JP7332880B2 - Method for manufacturing light emitting device - Google Patents

Description

Embodiments of the present invention relate to a method for manufacturing a light emitting device.

A light emitting device using a light emitting diode (LED) is used as a backlight of a liquid crystal display device incorporated in a thin electronic device such as a smart phone. In such a light-emitting device, a side-light-emitting type light-emitting device in which an electrode surface and a light-emitting surface are perpendicular to each other is adopted in order to reduce the thickness of electronic equipment. There is also a demand for further miniaturization of side emission type light emitting devices.

JP 2017-34145 A

An object of the embodiments of the present invention is to provide a method for manufacturing a light-emitting device that can be miniaturized.

A method for manufacturing a light-emitting device according to an embodiment includes: a first electrode forming surface; a first light emitting element having a first element side surface and a pair of first electrodes provided on the first electrode forming surface; and a first conductor located away from the first light emitting element and facing the first element side surface. a pair of first conductive members having inner side surfaces; a covering member that exposes a portion of the pair of first electrodes and the pair of first conductive members and covers the first element side surface and the first conductive inner side surface; providing an intermediate comprising The manufacturing method includes forming a pair of second conductive members electrically connecting the pair of first electrodes and the pair of first conductive members; removing a portion of the covering member such that a first conductive outer surface located opposite to the covering member is exposed from the covering member.

According to the embodiments, it is possible to realize a method for manufacturing a light-emitting device that can be miniaturized.

FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. FIG. 4 is a plan view showing the method for manufacturing the light emitting device according to the first embodiment; It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. 1 is a rear view showing a light emitting device according to a first embodiment; FIG. It is a top view which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 2nd Embodiment. It is a back view which shows the light-emitting device which concerns on 2nd Embodiment. It is a top view which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 3rd Embodiment. It is a rear view showing a light-emitting device according to a third embodiment. It is a top view which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a top view which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is an end elevation which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment. It is a back view which shows the light-emitting device which concerns on 4th Embodiment.

<First embodiment>
First, a method for manufacturing the light emitting device according to the first embodiment will be schematically described.
This embodiment is a method for manufacturing the side emission type light emitting device 1 . The method for manufacturing the light-emitting device 1 according to the present embodiment comprises: a first electrode formation surface 21a; and a pair of first electrodes 23a and 23b provided on the first electrode forming surface 21a and the first element side surface 21c between the first light emitting element 21 and the first A pair of first conductive members 10a and 10b having first conductive inner side surfaces 11a and 11b facing the element side surface 21c, a pair of first electrodes 23a and 23b, and part of the pair of first conductive members 10a and 10b providing an intermediate body 101 including a covering member 30 that is exposed and covers the first element side surface 21c and the first conductive inner side surfaces 11a and 11b.

Further, in the method for manufacturing the light emitting device 1 according to the present embodiment, the pair of second conductive members 40a and 40b for electrically connecting the pair of first electrodes 23a and 23b and the pair of first conductive members 10a and 10b is provided. and covering member 30 such that first conductive outer surfaces 12a and 12b located opposite first conductive inner surfaces 11a and 11b in first conductive members 10a and 10b are exposed from covering member 30. and removing a portion.

A detailed description will be given below.
1A to 8B are diagrams showing a method for manufacturing a light emitting device according to this embodiment. FIG. 8C is a rear view showing the light emitting device according to this embodiment. 1A and 1B show the same process, FIG. 1A being a plan view and FIG. 1B being an end view. However, in FIGS. 1A and 1B, the number and dimensional ratio of each member do not necessarily match. The same applies to the figures after FIG. 2A. End views, such as FIG. 1B, show end views passing through first conductive members that are adjacent in the X direction.

(Preparation step of intermediate 101)
First, as shown in FIGS. 1A and 1B, a first support 111 is prepared. The first support 111 is, for example, an adhesive sheet. A plurality of pairs of first conductive members 10 a and 10 b are arranged on the first support 111 . The first conductive members 10 a and 10 b are fixed in contact with the first support 111 .

The first conductive members 10a and 10b are, for example, metal blocks. More specifically, the first conductive members 10a and 10b are made of a conductive material, such as metal, such as gold (Au) or copper (Cu). When the first conductive members 10a and 10b are made of copper, it is preferable that the surfaces of the first conductive members 10a and 10b be plated with a noble metal such as gold. The shape of the first conductive members 10a and 10b is, for example, a rectangular parallelepiped.

Hereinafter, in this specification, the XYZ orthogonal coordinate system is adopted for convenience of explanation. The directions parallel to and orthogonal to the upper surface of the first support 111 are defined as "X direction" and "Y direction", and the direction perpendicular to the upper surface of the first support 111 is defined as "Z direction". Pairs of the first conductive members 10a and 10b are arranged in a matrix along the X and Y directions. Each pair of first conductive members 10a and 10b are arranged in the Y direction.

