JP2018061027A - Method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device easy to mount.SOLUTION: A method for manufacturing a light-emitting device comprises the steps of: preparing an intermediate including a plurality of light-emitting elements separated from each other and each having a pair of electrodes on the side of one common face, and a covering member which covers side faces of the plurality of light-emitting elements so that the surface of each pair of electrodes is partially exposed, and which has concave portions between the light-emitting elements; forming a metal layer continuously covering the surface of each pair of electrodes of the plurality of light-emitting elements and the inner face of each concave portion of the covering member; and cutting the covering member and the metal layer at the inner face of the concave portion.SELECTED DRAWING: Figure 7B

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  2. Description of the Related Art Conventionally, light emitting devices including light emitting elements have been widely used as light sources for liquid crystal television backlights and lighting fixtures. As such a light emitting device, a light emitting device in which an electrode of an LED element serves as a connection electrode for a mother substrate has been proposed (for example, Patent Document 1).

JP 2012-227470 A

However, since the mounting electrode is relatively small in such a light emitting device, it may be difficult to mount the light emitting device.
Therefore, an embodiment of the present invention aims to provide a method of manufacturing a light emitting device that can be easily mounted.

  A method for manufacturing a light emitting device according to an embodiment of the present invention includes a pair of electrodes on the same surface side, a plurality of light emitting elements separated from each other, and a plurality of surfaces so that a part of the surface of the pair of electrodes is exposed. A step of preparing an intermediate body that includes a covering member that covers a side surface of the light emitting element and has a recess between the plurality of light emitting elements, and a surface of the pair of electrodes of the light emitting element and an inner surface of the recess of the covering member are continuously provided And forming a covering metal layer, and cutting the covering member and the metal layer on the inner surface of the recess.

  According to the method for manufacturing a light emitting device according to the embodiment of the present invention, a light emitting device that can be easily mounted can be manufactured.

It is a schematic plan view which shows the process of arrange | positioning the light emitting element on a support body based on the manufacturing method of the light-emitting device of embodiment. It is a schematic sectional drawing in the X1-X1 'line | wire of FIG. 1A. It is a schematic plan view which shows the process of forming the coating | coated member based on the manufacturing method of the light-emitting device of embodiment. It is a schematic sectional drawing in the X2-X2 'line | wire of FIG. 2A. It is a schematic sectional drawing which shows the process of exposing the electrode of a light emitting element from the coating | coated member based on the manufacturing method of the light-emitting device of embodiment. It is a schematic plan view which shows the process of forming a recessed part in the coating | coated member based on the manufacturing method of the light-emitting device of embodiment. It is a schematic sectional drawing in the X4-X4 'line | wire of FIG. 4A. It is a schematic plan view which shows the process of forming the metal layer based on the manufacturing method of the light-emitting device which concerns on embodiment. It is a schematic sectional drawing in the X5-X5 'line | wire of FIG. 5A. It is a schematic plan view which shows the process of removing the metal layer between a pair of electrodes which concerns on the manufacturing method of the light-emitting device which concerns on embodiment. It is a schematic sectional drawing in the X6-X6 'line of FIG. 6A. It is a schematic plan view which shows the process of cut | disconnecting a metal layer in the inner surface of a recessed part based on the manufacturing method of the light-emitting device which concerns on embodiment. It is a schematic sectional drawing in the X7-X7 'line | wire of FIG. 7A. It is a schematic side view of a single light emitting device according to an embodiment. It is a schematic sectional drawing which shows the example which joined the light-emitting device shown in FIG. 8 to the mounting substrate. It is a schematic side view of the light-emitting device single-piece | unit which concerns on the modification of embodiment. It is a schematic sectional drawing which shows the manufacturing method of the light-emitting device which concerns on the modification of embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting device and the manufacturing method thereof described below are for realizing the technical idea of the embodiment and are not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts do not limit the technical scope of the present invention, but are merely illustrative examples and may be exaggerated for clarity of explanation. is there. The embodiments described below can be applied by appropriately combining the components.

The method for manufacturing a light emitting device according to the present embodiment includes a pair of electrodes on the same surface, a plurality of separated light emitting elements, and a plurality of light emitting elements so that a part of the surface of the pair of electrodes is exposed. A step of preparing an intermediate body that includes a covering member that covers a side surface and has a recess between a plurality of light emitting elements, and continuously covers a surface of a pair of electrodes of the light emitting element and an inner surface of the recess of the covering member A method for manufacturing a light emitting device, comprising: a step of forming a metal layer; and a step of cutting the covering member and the metal layer on the inner surface of the recess.
This manufacturing method is as follows, for example.

