JP2010203694A - Liquid cooling type cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid cooling type cooling device capable of uniforming a distribution of flow rate in the width direction of a parallel flow channel part in which a plurality of flow channels are formed in parallel with each other. <P>SOLUTION: This liquid cooling type cooling device 1 includes a casing 2 having a peripheral wall 5 including a right sidewall 6 and a left sidewall 7. A cooling liquid inlet 11 is formed on a front end section of the right sidewall 6, and a cooling liquid outlet 12 is formed on a back end section. The parallel flow channel part 16 composed of the plurality of flow channels 15 is formed on a position between both sidewalls 6, 7 and between the cooling liquid inlet 11 and the cooling liquid outlet 12 in the casing 2. An upstream-side part with respect to the parallel flow channel part 16 in the casing 2 is applied as an inlet header section 21, and a downstream-side part is applied as an outlet header section 22. In the parallel flow channel part 16, a plurality of flow channel groups 17A, 17B respectively composed of the plurality of flow channels 15 and having different passage resistances are arranged in the width direction of the parallel flow channel part 16. The passage resistance of the flow channel group 17A at a right sidewall 6 side is larger than that of the flow channel group 17B at a left sidewall 7 side. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a liquid cooling type cooling device that is applied to a semiconductor power conversion device such as a vehicle and cools a heating element such as a semiconductor element.

  In this specification and claims, the “width of the parallel flow path portion” means a width in a direction orthogonal to the length direction of the flow paths provided in the parallel flow path portion. Further, in this specification and claims, “corrugated fin fin pitch” refers to the adjacent wave in one corrugated fin comprising a wave crest, a wave bottom, and a connecting portion that connects the wave crest and the wave bottom. It shall mean the distance between the tops or the distance between adjacent wave bottoms.

  Conventionally, as this type of liquid cooling type cooling device, the present applicant previously has a peripheral wall provided with a first side wall and a second side wall facing each other, and is cooled at one end of the first side wall. A liquid inlet is formed, and a casing having a cooling liquid outlet formed at the other end of the first side wall is provided. Between the first and second side walls in the casing and between the cooling liquid inlet and the cooling liquid outlet, A parallel flow path portion composed of a plurality of flow paths in which the coolant flows in the length direction of the first and second side walls is provided at a position between them, and a portion upstream of the parallel flow path portion in the casing is cooled. The inlet header portion that leads to the liquid inlet and the outlet header portion that communicates with the coolant outlet at the downstream side of the parallel flow passage portion, and the passage resistance of the parallel flow passage portion is the width direction of the parallel flow passage portion. Liquid cooling that is equal in each part of Proposed location (see Patent Document 1).

  However, in the case of the liquid cooling type cooling device described in Patent Document 1, a cooling liquid inlet and a cooling liquid outlet are formed on the first side wall of the casing, and the passage resistance of the parallel flow path portion is in the width direction of the parallel flow path portion. Therefore, the coolant flowing into the inlet header portion in the casing from the coolant inlet easily flows through the flow path located on the first side wall side in the parallel flow path portion, and the second side wall side. There is a problem that the flow rate distribution in the width direction of the parallel flow path portions becomes non-uniform and the cooling performance is deteriorated in the portion where the flow rate is reduced.

JP-A-2005-274120

  An object of the present invention is to provide a liquid cooling type cooling device that can solve the above-described problems and can uniformize the flow velocity distribution in the width direction of the parallel flow path portions in which a plurality of flow paths are formed in parallel.

  In order to achieve the above object, the present invention comprises the following aspects.