Of the side surfaces of the first conductive members 10a and 10b, both side surfaces facing in the X direction are defined as first conductive inner side surfaces 11a and 11b. One of the first conductive inner side surfaces 11a and 11b faces a side surface (first element side surface) of a first light emitting element described later, and the other side of the first conductive inner side surfaces 11a and 11b faces a first conductive inner side surface 11b described later. 2 It faces the side surface of the light emitting element (the side surface of the second element). A first conductive inner surface facing the side surface of the first light emitting element (first element side surface) may be referred to as a first A conductive inner surface. Also, the first conductive inner surface facing the side surface of the second light emitting element (second element side surface) may be referred to as the 1B conductive inner surface. Note that FIG. 1A shows an example in which four pairs of the first conductive members 10a and 10b are arranged along the X direction and two pairs along the Y direction. Although an example in which three first conductive members 10a and 10b are arranged along is shown, the number of arranged first conductive members 10a and 10b is not limited to this.

Next, as shown in FIGS. 2A and 2B, the first light emitting element 21 and the second light emitting element 22 are arranged on the first support 111 . The first light emitting element 21 and the second light emitting element 22 are arranged so as to sandwich the pair of the first conductive members 10a and 10b in the X direction. That is, between the first light emitting element 21 and the second light emitting element 22, a pair of first conductive members 10a and 10b are arranged. A second light emitting element 22 and a first light emitting element 21 are arranged between two first conductive members 10a adjacent in the X direction. The shapes of the first light emitting element 21 and the second light emitting element 22 are substantially rectangular parallelepipeds.

The surface of the first light emitting element 21 includes a first electrode formation surface 21a, a first light extraction surface 21b, and a first element side surface 21c. The first light extraction surface 21b is the surface opposite to the first electrode formation surface 21a. The first element side surface 21c is a surface between the first electrode formation surface 21a and the first light extraction surface 21b. A pair of first electrodes 23a and 23b are provided apart in the Y direction on the first electrode forming surface 21a. The first electrodes 23a and 23b protrude from the first electrode forming surface 21a by their thickness. A first electrode formation surface 21 a and first electrodes 23 a and 23 b of the first light emitting element 21 face the first support 111 . The first element side surface 21c of the first light emitting element 21 faces the first conductive inner side surfaces 11a and 11b (first A conductive inner side surfaces) of the pair of first conductive members 10a and 10b, and is separated from the first conductive members 10a and 10b. Place them apart. As shown in FIG. 2B, in the X direction, the distance from the first element side surface 21c to the first A conductive inner surface is preferably narrower than the width of the first light emitting element 21 and the width of the first conductive member 10a. Thereby, the size of the light emitting device can be reduced in the X direction.

Similarly, the surface of the second light emitting element 22 includes a second electrode formation surface 22a, a second light extraction surface 22b, and a second element side surface 22c. The second light extraction surface 22b is the surface opposite to the second electrode formation surface 22a. The second element side surface 22c is a surface between the second electrode forming surface 22a and the second light extraction surface 22b. A pair of second electrodes 24a and 24b are spaced apart in the Y direction on the second electrode forming surface 22a. The second electrodes 24a and 24b protrude from the second electrode formation surface 22a by their thickness. A second electrode formation surface 22 a and second electrodes 24 a and 24 b of the second light emitting element 22 face the first support 111 . The second element side surface 22c of the second light emitting element 22 faces the first conductive inner side surfaces 11a and 11b (1B conductive inner side surfaces) of the pair of first conductive members 10a and 10b, and is separated from the first conductive members 10a and 10b. Place them apart. As shown in FIG. 2B, in the X direction, the distance from the second element side surface 22c to the 1B conductive inner surface is preferably narrower than the width of the second light emitting element 22 and the width of the first conductive member 10a. In the X direction, the distance from the second element side surface 22c to the first B conductive inner surface is preferably equal to the distance from the first element side surface 21c to the first A conductive inner surface. By doing so, it becomes easier to miniaturize the light emitting device 1 in the X direction. In this specification, variation within ±5% is allowed for equivalent.

Next, as shown in FIGS. 3A and 3B, translucent members 26 are formed on the first light extraction surface 21b of the first light emitting element 21 and on the second light extraction surface 22b of the second light emitting element 22, respectively. to place Each translucent member 26 covers the first light extraction surface 21b and the second light extraction surface 22b, and partially cuts the light emitted from the first light emitting element 21 and the light emitted from the second light emitting element 22. partially transparent.