1. Step of preparing the intermediate body First, a pair of electrodes are provided on the same surface side, and a plurality of light emitting elements separated from each other and a side surface of the plurality of light emitting elements are covered so that a part of the surface of the pair of electrodes is exposed. And the process of preparing an intermediate body provided with the coating | coated member which has a recessed part between several light emitting elements is performed.
This step can be performed by, for example, the following steps.

1-1. Arrangement of Light-Emitting Element on Support As shown in FIGS. 1A and 1B, a plurality of light-emitting elements having a pair of electrodes 2a and 2b on a main light-emitting surface Q and an electrode formation surface opposite to the main light-emitting surface Q. The light-emitting element 2 is arranged on the support 1 so that the electrodes 2a and 2b face up and are adjacent to each other.
The light emitting element 2 includes a semiconductor layer including at least a light emitting layer, and has a main light emitting surface Q and a pair of positive and negative electrodes 2a and 2b on an electrode forming surface which is a surface opposite to the main light emitting surface Q. In this way, by using the light emitting elements 2 individually separated from the wafer state, for example, after selecting the characteristics, only those having the desired characteristics are used for manufacturing the light emitting apparatus, thereby forming the light emitting apparatus with high yield. be able to.

  The planar shape of the light emitting element 2 may be any of a circular shape, an elliptical shape, a triangular shape, a polygonal shape such as a quadrangular shape and a hexagonal shape. Further, the size and thickness of the light emitting element 2 can be appropriately selected. In this embodiment, for example, the light emitting element 2 having a rectangular planar shape can be used.

  A support 1 on which the light emitting element 2 is arranged is prepared. The support 1 may be removed before cutting a metal layer and a covering member, which will be described later, or may be used as a part of a light emitting device by cutting together with the metal layer and the covering member.

  In this embodiment, the electrodes 2 a and 2 b of such a light emitting element 2 face upward, that is, the main light emitting surface Q is in contact with the support 1, and the upper surfaces of the electrodes 2 a and 2 b of the light emitting element 2 are opposite to the support 1. The plurality of light emitting elements 2 are arranged on the support 1 so as to be adjacent to each other. Thereby, it is easy to form a metal layer on the electrode in a later step, and it is easy to form a covering member so as to expose the main light emitting surface Q.

  Furthermore, it is preferable that the plurality of light emitting elements 2 be arranged so that the different polarities of the respective light emitting elements 2 are adjacent to each other. Specifically, as shown in FIG. 1A, the positive electrode 2a of one light emitting element 2 and the negative electrode 2b of the other light emitting element 21 are adjacent to each other, and the negative electrode 2b of one light emitting element 2 and the other It is preferable to arrange a plurality of light emitting elements 2 so that the positive electrodes 2a of the light emitting elements 2 are adjacent to each other.

  The arrangement interval of the plurality of light emitting elements 2 can be arbitrarily set. This interval affects the thickness of the covering member 3 and the recess 3a described later. Therefore, it is preferable to adjust the width of the gap so that the desired thickness of the covering member 3 can be obtained. For example, although it depends on the arrangement accuracy of the light emitting element 2, the cutting position accuracy in the subsequent singulation process, the configuration of the covering member 3, and the shape of the recess 3a, the light emitting element 2 may be arranged with an interval of about 0.1 μm to 300 μm. it can. Thereby, it is possible to form the covering member 3 that can easily form the metal layer 4 in a later step and can sufficiently block light leaking from other than the main light emitting surface Q. Furthermore, the number of manufactured light emitting devices can be increased, and the light emitting devices can be manufactured efficiently.

  When the light emitting element 2 is arranged on the support 1, for example, an adhesive is previously arranged on the support 1 and the light emitting element 2, or the light emitting element 2 is supported by the adhesive using the support 1 having an adhesive film. It can be fixed on the body 1. As the adhesive, those known in the art such as a resin can be used. In particular, when the support 1 is used as a part of the light-emitting device 10, it is preferable to use a resin having translucency. In addition, when using the support body 1 which has adhesiveness, you may fix the light emitting element 2 on the support body 1 with the adhesiveness of the support body 1. FIG. Thereby, the light emitting element 2 can be efficiently arranged with a small number of steps. As the support 1, a flat plate such as a film or ceramic in which an adhesive is disposed on a resin can be used.

1-2. Formation of Covering Member 3 Next, the side surfaces of the plurality of light emitting elements 2 are covered so that the upper surfaces of the pair of electrodes 2a and 2b are exposed, and the covering member 3 having the recesses 3a between the plurality of light emitting elements 2 is formed. To do.

