JP6055232B2 - Cooling plate and cooling device - Google Patents

Description

  The present invention relates to a cooling plate and a cooling device used in a cooling device for a semiconductor element in which a cooling fluid flows.

  In recent years, semiconductor elements have been used for various purposes. A semiconductor element generates heat due to an energized current. However, the characteristics of the semiconductor element are degraded due to an increase in temperature of the semiconductor element due to the generated heat. For this reason, it is necessary to cool the temperature so that the temperature does not deteriorate. In particular, a large-capacity semiconductor device generates a large amount of heat, so a water-cooling plate that uses water as a cooling fluid and has a high cooling capacity is used.

  The water cooling plate is formed with a flow path through which the cooling fluid flows inside the element mounting surface, and the cooling fluid that has flowed from the inlet passes through the flow path portion and finally flows out from the outlet. The design is important because the shape and arrangement of the flow path and the inlet / outlet affect the cooling performance.

  The cooling fluid gradually rises in temperature due to heat from the semiconductor element when passing through the flow path portion after flowing in from the inlet, and becomes the highest when exiting from the outlet. For this reason, normally, the temperature of the surface which cools the semiconductor element on the surface of the water cooling plate is the lowest in the vicinity of the inlet and the highest in the vicinity of the outlet. That is, even if the semiconductor element near the entrance is well cooled, the semiconductor element near the exit is not sufficiently cooled. As described above, the temperature in the vicinity of the outlet where the temperature of the semiconductor element is the highest needs to be equal to or lower than the predetermined temperature. Therefore, the temperature in the vicinity of the outlet determines the cooling performance of the entire water cooling plate.

  On the other hand, the flow path is folded at an intermediate position between the inlet and the outlet, and the forward path from the intermediate position to the inlet side and the return path from the intermediate position to the outlet side are arranged along the entire surface of the water cooling plate. A water-cooled plate has been proposed. If it does in this way, even if it will take out any part of a water cooling plate, a cold cooling fluid and a warm cooling fluid will circulate along with it. By doing so, the temperature rise of the water-cooled plate surface in the vicinity of the return path having a relatively high temperature can be suppressed due to the influence of the outbound path that is immediately adjacent and relatively low in temperature. Since the vicinity of the outlet having the highest temperature in the return path is adjacent to the vicinity of the inlet having the lowest temperature in the outward path, the temperature is canceled and becomes an intermediate temperature. In this way, the surface temperature is uniform throughout the water-cooled plate, and the maximum temperature is lowered, so that the cooling performance is improved.

  Patent Documents 1 to 3 propose a water-cooled plate in which the above-described forward path and return path are arranged side by side, and further, a water-cooled plate with improved cooling performance by providing some shape on the inner surface of the flow path is proposed. Has been. Patent Document 1 describes a water-cooled plate in which a concave portion having a cross-sectional arc shape is formed on an opposing surface. Patent Document 2 specifically describes a ball-shaped transfer formed on the inner surface of a pipe. A water-cooled plate in which the cooling efficiency is improved by increasing the surface area due to the unevenness is described. Patent Document 3 describes that a similar effect can be achieved even if fins or the like are attached in each flow path and a means for improving the heat transfer coefficient is added. In Patent Documents 1 to 3, in addition to the above-described effect of uniforming the surface temperature of the water-cooled plate, the cooling performance is improved by devising the inside of the flow path.

JP-A-6-268127 JP-A-11-204710 JP 2005-197454 A

  However, none of Patent Documents 1 to 3 mentions in detail the arrangement of the shape to be applied to the inner surface of the flow path for improving the cooling performance. Among them, from the term “opposing surface” described in Patent Document 1, it is inferred that, in Patent Document 1, the unevenness is aligned on the walls on both sides of the flow path. In Patent Document 2, since the method of imparting the uneven shape is a shot ball shape transfer, it is presumed that the positions are aligned on the walls on both sides of the flow path. In this way, when the uneven shape on the inner surface of the flow path is uniform, heat transfer is promoted and the heat transfer rate is not promoted because the heat transfer is not promoted. A region where the temperature does not decrease relatively around the low wall surface appears along the flow direction of the cooling fluid. That is, a relatively low temperature portion and a relatively high portion appear together, resulting in a temperature difference. Note that Patent Document 3 does not describe the position of the fin that is supposed to be on the inner surface of the flow path.

