JP2019114811A - Light-emitting device - Google Patents

Abstract

To provide a light-emitting device that can be easily mounted.SOLUTION: A light-emitting device 10 comprises: a light-emitting element 2 that comprises a semiconductor layer having a main light-emitting surface Q and an electrode formation surface at an opposite side to the main light-emitting surface, and a pair of electrodes 2a and 2b on the electrode formation surface; a coating member 3 that coats a lateral face of the light-emitting element and comprises a recessed part on its outer face; and a metal layer 4 connected with the electrodes and arranged in the recessed part.SELECTED DRAWING: Figure 9

Description

  The present disclosure relates to a light emitting device.

2. Description of the Related Art Conventionally, a light emitting device provided with a light emitting element has been widely used as a light source for a backlight for liquid crystal television, a lighting fixture, and the like. As such a light emitting device, a light emitting device in which an electrode of an LED element is a connection electrode to a mother substrate has been proposed (for example, Patent Document 1).

JP 2012-227470 A

However, in such a light emitting device, the mounting electrode is relatively small, which may make it difficult to mount the light emitting device.
Therefore, an embodiment of the present invention aims to provide a method of manufacturing a light emitting device that is easy to mount.

  A light emitting device according to an embodiment of the present invention includes: a semiconductor layer having a main light emitting surface; and an electrode forming surface opposite to the main light emitting surface; a light emitting element including a pair of electrodes on the electrode forming surface; It is a light-emitting device provided with the covering member which covers the side of a light emitting element, and equips the exterior with a covering member and a metal layer connected to the electrode and arranged in the recess.

According to the method of manufacturing a light emitting device according to the embodiment of the present invention, it is possible to manufacture a light emitting device that is easy to mount.

It is a schematic plan view which shows the process of arrange | positioning a light emitting element on a support body based on the manufacturing method of the light-emitting device of embodiment. It is a schematic sectional drawing in the X1-X1 'line | wire of FIG. 1A. It is a schematic plan view which shows the process of forming a covering member based on the manufacturing method of the light-emitting device of embodiment. It is a schematic sectional drawing in the X2-X2 'line | wire of FIG. 2A. It is a schematic sectional drawing which shows the process of exposing the electrode of a light emitting element from a covering member based on the manufacturing method of the light-emitting device of embodiment. It is a schematic plan view which shows the process of forming a recessed part in a coating member based on the manufacturing method of the light-emitting device of embodiment. It is a schematic sectional drawing in the X4-X4 'line | wire of FIG. 4A. It is a schematic plan view which shows the process of forming a metal layer based on the manufacturing method of the light-emitting device which concerns on embodiment. It is a schematic sectional drawing in the X5-X5 'line | wire of FIG. 5A. It is a schematic plan view which shows the process of removing the metal layer between a pair of electrodes which concerns on the manufacturing method of the light-emitting device which concerns on embodiment. It is a schematic sectional drawing in X6-X6 'line | wire of FIG. 6A. It is a schematic plan view which shows the process of cutting a metal layer in the inner surface of a recessed part based on the manufacturing method of the light-emitting device which concerns on embodiment. It is a schematic sectional drawing in X7-X7 'line | wire of FIG. 7A. It is a schematic side view of the single light emitting device according to the embodiment. FIG. 9 is a schematic cross-sectional view showing an example in which the light emitting device shown in FIG. 8 is joined to a mounting substrate. It is a schematic side view of the light-emitting device single-piece concerning the modification of an embodiment. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device which concerns on the modification of embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting device and the manufacturing method thereof to be described below are for embodying the technical idea of the embodiment, and are not limited to the following. In particular, the dimensions, materials, shapes, relative positions, etc. of the component parts do not limit the technical scope of the present invention, and are merely illustrative examples, and are exaggerated to clarify the explanation. is there. The embodiments described below can be applied by appropriately combining each configuration and the like.

The method of manufacturing a light emitting device according to the present embodiment includes a plurality of light emitting elements provided on the same side with a plurality of separated light emitting elements, and a plurality of light emitting elements such that a part of the surface of the pair of electrodes is exposed. Providing an intermediate body including a side surface and a covering member having a recess between a plurality of light emitting elements, continuously covering the surfaces of the pair of electrodes of the light emitting element and the inner surface of the recess of the covering member It is a manufacturing method of a light emitting device including the process of forming a metal layer, and the process of cutting a covering member and a metal layer in the inner surface of a crevice.
This manufacturing method is, for example, as follows.