1-2-1. Molding of Cover Member 3 In this embodiment, next, the cover member 3 that covers at least the side surfaces of the plurality of light emitting elements 2 is formed. Specifically, a covering member 3 that continuously covers a surface other than a portion facing the support 1 of the plurality of light emitting elements 2 arranged on the support 1 is formed on the support 1. Thereby, the covering member 3 for protecting the light emitting element 2 can be easily formed, and further, when the covering member 3 is light reflective or light blocking, light leakage from other than the main light emitting surface Q is prevented. be able to.

  Here, as shown in FIGS. 4A and 4B, the covering member 3 is formed so that the electrodes 2 a and 2 b are exposed from the upper surface of the covering member 3. The covering member 3 may be formed in such a shape that the electrodes 2a and 2b are exposed from the beginning. On the other hand, as shown in FIGS. 2A and 2B, for example, the covering member 3 is covered up to the upper surfaces of the electrodes 2a and 2b. As shown in FIG. 3, the electrodes 2a and 2b can be exposed by removing the removal portion 3S on the top of the covering member 3 by cutting or polishing as shown in FIG. Alternatively, the electrodes 2a and 2b may be exposed by removing the upper portion of the covering member 3 and the electrodes 2a and 2b. Details of the exposure process of the electrodes 2a and 2b will be described later.

As the material of the covering member 3, a material such as a base material such as a resin containing a light reflective or light absorbing substance can be used. The covering member can be formed by molding by transfer molding, compression molding, screen printing, potting, spraying, or the like. In particular, in order to reliably form the covering member 3 in a relatively narrow space between the plurality of light emitting elements 2, a molding method using a mold such as compression molding, compression molding, or transfer molding is preferable.
The covering member 3 may be formed at a time as described above (a form in which a part of the formed covering member 3 is removed is also formed at a time) or may be formed in a plurality of times. .

1-2-2. Electrode Exposure In the first embodiment, after covering the upper surfaces of the electrodes 2 a and 2 b with the covering member 3, the covering member 3 is then removed as shown in FIG. 3, and the light-emitting element 2 covered with the covering member 3 is removed. The upper surfaces of the electrodes 2 a and 2 b are exposed from the surface (upper surface) of the covering member 3. Thereby, the electrode which supplies the electricity to the light emitting element 2 can be formed by making the metal layer 4 and electrodes 2a, 2b formed in a later process contact.

For the exposure of the electrodes 2a and 2b, methods such as grinding, cutting and etching can be used. In order to reduce a decrease in adhesion between the metal layer 4 and the covering member 3 and between the metal layer 4 and the electrodes 2a and 2b provided in a later step, in this step, the upper surfaces of the covering member 3 and the electrodes 2a and 2b are It is preferable to make it flat so that it may become substantially the same plane. From such a viewpoint and a viewpoint of improving mass productivity, grinding is preferable.
The electrodes 2a and 2b may be exposed at the same time as the covering member 3 is formed or after the covering member 3 is formed.

1-2-3. Next, in this embodiment, the recessed part 3a is formed by removing a part of the covering member 3. Specifically, as shown in FIGS. 4A and 4B, the covering member 3 between the light emitting elements 2 is cut in a direction substantially perpendicular to the main light emitting surface Q of the light emitting elements 2. Thereby, the metal layer 4 formed in a later step can be formed up to the side surface of the light emitting device 10.

  The removal of the covering member 3 for forming the recess 3a uses a cutting method known in the art, for example, blade dicing using a blade, laser dicing, cutter scribe, drill, blast using a mask, or the like. be able to.

  If the plurality of light emitting elements 2 arranged on the support 1 have the same shape, the recesses 3a of the covering member 3 can be easily formed. Furthermore, in this embodiment, since the two rectangular light emitting elements 2 are arranged so that the side surfaces thereof face each other, the covering member 3 in the vicinity thereof is cut along the four sides of the light emitting elements 2 to form the recesses 3a. It's easy to do. Further, in the subsequent steps, the covering member 3 and the metal layer 4 can be efficiently cut and individual light emitting devices can be separated.

  In addition, formation of the recessed part 3a may be performed simultaneously with the shaping | molding of the coating | coated member 3, besides providing by removing a part of the coating | coated member 3 shape | molded like this embodiment. For example, the covering member 3 may be formed in a shape that covers the light emitting element 2 and has the concave portion 3 a with a mold for forming the covering member 3. In addition, formation of the recessed part 3a may be performed before the exposure process of the above-mentioned electrodes 2a and 2b, and may be performed after that. When the step is performed after the exposure process of the electrodes 2a and 2b of the light emitting element 2, the recess 3a can be formed while confirming the positions of the electrodes 2a and 2b of the light emitting element 2 with a camera. The accuracy of forming the recess 3a can be increased, which is preferable.