1) A peripheral wall having a first side wall and a second side wall facing each other, and a coolant inlet is formed at one end of the first side wall, and cooling is performed at the other end of the first side wall. A casing having a liquid outlet is provided, and the length of the first and second side walls in the casing is between the first and second side walls and between the cooling liquid inlet and the cooling liquid outlet. A parallel flow path portion composed of a plurality of flow paths flowing in the direction is provided, and a portion upstream of the parallel flow path portion in the casing serves as an inlet header portion leading to the coolant inlet, and more than the parallel flow path portion. A liquid-cooling type cooling device in which a downstream portion is an outlet header portion that leads to a coolant outlet,
A plurality of flow path groups each having a plurality of flow paths and having different passage resistances are provided in the parallel flow path portion side by side in the width direction of the parallel flow path portions. A liquid-cooling type cooling device that is largest in the flow path group at the side wall side end and gradually decreases toward the flow path group at the second side wall side end.

  2) Each flow path group of the parallel flow path portion is constituted by one corrugated fin including a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. It differs for each corrugated fin constituting the road group, the fin pitch of the corrugated fin of the flow path group at the first side wall side end is the smallest, and the fin pitch of the corrugated fin of the flow path group at the second side wall end is The liquid cooling type cooling apparatus according to 1), which is the largest.

  3) Two flow path groups are provided in the parallel flow path portion, and each flow path group in the parallel flow path portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. The liquid cooling according to 1), wherein the fin pitch of the corrugated fins of the channel group on the first side wall side is smaller than the fin pitch of the corrugated fins of the channel group on the second side wall side. Cooling device.

  4) Two flow path groups are provided in the parallel flow path portion, and the flow path group on the first side wall side of the parallel flow path portion connects the wave crest portion, the wave bottom portion, and the wave crest portion and the wave bottom portion. A plurality of corrugated fins including a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion, the flow path of the coolant flows. The liquid cooling type cooling apparatus according to 1), which is configured by being arranged at intervals in the direction.

  5) Two flow path groups are provided in the parallel flow path portion, and the flow path group on the first side wall side of the parallel flow path portion connects the wave crest portion, the wave bottom portion, and the wave crest portion and the wave bottom portion. A plurality of corrugated fins including a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion, the flow path of the coolant flows. The fin pitch of at least one corrugated fin among the corrugated fins of the flow path group on the second side wall side is equal to the fin pitch of the corrugated fins of the flow path group on the first side wall side. In addition, the fin pitch of the other corrugated fins among the plurality of corrugated fins in the flow path group on the second side wall side is larger than the fin pitch of the corrugated fins in the flow path group on the first side wall side. Above 1), wherein the liquid-cooling type cooling device.

  6) Two flow path groups are provided in the parallel flow path portion, and each flow path group of the parallel flow path portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. The corrugated fins of the corrugated fins of the flow path group on the first side wall side meander, the wave bottoms and the connecting parts meander as viewed from the plane, and the wave crests of the corrugated fins of the flow path group on the second side wall side, The liquid cooling type cooling apparatus as described in 1) above, wherein the wave bottom portion and the connecting portion are linear when viewed from the plane.

  7) Three flow path groups are provided in the parallel flow path portion, and each flow path group in the parallel flow path portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. A plurality of louvers are formed in the connecting portion of the corrugated fins of the flow path group at the first side wall side end portion side by side in the length direction of the connecting portion. The corrugated fin's wave crest, wave bottom and connecting portion are linear when viewed from the plane, and the corrugated fin's wave crest, wave bottom and connecting portion of the middle channel group meander as viewed from the plane. The liquid cooling type cooling device according to 1) above.

  According to the liquid cooling type cooling apparatus of 1) to 7) above, a plurality of flow channel groups consisting of a plurality of flow channels and having different passage resistances are arranged in the parallel flow channel portion in the width direction of the parallel flow channel portion. The passage resistance of each flow path group is the largest in the flow path group at the first side wall side end, and gradually decreases toward the flow path group at the second side wall side end. Therefore, the coolant that has flowed into the inlet header portion is less likely to flow through the flow path group at the end portion on the first side wall side in the parallel flow path portion, and toward the flow path group at the end portion on the second side wall side. Accordingly, it becomes easier to flow through the flow path of the flow path group. Therefore, it becomes possible to equalize the flow velocity distribution in the width direction of the parallel flow passage portion in which a plurality of flow passages are formed in parallel, and the occurrence of a portion where the cooling performance is reduced due to the decrease in the flow velocity. Can be prevented.