1. Step of preparing the intermediate First, a pair of electrodes are provided on the same side, and the side surfaces of the plurality of light emitting elements are covered so that a part of the surfaces of the plurality of separated light emitting elements and the pair of electrodes are exposed. And a step of preparing an intermediate including a covering member having a recess between the plurality of light emitting elements.
This process can be performed, for example, by the following process.

1-1. Arrangement of Light Emitting Element on Support As shown in FIGS. 1A and 1B, a plurality of main light emitting surface Q and a plurality of electrodes having a pair of electrodes 2a and 2b on the electrode forming surface opposite to main light emitting surface Q The light emitting element 2 is disposed on the support 1 so as to be adjacent to each other with the electrodes 2a and 2b facing upward.
The light emitting element 2 includes a semiconductor layer including at least a light emitting layer, and has a main light emitting surface Q and a pair of positive and negative electrodes 2 a and 2 b on an electrode forming surface opposite to the main light emitting surface Q. As described above, light emitting devices are formed with good yield by using only light emitting devices having desired characteristics after using, for example, sorting of characteristics using light emitting elements 2 separated individually from a wafer state. be able to.

The planar shape of the light emitting element 2 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon. Further, the size and thickness of the light emitting element 2 can be appropriately selected. In this embodiment, for example, the light emitting element 2 having a rectangular planar shape can be used.

The support 1 on which the light emitting element 2 is to be disposed is prepared. The support 1 may be removed before cutting a metal layer and a covering member described later, or may be used as part of a light emitting device by cutting together with the metal layer and the covering member.

In this embodiment, the electrodes 2a and 2b of the light emitting element 2 face upward, that is, the main light emitting surface Q is in contact with the support 1, and the upper surface of the electrodes 2a and 2b of the light emitting element 2 is opposite to the support 1 The plurality of light emitting elements 2 are arranged adjacent to each other on the support 1 so as to be arranged in Thereby, it is easy to form a metal layer on an electrode in a later process, and to form a covering member so as to expose the main light emitting surface Q.

Furthermore, it is preferable to arrange the plurality of light emitting elements 2 such that the different poles of the respective light emitting elements 2 are adjacent to each other. Specifically, as shown in FIG. 1A, the positive electrode 2a of one light emitting element 2 and the negative electrode 2b of the other light emitting element 21 are adjacent, and the negative electrode 2b of the one light emitting element 2 and the other It is preferable to arrange the plurality of light emitting elements 2 such that the positive electrode 2 a of the light emitting element 2 is adjacent to the light emitting element 2.

The arrangement intervals of the plurality of light emitting elements 2 can be set arbitrarily. This interval affects the thickness of the covering member 3 and the recess 3a described later. Therefore, it is preferable to adjust the width of the gap so that the desired thickness of the covering member 3 can be obtained. For example, although it depends on the arrangement accuracy of the light emitting element 2, the cutting position accuracy in the subsequent individualization process, the configuration of the covering member 3, and the shape of the recess 3a, 0.
It can arrange | position at intervals of about 1 micrometer-300 micrometers. As a result, it is possible to easily form the metal layer 4 in a later step, and to form the covering member 3 capable of sufficiently shielding light leaking from other than the main light emitting surface Q. Furthermore, the number of light emitting devices manufactured can be increased, and the light emitting devices can be manufactured efficiently.

When disposing the light emitting element 2 on the support 1, for example, an adhesive is previously disposed on the support 1 and the light emitting element 2, or the light emitting element 2 is supported by the adhesive using the support 1 having an adhesive film. It can be fixed on the body 1. As the adhesive, those known in the art such as resins can be used. In particular, when the support 1 is used as a part of the light emitting device 10, it is preferable to use a resin having translucency. When using the adhesive support 1, the support 1 is used.
The light emitting element 2 may be fixed on the support 1 by the adhesiveness of Thus, the light emitting element 2 can be efficiently disposed with a small number of steps. The support 1 may be a flat plate such as a film or ceramic in which an adhesive is disposed on a resin.

1-2. Next, the side surfaces of the plurality of light emitting elements 2 are covered so that the upper surfaces of the pair of electrodes 2a and 2b are exposed, and the covering member 3 having the recess 3a is formed between the plurality of light emitting elements 2 Do.

1-2-1. Forming of Cover Member 3 In this embodiment, next, the cover member 3 that covers the side surfaces of at least the plurality of light emitting elements 2 is formed. Specifically, a covering member 3 is formed on the support 1 so as to continuously cover the surface of the plurality of light emitting elements 2 disposed on the support 1 except the portion facing the support 1. By this,
The covering member 3 for protecting the light emitting element 2 can be easily formed, and light leakage from other than the main light emitting surface Q can be prevented when the covering member 3 is light reflective or light shielding. .