The translucent member 26 may be a single layer or may have multiple layers. For example, the translucent member 26 may be provided with a wavelength conversion layer 27 and a translucent layer 28 provided on the wavelength conversion layer 27 . In this case, in the wavelength conversion layer 27, phosphor particles may be contained in a base material made of a translucent resin material. The configuration of the translucent member 26 is not limited to this. For example, the wavelength conversion layer 27 may not be provided, and the translucent layer 28 may not be provided. The length of the translucent member 26 in the X direction and the Y direction is preferably longer than the length of the first light emitting element 21 and the length of the second light emitting element 22 . By doing so, it becomes easier to extract the light from the first light emitting element 21 and the second light emitting element 22 .

In the example shown in FIGS. 1A to 3B, the first conductive members 10a and 10b are first arranged on the first support 111, then the first light emitting element 21 and the second light emitting element 22 are arranged, and then Although an example of arranging the translucent member 26 has been shown, the present invention is not limited to this. For example, first the first light emitting element 21 and the second light emitting element 22 may be arranged on the first support 111, then the first conductive members 10a and 10b may be arranged, and then the translucent member 26 may be arranged. good. Alternatively, the first light-emitting element 21 and the second light-emitting element 22 are first arranged on the first support 111, the translucent member 26 is arranged thereon, and then the first conductive members 10a and 10b are arranged. may Alternatively, a laminate including the first light-emitting element 21 and the translucent member 26 and a laminate including the second light-emitting element 22 and the translucent member 26 are prepared in advance, and these laminates are attached to the first support 111. , followed by or before the first conductive members 10a and 10b.

Next, as shown in FIGS. 4A and 4B, the first conductive members 10a and 10b, the first light emitting element 21, the second light emitting element 22, and the translucent member 26 are covered on the first support 111. , forming the covering member 30 . The covering member 30 is made of, for example, white resin. The covering member 30 covers the first element side surface 21c of the first light emitting element 21, the second element side surface 22c of the second light emitting element 22, and the first conductive inner side surfaces 11a and 11b of the pair of first conductive members 10a and 10b. The covering member 30 may be arranged in the space around the first electrodes 23a and 23b between the first support 111 and the first electrode forming surface 21a. Similarly, the covering member 30 may be arranged in the space around the second electrodes 24a and 24b between the first support 111 and the second electrode forming surface 22a. The first surface 30a of the covering member 30 is in contact with the first support 111, and the upper surface of the translucent member 26 is exposed from the covering member 30 on the second surface 30b opposite to the first surface 30a. For example, the covering member 30 may be formed so that at least a portion of the upper surface of the translucent member 26 is not covered on the second surface 30b, and the covering member that covers the upper surface of the translucent member 26 on the second surface 30b. A portion of the covering member 30 may be removed after forming the covering member 30 so that the upper surface of the translucent member 26 is exposed from the covering member 30 . On the second surface 30b, when the covering member 30 covers the upper surface of the translucent member 26, the first conductive members 10a and 10b, the first light emitting element 21, the second light emitting element 22, and the translucent member 26 are buried. The covering member 30 is formed as follows.

Next, as shown in FIGS. 5A and 5B, the covering member 30 and its contents are replaced from the first support 111 to the second support 112 . The inclusion means the first conductive member and the first light emitting element covered with the covering member. When the covering member covers the second light emitting element and/or the translucent member, the second light emitting element and/or the translucent member are also included in the inclusion. The second support 112 is, for example, an adhesive sheet such as a dicing tape. At this time, the second surface 30 b of the covering member 30 and the upper surface of the translucent member 26 adhere to the second support 112 . Then, by peeling the first support 111 from the covering member 30, the first conductive member 10a, the first conductive member 10b, and the first light emitting element 21 are removed from the first surface 30a of the covering member 30. A pair of first electrodes 23 a and 23 b and a pair of second electrodes 24 a and 24 b of the second light emitting element 22 are exposed from the covering member 30 . Thus, the produced intermediate 101 is prepared. In this specification, "preparing an intermediate" includes various actions for obtaining an intermediate. For example, intermediates may be made and prepared, or pre-made intermediates may be purchased and prepared.

(Step of forming second conductive member)
Next, as shown in FIGS. 6A and 6B, second conductive members 40a and 40b are formed on part of the first surface 30a of the covering member 30 of the intermediate body 101. Next, as shown in FIGS. The second conductive members 40a and 40b are, for example, metal films, for example, laminated films of a nickel layer and a gold layer. For example, a metal film is formed on the entire surface of the intermediate 101 by sputtering or electroplating. For example, a metal film having a desired shape may be formed to form the second conductive members 40a and 40b. The membrane may be selectively removed to form second conductive members 40a and 40b.

A pair of second conductive members 40a and 40b connect a pair of first electrodes 23a and 23b and a pair of first conductive members 10a and 10b. The pair of second conductive members 40a and 40b may connect the pair of first electrodes 23a and 23b, the pair of first conductive members 10a and 10b, and the pair of second electrodes 24a and 24b. More specifically, the second conductive member 40 a connects the first electrode 23 a of the first light emitting element 21 , the first conductive member 10 a and the second electrode 24 a of the second light emitting element 22 . The second conductive member 40 b connects the first electrode 23 b of the first light emitting element 21 , the first conductive member 10 b and the second electrode 24 b of the second light emitting element 22 .