  The recess is preferably provided between the plurality of light emitting elements 2 and adjacent to the electrodes 2a and 2b of the plurality of light emitting elements. As a result, the metal layer 4 provided in the recess 3a and the electrodes 2a and 2b of the plurality of light emitting elements 2 can be easily connected.

The shape of the inner surface of the recess 3a substantially determines the shape of the metal layer 4 or castellation on the side surface of the light emitting device 10 to be manufactured. Therefore, what is necessary is just to be calculated | required by the magnitude | size and the characteristic of the light-emitting device 10 to manufacture.
For example, the depth of the recess 3a (the vertical width in FIG. 4B) can be, for example, about 1% to 99% of the height of the light emitting device 10. When the depth of the concave portion 3a is increased, the area of the metal layer 4 provided on the side surface of the light emitting device 10 can be increased, so that the mounting strength can be increased when the light emitting device 10 is mounted on the mounting substrate. However, if the depth of the recess 3a is excessively increased, the end of the metal layer 4 and the light emitting surface of the light emitting device 10 are brought close to each other, so that an adhesive member such as solder used for mounting may affect the light emission of the light emitting device. . Therefore, for example, the depth of the recess 3 a is preferably about 20 to 50% of the height of the light emitting device 10.

Examples of the shape of the recess 3 a in a top view include a rectangle and a circle that are long in the direction along the side of the light emitting element 2. The recess 3a is preferably formed so as to be extended so that the metal layer 4 can be formed from one end to the other end of one side of the light emitting device 10. By using such a metal layer 4, the mounting accuracy of the light emitting device 10 can be increased.
The recess 3 a may be a single groove extending adjacent to the plurality of light emitting elements 2. Thereby, the recessed part 3a can be easily provided by shaping | molding by cutting or a metal mold | die. On the other hand, a plurality of recessed portions that are spaced apart when viewed from above may be provided. For example, it is good also as the separate recessed part 3a adjacent to each of the some light emitting element 2. FIG.
The width of the recess 3a (the length in the horizontal direction in FIG. 4B) is preferably provided so that the metal layer 4 can be formed and can be easily cut. The side surface of the recess 3a may be inclined or vertical.
In addition, the recessed part 3a should just be provided in the part used as the side surface of the light-emitting device 10, and when manufacturing the light-emitting device 10 which has the some light emitting element 2, it is provided among all the some light emitting elements 2. FIG. It does not have to be done.

As shown in FIG. 5B, two or more recesses may be provided between the two light emitting elements 2.
On the other hand, as shown in FIG. 11, only one recess 3 a can be provided between the two light emitting elements 2. Thereby, since the width | variety of the recessed part 3a can be expanded without making the space | interval of the light emitting element 2 wide, the cutting | disconnection in the inner surface of the recessed part 3a mentioned later can be performed easily. Moreover, the material of the relatively expensive metal layer 4 formed in the recess 3a can be used effectively, and an inexpensive light emitting device can be manufactured.

  As described above, intermediate 100 is obtained.

  Next, the metal layer 4 that continuously covers the surface of the pair of electrodes 2 a and 2 b of the light emitting element 2 and the inner surface of the recess 3 a of the covering member 3 of the intermediate body 100 is formed.

2. Formation of Metal Layer As shown in FIGS. 5A and 5B, the metal layer 4 is formed over the surface (upper surface) of the intermediate body 100 where the electrodes of the light emitting element are exposed and the inner surface of the recess 3a.
Since the metal layer 4 is used as a mounting terminal of the light emitting device 10, the configuration is provided in consideration of the mountability and adhesion of the light emitting device 10.
As a material of the metal layer 4, for example, gold, silver, nickel, aluminum, rhodium, copper, or an alloy thereof may be a single layer or a stacked layer. As the layer in contact with the intermediate body 100 (the first layer of the metal layer), it is preferable to use Ni in order to improve the adhesion. In order to prevent the mounting solder from diffusing into the metal layer 4, it is preferable to include a Ru layer. Moreover, it is preferable to use Au with high corrosion resistance etc. for the outermost surface. That is, it is preferable to use a Ni / Ru / Au stacked structure from the side close to the intermediate body 100.
The thickness of the metal layer 4 is preferably thin, and can be appropriately set as a condition that can secure the bonding strength when the light emitting device 10 is bonded to the mounting substrate. For example, the laser ablation may be selectively caused to occur, for example, 1 μm or less is preferable, and 1000 μm or less is more preferable. Moreover, it is preferable that it is thickness which can reduce the corrosion of an electrode, for example, 5 nm or more. Here, the thickness of the metal layer means the total thickness of the plurality of layers when the metal layer is formed by laminating a plurality of layers.
When the metal layer 4 has a laminated structure, the thickness of one layer of the laminated structure can be, for example, 10 mm to 1000 mm, and preferably about 150 mm to 1000 mm.
The metal layer 4 can be formed by ALD, CVD, sputtering, or vapor deposition. Among these, the metal layer 4 can be easily formed by sputtering.