Here, as shown in FIGS. 4A and 4B, the covering member 3 is formed so that the electrodes 2a and 2b are exposed from the upper surface of the covering member 3. The covering member 3 may be formed in such a shape that the electrodes 2a and 2b are exposed from the beginning, while covering the covering member 3 up to the upper surface of the electrodes 2a and 2b, for example, as shown in FIGS. 2A and 2B. The electrodes 2a and 2b can be exposed by removing the removal portion 3S on the top of the covering member 3 by cutting, polishing, or the like as shown in FIG. Alternatively, the electrodes 2a and 2b may be exposed by removing the upper portions of the covering member 3 and the electrodes 2a and 2b. Details of the exposure process of the electrodes 2a and 2b will be described later.

As a material of the covering member 3, a material in which a light reflecting or light absorbing substance is contained in a base material such as a resin can be used. The covering member can be formed by molding by transfer molding, compression molding, screen printing, potting, spraying or the like. In particular,
In order to form the covering member 3 reliably to a relatively narrow space between the plurality of light emitting elements 2, a molding method using a mold such as compression molding, compression mold, transfer mold or the like is preferable.
In addition, as described above, the covering member 3 may be formed at one time (indicated that the form in which a part of the formed covering member 3 is removed is also formed at one time), or may be formed in plural times. .

1-2-2. Exposure of Electrodes In the first embodiment, after covering up to the upper surfaces of the electrodes 2a and 2b with the covering member 3, the covering member 3 is removed as shown in FIG. 3 and the light emitting element 2 covered by the covering member 3 is then removed. Electrode 2a, 2
The upper surface of b is exposed from the surface (upper surface) of the covering member 3. Thereby, the metal layer 4 formed in a later step and the electrodes 2a and 2b can be brought into contact to form an electrode for supplying electricity to the light emitting element 2.

For the exposure of the electrodes 2a and 2b, methods such as grinding, cutting and etching can be used.
In order to reduce the decrease in adhesion between the metal layer 4 and the covering member 3 and between the metal layer 4 and the electrodes 2a and 2b provided in a later step, the upper surface of the covering member 3 and the electrodes 2a and 2b is It is preferable to be flat so as to be substantially the same plane. Grinding is preferable from such a viewpoint and a viewpoint of improving mass productivity.
The exposure of the electrodes 2a and 2b may be performed simultaneously with the formation of the covering member 3, or may be performed after the formation of the covering member 3.

1-2-3. Next, in the present embodiment, the recess 3 a is formed by removing a part of the covering member 3. Specifically, as shown in FIGS. 4A and 4B, the covering member 3 between the plurality of light emitting elements 2 is cut in a direction substantially perpendicular to the main light emitting surface Q of the light emitting element 2. Thereby, the metal layer 4 formed in a later process can be formed to the side surface of the light emitting device 10.

The removal of the covering member 3 for forming the concave portion 3a uses a cutting method known in the art, for example, blade dicing using a blade, laser dicing, cutter scribing, drill, blast using a mask, etc. be able to.

When the shapes of the plurality of light emitting elements 2 disposed on the support 1 are the same, it becomes easy to form the recess 3 a of the covering member 3. Furthermore, in the present embodiment, since the side surfaces of the two rectangular light emitting elements 2 are arranged to face each other, the covering member 3 in the vicinity along the four sides of the light emitting element 2
To easily form the recess 3a. Furthermore, the cutting of the covering member 3 and the metal layer 4 and the singulation of the individual light emitting devices can be performed efficiently in a later step.

In addition, formation of the recessed part 3a may be performed simultaneously at the time of shaping | molding of the covering member 3 besides providing by removing a part of covering member 3 shape | molded like this embodiment. For example, the covering member 3 may be formed in a shape having a recess 3a while covering the light emitting element 2 with a mold for forming the covering member 3. In addition, formation of the recessed part 3a may be performed before the exposure process of the above-mentioned electrodes 2a and 2b, and may be performed after. When the step of exposing the electrodes 2a and 2b of the light emitting element 2 is performed, the concave portions 3a can be formed while confirming the positions of the electrodes 2a and 2b of the light emitting element 2 with a camera. The precision of formation of the recessed part 3a can be raised, and it is preferable.

