JP2019075408A - Grinding method of workpiece - Google Patents

Grinding method of workpiece Download PDF

Info

Publication number
JP2019075408A
JP2019075408A JP2017198406A JP2017198406A JP2019075408A JP 2019075408 A JP2019075408 A JP 2019075408A JP 2017198406 A JP2017198406 A JP 2017198406A JP 2017198406 A JP2017198406 A JP 2017198406A JP 2019075408 A JP2019075408 A JP 2019075408A
Authority
JP
Japan
Prior art keywords
grinding
workpiece
holding
grinding wheel
chuck table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017198406A
Other languages
Japanese (ja)
Other versions
JP7049801B2 (en
Inventor
将樹 掛札
Masaki Kakefuda
将樹 掛札
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2017198406A priority Critical patent/JP7049801B2/en
Priority to SG10201808745WA priority patent/SG10201808745WA/en
Priority to KR1020180119044A priority patent/KR20190041414A/en
Priority to US16/153,302 priority patent/US20190111537A1/en
Priority to TW107135335A priority patent/TWI779109B/en
Priority to CN201811176230.8A priority patent/CN109659226A/en
Priority to DE102018217410.5A priority patent/DE102018217410A1/en
Publication of JP2019075408A publication Critical patent/JP2019075408A/en
Application granted granted Critical
Publication of JP7049801B2 publication Critical patent/JP7049801B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

To prevent formation of scratch for the reverse face or occurrence of crack in a workpiece due to entrainment of exfoliated abrasive grains while grinding, in a grinding method for forming a ring-shaped reinforcement part on the reverse face of the workpiece.SOLUTION: A method of grinding the reverse face Wb of a workpiece W, having a device region Wa1 and an outer boundary excessive region Wa2 on the surface Wa, with a grind stone 42b includes a protective step of covering the surface Wa of the workpiece W with a protective member T1, a step of holding the protective member T1 side by the holding surface 30a of a table 30 rotating by a revolving shaft 33 inclining at an angle of 45-180 degrees for the vertical direction after execution of the protective step, and a grinding step of grinding the workpiece reverse face Wb, corresponding to the device region Wa1 with the grind stone 42b rotating by a revolving shaft 40 orthogonal to the holding surface 30a, while supplying the grinding water, thus forming a circular recess Wb1 and a ring-shaped reinforcement part Wb2 surrounding the circular recess Wb1. In the grinding step, draining of the grinding water containing the exfoliated abrasive grains is accelerated by gradient of the workpiece W.SELECTED DRAWING: Figure 4

Description

本発明は、半導体ウエーハ等の板状の被加工物を研削砥石で研削する方法に関する。   The present invention relates to a method for grinding a plate-like workpiece such as a semiconductor wafer with a grinding wheel.

ＩＣやＬＳＩ等のデバイスが複数表面に形成された被加工物は、その裏面が研削されて所定の厚さに薄化され、さらに、ダイシング装置等の分割装置によって個々のデバイスチップに分割されて各種電子機器に利用される。
被加工物の裏面を研削する研削装置は、樹脂等からなる表面保護部材が貼着された被加工物を保持するチャックテーブルと、チャックテーブルに保持された被加工物を研削する研削砥石を回転可能に支持した研削手段と、研削手段を構成するスピンドルの軸心に形成された流路を通して研削砥石に研削水を供給する研削水供給手段とを備えており、被加工物を効率よく研削することができる。 The back surface of the workpiece with IC and LSI devices formed on multiple surfaces is ground and thinned to a predetermined thickness, and then divided into individual device chips by a dividing device such as a dicing device. Used in various electronic devices.
The grinding apparatus for grinding the back surface of the workpiece rotates a chuck table for holding the workpiece on which a surface protection member made of resin or the like is stuck, and a grinding wheel for grinding the workpiece held on the chuck table. A grinding means capable of being supported, and a grinding water supply means for supplying grinding water to a grinding wheel through a flow path formed in a shaft center of a spindle constituting the grinding means are provided to efficiently grind a workpiece be able to.

