JP2019125733A5 - - Google Patents

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Publication number
JP2019125733A5
JP2019125733A5 JP2018006358A JP2018006358A JP2019125733A5 JP 2019125733 A5 JP2019125733 A5 JP 2019125733A5 JP 2018006358 A JP2018006358 A JP 2018006358A JP 2018006358 A JP2018006358 A JP 2018006358A JP 2019125733 A5 JP2019125733 A5 JP 2019125733A5
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JP
Japan
Prior art keywords
optical fiber
dimming device
same
wafer
amount
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JP2018006358A
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English (en)
Japanese (ja)
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JP7068831B2 (ja
JP2019125733A (ja
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Priority claimed from JP2018006358A external-priority patent/JP7068831B2/ja
Priority to JP2018006358A priority Critical patent/JP7068831B2/ja
Priority to KR1020190004473A priority patent/KR102384828B1/ko
Priority to SG10201900354WA priority patent/SG10201900354WA/en
Priority to US16/248,599 priority patent/US10663287B2/en
Priority to TW108101492A priority patent/TWI750444B/zh
Priority to CN201910043492.5A priority patent/CN110052961B/zh
Publication of JP2019125733A publication Critical patent/JP2019125733A/ja
Publication of JP2019125733A5 publication Critical patent/JP2019125733A5/ja
Publication of JP7068831B2 publication Critical patent/JP7068831B2/ja
Application granted granted Critical
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JP2018006358A 2018-01-18 2018-01-18 研磨装置 Active JP7068831B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018006358A JP7068831B2 (ja) 2018-01-18 2018-01-18 研磨装置
KR1020190004473A KR102384828B1 (ko) 2018-01-18 2019-01-14 연마 장치
SG10201900354WA SG10201900354WA (en) 2018-01-18 2019-01-14 Polishing apparatus
TW108101492A TWI750444B (zh) 2018-01-18 2019-01-15 研磨裝置
US16/248,599 US10663287B2 (en) 2018-01-18 2019-01-15 Polishing apparatus
CN201910043492.5A CN110052961B (zh) 2018-01-18 2019-01-17 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018006358A JP7068831B2 (ja) 2018-01-18 2018-01-18 研磨装置

Publications (3)

Publication Number Publication Date
JP2019125733A JP2019125733A (ja) 2019-07-25
JP2019125733A5 true JP2019125733A5 (https=) 2020-11-26
JP7068831B2 JP7068831B2 (ja) 2022-05-17

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ID=67213754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018006358A Active JP7068831B2 (ja) 2018-01-18 2018-01-18 研磨装置

Country Status (6)

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US (1) US10663287B2 (https=)
JP (1) JP7068831B2 (https=)
KR (1) KR102384828B1 (https=)
CN (1) CN110052961B (https=)
SG (1) SG10201900354WA (https=)
TW (1) TWI750444B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
JP7364217B2 (ja) * 2019-11-05 2023-10-18 スピードファム株式会社 研磨装置
JP2022147223A (ja) * 2021-03-23 2022-10-06 大塚電子株式会社 光学測定システム、光学測定方法および測定プログラム
JP7680347B2 (ja) * 2021-12-24 2025-05-20 株式会社荏原製作所 膜厚測定方法および膜厚測定装置
JP2024093464A (ja) 2022-12-27 2024-07-09 株式会社荏原製作所 光学式膜厚測定器の光量調整方法および研磨装置
JP2024117029A (ja) * 2023-02-16 2024-08-28 株式会社東京精密 研磨終点検出装置及び方法並びにｃｍｐ装置

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Publication number Priority date Publication date Assignee Title
JP3730299B2 (ja) * 1996-02-07 2005-12-21 富士通株式会社 光等化増幅器および光等化増幅方法
JP3506114B2 (ja) * 2000-01-25 2004-03-15 株式会社ニコン モニタ装置及びこのモニタ装置を具えた研磨装置及び研磨方法
US6806948B2 (en) * 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP4096232B2 (ja) * 2002-07-04 2008-06-04 株式会社栗原工業 Ｌｅｄ面光源装置
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
CN100488729C (zh) * 2002-10-17 2009-05-20 株式会社荏原制作所 抛光状态监测装置和抛光装置以及方法
JP2005322939A (ja) * 2005-06-08 2005-11-17 Tokyo Seimitsu Co Ltd ウェーハ研磨方法
JP2011029505A (ja) * 2009-07-28 2011-02-10 Fujitsu Semiconductor Ltd 研磨終点検出方法及び半導体製造装置
GB2478590A (en) * 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
TW201223703A (en) * 2010-09-01 2012-06-16 Applied Materials Inc Feedback control of polishing using optical detection of clearance
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile
US20140224425A1 (en) * 2013-02-13 2014-08-14 Kabushiki Kaisha Toshiba Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatus
JP6105371B2 (ja) * 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
JP2015036714A (ja) * 2013-08-12 2015-02-23 三菱電機株式会社 光減衰器
EP3045106A4 (en) * 2014-06-09 2017-07-05 Olympus Corporation Endoscope system
JP6473050B2 (ja) * 2015-06-05 2019-02-20 株式会社荏原製作所 研磨装置
CN104932066B (zh) * 2015-06-30 2016-05-11 武汉光迅科技股份有限公司 一种硅波导耦合对准装置
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
CN107520740A (zh) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种化学机械抛光中光谱终点的检测方法、装置及系统

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