  The main purpose of the water-cooled plate in which the forward path and the backward path described in Patent Documents 1 to 3 are arranged side by side is to make the surface temperature uniform and lower the maximum temperature, but is applied to the inner surface of the flow path. There was no description about the arrangement of the shape of the heat transfer promoting portion, and this was insufficient for making the temperature of the water-cooled plate surface uniform.

  The present invention has been made in view of the above circumstances, and is applied to a cooling device for a semiconductor element in which a cooling fluid flows, and the maximum temperature can be lowered by making the surface temperature more uniform. An object of the present invention is to provide a cooling plate and a cooling device with high cooling performance.

The cooling plate according to the first aspect of the present invention is:
A cooling plate provided with a flow path for circulating a cooling fluid therein,
A first partition, a second partition, and a third partition;
The flow path comprises at least one set of forward and return paths,
The forward path and the return path are disposed adjacent to each other via the first partition wall,
A first heat transfer promoting portion is provided on a partition wall surface on the forward path side of the first partition;
A second heat transfer promoting part is provided on the return wall side partition surface of the first partition;
A third heat transfer promoting portion is provided on a partition wall surface on the forward path side of the second partition;
A fourth heat transfer promoting portion is provided on the return wall side partition surface of the third partition wall;
Said first heat transfer enhancing portion and the front Stories second heat transfer enhancing portion is disposed in alternating direction parallel to the flow direction of the cooling fluid as a reference,
The first heat transfer promotion part and the third heat transfer promotion part are alternately arranged with reference to a direction parallel to the flow direction of the cooling fluid,
The second heat transfer promotion part and the fourth heat transfer promotion part are alternately arranged on the basis of the direction parallel to the flow direction of the cooling fluid,
A fillet is provided between the first heat transfer promoting portion and the first partition;
A fillet is provided between the second heat transfer promoting portion and the first partition;
A fillet is provided between the third heat transfer promoting portion and the second partition;
A fillet is provided between the fourth heat transfer promoting portion and the third partition;
The cross-sectional shape of the heat transfer promoting part cut by a plane passing through the center of the flow path is a quadrangular shape,
The fillet has a circular arc shape connecting the heat transfer promoting portion and the partition wall in a plan view cut by a plane passing through the center of the flow path .
It is characterized by that.

The flow path comprises at least two sets of forward and return paths;
Each of the forward path and the return path includes a substantially straight part and an arcuate part,
The substantially straight portion of the forward path and the substantially straight portion of the return path are connected via the arc-shaped portion in the vicinity of the end of the cooling plate,
The arc-shaped portion may have a smooth surface shape.

A region in the vicinity of the connection portion between the substantially straight portion and the arc-shaped portion has a smooth surface shape,
The length of the region may be less than the length of the pitch of the first heat transfer promoting portion with reference to a direction parallel to the traveling direction of the cooling fluid.

The cooling device according to the second aspect of the present invention is:
The cooling plate is provided.

  ADVANTAGE OF THE INVENTION According to this invention, it applies to the cooling device of the semiconductor element with which a cooling fluid distribute | circulates the inside, the cooling plate with high cooling performance and cooling which can lower the maximum temperature by making the surface temperature more uniform An apparatus can be provided.

It is sectional drawing which shows typically the structure of the cooling plate and cooling device which concern on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the flow of the cooling fluid in the heat-transfer promotion part vicinity of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the edge part vicinity of the cooling plate which concerns on embodiment of this invention. It is sectional drawing which shows typically the structure of the cooling plate which concerns on related technology. It is sectional drawing which shows typically the structure of the cooling plate which concerns on related technology.

  Hereinafter, a water cooling plate 100 (cooling plate) and a cooling device 200 according to an embodiment of the present invention will be described with reference to the drawings. The cooling device 200 according to the embodiment of the present invention includes a water cooling plate 100 (FIG. 1). In the present specification, for simplification and clarification of the drawing, the cooling apparatus 200 includes the water cooling plate 100 only in FIG. 1, but the cooling apparatus 200 according to the embodiment of the present invention is illustrated in FIG. Any of the water-cooling plates according to the embodiment of the present invention shown in FIGS.