The recess is preferably provided between the plurality of light emitting elements 2 and at a position adjacent to the electrodes 2 a and 2 b of the plurality of light emitting elements. Thereby, the metal layer 4 provided in the recess 3 a can be easily connected to the electrodes 2 a and 2 b of the plurality of light emitting elements 2.

The shape of the inner surface of the recess 3a substantially determines the shape of the metal layer 4 or castellation on the side of the light emitting device 10 to be manufactured. Therefore, the size and characteristics of the light emitting device 10 to be manufactured may be determined.
For example, the depth (the width in the vertical direction in FIG. 4B) of the recess 3 a can be, for example, about 1% to 99% of the height of the light emitting device 10. When the depth of the recess 3a is increased, the area of the metal layer 4 provided on the side surface of the light emitting device 10 can be increased, so that the mounting strength can be increased when the light emitting device 10 is mounted on a mounting substrate. However, if the depth of the concave portion 3a is too deep, the end of the metal layer 4 and the light emitting surface of the light emitting device 10 come close, so there is a possibility that an adhesive member such as solder used for mounting may affect the light emission of the light emitting device. . Therefore, for example, it is preferable to set the depth of the recess 3 a to about 20 to 50% of the height of the light emitting device 10.

The shape of the recess 3 a in a top view may be a rectangle, a circle, or the like long in the direction along the side of the light emitting element 2. The recess 3 a is preferably extended so that the metal layer 4 can be formed from the end of one side surface of the light emitting device 10 to the end. The mounting accuracy of the light emitting device 10 can be enhanced by using such a metal layer 4.
The recess 3 a may be a groove extending adjacent to the plurality of light emitting elements 2. Thus, the recess 3a can be easily provided by cutting or molding with a die. On the other hand, a plurality of recessed portions separated in top view may be provided. For example, it may be a separate recess 3 a adjacent to each of the plurality of light emitting elements 2.
It is preferable that the width (the length in the horizontal direction in FIG. 4B) of the recess 3 a be provided to such an extent that the metal layer 4 can be formed and easily cut. The side surface of the recess 3a may be inclined or vertical.
The recess 3 a may be provided in a portion to be a side surface of the light emitting device 10, and in the case of manufacturing the light emitting device 10 having a plurality of light emitting elements 2, provided between all the plurality of light emitting elements 2. It does not have to be done.

As shown in FIG. 5B, two or more recesses may be provided between two light emitting elements 2.
On the other hand, as shown in FIG. 11, only one recess 3 a can be provided between the two light emitting elements 2. As a result, the width of the recess 3a can be increased without increasing the distance between the light emitting elements 2, so that the inner surface of the recess 3a described later can be easily cut. Also, the recess 3a
The material of the relatively expensive metal layer 4 formed therein can be effectively utilized, and an inexpensive light emitting device can be manufactured.

  Intermediate 100 is obtained as described above.

Next, the metal layer 4 is formed to continuously cover the surfaces of the pair of electrodes 2 a and 2 b of the light emitting element 2 and the inner surface of the recess 3 a of the covering member 3 in the intermediate 100.

2. Formation of Metal Layer As shown in FIGS. 5A and 5B, the surface (upper surface) on which the electrode of the light emitting element of Intermediate 100 is exposed.
And the metal layer 4 is formed over the inner surface of the recessed part 3a.
Since the metal layer 4 is used as a mounting terminal for the light emitting device 10, the configuration thereof is the light emitting device 1.
It is provided in consideration of 0 mountability and adhesion.
The material of the metal layer 4 can be, for example, gold, silver, nickel, aluminum, rhodium, copper, or a single layer or lamination of these alloys or the like. As a layer in contact with the intermediate 100 (a first layer of a metal layer), it is preferable to use Ni in order to improve adhesion. In order to prevent the diffusion of the mounting solder into the metal layer 4, it is preferable to include a layer of Ru. Moreover, it is preferable to use Au with high corrosion resistance etc. for the outermost surface. That is, it is preferable to use a layered structure of Ni / Ru / Au from the side close to the intermediate 100.
It is preferable that the thickness of the metal layer 4 be thin, and accordingly, when bonding the light emitting device 10 to the mounting substrate, it can be set as a condition that can ensure the bonding strength. The laser ablation can be selectively performed, for example, preferably 1 μm or less, and more preferably 1000 Å or less. Moreover, it is preferable that it is thickness which can reduce corrosion of an electrode, for example, 5 nm or more. Here, the thickness of the metal layer refers to the total thickness of the plurality of layers when the metal layer is configured by laminating a plurality of layers.
When the metal layer 4 has a laminated structure, the thickness of one of the laminated structures is, for example, 10 Å.
It can be 1000 Å, preferably about 150 Å to 1000 Å.
The formation of the metal layer 4 can be performed by ALD, CVD, sputtering, or vapor deposition. Above all, the metal layer 4 can be easily formed by sputtering.