(Step of removing part of covering member 30)
Next, as shown in FIGS. 7A and 7B, a blade 113 is used to form a plurality of grooves 114 passing through the covering member 30 from the first surface 30a to the second surface 30b. Note that the grooves 114 may be formed by a known method, for example, by laser. The groove 114 extends in the X direction or the Y direction. However, the groove 114 is not formed in the first light emitting element 21 and the second light emitting element 22 .

When forming the groove 114, a portion of the covering member 30 and a portion of the first conductive members 10a and 10b are removed. Portions of first conductive members 10a and 10b are removed to form first conductive outer surfaces 12a and 12b opposite first conductive inner surfaces 11a and 11b. First conductive outer surfaces 12 a and 12 b are exposed from covering member 30 . If the second conductive member connects the first electrode, the first conductive member, and the second electrode, a portion of the second conductive member is removed when forming the groove 114 . As a result, the covering member 30 is separated for each first light emitting element 21 and each second light emitting element 22, so that the light emitting device can be separated.

(Light emitting device 1)
Next, as shown in FIGS. 8A-8C, the second support 112 is removed. Thereby, a plurality of light emitting devices 1 are manufactured at the same time. Each light-emitting device 1 is provided with a laminate in which the first light-emitting element 21 or the second light-emitting element 22 and the translucent member 26 are laminated. Also, a covering member 30 is provided to cover the side surface of this laminate. The first light extraction surface 21 b of the first light emitting element 21 and the second light extraction surface 22 b of the second light emitting element 22 are exposed from the covering member 30 .

The first electrode 23a and the second electrode 24a are connected to the second conductive member 40a, and the second conductive member 40a is connected to the first conductive member 10a. The first electrode 23b and the second electrode 24b are connected to the second conductive member 40b, and the second conductive member 40b is connected to the first conductive member 10b. The first conductive members 10 a and 10 b are arranged on the first element side surface 21 c side of the first light emitting element 21 or on the second element side surface 22 c side of the second light emitting element 22 . The first conductive members 10 a and 10 b shown in FIG. 8C function as external electrodes of the light emitting device 1 .

The first conductive outer surfaces 12a and 12b are preferably covered with a metal film containing gold. When the first conductive members 10a and 10b contain an oxidizable metal material such as copper, the first conductive outer surfaces 12a and 12b are covered with a metal film containing gold so that the first conductive members 10a and 10b can suppress the oxidation of Alternatively, a metal film may be formed to partially cover the first conductive outer surfaces 12a and 12b and the covering member 30. FIG. This makes it possible to increase the size of the external electrode of the light emitting device, thereby making it easier to improve the bonding strength between the mounting substrate on which the light emitting device is mounted and the light emitting device.

Next, the effects of this embodiment will be described.
According to this embodiment, it is possible to manufacture the side-emission type light-emitting device 1 having the first conductive outer surface as the mounting surface. The mounting surface is the surface facing the mounting substrate on which the light emitting device 1 is mounted. In the light emitting device 1, the first electrodes 23a and 23b of the first light emitting element 21 or the second electrodes 24a and 24b of the second light emitting element 22 are external electrodes via the second conductive members 40a and 40b. It is connected to the first conductive members 10a and 10b. Therefore, the light-emitting device 1 is not provided with a substrate. Thereby, miniaturization of the light-emitting device 1 can be achieved.

<Second embodiment>
9A is a plan view showing the manufacturing method of the light emitting device according to this embodiment, and FIG. 9B is an end view thereof. 10A to 11C are end views showing the method of manufacturing the light emitting device according to this embodiment. FIG. 11D is a rear view showing the light emitting device according to this embodiment. In the second embodiment, differences from the first embodiment will be mainly described, and the description of the same parts as the first embodiment will be simplified or omitted. The same applies to third and fourth embodiments to be described later.

First, a frame 121 is prepared as shown in FIGS. 9A and 9B. The frame 121 includes a plurality of pairs of first conductive members 10a and 10b and an insulating member 14 that holds the plurality of pairs of first conductive members 10a and 10b. The insulating member 14 may be made of, for example, a resin material. The first conductive member 10a has a first conductive inner surface 11a and a first conductive outer surface 12a. The first conductive outer surface 12a is opposite the first conductive inner surface 11a. Similarly, first conductive member 10b has a first conductive inner surface 11b and a first conductive outer surface 12b. The first conductive outer surface 12b is opposite the first conductive inner surface 11b.