  In the embodiment of the present invention, in the water cooling plate 100 provided with flow paths (outward path 110 and return path 112) through which water as a cooling fluid is circulated, the flow path includes at least one pair of forward path 110 and return path 112. It arranges adjacent via the partition 106. FIG. For this reason, the flow path depicted in the water cooling plate 100 of FIGS. 1, 2, and 4 to 14 is part of the water cooling plate 100, while the forward path 110 and the return path 112 are adjacent to each other. It is a cross-sectional view seen through a plane parallel to the surface of the water cooling plate 100 through the center of the flow path.

  As shown in FIG. 1, the water cooling plate 100 is located between the outer partition wall 102 (second partition wall) on the outward path 110, the outer partition wall 104 (third partition wall) on the outer path 112, and the forward path 110 and the return path 112. A partition wall 106 (first partition wall), a forward path 110 through which cooling fluid flows between the partition wall 102 and the partition wall 106, and a return path 112 through which cooling fluid flows between the partition wall 104 and the partition wall 106. . In FIG. 1, the configuration including the pair of forward paths 110 and the return path 112 has been described. However, the water-cooling plate 100 only needs to include at least one pair of the forward path 110 and the return path 112, but is not limited to the following. For example, two sets of forward paths 110 and return paths 112 may be provided, five sets of forward paths 110 and return paths 112 may be provided, or ten sets of forward paths 110 and return paths 112 may be provided.

  The material of the water cooling plate 100 is preferably a material having high thermal conductivity, and for example, aluminum, copper, and alloys thereof are preferably used. In particular, the aluminum alloy is lighter, so it is more preferable for cooling the semiconductor element used for automobiles and vehicles because it leads to improved fuel consumption. When the water cooling plate 100 is manufactured, it is necessary to form an internal space serving as a flow path inside and provide an inlet and an outlet for the cooling fluid. As a manufacturing method of the water-cooled plate 100, for example, a method of dividing and manufacturing a plurality of parts using a method such as cutting, press molding, or extrusion molding, and joining them is used. Various methods for dividing the water-cooled plate 100 into a plurality of parts are conceivable, but as a joining method, in the case of an aluminum alloy, for example, a method of joining parts by brazing heating or the like is excellent in mass productivity and is preferably used. Used. Note that the effect of the present invention is not dependent on the material and manufacturing method of the water cooling plate 100, and the material and manufacturing method of the water cooling plate 100 can be selected as appropriate.

  Further, the heat transfer promotion part 108 (first heat transfer promotion part) provided on both the partition wall surface 114 on the forward path 110 side and the partition wall surface 116 on the return path 112 side of the partition wall 106 between the adjacent forward path 110 and the return path 112. And the second heat transfer promoting part) is shown in FIG. 1 by hatching. The heat transfer facilitating unit 108 alternately turns to the forward path 110 side and the backward path 112 side along a direction parallel to the flow direction of the main flow of the cooling fluid (the flow direction in the forward path 110 is D1, and the flow direction in the return path 112 is D2). Arranged (FIG. 1). The heat transfer promoting unit 108 has a wall surface on the surface thereof where heat transfer is promoted to increase the heat transfer coefficient, and has a function of promoting heat transfer from the cooling fluid to the partition wall 106. By arranging the heat transfer promotion unit 108 alternately on the forward path 110 side and the return path 112 side, a region on the surface of the water-cooled plate 100 where the temperature around the wall surface of the heat transfer promotion unit 108 having a high heat transfer rate is relatively lowered is obtained. It is more preferable that the temperature is more uniform in the water-cooling plate 100 because it is evenly distributed and does not concentrate at a specific position. For example, the heat transfer promoting part 108 and the partition wall 106 may be integrated by joining different members from each other by brazing or soldering, or the flow path (outward path 110 and / or / Alternatively, the material of the portion of the return path 112) may be formed by being removed by a method such as cutting.