In this embodiment, first, one continuous metal layer 4 is coated with a covering member 3 and a plurality of electrodes 2a, 2
It is formed over substantially the entire surface of the surface of b. Therefore, as shown in FIGS. 6A and 6B,
A part of the metal layer 4 which exists so as to connect between the positive and negative electrodes 2a and 2b of one light emitting element 2 is removed. If not removed, the electrodes 2a and 2b are in a short circuited state, there is no electric supply to the light emitting device 10, and the light emitting device 10 is broken. For example, the metal layer 4 between the electrodes 2a and 2b is exposed to the electrodes 2a and 2b by laser irradiation or etching or router processing.
The metal layer 4 can be removed in a uniaxial direction parallel to b. In particular, according to laser irradiation, the metal layer can be easily and accurately removed by ablation.

Thus, a part of the metal layer 4 provided on substantially the entire surface of the intermediate body 100 is removed to form the metal layer 4.
It is preferable from the viewpoint of mass productivity because forming the metal layer 4 is easier than forming the metal layer 4 by patterning using a mask or the like.

The height of the metal layer 4 on the side surface of the light emitting device 10 is 1% to 99%, preferably about 10 to 75%, of the height of the light emitting device 10 from the surface facing the mounting substrate of the light emitting device 10
It can be provided at about 5 to 50%. The height of the metal layer 4 can be controlled by the depth of the above-mentioned recess 3 a when the metal layer 4 is formed nonselectively on the upper surface of the intermediate 100.

In this embodiment, since the plurality of light emitting elements 2 are arranged such that the region between the electrodes 2 a and 2 b of the plurality of light emitting elements 2 becomes one strip in plan view, the positive and negative electrodes 2 a of the light emitting element 2
, 2b can be easily removed. In order to remove the metal layer between the electrodes 2a and 2b in a straight line, it is preferable that the arrangement of the plurality of light emitting elements 2 on the support 1 be performed in a state where the positional deviation is small. By arranging the light emitting elements 2 accurately, variations in the shape of the electrodes generated when removing the metal layer 4 between the electrodes 2a and 2b can be reduced, and the productivity and quality stability of the light emitting device can be reduced. Can be improved.

In addition, as long as the metal layer 4 provided on the inner surface of the concave portion 3a and the electrodes 2a and 2b of the light emitting element 2 are electrically connected, the other portion provided on the intermediate 100 may be removed. For example, when the covering member 3 and the metal layer 4 to be described later are cut or separated into pieces as the light emitting device 10, the metal layer 4 provided on the upper surface of the intermediate 100 at the position to be cut is removed. It is also good. As a result, the occurrence of metal burrs and dust during cutting can be reduced, and the light emitting device 10 can be manufactured stably.
After the light emitting device 10 is completed, a portion corresponding to the peripheral portion of the bottom surface of the light emitting device 10 (the surface called the upper surface in the state of the intermediate 100) may be removed.
In the metal layer 4, the portion connected to the one electrode 2 a of the light emitting element 2 and the portion connected to the other electrode 2 b may have substantially the same shape, or may have different shapes. For example, by making these shapes different from each other, it can be used as a mark for identifying the polarity of the light emitting device 10. Such removal can be performed by laser irradiation or etching, router processing, or the like. In particular, according to the laser irradiation, since the metal layer 4 can be removed with high accuracy, it can be easily formed into a relatively complicated shape.
The metal layer 4 may be provided on all of the inner surface of the recess 3a or may be provided partially.

3. Cutting of Cover Member and Metal Layer Next, as shown in FIGS. 7A and 7B, the cover member 3 and the metal layer 4 are cut at the inner surface of the recess 3a.
At this time, the covering member 3 and the metal layer 4 of the portion without the recess 3a can also be cut.
In addition, it is not necessary to cut | disconnect in all the recessed parts 3a. For example, when one light emitting device is manufactured to include a plurality of light emitting elements 2, the covering member 3 between the plurality of light emitting elements 2 is not cut without cutting the recess 3 a disposed between the plurality of light emitting elements 2. Recess 3a (and metal layer 4)
) May be provided.

The cutting is performed by a method capable of cutting the covering member 3 and the metal layer 4. For example, blade dicing using a blade, laser dicing, cutter scribing, or the like can be used.