The frame 121 has a plurality of rectangular penetrating portions 121a when viewed from the thickness direction (Z direction). The penetrating portions 121a are arranged along the lateral direction (X direction). The first conductive inner side surfaces 11a and 11b of the first conductive members 10a and 10b are exposed to the outside on the inner side surfaces of the through portions 121a. Each of the first conductive inner side surfaces 11a and 11b of the first conductive member is exposed to the outside on the inner side surface of one penetrating portion 121a. The first conductive outer surfaces 12a and 12b of the first conductive members 10a and 10b are disposed within the insulating member 14. As shown in FIG. That is, the first conductive outer surfaces 12a and 12b of the first conductive members 10a and 10b are not exposed to the outside.

Then, the frame 121 is arranged on the first support 111 . At this time, the arrangement direction of the penetrating portions 121a is arranged in the X direction. Also, the first conductive members 10 a and 10 b and the insulating member 14 are arranged so as to be in contact with the first support 111 .

Subsequent steps are the same as in the first embodiment.
That is, as shown in FIG. 10A , the first light emitting element 21 and the second light emitting element 22 are arranged on the first support 111 within the through portion 121 a of the frame 121 . The first light emitting element 21 has a first electrode formation surface 21a, first electrodes 23a and 23b facing the first support 111, and a first element side surface 21c inside the first conductive member of the pair of first conductive members 10a and 10b. It is arranged so as to face the side surfaces 11a and 11b (first A conductive inner side surfaces) and to be positioned away from the first conductive members 10a and 10b. The same applies to the second light emitting element 22 as well.

Next, as shown in FIG. 10B, translucent members 26 are arranged on the first light extraction surface 21b of the first light emitting element 21 and on the second light extraction surface 22b of the second light emitting element 22. Next, as shown in FIG. The translucent member 26 covers the first light extraction surface 21b and the second light extraction surface 22b.

Next, as shown in FIG. 10C, the insulating member 14, the first conductive members 10a and 10b, the first light emitting element 21, the second light emitting element 22, and the translucent member 26 are covered on the first support 111. Thus, the covering member 30 is formed. The first surface 30a of the covering member 30 is in contact with the first support 111, and the upper surface of the translucent member 26 is exposed from the covering member 30 on the second surface 30b.

Next, as shown in FIG. 11A, the covering member 30 and its contents are replaced from the first support 111 to the second support 112 . As a result, on the first surface 30a of the covering member 30, part of the first conductive member 10a, part of the first conductive member 10b, the pair of first electrodes 23a and 23b of the first light emitting element 21, and the second light emitting element Twenty-two pairs of second electrodes 24 a and 24 b are exposed from the covering member 30 . Thus, the produced intermediate 102 is prepared.

Next, second conductive members 40a and 40b are formed on a portion of the first surface 30a of the covering member 30 of the intermediate body 102 . The second conductive member 40 a connects the first electrode 23 a of the first light emitting element 21 , the first conductive member 10 a and the second electrode 24 a of the second light emitting element 22 . The second conductive member 40 b connects the first electrode 23 b of the first light emitting element 21 , the first conductive member 10 b and the second electrode 24 b of the second light emitting element 22 .

Next, as shown in FIG. 11B, a blade 113 is used to remove part of the covering member 30 and part of the insulating member 14 of the frame 121 to form grooves 114 . As a result, the covering member 30 is separated for each of the first light emitting element 21 and the second light emitting element 22, and the light emitting device 2 can be singulated. Also, the first conductive outer surfaces 12 a and 12 b of the first conductive members 10 a and 10 b are exposed from the covering member 30 . The insulating member 14 remains between the first conductive member 10a and the first conductive member 10b. Since the blade 113 does not cut the first conductive members 10a and 10b, wear of the blade 113 is suppressed, and the manufacturing cost of the light emitting device can be reduced.

A part of the first conductive members 10a and 10b may be removed when the grooves 114 are formed. In this case, portions of the first conductive members 10a and 10b may be removed to form first conductive outer surfaces 12a and 12b opposite the first conductive inner surfaces 11a and 11b. .

Thereby, as shown in FIGS. 11C and 11D, a plurality of light emitting devices 2 are manufactured at the same time. In the light emitting device 1 according to the first embodiment, the first conductive member 10a and the first conductive member 10b are surrounded by the covering member 30 when viewed from the first conductive outer surface side (X direction). As shown in FIG. 11D, the light emitting device 2 according to the second embodiment differs in that the first conductive member 10a and the first conductive member 10b are sandwiched between insulating members 14. As shown in FIG.

In the present embodiment, since the frame 121 is prepared in advance and arranged on the first support 111, positioning of the first conductive members 10a and 10b is easy.

<Third Embodiment>
12A is a plan view showing the manufacturing method of the light emitting device according to this embodiment, and FIG. 12B is an end view thereof. 13A to 14C are end views showing the method of manufacturing the light emitting device according to this embodiment. FIG. 14D is a rear view showing the light emitting device according to this embodiment.