  On the other hand, in FIG. 15, the case where arrangement | positioning of the heat-transfer acceleration | stimulation part 8 is prepared in the water cooling plate 1 is shown as related technology. The water cooling plate 1 includes a partition 2 outside the outward path, a partition 4 outside the return path, and a partition 6 between the outbound path and the return path, and an outbound path 10 in which a cooling fluid flows between the partition 2 and the partition 6. And a return path 12 through which a cooling fluid flows between the partition wall 4 and the partition wall 6. As shown in the water-cooled plate 1 in FIG. 15, when the arrangement of the heat transfer promotion portions 8 is not alternately arranged on the partition wall surface 14 on the forward path 10 side and the partition wall surface 16 on the return path 12 side, the wall surface having a high heat transfer coefficient The area of the surface of the water cooling plate 1 where the temperature is relatively lowered appears intermittently along the flow direction (d1 and d2) of the cooling fluid. That is, since the portion where the temperature is relatively lowered and the portion where the temperature is relatively high appear intermittently, the temperature of the water-cooled plate 1 is not sufficiently uniformized.

  In the embodiment of the present invention, the specific shape of the heat transfer promoting unit 108 is not limited to the convex shape described later, but may be a fin shape or a shape that stirs the flow. Any shape and / or means may be used, such as joining by parts, or promoting heat transfer by changing a fine surface shape or surface characteristics.

  As a specific shape of the heat transfer promoting unit 108, for example, a good convex shape protruding toward the main flow of the cooling fluid flow, that is, a flow path (outward path 110 and return path 112) parallel to the surface of the cooling plate 100 is used. The shape of the heat transfer promoting part 108 in the cross section is a convex shape. By doing so, the flow of the cooling fluid meanders at the convex portion of the heat transfer promoting portion 108 and changes its direction, and the flow velocity increases rapidly. The heat transfer coefficient increases on the wall surface where the flow velocity is increased (for example, the high heat transfer coefficient wall surface 118 in FIG. 2). In addition, it becomes possible to sufficiently stir the cooling fluid when the flow direction of the cooling fluid changes, and the cooling fluid that has risen in temperature near the wall surface and the cooling fluid that flows near the center of the flow path away from the wall surface The fluid (cooling fluid having a relatively low temperature) is exchanged. If it does so, since the cooling fluid with comparatively low temperature will replace and come into contact with a wall surface, the effect | action which accelerates | stimulates heat transfer will become large. When the shape of the heat transfer promoting portion 108 is a convex shape, it becomes difficult for the cooling fluid flow to stagnate, and the effect of stirring the cooling fluid can be further increased. As described above, the heat transfer rate in the heat transfer accelerating portion 108 is increased and the heat transfer of the water cooling plate 100 is promoted due to an increase in the flow velocity of the cooling fluid and a change in the flow direction of the cooling fluid. The

  FIG. 2 shows a quadrangular shape as a more specific shape of the convex heat transfer promoting portion 108. The cool quadrilateral shape that protrudes toward the main flow of the cooling fluid increases the flow rate of the cooling fluid and also increases the heat transfer rate by stirring the flow of the cooling fluid to increase the heat transfer rate. More preferable. By making the shape of the heat transfer promoting portion 108 into a quadrangular shape, as shown in FIG. 3, the flow D3 of the cooling fluid is a convex portion of the heat transfer promoting portion 108, meandering toward a place where the flow path becomes narrower. As the direction is changed, the flow velocity increases rapidly in the vicinity of the narrow channel. The heat transfer coefficient increases on the rectangular convex wall surface and the opposite wall surface where the flow velocity is increased. Also, when the flow direction is changed so as to avoid the quadrangular convex shape, the cooling fluid can be sufficiently stirred, the cooling fluid that has received heat near the wall surface and the temperature has risen, and the center of the flow path away from the wall surface The cooling fluid flowing through the gas is replaced. If it does so, since the cooling fluid with comparatively low temperature will replace and come into contact with a wall surface, the effect | action which accelerates | stimulates heat transfer will become large. By doing so, as shown in FIG. 4, a low temperature portion (low temperature portion 120) continues in the partition wall, and the temperature becomes more uniform, which is more preferable.

  On the other hand, FIG. 16 shows a form in which rectangular convex shapes are arranged as a related technique. When the quadrangular convex shapes are not arranged alternately on the forward and return sides, the area of the surface of the water-cooled plate where the temperature decreases around the wall surface where the heat transfer coefficient is high is along the flow direction of the cooling fluid. Will appear intermittently. That is, since the temperature decreasing portion and the relatively high temperature portion appear intermittently, the temperature becomes insufficiently uniform.