In the present embodiment, the plurality of recesses 3 which are one groove extended adjacent to the light emitting element 2
Since the inner surface of a is cut using a dicer, cutting can be performed easily.

Cutting of the covering member and the metal layer may be performed so as to divide the recess 3 a into two by cutting at substantially the center of one recess 3 a as shown in FIG. 7B. Moreover, you may carry out so that the side surface on the side which left | separated from the light emitting element 2 among the side surfaces of the inner surface of the recessed part 3a may be removed. Alternatively, the two recesses 3a may be cut at one time so as to remove the covering member disposed between the two recesses 3a in FIG. 7A. As a result, the number of times of cutting can be reduced, and since the cutting and the removal of the covering member not used for the light emitting device can be simultaneously performed, the manufacturing can be easily performed. Alternatively, the recess 3a provided only between two light emitting elements 2 as shown in FIG. 11 may be cut, and the two side surfaces of the one recess 3a may be provided as the side surfaces of two light emitting devices. As a result, the number of cuts can be reduced, which facilitates manufacture.

In the present embodiment, since the covering member 3 is completely cut at the same time when the covering member 3 and the metal layer 4 are cut on the inner surface of the recess, the individualization of the light emitting device described later can be simultaneously performed. , Mass productivity can be enhanced. In addition, after cutting of the covering member 3 and the metal layer 4, the process of removing the covering member 3 or the metal layer 4 and forming may be included.

Segregation of Light Emitting Device In the present embodiment, as shown in FIGS. 7A and 7B, the covering member 3 and the metal layer 4 are cut at portions other than the recess 3 a to form the separating groove 5, thereby forming the light emitting device 10. It is individualized.
As described above, when the same shape of the light emitting element 2 disposed on the support 1 is used, the light emitting device 10 can be easily singulated in addition to the formation of the concave portion 3 a. In this embodiment, the side surfaces of the plurality of rectangular light emitting elements 2 are arranged to face each other.
It is easy to cut along the edges of the light source, and the individual light emitting devices can be efficiently separated.

As described above, as shown in FIGS. 8 and 9, the electrodes of the light emitting device 10 are provided across the surface (side surface) substantially perpendicular to the main light emitting surface Q when mounting on the mounting substrate 8 by singulation. Metal layer 4 can be formed. Even when the electrodes 2a and 2b have the same shape as the electrodes of the mounting substrate 8 and no electrodes are formed, light emission of the light emitting device 10 can be achieved by mounting using the metal layer 4 provided on the side surface of the light emitting device 10. It is possible to manufacture a side view type light emitting device 10 whose surface Q is perpendicular to the mounting surface of the mounting substrate 8.
Thereby, the light emitting device 10 which can be easily mounted on the mounting substrate 8 can be formed.

Thus, by providing the metal layer 4 used for mounting along the side surface of the light emitting device 10,
The light emitting device can be easily and accurately mounted. Moreover, since a solder fillet is formed on the metal layer 4 on the side surface of the light emitting device 10 when mounted, the mounting of the light emitting device 10 can be easily confirmed, and the mounting substrate 8 and the light emitting device 10 are mounted. It is possible to increase the adhesive strength at the time of Accordingly, it can be preferably used for a small light emitting device 10 used as a light source of a backlight of a liquid crystal display, which is relatively difficult to mount and it is difficult to increase the area of the electrode.

The metal layer 4 is preferably provided in a wide area on the bottom surface of the light emitting device 10. For example, it is preferable to be provided in an area of 20% to 90%, more preferably 50% to 80% of the area of the bottom surface of the light emitting device 10. Thereby, the heat dissipation and mounting strength of the light emitting device 10 can be enhanced.

By arranging the metal layer 4 so that the side surface of the metal layer 4 is substantially flush with the side surface of the light emitting device 10, the spacing between the light emitting devices 10 can be obtained while obtaining the above effects when mounting the plurality of light emitting devices 10 side by side. Can be narrowed. Thereby, the light emitting device 10 can be mounted at high density.

In the present embodiment, although the recess 3 a of the groove is provided on each side of each light emitting element 2, one recess may be provided between the adjacent light emitting elements 2. The metal layer 4 may be formed on the side surface of each of the two light emitting devices adjacent to the recess by cutting at the inner surface of such one recess. According to this, the number of times of cutting can be reduced, and the manufacturing efficiency can be enhanced.