  According to the liquid cooling type cooling apparatus 2), the passage resistance of each flow path group can be adjusted relatively easily.

  According to the liquid cooling type cooling apparatus of 3) to 6) above, when two flow path groups are provided in the parallel flow path portion, the passage resistance of each flow path group is adjusted relatively easily. be able to.

  According to the liquid cooling type cooling device of the above 7), when three flow path groups are provided in the parallel flow path portion, the passage resistance of each flow path group can be adjusted relatively easily. .

It is a perspective view which shows the liquid cooling type cooling device of Embodiment 1 of this invention. It is the sectional view on the AA line of FIG. FIG. 3 is a sectional view taken along line B-B in FIG. 2. The flow rate ratio (local flow rate / average flow rate) of the flow rate of the water flowing through each part flow path to the average flow speed in all flow paths of the parallel flow path part of the liquid cooling type cooling device of Embodiment 1 is expressed by the passages of both flow path groups. It is a graph shown with the flow rate ratio (local flow rate / average flow rate) of the flow rate of the water which flows through the flow path of each part with respect to the average flow speed in all the flow paths of the parallel flow path part in case resistance is equal. It is a figure equivalent to FIG. 3 which shows the liquid cooling type cooling device of Embodiment 2 of this invention. It is a figure equivalent to FIG. 3 which shows the liquid cooling type cooling device of Embodiment 3 of this invention. It is a figure equivalent to FIG. 3 which shows the liquid cooling type cooling device of Embodiment 4 of this invention. It is a perspective view which expands and shows a part of corrugated fin of the 1st flow path group of the liquid cooling type cooling device of FIG. It is a figure equivalent to FIG. 3 which shows the liquid cooling type cooling device of Embodiment 5 of this invention. FIG. 10 is an enlarged perspective view illustrating a part of the corrugated fins of the first flow path group of the liquid cooling type cooling device of FIG. 9. The flow velocity ratio (local flow velocity / average flow velocity) of the flow velocity of the water flowing through each flow passage to the average flow velocity in all flow passages of the parallel flow passage portion of the liquid cooling type cooling device of the embodiment 5 of the three flow passage groups. It is a graph shown with the flow rate ratio (local flow rate / average flow rate) of the flow rate of the water which flows through the flow path of each part with respect to the average flow speed in all the flow paths of the parallel flow path part when passage resistance is equal.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same part and the same thing through all drawings, and the overlapping description is abbreviate | omitted.

  In the following description, the top and bottom, left and right in FIG. 2 are referred to as top and bottom, and left and right, the bottom of FIGS. 3, 5, 6, 7, and 9 is the front, and the top is the back.

  In the following description, the term “aluminum” includes aluminum alloys in addition to pure aluminum.

Embodiment 1
This embodiment is shown in FIGS.

  1 to 3 show a state in which a semiconductor element as a heating element is attached to the liquid cooling type cooling device according to the first embodiment of the present invention.

  1 to 3, the liquid cooling type cooling device (1) includes a casing (2) including a top wall (3), a bottom wall (4), and a peripheral wall (5), and the peripheral wall of the casing (2). (5) is a vertical right side wall (6) (first side wall) extending in the front-rear direction, a vertical left side wall (7) (second side wall) extending in the front-rear direction and facing the right side wall (6), A vertical rear wall (8) connecting the rear ends of the right side wall (6) and the left side wall (7), and a vertical shape connecting the front ends of the right side wall (6) and the left side wall (7). It consists of a front side wall (9). A coolant inlet (11) is formed at the front end of the right side wall (6) of the peripheral wall (5) of the casing (2) so as to protrude rightward, and the coolant outlet is also formed at the rear end of the right side wall (6). (12) is formed so as to protrude rightward. Each of the coolant inlet (11) and the coolant outlet (12) opens to the right. The casing (2) includes an upper upper component (13) made of an upper peripheral wall forming portion (5A) that forms the top half of the top wall (3) and the peripheral wall (5), and a bottom wall (4) and a peripheral wall ( 5) An aluminum lower component member (14) including a lower peripheral wall forming portion (5B) forming the lower half portion. Outward flanges (13a) and (14a) are respectively provided at the lower end portion of the upper peripheral wall forming portion (5A) of the upper component member (13) and the upper end portion of the lower peripheral wall forming portion (5B) of the lower component member (14). They are integrally formed, and the outward flanges (13a) and (14a) of the two component members (13) and (14) are brazed to each other.