First, as shown in FIGS. 12A and 12B, a frame 131 is prepared. The frame 131 includes a plurality of pairs of first conductive members 10a and 10b and an insulating member 15 that holds the plurality of pairs of first conductive members 10a and 10b. The first conductive members 10a and 10b are positioned on one side of the insulating member 15 in the thickness direction. The insulating member 15 may be made of, for example, a resin material. The frame 131 includes a plurality of rectangular through portions 131a when viewed from the thickness direction (Z direction). The penetrating portions 131a are arranged along the lateral direction (X direction). The first conductive members 10a and 10b have first conductive inner surfaces 11a and 11b exposed to the outside on the inner surfaces of two adjacent through portions 131a. As shown in FIG. 12B, the first conductive inner side surfaces 11a and 11b located between two adjacent penetrating portions 131a are exposed to the outside on both side surfaces facing in the X direction. The width of the first conductive inner side surfaces 11a and 11b in the X direction and the width of the insulating member 15 in the X direction may be the same between two adjacent penetrating portions 131a.

Then, the frame 131 is arranged on the second support 112 . At this time, the arrangement direction of the penetrating portions 131a is arranged in the X direction. Also, the frame 131 is arranged in such a direction that the first conductive members 10 a and 10 b are separated from the second support 112 via the insulating member 15 .

Next, as shown in FIG. 13A , the translucent member 26 is arranged on the second support 112 in the through portion 131 a of the frame 131 . The translucent members 26 are arranged so as to sandwich the insulating member 15 located below the first conductive members 10a and 10b in the X direction. When the translucent member 26 includes the wavelength conversion layer 27 and the translucent layer 28, the translucent member 26 can be arranged, for example, so that the translucent layer 28 is positioned on the second support 112 side. .

Next, as shown in FIG. 13B, the first light-emitting element 21 and the second light-emitting element 22 are arranged on the translucent member 26 so as to sandwich the pair of the first conductive members 10a and 10b. The first light emitting element 21 and the second light emitting element 22 are arranged at positions separated from the first conductive members 10a and 10b. At this time, the first light extraction surface 21b and the second light extraction surface 22b face the translucent member 26, and the first element side surface 21c and the second element side surface 22c are the first surfaces of the pair of first conductive members 10a and 10b. It faces the conductive inner surfaces 11a and 11b. In addition, it is preferable to design the thickness of the frame 131 so that the positions of the top surfaces of the pair of first electrodes are substantially equal to the positions of the top surfaces of the first conductive members 10a and 10b in the Z direction.

Next, as shown in FIG. 13C , a covering member 30 is formed on the second support 112 so as to cover the frame 131 , the translucent member 26 , the first light emitting element 21 and the second light emitting element 22 . The second surface 30b of the covering member 30 is in contact with the second support 112, and on the first surface 30a, the first conductive members 10a and 10b, the pair of first electrodes 23a and 23b of the first light emitting element 21, the second light emitting element Twenty-two pairs of second electrodes 24 a and 24 b are exposed from the covering member 30 . Thus, the produced intermediate 103 is prepared.

In addition, by forming the covering member 30 covering the first conductive members 10a and 10b, the first electrodes 23a and 23b, and the second electrodes 24a and 24b and then grinding the covering member 30, the first surface 30a is 1 The conductive members 10 a and 10 b, the first electrodes 23 a and 23 b, and the second electrodes 24 a and 24 b may be exposed from the covering member 30 . At this time, together with the covering member 30, at least one of the first conductive members 10a and 10b, the first electrodes 23a and 23b, and the second electrodes 24a and 24b may be ground. Thereby, the exposed surfaces of the first conductive members 10a and 10b, the first electrodes 23a and 23b, and the second electrodes 24a and 24b can be flush with the first surface 30a of the covering member 30. FIG.

Subsequent steps are the same as in the first embodiment.
That is, as shown in FIG. 14A, the second conductive members 40a and 40b are formed on part of the first surface 30a of the covering member 30 of the intermediate body 103. As shown in FIG. The pair of second conductive members 40a and 40b connect the pair of first electrodes 23a and 23b, the pair of first conductive members 10a and 10b, and the pair of second electrodes 24a and 24b.

Next, as shown in FIG. 14B, a blade 113 is used to remove part of the covering member 30 and part of the insulating member 15 to form grooves 114 . As a result, the covering member 30 is separated for each of the first light emitting element 21 and the second light emitting element 22, and the light emitting device 3 can be singulated. Also, portions of the first conductive members 10a and 10b are removed when the grooves 114 are formed. Thereby, the first conductive outer surface 12a of the first conductive member 10a and the first conductive outer surface 12b of the first conductive member 10b are formed. The first conductive outer surface 12 a and the first conductive outer surface 12 b are exposed from the covering member 30 . The insulating member 15 remains between the first conductive members 10a and 10b and below the first conductive members 10a and 10b.

