E8b. When flowing to the downstream side, a part of the refrigerant flowing in the vicinity of the bottom wall portion 24 flows into the slits S1 to S7 recessed downward in the gravitational direction (arrow C1 direction) and flows out again to move upward (arrow). Convection in the (C2 direction) occurs.

  Due to the convection of the refrigerant, the refrigerant flowing in the vicinity of the bottom wall portion 24 which is the lower portion flows toward the refrigerant flowing on the top wall portion 20 side (in the direction of arrow C2) which is the electronic component E1a to E8a, E1b to E8b side and mixed. (See FIG. 4).

  Thereby, it cools by the refrigerant | coolant in order toward the downstream from the electronic components E1a and E1b provided in the upstream (arrow B1 direction). Specifically, heat generated in the electronic components E1a and E1b is transmitted from the top wall portion 20 of the first casing 12 to the fins 16, and the electronic components E1a and E1b out of the refrigerant flowing along the fins 16 Heat is exchanged with the refrigerant flowing in the opposite position, and the refrigerant is cooled by the cold heat transmitted to the electronic components E1a and E1b through the fins 16 and the top wall portion 20 of the first casing 12, and the heat is heated by the heat exchange. Is done.

  And the refrigerant | coolant which flows through the width direction outer side (arrow A1, A2 direction) in the fin 16 is arrange | positioned downstream by distribute | circulating further downstream (arrow B2 direction) after cooling electronic components E1a and E1b. Heat exchange is performed with the electronic components E2a to E8a and E2b to E8b, and the electronic components are cooled in order.

  At this time, the width direction length L of each of the slits S1 to S7 is formed so as to become gradually longer toward the downstream side (the direction of the arrow B2), and when the width direction length L is longer, the refrigerant flows into the inside. Therefore, the flow resistance of the refrigerant increases as it flows downstream (in the direction of arrow B2) in proportion to the length L in the width direction.

  Therefore, in the first and second casings 12 and 14, a part of the refrigerant flowing in the vicinity of the bottom wall portion 24 flows into the slits S <b> 1 to S <b> 7 that gradually increase in the length L in the width direction, thereby downstream. The convection toward the top wall 20 side (in the direction of arrow C2) is promoted as it flows.

  Thereby, each electronic component is produced by deflecting the refrigerant flowing in the vicinity of the bottom wall portion 24 of the second casing 14 upward by the plurality of slits S1 to S7 arranged along the refrigerant flow direction to cause convection. Preferably, the refrigerant on the first casing 12 side (top wall portion 20 side) heated by E1a to E8a and E1b to E8b and the relatively cool refrigerant on the second casing 14 side (bottom wall portion 24 side) are used. Mixing can lower the refrigerant temperature.

  In addition to that, by gradually increasing the counter flow rate from the upstream side toward the downstream side due to the change in the width direction length L of the slits S1 to S7, the bottom of the slits S1 to S7 is positively lowered toward the downstream side. Since the cold refrigerant on the wall 24 side can be convected and mixed with the refrigerant on the top wall 20 side that is gradually warmed by heat exchange with the electronic components E1a to E8a and E1b to E8b, the first casing The refrigerant temperature of the refrigerant flowing through the 12 side is reduced more effectively.

  In other words, by changing the length L in the width direction of the slits S1 to S7 so as to become longer toward the downstream side, it becomes possible to gradually increase the refrigerant stirring effect toward the downstream side.

  Finally, the refrigerant heat-exchanged with each of the electronic components E1a to E8a and E1b to E8b flows along the fin 16 to the discharge port 32 on the downstream side, and from the discharge port 32 to the pipe 42b (see FIG. 1). ). Note that the refrigerant is cooled again outside the first and second casings 12 and 14 and then circulated by being supplied from the coolant supply means to the supply port 30.

  Note that the refrigerant flowing along the fin 16 by the second guide wall 36 disposed on the downstream side of the fin 16 is less likely to flow near the center in the width direction in which the first and second guide walls 34 and 36 are disposed. The electronic components E1a to E8a and E1b to E8b can be more actively distributed to the outside in the width direction (arrows A1 and A2 directions).

  As described above, in the present embodiment, in the first and second casings 12 and 14 constituting the liquid cooling type cooling device 10, a plurality of slits S1 to S1 are formed in the bottom wall portion 24 of the second casing 14 facing the fins 16. S7 is provided, and the slits S1 to S7 are recessed downward in the weight direction (arrow C1 direction) with respect to the bottom wall portion 24, and in the width direction (arrows) substantially orthogonal to the refrigerant flow direction (arrow B2 direction). In addition to extending in the (A direction), the width direction length L gradually increases from the upstream side toward the downstream side (arrow B2 direction).

  As a result, a part of the refrigerant flowing on the second casing 14 side (bottom wall portion 24 side) flows into the slits S1 to S7 and flows back to the flow path 28 side, thereby moving upward (arrow C2). And the convection in the flow path 28, and the convective flow rate of the refrigerant can be increased from the upstream side toward the downstream side according to the change in the width direction length L of each of the slits S1 to S7. .