  In this embodiment, first, one continuous metal layer 4 is formed on substantially the entire surface over the surfaces of the covering member 3 and the plurality of electrodes 2a and 2b. For this reason, as shown in FIGS. 6A and 6B, a part of the metal layer 4 existing so as to connect between the positive and negative electrodes 2a, 2b of one light emitting element 2 is removed. If not removed, the electrodes 2a and 2b are short-circuited and there is no electrical supply to the light-emitting device 10, and the light-emitting device 10 is destroyed. For example, the metal layer 4 can be removed in a uniaxial direction parallel to the electrodes 2a and 2b by irradiating the laser, etching, or router processing. In particular, by laser irradiation, the metal layer can be easily and accurately removed by ablation.

  In this way, the metal layer 4 is formed by removing a part of the metal layer 4 provided on substantially the entire surface of the intermediate body 100 than by forming the metal layer 4 by patterning using a mask or the like. However, since it is easy, it is preferable from the viewpoint of mass productivity.

  The height of the metal layer 4 on the side surface of the light emitting device 10 is 1% to 99%, preferably about 10 to 75%, more preferably 15% of the height of the light emitting device 10 from the surface facing the mounting substrate of the light emitting device 10. About 50% can be provided. When the metal layer 4 is non-selectively formed on the upper surface of the intermediate body 100, the height of the metal layer 4 can be controlled by the depth of the recess 3a.

  In this embodiment, since the plurality of light emitting elements 2 are arranged so that the region between the electrodes 2a and 2b of the plurality of light emitting elements 2 is formed in one band shape in plan view, the positive and negative electrodes 2a of the light emitting element 2 The metal layer 4 between 2b can be easily removed. In order to remove the metal layer between the electrodes 2a and 2b in a straight line, it is preferable that the plurality of light emitting elements 2 be arranged on the support 1 in a state where there is little displacement. If the light emitting elements 2 are arranged with high accuracy, the variation in the shape of the electrode that occurs when the metal layer 4 between the electrodes 2a and 2b is removed can be reduced, and the productivity and quality stability of the light emitting device can be reduced. Can be improved.

As long as the metal layer 4 provided on the inner surface of the recess 3a and the electrodes 2a and 2b of the light emitting element 2 are electrically connected, other portions provided in the intermediate body 100 may be removed. For example, when the covering member 3 and the metal layer 4 described later are cut or separated into individual light emitting devices 10, the metal layer 4 provided on the upper surface of the intermediate body 100 at the position to be cut is removed. Also good. Thereby, it is possible to reduce the occurrence of metal burrs and dust during cutting, and the light emitting device 10 can be manufactured stably.
After the light emitting device 10 is completed, a portion corresponding to the peripheral edge of the bottom surface of the light emitting device 10 (the surface called the upper surface in the state of the intermediate body 100) may be removed.
In the metal layer 4, the portion connected to one electrode 2 a of the light emitting element 2 and the portion connected to the other electrode 2 b may have substantially the same shape or different shapes. For example, by making these shapes different from each other, it can be used as a mark for distinguishing the polarity of the light emitting device 10. Such removal can be performed by laser irradiation, etching, router processing, or the like. In particular, by laser irradiation, the metal layer 4 can be removed with high accuracy, so that it can be easily formed into a relatively complicated shape.
The metal layer 4 may be provided on the entire inner surface of the recess 3a or may be provided partially.

3. Next, as shown in FIGS. 7A and 7B, the covering member 3 and the metal layer 4 are cut on the inner surface of the recess 3a.
At this time, the covering member 3 and the metal layer 4 in a portion without the recess 3a can also be cut.
Note that it is not necessary to cut all the recesses 3a. For example, when manufacturing one light emitting device including a plurality of light emitting elements 2, the covering member 3 between the plurality of light emitting elements 2 is not cut without cutting the recesses 3 a arranged between the plurality of light emitting elements 2. It is good also as a light-emitting device provided with the recessed part 3a (and metal layer 4).