  In the casing (2), the coolant extends in the front-rear direction between the right side wall (6) and the left side wall (7) and between the coolant inlet port (11) and the coolant outlet port (12). A plurality of flow paths (15) flowing in the front-rear direction (the length direction of the right side wall (6) and the left side wall (7)) are formed side by side in the left-right direction. A portion (16) is provided. In the parallel flow path portion (16), a plurality of continuous flow paths (15) and a plurality of different flow path resistances, here two flow path groups (17A) and (17B) are arranged in the left-right direction (parallel They are provided side by side in the width direction of the flow path portion. Hereinafter, the channel group (17A) on the right side wall (6) side is referred to as a first channel group, and the channel group (17B) on the left side wall (7) side is referred to as a second channel group. The passage resistance of the first flow path group (17A) is larger than the passage resistance of the second flow path group (17B). That is, the passage resistance of each flow path group (17A) (17B) is the largest in the first flow path group (17A) at the end portion on the right side wall (6), and the end portion on the left side wall (7) side. It gradually decreases toward the second flow path group (17B).

  Each flow path group (17A) (17B) of the parallel flow path portion (16) includes a wave crest (18a) (19a), a wave bottom (18b) (19b) and a wave crest (18a) (19a) and a wave bottom ( 18 b, 19 b, and a single aluminum corrugated fin 18, 19 composed of vertical connecting portions 18 c, 19 c. Each corrugated fin (18) (19) has a wave crest (18a) (19a) on the top wall (3) of the casing (2), and a wave bottom (18b) (19b) is on the bottom wall (4) of the casing (2). Each is brazed. The fin pitch of the corrugated fins (18) constituting the first flow path group (17A) is smaller than the fin pitch of the corrugated fins (19) constituting the second flow path group (17B). The passage resistance of the first flow path group (17A) is larger than the passage resistance of the second flow path group (17B). The corrugated fins (18) and (19) have the same wall thickness.

  In the casing (2), the upstream (front) portion of the parallel flow passage portion (16) is an inlet header portion (21) leading to the coolant inlet port (11), and the parallel flow passage portion (16) Further, the downstream (rear) portion is an outlet header portion (22) communicating with the coolant outlet (12). The internal height of the entire casing (2), that is, the heights of the inlet header portion (21), the outlet header portion (22), and the parallel flow path portion (16) are equal. In addition, the width in the front-rear direction of the inlet header portion (21) and the outlet header portion (22) is the same over the entire length. The shape of the inflow end portion (21a) on the right side wall (6) side leading to the coolant inlet port (11) in the inlet header portion (21), and the right side wall leading to the coolant outlet port (12) in the outlet header portion (22) ( 6) The shape of the outflow end (22a) on the side is square, the width of the inflow end (21a) of the inlet header (21) (the width in the front-rear direction), and the outflow end of the outlet header (22) The width of (22a) (the width in the front-rear direction) is equal. Moreover, as shown in FIG. 2, the cross-sectional shape of a parallel flow path part (16) is a square.