Thereby, as shown in FIGS. 14C and 14D, a plurality of light emitting devices 3 are manufactured at the same time. In the light-emitting device 1 according to the first embodiment, the first conductive outer surfaces 12a and 12b are surrounded by the covering member 30 when viewed from the first conductive outer surface side (X direction), whereas in FIG. As shown, the light emitting device 3 according to the third embodiment differs in that the first conductive outer surfaces 12a and 12b are surrounded by the insulating member 15 when viewed from the first conductive outer surface side (X direction). there is

In this embodiment, when the frame 131 is placed on the second support 112, the first conductive members 10a and 10b are separated from the second support 112. As shown in FIG. When the first light-emitting element 21 and the second light-emitting element 22 are arranged, the positions of the top surfaces of the first electrodes 23a and 23b and the top surfaces of the second electrodes 24a and 24b in the Z direction are the first conductive members 10a and 10b. It is preferable to design the thickness of the frame 131 so as to be approximately equal to the position of the upper surface of the frame 131 . When the covering member 30 is formed, for example, by grinding at least one of the first conductive members 10a and 10b, the first electrodes 23a and 23b, and the second electrodes 24a and 24b, the first surface 30a is 1 Conductive members 10a and 10b, first electrodes 23a and 23b, and second electrodes 24a and 24b may be exposed. In this embodiment, the first conductive member 10a and the first conductive member 10b, the first electrodes 23a and 23b, and the second electrodes 24a and 24b on the first surface 30a of the covering member 30 are exposed to the outside. Since it is manufactured on the second support 112, the step of replacing the covering member 30 and its contents from the first support 111 to the second support 112 can be omitted.

<Fourth Embodiment>
15A is a plan view showing the manufacturing method of the light emitting device according to this embodiment, and FIG. 15B is an end view thereof. 16A is a plan view showing the manufacturing method of the light emitting device according to this embodiment, and FIG. 16B is an end view thereof. 17A to 18B are end views showing the manufacturing method of the light emitting device according to this embodiment. FIG. 18C is a rear view showing the light emitting device according to this embodiment.

First, as shown in FIGS. 15A and 15B, the translucent member 26 is arranged on the second support 112 . Unlike the first to third embodiments, the translucent member 26 is in a state before it is singulated. One translucent member is provided for two or more light emitting elements. Note that the light emitting element refers to a first light emitting element and/or a second light emitting element, which will be described later. When the translucent member 26 includes the wavelength conversion layer 27 and the translucent layer 28, the translucent layer 28 may be positioned on the second support 112 side.

Next, as shown in FIGS. 16A and 16B, the frame 121 is arranged on the translucent member 26 . The configuration of the frame 121 is as described in the second embodiment. The thickness of the frame 121 is preferably substantially equal to the thickness of the first light emitting element 21 and the second light emitting element 22 .

Subsequent steps are the same as in the third embodiment.
That is, as shown in FIG. 17A, the first light-emitting element 21 and the second light-emitting element 22 are arranged on the translucent member 26 so as to sandwich the pair of the first conductive members 10a and 10b. At this time, it is preferable that the upper surfaces of the first electrodes 23a and 23b and the upper surfaces of the second electrodes 24a and 24b are positioned substantially equal to the upper surface of the frame 121 in the Z direction.

Next, as shown in FIG. 17B, the covering member 30 is formed on the second support 112 . On the first surface 30a of the covering member 30, the first conductive members 10a and 10b, the first electrode forming surface 21a of the first light emitting element 21, the pair of first electrodes 23a and 23b, and the second electrode of the second light emitting element 22 are formed. The surface 22 a and the pair of second electrodes 24 a and 24 b are exposed from the covering member 30 . Thus, the produced intermediate 104 is prepared.

Next, as shown in FIG. 17C, second conductive members 40a and 40b are formed on part of the first surface 30a of the covering member 30 of the intermediate body 104. Next, as shown in FIG.

Next, as shown in FIG. 18A, a blade 113 is used to remove a portion of the covering member 30, a portion of the insulating member 14 of the frame 121, and a portion of the translucent member 26 to form a groove 114. . As a result, the covering member 30 is separated for each of the first light emitting element 21 and the second light emitting element 22, and the light emitting device 4 can be singulated. Also, the translucent member 26 is separated for each of the first light emitting element 21 and the second light emitting element 22 .

In this way, as shown in FIGS. 18B and 18C, a plurality of light emitting devices 4 are manufactured simultaneously. In the light emitting device 1 according to the first embodiment, the first conductive member 10a and the first conductive member 10b are surrounded by the covering member when viewed from the first conductive outer surface side (X direction). As shown in 18C, the light emitting device 4 according to the fourth embodiment differs in that the first conductive member 10a and the first conductive member 10b are sandwiched between the insulating members 14. FIG. Further, in the light-emitting device 1 according to the first embodiment, the translucent members 26 are covered with the covering members 30 on the four side surfaces of the light-emitting device 1, whereas in the light-emitting device 1 according to the fourth embodiment. 4 is different in that the translucent member 26 is exposed from the covering member 30 on four side surfaces of the light emitting device 4 .