  Cutting is performed by a method capable of cutting the covering member 3 and the metal layer 4. For example, blade dicing using a blade, laser dicing, cutter scribe, or the like can be used.

  In the present embodiment, since the inner surfaces of the plurality of recesses 3a that are one groove extending adjacent to the light emitting element 2 are cut using a dicer, the cutting can be easily performed.

  As shown in FIG. 7B, the covering member and the metal layer may be cut so as to divide the recess 3a into two parts by cutting at approximately the center of one recess 3a. Moreover, you may carry out so that the side surface of the side away from the light emitting element 2 may be removed among the side surfaces of the inner surface of the recessed part 3a. Moreover, you may cut | disconnect the two recessed parts 3a at once so that the coating | coated member arrange | positioned between the two recessed parts 3a in FIG. 7A may be removed. Thereby, since the frequency | count of cutting | disconnection can be reduced and the removal of the coating | coated member which was not utilized for the light-emitting device can be performed simultaneously, manufacture can be performed easily. Further, only one recess 3a provided between two light emitting elements 2 as shown in FIG. 11 may be cut, and two side surfaces of one recess 3a may be provided as side surfaces of two light emitting devices, respectively. Thereby, since the frequency | count of a cutting | disconnection can be reduced, manufacture can be performed easily.

  In the present embodiment, since the covering member 3 is completely cut at the same time when the covering member 3 and the metal layer 4 are cut on the inner surface of the concave portion, the light emitting device described later can be separated at the same time. , Mass productivity can be increased. In addition, after cutting | disconnection of the covering member 3 and the metal layer 4, you may have processes, such as removing the shaping | molding member 3 or the metal layer 4, and shape | molding.

In this embodiment, as shown in FIGS. 7A and 7B, the covering member 3 and the metal layer 4 are cut to form the separation groove 5 at portions other than the recesses 3a, and the light emitting device 10 is formed. It is singulated.
As described above, when the same shape is used for the light emitting element 2 arranged on the support 1, the light emitting device 10 can be easily separated into pieces in addition to the formation of the recess 3a. In this embodiment, since the side surfaces of the plurality of rectangular light emitting elements 2 are arranged to face each other, it is easy to cut along the sides of the light emitting elements 2 and the individual light emitting devices are efficiently separated into individual pieces. Can do.

As described above, as shown in FIGS. 8 and 9, the electrodes of the light emitting device 10 are formed over a surface (side surface) substantially perpendicular to the main light emitting surface Q when mounted on the mounting substrate 8 as shown in FIGS. A metal layer 4 can be formed. Even when the electrodes 2 a and 2 b are not formed with the same shape as the electrodes of the mounting substrate 8, the light emitting device 10 emits light by mounting using the metal layer 4 on the side surface of the light emitting device 10. The side view type light emitting device 10 in which the surface Q is perpendicular to the mounting surface of the mounting substrate 8 can be manufactured.
Thereby, the light emitting device 10 that can be easily mounted on the mounting substrate 8 can be formed.

  Thus, by providing the metal layer 4 used for mounting along the side surface of the light emitting device 10, the light emitting device can be mounted easily and accurately. Moreover, since a solder fillet is formed on the metal layer 4 on the side surface of the light emitting device 10 when mounted, the mounting of the light emitting device 10 can be easily confirmed, and the mounting substrate 8 and the light emitting device 10 are mounted. It is possible to increase the adhesive strength when being applied. Thereby, it can be preferably used for a small light emitting device 10 used for a light source of a backlight of a liquid crystal display, which is relatively difficult to mount and difficult to increase the area of the electrode.

  The metal layer 4 is preferably provided in a wide area on the bottom surface of the light emitting device 10. For example, it is preferable that the light emitting device 10 is provided with an area of 20% to 90%, more preferably 50% to 80% of the area of the bottom surface. Thereby, the heat dissipation of the light-emitting device 10 and mounting strength can be improved.

  By arranging the side surfaces of the metal layer 4 so as to be substantially flush with the side surfaces of the light emitting device 10, when mounting the plurality of light emitting devices 10 side by side, the distance between the light emitting devices 10 is obtained while obtaining the above-described effects. Can be narrowed. Thereby, the light-emitting device 10 can be mounted with high density.