Here, when the width in the left-right direction of the parallel flow path portion (16) is a mm and the length in the front-rear direction of the flow path (15) of the parallel flow path portion (16) is b mm, a ≧ b. . The width in the left-right direction of the parallel channel portion (16) is amm, the length in the front-rear direction of the channel (15) in the parallel channel portion (16) is bmm, and the inlet end of the inlet header (21) The width of the outflow end portion (22a) of the section (21a) and the outlet header section (22) is cmm, and the height of the inlet header section (21), the outlet header section (22) and the parallel flow path section (16) is 10 mm or less. In this case, it is preferable that the relationship of bc / a ² ≦ 0.15 is satisfied. Further, when the passage resistance of the first passage group (17A) of the parallel passage portion (16) is Ra and the passage resistance of the second passage group (17B) is Rc, Rc = Ra × C and C = It is preferable that the relationship of 0.5 to 0.9 is satisfied. Further, when the horizontal width of the parallel flow path portion (16) is amm and the horizontal width of the first flow path group (17A) of the parallel flow path portion (16) is d, d = a × K And K = 0.15 to 0.8 are preferably satisfied.

  The semiconductor element (P), which is a heating element, is joined to the outer surface of the top wall (3) of the casing (2) via the plate-like insulating member (I).

  In the liquid cooling type cooling device (1) having the above configuration, the coolant flowing into the inlet header portion (21) from the coolant inlet (11) through the inflow end portion (21a) is the parallel flow path portion (16). The flow is divided into all the flow paths (15), and flows backward in all the flow paths (15). At this time, the passage resistance of the second passage group (17B) is smaller than the passage resistance of the first passage group (17A). , That is, the flow velocity distribution in the width direction of the parallel flow path portion (16) is made uniform.

  The coolant flowing backward in the flow path (15) of the parallel flow path portion (16) enters the outlet header (22) and flows to the right in the outlet header (22). It flows out from the coolant outlet (12) through the outflow end (22a) on the left side wall (7) side in (22).

  The heat generated from the semiconductor element (P) is a coolant that flows in the flow path (15) through the insulating member (I), the top wall (3) of the casing (2), and the corrugated fins (18) (19). The semiconductor element (P) is cooled.

  For reference, the flow rate ratio (local flow rate / average flow rate) of the flow rate of the water flowing through each flow channel (15) to the average flow velocity in all flow channels (15) of the parallel flow channel portion (16) is shown in FIG. Is shown by a solid line. In addition, the flow velocity of the water flowing through the flow passages (15) of each part relative to the average flow velocity of all flow passages (15) of the parallel flow passage portion (16) when the passage resistances of both flow passage groups (17A) and (17B) are equal The flow rate ratio (local flow rate / average flow rate) is shown by a broken line in FIG.

Embodiment 2
This embodiment is shown in FIG.

  In the case of the liquid cooling type cooling device (25) of this embodiment, the first flow path group (17A) of the parallel flow path portion (16) is constituted by one corrugated fin (18), and the second flow path group (17b ) Is composed of a wave crest (not shown), a wave bottom (not shown), and a plurality of connecting portions (26a) for connecting the wave crest and the wave bottom, and here two aluminum corrugated fins (26) are provided in the front-rear direction. It is configured by being arranged at intervals in the (cooling liquid flow direction). The corrugated fins (18) and (26) have their wave crests brazed to the top wall (3) of the casing (2), and the wave bottoms are brazed to the bottom wall (4) of the casing (2). The fin pitch of the corrugated fins (18) of the first flow path group (17A) is equal to the fin pitch of both corrugated fins (26) of the second flow path group (17B). The corrugated fins (18) and (26) are equal in thickness. Then, since there is a gap between the corrugated fins (26) constituting the second flow path group (17B), the passage resistance of the first flow path group (17A) is reduced to the passage of the second flow path group (17B). It is larger than the resistance.

  Other configurations are the same as those of the liquid cooling type cooling apparatus (1) of the first embodiment.

Embodiment 3
This embodiment is shown in FIG.