  5 to 7 show forms in which the convex shape of the heat transfer promoting unit 108 is a trapezoidal shape, a triangular shape, and an arc shape, respectively. The effect of the convex shape of the heat transfer promoting part 108 being a trapezoidal shape, a triangular shape, or an arc shape is the same as the effect in the case of the quadrangular shape described above. Although there is a difference in the method of providing the heat transfer promotion part 108 on each partition wall of the water cooling plate 100 depending on what convex heat transfer promotion part 108 is used, the effect of stirring the cooling fluid and the degree of increase in pressure loss In consideration of the ease of manufacture and the like, it is possible to appropriately select the shape of the heat transfer promoting portion 108. In addition, the shape of the heat transfer promotion unit 108 illustrated in the present specification is merely an example, and may be another shape, and the ratio of the height and width of the convex shape is not limited to that illustrated. .

  8 to 11 are respectively shown at the boundary between the convex heat transfer promoting portion 108 and the partition wall 106 having a quadrangular shape, a trapezoidal shape, a triangular shape, or an arc shape shown in FIGS. 2 and 5 to 7. The form by which the fillet 122 was provided and the heat-transfer promotion part 108 and the partition 106 were connected smoothly is shown. Providing the fillet 122 reduces the amount of stagnation of the cooling fluid in the vicinity of the root of the convex heat transfer promoting portion 108 where the flow of the cooling fluid changes, so that an increase in pressure loss in the forward path 110 and the return path 112 can be suppressed. The shape of the fillet 122 may be linear as shown in FIGS. 8 to 11 or may be curved. As for the fillet 122, for example, another member may be joined together by brazing or soldering, or the material of the flow path (outward path 110 and return path 112) is originally cut from the integral member, for example. The remaining material removed by a method such as processing may form a fillet.

  In FIG. 12, not only the partition wall 106 between the forward path 110 and the return path 112 but also the opposite wall surfaces (the wall surface 124 on the forward path 110 side and the wall surface 126 on the return path 112 side) have a convex heat transfer promoting portion 108 ( The form with which the 3rd heat transfer promotion part and the 4th heat transfer promotion part) were provided is shown. The water cooling plate 100 shown in FIG. 12 has the heat transfer promoting part 108 having the convex shape of the partition wall 106 between the forward path 110 and the return path 112 and the convex shape of the opposite wall surfaces (the wall surface 124 and the wall surface 126). The heat transfer promoting portions 108 are alternately arranged along a direction parallel to the flow direction of the main flow of the cooling fluid. As shown in FIG. 12, by arranging the heat transfer promoting portions 108 alternately, considering the forward path 110 and the return path 112, the flow snakes along the cooling fluid flow path, but the flow path width increases. -Since the reduction is alleviated, the change in flow velocity will be small. For this reason, an increase in pressure loss can be suppressed. In the form shown in FIG. 12, the heat transfer promoting portions 108 having a convex shape are alternately arranged on a total of four wall surfaces including the wall surface of the forward path 110 and the wall surface of the return path 112. For this reason, the portion where the temperature of the water cooling plate 100 is lowered is more evenly distributed and is not concentrated at a specific position, so that the temperature becomes more uniform, which is more preferable.