近年、デバイスチップの軽量化、小型化を達成するために、被加工物の厚さをより薄くすることがウエーハの研削方法においては要求されている。しかし、このように薄く形成されたウエーハは剛性が低下し取り扱いが困難になり、ウエーハ搬送時等において破損する恐れがある。そこで、例えば、被加工物を１００μｍ以下となるように薄く研削し、さらに、被加工物の裏面の内、表面のデバイスが形成された領域に対応する領域のみを薄く研削するとともに、表面のデバイス領域を囲繞する外周余剰領域に対応するリング状の補強部を裏面に残存させることで、薄くなった被加工物の取り扱いを容易にする研削方法がある(例えば、特許文献１参照)。   In recent years, in order to achieve weight reduction and miniaturization of device chips, it is required in the wafer grinding method to make the thickness of the workpiece thinner. However, such a thinly formed wafer is lowered in rigidity and becomes difficult to handle, and there is a possibility that the wafer may be damaged during wafer conveyance or the like. Therefore, for example, the workpiece is thinly ground so as to be 100 μm or less, and further, only the region corresponding to the region where the device on the surface is formed is thinly polished on the back surface of the workpiece, There is a grinding method which facilitates handling of the thinned workpiece by leaving a ring-shaped reinforcing portion corresponding to an outer peripheral surplus region surrounding the region on the back surface (see, for example, Patent Document 1).

特開２００７−１９４６１号公報JP, 2007-19461, A

しかし、上記のような研削方法においては、被加工物の裏面にリング状補強部が形成されるため、研削中に該リング状補強部が堤防となり被加工物の円形凹部内に研削砥石から脱落した砥粒を含む研削水が滞留してしまう。そして、被加工物の円形凹部内に滞留した脱落砥粒が、研削中の研削砥石に巻き込まれ研削砥石の先端の研削面に付着する。先端の研削面に脱落砥粒が付着した状態の研削砥石で研削を続行すると、被加工物の被研削面にスクラッチが形成されたり被加工物の割れが発生したりする。   However, in the grinding method as described above, since the ring-shaped reinforcing portion is formed on the back surface of the workpiece, the ring-shaped reinforcing portion becomes an embankment during grinding and falls off from the grinding stone in the circular recess of the workpiece Grinding water containing the abrasive grains is retained. Then, the falling-off abrasive particles staying in the circular recess of the workpiece are caught in the grinding wheel during grinding and adhere to the grinding surface of the tip of the grinding wheel. When grinding is continued with the grinding wheel in a state in which falling abrasive grains are attached to the ground surface of the tip, scratches are formed on the surface to be ground of the workpiece or cracking of the workpiece occurs.

よって、被加工物の裏面中のデバイス領域に対応する領域を研削し円形状の凹部を形成し、デバイス領域を囲繞する外周余剰領域に対応するウエーハの裏面の領域にリング状補強部を形成する研削方法においては、研削中の研削砥石の脱落砥粒の巻き込みを要因として、被加工物の裏面にスクラッチが形成されたり被加工物の割れが発生したりしてしまうことが無いようにするという課題がある。   Therefore, a region corresponding to the device region in the back surface of the workpiece is ground to form a circular recess, and a ring-shaped reinforcing portion is formed in the region on the back surface of the wafer corresponding to the peripheral excess region surrounding the device region. In the grinding method, scratching is not formed on the back surface of the workpiece or cracking of the workpiece occurs due to the inclusion of falling abrasive grains of the grinding wheel during grinding. There is a problem.

上記課題を解決するための本発明は、複数のデバイスが形成されたデバイス領域と該デバイス領域を囲繞する外周余剰領域とを表面に有する被加工物の裏面を研削砥石で研削する被加工物の研削方法であって、被加工物の表面を保護部材で覆う表面保護ステップと、該表面保護ステップを実施した後、鉛直方向に対して４５度〜１８０度の角度に傾斜した回転軸で回転するチャックテーブルの保持面で、被加工物の保護部材側を保持する保持ステップと、該保持面と直交する回転軸で回転する研削砥石で該デバイス領域に対応する被加工物の裏面を研削水を供給しながら研削して、円形凹部と該外周余剰領域に対応し該円形凹部を囲繞するリング状補強部とを形成する研削ステップ、を備え、該研削ステップでは、研削砥石から脱落した砥粒を含む研削水の排出が被加工物の傾斜によって促される研削方法である。   The present invention for solving the above-mentioned problems is a workpiece which has a back surface of a workpiece having a device region in which a plurality of devices are formed and an outer peripheral surplus region surrounding the device region. A grinding method comprising: a surface protection step of covering the surface of a workpiece with a protective member; and after performing the surface protection step, rotating about an axis of rotation inclined at an angle of 45 degrees to 180 degrees with respect to the vertical direction. In the holding surface of the chuck table, holding water for holding the protective member side of the workpiece, and grinding water on the back surface of the workpiece corresponding to the device area by a grinding wheel rotating on a rotation axis orthogonal to the holding surface. Grinding step of grinding while supplying to form a circular recess and a ring-shaped reinforcing portion corresponding to the outer circumferential surplus region and surrounding the circular recess; and in the grinding step, the abrasive grains dropped from the grinding stone Discharging the grinding water containing is grinding method inspired by the inclination of the workpiece.