  In the case of the liquid cooling type cooling device (30) of this embodiment, a wave crest (not shown) is formed in the gap between the two corrugated fins (26) in the second channel group (17B) of the parallel channel portion (16). One aluminum corrugated fin (31) including a wave bottom portion (not shown) and a connecting portion (31a) connecting the wave top portion and the wave bottom portion is disposed. The fin pitch of the corrugated fins (31) is larger than the fin pitch of the corrugated fins (18) of the first flow path group (17A). That is, the second flow path group (17B) of the parallel flow path portion (16) includes a plurality of corrugated fins including a wave crest part, a wave bottom part, and connecting parts (26a) and (31a) that connect the wave crest part and the wave bottom part. (26) (31) are arranged in the front-rear direction (flow direction of coolant), and the two corrugations at the front and rear ends of all corrugated fins (26) (31) in the second flow path group (17B) The fin pitch of the fin (26) is equal to the fin pitch of the corrugated fin (18) of the first flow path group (17A), and the corrugated fin (31) at the center of the second flow path group (17B). This fin pitch is larger than the fin pitch of the corrugated fins (18) of the first flow path group (17A). And the fin pitch of the corrugated fin (31) arranged in the gap between the corrugated fins (26) constituting the second flow path group (17B) is the corrugated fin (18) of the first flow path group (17A). As a result, the passage resistance of the first flow path group (17A) is larger than the passage resistance of the second flow path group (17B). In addition, the thickness of all the corrugated fins (18), (26), and (31) is equal.

  Other configurations are the same as those of the liquid cooling type cooling device (25) of the second embodiment.

Embodiment 4
This embodiment is shown in FIG. 7 and FIG.

  In the case of the liquid cooling type cooling device of this embodiment, the first flow path group (17A) of the parallel flow path portion (16) includes the wave crest (36a), the wave bottom (36b), and the wave crest (36a). It is constituted by one aluminum corrugated fin (36) comprising a connecting portion (36c) for connecting the bottom portion (36b). The wave crest portion (36a), the wave bottom portion (36b), and the connecting portion (36c) of the corrugated fin (36) of the first flow path group (17A) meander as viewed from the plane. Further, the corrugated fins (18) constituting the second flow path group (17B) have the same configuration as the corrugated fins (18) of the first flow path group (17A) of Embodiment 1, and the wave crest part and the wave bottom part. The connecting portion (18c) is linear when viewed from the plane. Note that the fin pitches of the corrugated fins (36) and (18) of the two flow path groups (17A) and (17B) are equal. The corrugated fins (36) and (18) are equal in thickness. The wave crest (36a), the wave bottom (36b) and the connecting portion (36c) of the corrugated fin (36) of the first flow path group (17A) meander as viewed from the plane, and the second flow path group ( The corrugated fin (18) of the corrugated fin (17B) has a wave crest, a wave bottom and a connecting portion (18c) that are straight when viewed from above, so that the passage resistance of the first flow path group (17A) is the second flow. It is larger than the passage resistance of the road group (17B).

  Other configurations are the same as those of the liquid cooling type cooling apparatus (1) of the first embodiment.

Embodiment 5
This embodiment is shown in FIGS.

  In the case of the liquid cooling type cooling device (40) of this embodiment, the parallel flow path portion (16) includes a plurality of continuous flow paths (15) and a plurality of flow resistances (here, three) having different flow resistances. The channel groups (41A), (41B), and (41C) are provided side by side in the left-right direction (the width direction of the parallel channel portion). Hereinafter, the channel group (41A) on the right side wall (6) side is referred to as a first channel group, and the channel group (41B) on the left side of the first channel group (41A) is referred to as a second channel group. The flow path group (41C) on the left side wall (7) side is referred to as a third flow path group.

  The first flow path group (41A) of the parallel flow path portion (16) includes a wave crest part (42a), a wave bottom part (42b), and a connection part (42c) that connects the wave crest part (42a) and the wave bottom part (42b). ), And a plurality of louvers (43) extending in the vertical direction on the connecting portion (42c) are formed by one aluminum corrugated fin (42).