  In FIG. 13, the convex shape of the heat transfer promoting portion 108 is a quadrangular shape, and a fillet 122 is provided at the root thereof, and not only the partition wall 106 between the forward path 110 and the return path 112 but also the opposite wall surface (the forward path 110 side). The wall surface 124 and the wall surface 126 on the return path 112 side are shown with a heat transfer promoting portion 108 having a convex shape and a fillet 122 provided at the base thereof. By considering the flow path shape as shown in FIG. 13, when considering the forward path 110 and the return path 112, the flow of the cooling fluid meanders along the flow path, but the flow path width is further expanded or reduced. Since it is further relaxed, the change in the flow rate of the cooling fluid becomes even smaller. For this reason, the increase in the pressure loss in the flow path (outward path 110 and return path 112) in the water-cooling plate 100 can be suppressed to the minimum, which is even more preferable. Further, since the flow path (the forward path 110 and the return path 112) is configured only by a combination of vertical and horizontal straight lines and arcs, the ease of manufacturing can be further enhanced. For example, when the flow path is formed by cutting, if the R of the tool end mill and the R of the fillet 122 provided at the base of the convex shape of the heat transfer promoting unit 108 are matched to each other, a linear shape is obtained. Since the flow path can be formed only by the movement of the tool, the processing time when manufacturing the water-cooled plate 100 can be shortened. In FIG. 13, the form in which the fillet 122 is provided on the water-cooling plate 100 in which the convex shape of the heat transfer promotion unit 108 is a quadrangular shape has been described, but the heat transfer promotion unit 108 may have other shapes. Although not limited to this, the fillet 122 may be provided in the water cooling plate 100 provided with the heat-transfer promotion part 108 which is shapes, such as trapezoid shape, a triangle shape, and circular arc shape, for example.

  FIG. 14 shows the shape of the folded flow path of the forward path 110 and the return path 112 in the vicinity of the end of the water cooling plate 100. In FIG. 14, the water cooling plate 100 includes two sets of an outward path 110 and an inbound path 112, and each of the outbound path 110 and the inbound path 112 includes a substantially linear portion and an arc-shaped portion. The straight portion and the substantially straight portion of the return path 112 are connected so as to be folded back via an arc-shaped portion, and an arc-shaped flow path 128 is formed in the vicinity of the end of the water cooling plate 100. As shown in FIG. 14, the heat transfer promoting part 108 having a convex shape is not provided in the arc-shaped flow path 128 at the end of the water-cooling plate 100 and the vicinity thereof, and has a smooth surface shape. In other words, the heat transfer promoting portion 108 having a convex shape is provided on the water cooling plate 100 to stir the cooling fluid and promote heat transfer, but the folded portion (arc-shaped flow where the direction of the cooling fluid changes 180 degrees. Since the cooling fluid is naturally agitated in the path 128 and the area in the vicinity thereof, it is not necessary to agitate the cooling fluid by further providing the heat transfer promoting part 108 having a convex shape. By not providing the heat transfer promoting part 108 having a convex shape in the part (that is, by having a smooth surface shape), an increase in pressure loss can be suppressed. For this reason, in the embodiment of the present invention, not only the arc-shaped flow path 128 of the water cooling plate 100 but also the vicinity thereof is provided with a region without the heat transfer promoting portion 108 having a convex shape. Note that the distance W ′ from the end of the arcuate flow path 128 to the heat transfer promotion part 108 closest to the arcuate flow path 128 (the heat transfer promotion part 108 provided on the rightmost side in FIG. 14) is approximately If it is smaller than the pitch W of the heat transfer promotion part 108 having a convex shape in the linear part, the heat transfer promotion part 108 having a convex shape may not be provided in the region. Similarly to the partition wall of the water-cooled plate 100 described above, the partition wall that forms the arc-shaped channel 128 is also manufactured by, for example, cutting, press molding, extrusion molding, or the like. In FIG. 14, the configuration including two sets of forward paths 110 and return paths 112 has been described. However, four sets of forward paths 110 and return paths 112 may be provided, or six sets of forward paths 110 and return paths 112 may be provided. Good.

  As described above, in the water cooling plate 100 according to the embodiment of the present invention, the surface temperature of the water cooling plate 100 can be made more uniform, and the maximum temperature of the water cooling plate 100 can be lowered. By applying the semiconductor device to the semiconductor device cooling device 200 in which the cooling fluid flows, the cooling device 200 with high cooling performance can be obtained. In particular, when the amount of heat generated is large as in a large-capacity semiconductor element, it is more preferable to use the water-cooling plate 100 and the cooling device 200 including the water-cooling plate 100 according to the embodiment of the present invention.