According to this embodiment, one translucent member 26 is placed on the second support 112 and separated by the blade 113 together with the covering member 30 and the like, so that multiple translucent members 26 are placed on the second support 112 . 112 can be omitted.

Each above-mentioned embodiment is an example which embodied the present invention, and the present invention is not limited to these embodiments. For example, the present invention includes the addition, deletion, or modification of some components or steps in each of the above-described embodiments. Moreover, each of the above-described embodiments can be implemented in combination with each other.

INDUSTRIAL APPLICABILITY The present invention can be used, for example, as a light source for electronic equipment.

1, 2, 3, 4: light emitting device 10a, 10b: first conductive member 11a, 11b: first conductive inner surface 12a, 12b: first conductive outer surface 14, 15: insulating member 21: first light emitting element 21a : first electrode formation surface 21b: first light extraction surface 21c: first element side surface 22: second light emitting element 22a: second electrode formation surface 22b: second light extraction surface 22c: second element side surface 23a, 23b: second light extraction surface 1 electrode 24a, 24b: second electrode 26: translucent member 27: wavelength conversion layer 28: translucent layer 30: coating member 30a: first surface 30b: second surface 40a, 40b: second conductive member 101, 102 , 103, 104: Intermediate 111: First support 112: Second support 113: Blade 114: Groove 121: Frame 121a: Penetrating part 131: Frame 131a: Penetrating part

Claims (8)

a first electrode forming surface, a first light extraction surface opposite to the first electrode forming surface, a first element side surface between the first electrode forming surface and the first light extracting surface, and the first electrode forming surface and a pair of first conductive members having a first conductive inner side surface located apart from the first light emitting element and facing the side surface of the first element. and a covering member that exposes a portion of the pair of first electrodes and the pair of first conductive members and covers the first element side surface and the first conductive inner side surface;
forming a pair of second conductive members electrically connecting the pair of first electrodes and the pair of first conductive members;
forming a first conductive outer surface on the first conductive member opposite to the first conductive inner surface and exposed from the covering member by removing a portion of the pair of first conductive members; and,
A method for manufacturing a light-emitting device comprising the intermediate body further includes a second light emitting element having a pair of second electrodes, wherein the pair of first conductive members are disposed between the first light emitting element and the second light emitting element;
In the step of forming the pair of second conductive members, the second conductive members are also connected to the pair of second electrodes,
2. The method according to claim 1, wherein the step of forming the first conductive outer surface also removes a portion of the second conductive member and a portion of the covering member so that the second light emitting element is separated from the first light emitting element. A method of manufacturing the described light emitting device. a first electrode forming surface, a first light extraction surface opposite to the first electrode forming surface, a first element side surface between the first electrode forming surface and the first light extracting surface, and the first electrode forming surface and a first conductive inner surface facing the first element side surface away from the first light emitting element and the first conductive inner surface opposite the first conductive inner surface. a pair of first conductive members having first conductive outer surfaces located on the sides ; an insulating member in contact with the first conductive outer surfaces ; a portion of the pair of first electrodes; and a covering member exposing a portion of the insulating member and covering the first element side surface and the first conductive inner surface;
forming a pair of second conductive members electrically connecting the pair of first electrodes and the pair of first conductive members;
removing a portion of the insulating member such that the first conductive outer surface is exposed from the covering member;
A method for manufacturing a light-emitting device comprising the intermediate body further includes a second light emitting element having a pair of second electrodes, wherein the pair of first conductive members are disposed between the first light emitting element and the second light emitting element;
In the step of forming the pair of second conductive members, the second conductive members are also connected to the pair of second electrodes,
4. The step of removing a portion of the insulating member also removes a portion of the second conductive member and a portion of the covering member to separate the second light emitting element from the first light emitting element. 3. A method for manufacturing the light emitting device according to 1 . 5. The method of manufacturing a light-emitting device according to claim 3, wherein in the step of preparing the intermediate, the pair of first conductive members are connected by the insulating member. 6. The method of manufacturing a light emitting device according to claim 1, wherein the intermediate body further includes a translucent member covering the first light extraction surface. 7. The step of preparing the intermediate includes disposing the first light emitting element on the first support so that the first electrode forming surface and the first support face each other. 1. A method for manufacturing a light-emitting device according to claim 1. 7. The step of preparing the intermediate includes disposing the first light emitting element on the second support such that the first light extraction surface faces the second support. 1. A method for manufacturing a light-emitting device according to claim 1.

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