JP2019096671A - ボンディング装置およびボンディング方法 - Google Patents
ボンディング装置およびボンディング方法 Download PDFInfo
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- JP2019096671A JP2019096671A JP2017222940A JP2017222940A JP2019096671A JP 2019096671 A JP2019096671 A JP 2019096671A JP 2017222940 A JP2017222940 A JP 2017222940A JP 2017222940 A JP2017222940 A JP 2017222940A JP 2019096671 A JP2019096671 A JP 2019096671A
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- bonding
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- reaction force
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Die Bonding (AREA)
Abstract
Description
21、21A、21B、21C チップ
23 コレット
31 荷重付与手段
32 反力検出手段
33 ボンディング荷重算出手段
41 ロードセル
Claims (6)
- コレットにて吸着しているチップをボンディングポジションでボンディングするボンディング装置であって、
ボンディングポジションでチップをボンディングする際にチップにボンディング荷重を付与する荷重付与手段と、
荷重付与手段にてチップにボンディング荷重を付与している際のチップからの反力を検出する反力検出手段と、
反力検出手段にて検出された反力検出値が増加途中で変動したときに、その変動した際のボンディング荷重を算出するボンディング荷重算出手段とを備え、
荷重付与手段による付与荷重を、ボンディング荷重算出手段にて算出したボンディング荷重を越えない荷重に設定することを特徴とするボンディング装置。 - 前記荷重付与手段はコレットに荷重を付与して、チップにボンディング荷重を付与することを特徴とする請求項1に記載のボンディング装置。
- 前記反力検出手段は、荷重測定器であるロードセルを用いたことを特徴とする請求項1又は請求項2に記載のボンディング装置。
- 前記変動が、チップにクラックが生じた際の反力検出値の減少であることを特徴とする請求項1〜請求項3のいずれか1項に記載のボンディング装置。
- 複数のチップが積層されてなるチップ積層体を有する半導体装置の製造に用いることを特徴とする請求項1〜請求項4のいずれか1項に記載のボンディング装置。
- コレットにて吸着しているチップをボンディングポジションで、ボンディング荷重を付与しつつボンディングするボンディング方法であって、
チップにボンディング荷重を付与している際のチップからの反力を検出し、検出された反力検出値が増加途中で変動したときに、その変動した際のボンディング荷重を算出し、その後、算出したボンディング荷重を越えない荷重でボンディングを行うことを特徴とするボンディング方法。
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Cited By (1)
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JP2021052096A (ja) * | 2019-09-25 | 2021-04-01 | キヤノンマシナリー株式会社 | ボンディング装置およびボンディング方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02246233A (ja) * | 1989-03-20 | 1990-10-02 | Fujitsu Ltd | ダイボンダ |
JPH0845993A (ja) * | 1995-08-10 | 1996-02-16 | Hitachi Ltd | 半導体装置の製造方法 |
WO2014155535A1 (ja) * | 2013-03-26 | 2014-10-02 | 富士機械製造株式会社 | 電子回路部品実装システム |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH02246233A (ja) * | 1989-03-20 | 1990-10-02 | Fujitsu Ltd | ダイボンダ |
JPH0845993A (ja) * | 1995-08-10 | 1996-02-16 | Hitachi Ltd | 半導体装置の製造方法 |
WO2014155535A1 (ja) * | 2013-03-26 | 2014-10-02 | 富士機械製造株式会社 | 電子回路部品実装システム |
Cited By (1)
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JP2021052096A (ja) * | 2019-09-25 | 2021-04-01 | キヤノンマシナリー株式会社 | ボンディング装置およびボンディング方法 |
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