  In the present embodiment, one groove recess 3 a is provided on each side of each light emitting element 2, but one recess may be provided between adjacent light emitting elements 2. The metal layer 4 may be formed on the side surfaces of each of the two light emitting devices adjacent to the recess by cutting at the inner surface of such one recess. According to this, the frequency | count of cutting can be reduced and the efficiency of manufacture can be improved.

  In this embodiment, as shown in FIG. 9, the outer surface of the covering member 3 and the metal layer 4 of the light emitting device 10 is provided so as to be substantially flush with each other. However, as shown in FIG. The covering member 3 has an opening on the side surface of the light emitting device, and a castellation may be provided by providing a part of the metal layer 4 in the opening. By providing the metal layer 4 in such an opening, the area where the solder and the metal layer are bonded can be increased without increasing the height of the metal layer 4, and the mounting reliability of the light emitting device can be improved. it can. Such a metal layer 4 is formed so that the width of the recess 3a is wide when preparing the intermediate, and after forming the metal layer 4 on the inner surface of the recess 3a, a part of the bottom surface 3d of the recess 3a remains in the light emitting device. By cutting in this way, it can be formed. Such an opening can be formed, for example, by leaving not only the side surface but also the bottom surface 3d of the inner surface of the recess 3a when the covering member 3 and the metal layer 4 are cut.

4). Other Steps In addition to the above steps, for example, a step of forming a wavelength conversion layer, a step of forming a translucent layer, and the like may be appropriately performed.

  In the step of forming the wavelength conversion layer, a wavelength conversion layer that converts light emitted from the main light emitting surface Q into a desired wavelength can be formed so as to cover the main light emitting surface Q. As the wavelength conversion layer, for example, a material containing a wavelength conversion material such as a phosphor in a base material such as resin or glass can be used. The wavelength conversion layer can be formed by a desired method such as spraying, printing, coating, or pasting. By covering the side surface of the wavelength conversion layer with the covering member, a light-emitting device having a high contrast between the light-emitting portion and the non-light-emitting portion, which is so-called good parting property, can be formed. The wavelength conversion layer may be performed before or after any of the above steps depending on the configuration. For example, a sheet made of a translucent resin containing a wavelength conversion material may be used as the support 1 and the support 1 may be used as a wavelength conversion layer. In addition, a wavelength conversion layer whose periphery is surrounded by a frame of a light-shielding member is formed in advance, and is attached to the main light-emitting surface before the covering member is formed, whereby a light-emitting device with good parting properties can be manufactured. . Alternatively, the covering member may be formed after the wavelength conversion layer is bonded to the main light emitting surface of the light emitting element before the covering member is formed. By adhering the main light emitting surface of the light emitting element on the wavelength conversion layer so as to face each other, the wavelength conversion layer and the light emitting element can be easily positioned. A light-transmitting adhesive such as a silicone resin can be used for bonding the wavelength conversion layer of the light-transmitting adhesive and the light emitting element. This translucent adhesive may be provided between the side surface of the light emitting element and the covering member.

  The step of forming the light transmitting layer is a step of forming a light transmitting layer having a light transmitting property on the light emitting surface (specifically, the wavelength conversion layer or the main light emitting surface Q) of the light emitting device. By forming the light transmitting layer, the light emitting surface of the light emitting device can be protected. As the light-transmitting layer, for example, a light-transmitting resin or glass can be used. Further, by including a filler or the like, it is possible to improve light extraction and reduce tackiness. The light-transmitting layer can be formed by a desired method such as spraying, printing, coating, or pasting. In the case of using the wavelength conversion layer, the wavelength conversion layer and the light-transmitting layer may be formed in advance and then provided in the light-emitting element.

  Hereinafter, each component will be described.

Light emitting element 2
As the light-emitting element 2, a light-emitting diode, a laser diode, or the like generally used in this field can be used. For example, the nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, III-V group compound semiconductor such as GaAs, ZnSe, II-VI group Various semiconductors such as compound semiconductors can be used. The light emitting element 2 may have a substrate for growing a semiconductor layer. Examples of the substrate include an insulating substrate such as sapphire, and a substrate made of an oxide such as SiC, ZnO, Si, GaAs, diamond, and a nitride semiconductor such as lithium niobate and neodymium gallate. The substrate may be removed using a laser lift-off method or the like.

Support 1
As described above, the support 1 can be made of sheet-like resin, ceramics, glass, or the like. In particular, it is preferable to use a sheet-like polyimide resin from the viewpoint of heat resistance.
The planar shape, size, thickness and the like of the support 1 can be appropriately adjusted depending on the size and number of the light emitting elements 2 to be arranged. In particular, the sheet-like support 1 having a uniform thickness and a flat surface is preferable because the light-emitting element 2 is easily disposed stably.