In this embodiment, as shown in FIG. 9, the covering member 3 of the light emitting device 10 and the outer surface of the metal layer 4 are provided so as to be substantially the same plane, but as shown in FIG. The covering member 3 may have an opening on the side surface of the light emitting device, and a portion of the metal layer 4 may be provided in the opening to provide castellation. By providing the metal layer 4 in such an opening, the area where the solder and the metal layer adhere to each other can be increased without increasing the height of the metal layer 4, and the mounting reliability of the light emitting device can be enhanced. it can. Such a metal layer 4 widens the width of the recess 3a when preparing the intermediate, and after forming the metal layer 4 on the inner surface of the recess 3a, a part of the bottom 3d of the recess 3a remains in the light emitting device It can be formed by cutting. Such an opening can be formed, for example, by leaving not only the side surface but also the bottom surface 3 d of the inner surface of the recess 3 a in the light emitting device when the covering member 3 and the metal layer 4 are cut.

4. Other Steps In addition to the above steps, for example, a step of forming a wavelength conversion layer, a step of forming a light transmitting layer, and the like may be appropriately performed.

In the step of forming the wavelength conversion layer, a wavelength conversion layer that converts light emitted from the main light emission surface Q into a desired wavelength can be formed to cover the main light emission surface Q. As a wavelength conversion layer, what contained wavelength conversion materials, such as fluorescent substance, in base materials, such as resin and glass, can be used, for example. The wavelength conversion layer can be formed by a desired method such as spraying, printing, application, and sticking. By covering the side surface of the wavelength conversion layer with the covering member as well, it is possible to form a light emitting device having a high contrast between the light emitting part and the non-light emitting part, that is, a so-called line-off property. The wavelength conversion layer is
Depending on the configuration, it may be performed before or after any of the steps described above. For example, a sheet made of a translucent resin containing a wavelength conversion material may be used as the support 1, and the support 1 may be used as a wavelength conversion layer. In addition, a wavelength conversion layer whose periphery is surrounded by the frame of the light shielding member is formed in advance, and is attached to the main light emitting surface before the formation of the covering member, whereby a light emitting device with good line-off can be manufactured. . In addition, after the wavelength conversion layer is adhered to the main light emitting surface of the light emitting element before the formation of the covering member, the covering member may be formed. The wavelength conversion layer and the light emitting element can be easily positioned by adhering the main light emitting surface of the light emitting element so as to face the wavelength conversion layer. A translucent adhesive such as silicone resin can be used to bond the wavelength conversion layer of the translucent adhesive to the light emitting element. The light transmitting adhesive may be provided between the side surface of the light emitting element and the covering member.

In the step of forming the light transmitting layer, the light emitting surface of the light emitting device (specifically, the wavelength conversion layer or the main light emitting surface Q)
It is a process of forming a translucent layer which has translucency on it. The light emitting surface of the light emitting device can be protected by forming the light transmitting layer. As a light transmission layer, resin, glass, etc. which have translucency, for example can be used. In addition, by including a filler etc., the light extraction improvement,
It is possible to reduce the tackiness. The light transmitting layer can be formed by a desired method such as, for example, spraying, printing, application, and sticking. In the case of using the above wavelength conversion layer, the wavelength conversion layer and the light transmission layer may be formed in advance and then provided in the light emitting element.

  Hereinafter, each component will be described.

Light emitting element 2
As the light emitting element 2, a light emitting diode, a laser diode or the like generally used in the relevant field can be used. For example, nitride-based semiconductors (In _x Al _Y Ga _1-x-Y N, 0 ≦ x
, 0 ≦ Y, X + Y ≦ 1), GaP, III-V group compound semiconductor such as GaAs, ZnSe
Various semiconductors such as II-VI compound semiconductors can be used. The light emitting element 2 may have a substrate for growing the semiconductor layer. Examples of the substrate include insulating substrates such as sapphire, and substrates made of oxides such as lithium niobate and neodymium gallium oxide lattice-joined to SiC, ZnO, Si, GaAs, diamond, and nitride semiconductors.
The substrate may be removed using a laser lift off method or the like.

Support 1
As described above, the sheet-like resin, ceramics, glass or the like can be used as the support 1. In particular, it is preferable to use a sheet-like polyimide resin from the viewpoint of heat resistance.
The planar shape, size, thickness and the like of the support 1 can be appropriately adjusted depending on the size and the number of the light emitting elements 2 to be disposed. In particular, a sheet-like support 1 having a uniform thickness and a flat surface is preferable because the light emitting element 2 can be stably disposed.