  The corrugated fin (36) constituting the second flow path group (41B) has the same configuration as the corrugated fin (36) of the first flow path group (17A) of the fourth embodiment, and has a wave crest part, a wave bottom part, and a connection part. The part (36c) meanders as seen from the plane. Further, the corrugated fins (18) constituting the third flow path group (41C) have the same configuration as the corrugated fins (18) of the first flow path group (17A) of Embodiment 1, and the wave crest part and the wave bottom part. The connecting portion (18c) is linear when viewed from the plane. Note that the fin pitches of the corrugated fins (42), (36), and (18) of the three flow path groups (41A), (41B), and (41C) are equal. In addition, the thickness of all the corrugated fins (42), (36) and (18) is equal. A plurality of louvers (43) are formed in the connecting portion (42c) of the corrugated fin (42) of the first channel group (41A), and the wave crest portion of the corrugated fin (36) of the second channel group (41B). The wave bottom part and the connecting part (36c) meander from the plane, and the wave crest part, the wave bottom part and the connecting part (18c) of the corrugated fin (18) of the third channel group (41C) are seen from the plane. By being linear, the passage resistance of the first flow path group (41A) is larger than the passage resistance of the second flow path group (41B), and the passage resistance of the second flow path group (41B) is the first. It is larger than the passage resistance of the three channel groups (41C). That is, the passage resistance of each channel group (41A) (41B) (41C) is the highest in the first channel group (41A) at the end on the right side wall (6) side, and the left side wall (7) It gradually decreases toward the third flow path group (41C) at the side end.

Here, when the width in the left-right direction of the parallel flow path portion (16) is a mm and the length in the front-rear direction of the flow path (15) of the parallel flow path portion (16) is b mm, a ≧ b. . The width in the left-right direction of the parallel channel portion (16) is amm, the length in the front-rear direction of the channel (15) in the parallel channel portion (16) is bmm, and the inlet end of the inlet header (21) The width of the outflow end portion (22a) of the section (21a) and the outlet header section (22) is cmm, and the height of the inlet header section (21), the outlet header section (22) and the parallel flow path section (16) is 10 mm or less. In this case, it is preferable that the relationship of bc / a ² ≦ 0.15 is satisfied. In addition, the passage resistance of the first passage group (41A) of the parallel passage portion (16) is Ra, the passage resistance of the second passage group (41B) is Rb, and the passage resistance of the third passage group (41C) is In the case of Rc, it is preferable that the relationship of Rb = Ra × C1, Rc = Ra × C2, C1 = 0.5 to 0.9, and C2 = 0.2 to 0.7 is satisfied. Furthermore, the width in the left-right direction of the parallel flow path portion (16) is amm, the width in the left-right direction of the first flow path group (41A) of the parallel flow path portion (16) is e, and the width of the parallel flow path portion (16) is When the width in the left-right direction of the second flow path group (41B) is f, it is preferable that the relationship of e = a × K, f = a × K, and K = 0.15 to 0.5 is satisfied. .

  For reference, the flow velocity ratio (local flow velocity / average flow velocity) of the flow velocity of the water flowing through each flow passage (15) with respect to the average flow velocity in all flow passages (15) of the parallel flow passage portion (16) is shown in FIG. Is shown by a solid line. In addition, when the passage resistances of all the channel groups (41A), (41B), and (41C) are equal, the parallel flow channel portion (16) flows through each channel (15) with respect to the average flow velocity in all the channels (15). The flow rate ratio (local flow rate / average flow rate) of the flow rate of water is shown by a broken line in FIG.

  The liquid cooling type cooling device of the present invention is applied to a semiconductor power conversion device such as a vehicle, and is suitably used for cooling a heating element such as a semiconductor element.

(1) (25) (30) (35) (40): Liquid cooling type cooling device
(2): Casing
(5): Perimeter wall
(6): Right side wall (first side wall)
(7): Left side wall (second side wall)
(11): Coolant inlet
(12): Coolant outlet
(15): Flow path
(16): Parallel flow path
(17A) (17B): Channel group
(18) (19): Corrugated fin
(18a) (19a): Wave peak
(18b) (19b): Wave bottom
(18c) (19c): Connection part
(21): Entrance header
(22): Exit header
(26): Corrugated fin
(26a): Connection part
(31): Corrugated fin
(36): Corrugated fin
(36a): Wave peak
(36b): Wave bottom
(36c): Connection part
(41A) (41B) (41C): Channel group
(42): Corrugated fin
(42a): Wave peak
(42b): Wave bottom
(42c): Connection part
(43): Louva