When the support 1 is used as a part of the light-emitting device, it is preferable that the support 1 has translucency, and the light transmittance from the light-emitting element 2 is 60% or more, 70% or more, 80% or more, 90% or more. Are preferred.
In particular, when the support 1 is used as a part of a light-emitting device, it is preferable to use a resin as the support 1, and a silicone resin, a silicone-modified resin, an epoxy resin, an epoxy-modified resin, a phenol resin, a polycarbonate resin, an acrylic resin, Examples thereof include those formed of a TPX resin, a polynorbornene resin, or a resin such as a hybrid resin including one or more of these resins. Among these, a silicone resin or an epoxy resin is preferable, and a silicone resin excellent in light resistance and heat resistance is particularly preferable.

Further, when the support 1 is used as a part of the light emitting device, if the support 1 contains a wavelength conversion member that converts the wavelength of light from the light emitting element, for example, a phosphor and / or a light emitting substance, the wavelength of the light emitting device. It can be used as a conversion layer.
As the phosphor and / or the light emitting substance, for example, an yttrium aluminum garnet (YAG) phosphor or the like can be used.

  The support 1 may contain a filler (for example, a diffusing agent, a colorant, etc.). Examples include silica, titanium oxide, zirconium oxide, magnesium oxide, glass, phosphor crystals or sintered bodies, and sintered bodies of phosphors and inorganic binders.

Covering member 3
The covering member 3 can be formed of, for example, a material in which a resin that is a base material contains a light-reflective or light-absorbing substance. Thereby, it is easy to shape the covering member 3 into a desired shape. Examples of the resin include silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, unsaturated polyester resin, polyimide resin, modified polyimide resin, phenol resin, urethane resin, acrylate resin, urea resin, acrylic resin, polyphthalamide (PPA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP) and the like. These may be used alone or in combination of two or more resins. In particular, from the viewpoint of heat resistance and weather resistance, it is preferable to include a silicone-based resin.
The thickness of the covering member 3 (distance from the side surface of the light emitting element 2 to the side surface of the light emitting device 100, D shown in FIG. 10) is, for example, 10 μm to 100 μm. A small light-emitting device can be formed while sufficiently blocking light.

  Examples of the light reflecting or light absorbing material include ceramics, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, silicon nitride, boron nitride, mullite, niobium oxide, zinc oxide, barium sulfate, Examples include various rare earth oxides (for example, yttrium oxide, gadolinium oxide). The light-reflecting or light-absorbing substance is preferably contained in an amount of about 20% to 80% by weight, more preferably about 30% to 70% by weight, based on the total weight of the covering member. Thereby, the light-shielding property and intensity | strength of a coating | coated member are securable.

  The light emitting device according to the embodiment of the present invention is used for various light emitting devices such as an illumination light source, various indicator light sources, an in-vehicle light source, a display light source, a liquid crystal backlight light source, a sensor light source, and a traffic light. Can do.

DESCRIPTION OF SYMBOLS 1 Support body 2 Light emitting element 2a, 2b Electrode of light emitting element 3 Cover member 3a Recessed part 3d Bottom face 4 Metal layer 5 Separation groove 8 Mounting substrate 9 Solder 10 Light emitting device 100 Intermediate body

Claims (7)

A plurality of light emitting elements each provided with a pair of electrodes on the same surface side and the side surfaces of the plurality of light emitting elements covered so that a part of the surface of the pair of electrodes is exposed, the plurality of light emitting elements A step of preparing an intermediate including a covering member having a recess between the elements;
Forming a metal layer that continuously covers the surface of the pair of electrodes of the light emitting element and the inner surface of the recess of the covering member;
And a step of cutting the covering member and the metal layer on the inner surface of the recess.   The method for manufacturing a light emitting device according to claim 1, wherein the recess is formed by removing a part of the covering member.   3. The method of manufacturing a light emitting device according to claim 1, wherein the step of forming the metal layer includes a step of forming by any one of ALD, CVD, sputtering, and vapor deposition.   The method for manufacturing a light emitting device according to claim 1, further comprising a step of removing a part of the metal layer after the step of forming the metal layer.   The light emitting device manufacturing method according to claim 3, wherein the removing step is performed by irradiating the metal layer with a laser.   The method for manufacturing a light emitting device according to claim 1, wherein the metal layer includes Ru.   The method for manufacturing a light emitting device according to claim 1, wherein the metal layer has a stacked structure in which Ni / Ru / Au is stacked.