In the case where the support 1 is used as part of a light emitting device, it is preferable that the support 1 has light transmitting property, and the light transmittance of the light emitting element 2 is 60% or more, 70% or more, 80% or more, 90% or more Is preferred.
In particular, when using the support 1 as a part of a light emitting device, it is preferable to use a resin as the support 1, and silicone resin, silicone modified resin, epoxy resin, epoxy modified resin, phenol resin, polycarbonate resin, acrylic resin, What is formed with resin etc., such as TPX resin, poly norbornene resin, or hybrid resin containing 1 or more types of these resins, is mentioned. Among these, silicone resins or epoxy resins are preferable, and silicone resins having excellent light resistance and heat resistance are particularly preferable.

Furthermore, when the support 1 is used as part of a light emitting device, the wavelength of the light emitting device can be obtained by including a wavelength conversion member for converting the wavelength of light from the light emitting element into the support 1, for example, a phosphor and / or a light emitting material. It can be used as a conversion layer.
As the phosphor and / or the light emitting material, for example, yttrium aluminum garnet (YAG) phosphor can be used.

The support 1 may contain a filler (eg, a diffusing agent, a coloring agent, etc.). For example, silica, titanium oxide, zirconium oxide, magnesium oxide, glass, a crystal or sintered body of a phosphor, a sintered body of a phosphor and a binder of an inorganic substance, and the like can be mentioned.

Cover member 3
The covering member 3 can be formed of, for example, a material in which a resin that is a base material contains a light reflective or light absorbing material. Thereby, the covering member 3 can be easily formed into a desired shape. As a resin, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, unsaturated polyester resin, polyimide resin, modified polyimide resin, phenol resin, urethane resin, acrylate resin, urea resin, acrylic resin, polyphthalamide (
PPA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP) and the like. You may use these individually or in combination of 2 or more types of resin. In particular, heat resistance,
It is preferable to contain a silicone resin from the viewpoint of weather resistance.
Note that the thickness of the covering member 3 (the distance from the side surface of the light emitting element 2 to the side surface of the light emitting device 100, D shown in FIG. 10) is 10 μm to 100 μm, for example. A small light emitting device can be formed while sufficiently blocking light.

As the light reflective or light absorbing substance, for example, ceramics, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, silicon nitride, boron nitride, mullite, niobium oxide, zinc oxide, barium sulfate, Various rare earth oxides (
For example, yttrium oxide, gadolinium oxide) and the like can be mentioned. The light-reflecting or light-absorbing substance is preferably contained in an amount of about 20% by weight to about 80% by weight, and more preferably about 30% by weight to about 70% by weight, based on the total weight of the covering member. Thereby, the light shielding property and the strength of the covering member can be secured.

The light emitting device according to the embodiment of the present invention may be used for various light emitting devices such as illumination light sources, light sources for various indicators, light sources for vehicles, light sources for displays, light sources for backlight of liquid crystals, light sources for sensors, and traffic lights. Can.

REFERENCE SIGNS LIST 1 support 2 light emitting element 2 a, 2 b electrode of light emitting element 3 covering member 3 a concave portion 3 d bottom surface 4 metal layer 5 separation groove 8 mounting substrate 9 solder 10 light emitting device 100 intermediate body

Claims (10)

A semiconductor layer having a main light emitting surface, and an electrode forming surface opposite to the main light emitting surface, and a light emitting element including a pair of electrodes on the electrode forming surface;
A covering member that covers the side surface of the light emitting element and has a recess on the outer surface;
And a metal layer connected to the electrode and disposed in the recess.   The light emitting device according to claim 1, further comprising a wavelength conversion layer covering the main light emitting surface.   The light emitting device according to claim 2, wherein the covering member covers a side surface of the wavelength conversion layer.   The light emitting device according to claim 2, further comprising a translucent adhesive between the covering member and the main light emitting surface.   The light emitting device according to any one of claims 1 to 4, further comprising the translucent adhesive between the covering member and the side surface of the light emitting element.   The light emitting device according to any one of claims 1 to 5, wherein the metal layer is provided in a region at a height of 15 to 50% of the height of the light emitting device from the mounting surface of the light emitting device. .   The light emitting device according to any one of claims 1 to 6, wherein the metal layer is provided on all the inner surfaces of the recess.   The light emitting device according to any one of claims 1 to 6, wherein the metal layer is partially provided on the inner surface of the recess.   The light emitting device according to any one of claims 1 to 8, wherein a thickness of the metal layer is 1 μm or less.   The light emitting device according to any one of claims 1 to 9, wherein the metal layer is a laminated structure.