  Further, as described above, the fillet 122 is provided in the vicinity of the convex root of the heat transfer promoting portion 108, and not only on the partition wall 106 between the forward path 110 and the return path 112, but also on the opposite wall surface 114 and wall surface 116. Further, by providing the heat transfer promoting part 108 having a convex shape, it is possible to minimize the increase in pressure loss in the forward path 110 and the return path 112, and to make the water-cooled plate 100 with improved manufacturability. Is even more preferable.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation and application are possible. For example, in this embodiment, although the form which uses water as a cooling fluid was demonstrated, you may use LLC (long life coolant) and oil as a cooling fluid. Further, a gas such as air may be used as the cooling fluid, and although it is necessary to change the dimensions of the heat transfer promoting portion 108 and the like, the same action and effect can be exhibited for the same reason as the water cooling plate 100. That is, the cooling plate according to the embodiment of the present invention may be the water cooling plate 100, a cooling plate using a long life coolant or oil as a cooling fluid, or a gas such as air as a cooling fluid. It may be a cooling plate to be used.

  Further, in the embodiment of the present invention, only a part of the flow path including the set of the forward path 110 and the return path 112 has been described. However, as the entire structure of the water cooling plate 100, how the set of the forward path 110 and the return path 112 is determined. Although it may be arrange | positioned and it is not limited to the following, for example, the outward path 110 and the return path 112 may be arrange | positioned like a zigzag folding.

  Further, when the cooling fluid enters from the inlet, the forward path 110 is branched into a plurality of parts, each of which forms a set of the forward path 110 and the backward path 112 to form the heat transfer promoting portion 108 as described above, and finally converges. It may be a flow channel structure that leads to the outlet.

DESCRIPTION OF SYMBOLS 1 Water cooling plate 2 Partition 4 Partition 6 Partition 8 Heat transfer promotion part 10 Outward path 12 Return path 14 Partition surface 16 Partition surface 100 Water cooling plate 102 Partition 104 Partition 106 Partition 108 Heat transfer promotion part 110 Outward path 112 Return path 114 Partition surface 116 Partition surface 118 High heat Transmittance wall surface 120 Low temperature portion 122 Fillet 124 Wall surface 126 Wall surface 128 Arc-shaped channel 200 Cooling device

Claims (4)

A cooling plate provided with a flow path for circulating a cooling fluid therein,
A first partition, a second partition, and a third partition;
The flow path comprises at least one set of forward and return paths,
The forward path and the return path are disposed adjacent to each other via the first partition wall,
A first heat transfer promoting portion is provided on a partition wall surface on the forward path side of the first partition;
A second heat transfer promoting part is provided on the return wall side partition surface of the first partition;
A third heat transfer promoting portion is provided on a partition wall surface on the forward path side of the second partition;
A fourth heat transfer promoting portion is provided on the return wall side partition surface of the third partition wall;
Said first heat transfer enhancing portion and the front Stories second heat transfer enhancing portion is disposed in alternating direction parallel to the flow direction of the cooling fluid as a reference,
The first heat transfer promotion part and the third heat transfer promotion part are alternately arranged with reference to a direction parallel to the flow direction of the cooling fluid,
The second heat transfer promotion part and the fourth heat transfer promotion part are alternately arranged on the basis of the direction parallel to the flow direction of the cooling fluid,
A fillet is provided between the first heat transfer promoting portion and the first partition;
A fillet is provided between the second heat transfer promoting portion and the first partition;
A fillet is provided between the third heat transfer promoting portion and the second partition;
A fillet is provided between the fourth heat transfer promoting portion and the third partition;
The cross-sectional shape of the heat transfer promoting part cut by a plane passing through the center of the flow path is a quadrangular shape,
The fillet has a circular arc shape connecting the heat transfer promoting portion and the partition wall in a plan view cut by a plane passing through the center of the flow path .
A cooling plate characterized by that. The flow path comprises at least two sets of forward and return paths;
Each of the forward path and the return path includes a substantially straight part and an arcuate part,
The substantially straight portion of the forward path and the substantially straight portion of the return path are connected via the arc-shaped portion in the vicinity of the end of the cooling plate,
The arc-shaped portion has a smooth surface shape,
The cooling plate according to claim 1 . A region in the vicinity of the connection portion between the substantially straight portion and the arc-shaped portion has a smooth surface shape,
Based on a direction parallel to the traveling direction of the cooling fluid, the length of the region is less than the length of the pitch of the first heat transfer promoting portion.
The cooling plate according to claim 2 . The cooling plate according to any one of claims 1 to 3 ,
A cooling device characterized by that.