  As a result, the refrigerant on the first casing 12 side (top wall portion 20 side, direction of arrow C2) heated and exchanged with the electronic components E1a to E8a, E1b to E8b, and the second casing 14 side (direction of arrow C1) are compared. The refrigerant on the first casing 12 side (top wall portion 20 side) is suitably cooled by suitably mixing the refrigerant that is being cooled by convection, and the electronic components E1a to E1a mounted on the first casing 12 are cooled. E8a and E1b to E8b can be effectively cooled. At the same time, the refrigerant on the first casing 12 side warmed as it flows downstream by actively increasing the counter-flow rate upward of the refrigerant flowing on the second casing 14 side toward the downstream side by the slits S1 to S7. The temperature of the refrigerant can be effectively reduced by mixing the refrigerated refrigerant with the convection, and the cooling efficiency of each of the electronic components E1a to E8a and E1b to E8b including the electronic components arranged on the downstream side can be further increased.

  In addition, the plurality of slits S1 to S7, as in the liquid cooling type cooling device 10 described above, the width direction length L of the two rows provided on the outer side in the width direction becomes longer toward the downstream side (arrow B2 direction). However, the slits S1a to S7a on one side in the width direction (arrow A1 direction) in the second casing 52 are not limited, for example, as in the liquid cooling type cooling device 50 shown in FIG. The slits S1b to S7b on the other side in the width direction (arrow A2 direction) are formed such that the width direction length L2 is gradually increased toward the downstream side (arrow B2 direction). May be.

  In this case, the width direction length L1 of the slits S1a to S7a on one side in the width direction (arrow A1 direction) is the length L2 in the width direction of the slit S7b on the other side in the width direction (arrow A2 direction). Is set to be approximately equivalent.

  Thereby, in the liquid cooling type cooling device 50 described above, the refrigerant is convected at substantially the same counter flow rate by the plurality of slits S1a to S7a from the upstream side to the downstream side on the one side in the width direction (arrow A1 direction), and in the width direction. On the other side (in the direction of arrow A2), the refrigerant can be convected so as to gradually increase the convective flow rate by the plurality of slits S1b to S7b from the upstream side toward the downstream side.

  Therefore, for example, in the first casing 12, when electronic components E1a to E8a that have a relatively large amount of heat generation and require cooling are arranged on one side in the width direction (arrow A1 direction), substantially the same width direction. By providing the slits S1a to S7a having the length L1, the refrigerant is positively convected, and the cooling efficiency of the electronic components E1a to E8a can be increased.

  On the other hand, when the electronic components E1b to E8b arranged on the other side in the width direction (arrow A2 direction) do not require cooling as much as one side in the width direction, gradually increase the counter flow rate of the refrigerant toward the downstream side. Thus, it is possible to improve the cooling efficiency for the electronic components E1b to E8b that gradually decrease toward the downstream side.

  Thus, when the plurality of slits S1a to S7a and S1b to S7b are provided in two rows along the width direction with respect to the second casing 52, the width direction length L1 of the slits S1a to S7a on one side in the width direction is provided. By setting the width direction length L2 of the slits S1b to S7b on the other side in the width direction to be different from each other, the circulation amount (contrast flow rate) of the refrigerant flowing on one side in the width direction (arrow A1 direction) and the width direction It is possible to freely adjust the flow rate (counter flow rate) of the refrigerant flowing on the other side (in the direction of arrow A2) and to realize optimum cooling efficiency according to the heat generation amount of the electronic components E1a to E8a and E1b to E8b. .

  In addition, the liquid cooling type cooling device according to the present invention is not limited to the above-described embodiment, and it is needless to say that various configurations can be adopted without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10, 50 ... Liquid cooling type cooling device 12 ... 1st casing 14, 52 ... 2nd casing 16 ... Fin 20 ... Top wall part 24 ... Bottom wall part E1a-E8a, E1b-E8b ... Electronic components S1-S7, S1a- S7a, S1b-S7b ... Slit

Claims (4)

A casing having a supply port for supplying a refrigerant and an exhaust port for discharging the refrigerant; and a fin housed in the casing; and a plurality of electronic components with heat generation provided in the casing In a liquid cooling type cooling device that cools by heat exchange with a refrigerant,
The casing includes a first wall portion on which the electronic component is mounted, and a second wall portion facing the first wall portion with the fin interposed therebetween,
In the second wall portion, a surface facing the fin is formed with a recess that is recessed in a direction away from the fin and extends in a width direction substantially orthogonal to the flow direction of the refrigerant, and the recess is in the flow direction. A plurality of the recesses along the width direction, and the length in the width direction of at least a part of the recesses is longer in the recesses arranged on the downstream side than the recesses arranged on the upstream side in the flow direction. A liquid cooling type cooling device. In the liquid cooling type cooling device according to claim 1,
The electronic components are provided in at least two rows in the width direction, the recesses are also formed in a plurality of rows corresponding to the electronic components, and are arranged so as to be between the plurality of electronic components. A liquid cooling type cooling device. In the liquid cooling type cooling device according to claim 2,
The concave portion is formed so that the width direction length in one row of the plurality of rows is different from the width direction length in the other row. In the liquid cooling type cooling device according to any one of claims 1 to 3,
The liquid cooling type cooling apparatus, wherein the casing is provided with a deflecting portion that deflects a part of the flow direction of the refrigerant toward the electronic component.

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