Claims (7)

A cooling liquid inlet is formed at one end of the first side wall and a cooling liquid outlet at the other end of the first side wall, the peripheral wall having a first side wall and a second side wall facing each other. The cooling liquid is disposed in the casing between the first and second side walls and between the cooling liquid inlet and the cooling liquid outlet in the length direction of the first and second side walls. A parallel flow path portion composed of a plurality of flow paths is provided, and a portion upstream of the parallel flow path portion in the casing serves as an inlet header portion leading to the coolant inlet, and is further downstream than the parallel flow path portion. Is a liquid cooling type cooling device in which the part is an outlet header part leading to the cooling liquid outlet,
A plurality of flow path groups each having a plurality of flow paths and having different passage resistances are provided in the parallel flow path portion side by side in the width direction of the parallel flow path portions. A liquid-cooling type cooling device that is largest in the flow path group at the side wall side end and gradually decreases toward the flow path group at the second side wall side end. Each flow path group of the parallel flow path portion is constituted by one corrugated fin composed of a wave crest part, a wave bottom part, and a connecting part that connects the wave crest part and the wave bottom part. The corrugated fins of the corrugated fins in the flow path group at the first side wall side end are the smallest, and the fin pitches of the corrugated fins in the flow path group at the second side wall end are the largest. The liquid cooling type cooling device according to claim 1. Two channel groups are provided in the parallel channel portion, and each channel group of the parallel channel portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. The liquid cooling type cooling according to claim 1, wherein the fin pitch of the corrugated fins of the channel group on the first side wall side is smaller than the fin pitch of the corrugated fins of the channel group on the second side wall side. apparatus. Two flow path groups are provided in the parallel flow path portion, and the flow path group on the first side wall side of the parallel flow path portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. A plurality of corrugated fins including a wave crest part, a wave bottom part, and a connecting part that connects the wave crest part and the wave bottom part in the flow direction of the coolant. The liquid cooling type cooling apparatus according to claim 1, wherein the liquid cooling type cooling apparatus is configured by being arranged at intervals. Two flow path groups are provided in the parallel flow path portion, and the flow path group on the first side wall side of the parallel flow path portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. A plurality of corrugated fins including a wave crest part, a wave bottom part, and a connecting part that connects the wave crest part and the wave bottom part in the flow direction of the coolant. The fin pitch of at least one corrugated fin among the corrugated fins in the flow path group on the second side wall side is equal to the fin pitch of the corrugated fins in the flow path group on the first side wall side. The fin pitch of the other corrugated fins among the plurality of corrugated fins in the flow path group on the second side wall side is larger than the fin pitch of the corrugated fins in the flow path group on the first side wall side. Motomeko 1 wherein the liquid-cooling type cooling device. Two channel groups are provided in the parallel channel portion, and each channel group of the parallel channel portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. The corrugated fin's wave crest, wave bottom and connecting portion of the flow path group on the first side wall side meander in a plan view, and the wave crest and wave bottom of the corrugated fin in the flow path group on the second side wall side. The liquid cooling type cooling device according to claim 1, wherein the connecting portion is linear when viewed from a plane. Three channel groups are provided in the parallel channel portion, and each channel group of the parallel channel portion includes a wave crest portion, a wave bottom portion, and a connecting portion that connects the wave crest portion and the wave bottom portion. A plurality of louvers are formed in the connecting portion of the corrugated fin of the flow path group at the end portion on the first side wall side, and are arranged side by side in the length direction of the connecting portion. The wave crest portion, wave bottom portion and connecting portion of the fin are linear when viewed from the plane, and the wave crest portion, wave bottom portion and connecting portion of the corrugated fin of the intermediate channel group meander as viewed from the plane. The liquid cooling type cooling device according to 1.

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