前記保護部材は、例えば、粘着テープである。   The protective member is, for example, an adhesive tape.

前記研削ステップにおいて、前記研削砥石から脱落した砥粒を含む研削水の排出位置は前記回転軸の傾いたチャックテーブルの最下点となるため、該研削砥石の回転軌跡と研削水の該排出位置とが重ならないように該研削砥石を位置付けるものとすると好ましい。   In the grinding step, the discharge position of the grinding water containing the abrasive grains dropped from the grinding wheel is the lowest point of the chuck table inclined to the rotation axis, so the rotation locus of the grinding wheel and the discharge position of the grinding water Preferably, the grinding wheel is positioned so that the two do not overlap.

本発明に係る研削方法においては、被加工物の表面を保護部材で覆う表面保護ステップと、表面保護ステップを実施後、鉛直方向に対して４５度〜１８０度の角度に傾斜した回転軸で回転するチャックテーブルの保持面で、被加工物の保護部材側を保持する保持ステップと、保持面と直交する回転軸で回転する研削砥石でデバイス領域に対応する被加工物の裏面を研削水を供給しながら研削して、円形凹部と外周余剰領域に対応し円形凹部を囲繞するリング状補強部とを形成する研削ステップ、を備えているため、研削ステップでは、研削砥石から脱落した砥粒を含む研削水の排出が被加工物の傾斜によって促されるので、研削中に研削砥石が脱落砥粒を巻き込んでしまうことが減り、被加工物の裏面にスクラッチが形成されたり被加工物の割れが発生したりしてしまうことを防ぐことが可能となる。   In the grinding method according to the present invention, after performing the surface protection step of covering the surface of the workpiece with the protective member and the surface protection step, rotation is performed with the rotation axis inclined at 45 degrees to 180 degrees with respect to the vertical direction. The step of holding the protective member side of the workpiece on the holding surface of the chuck table, and the grinding wheel rotating on the rotation axis orthogonal to the holding surface supplies grinding water to the back surface of the workpiece corresponding to the device area The grinding step includes grinding grains falling off the grinding stone in the grinding step, since the grinding step includes grinding while forming the ring-shaped reinforcing part corresponding to the circular recess and the outer circumferential surplus region and surrounding the circular recess. Since the discharge of the grinding water is promoted by the inclination of the workpiece, the grinding wheel is less likely to trap the falling abrasive grains during grinding, and a scratch is formed on the back surface of the workpiece or the workpiece. Les it is possible to prevent the ends up or generated.

研削ステップにおいて、研削砥石から脱落した砥粒を含む研削水の排出位置は回転軸の傾いたチャックテーブルの最下点となるため、研削砥石の回転軌跡と研削水の排出位置とが重ならないように研削砥石を位置付けるものとすることで、研削砥石から脱落した砥粒を含む研削水の排出がより効率よく行われるようになる。   In the grinding step, the discharge position of the grinding water containing abrasive grains dropped from the grinding wheel is the lowest point of the chuck table with the inclined rotation axis, so that the rotation trajectory of the grinding wheel and the discharge position of the grinding water do not overlap By positioning the grinding wheel on the surface of the grinding wheel, it is possible to more efficiently discharge the grinding water containing the abrasive grains dropped from the grinding wheel.

被加工物及び被加工物の表面を保護する保護部材の一例を示す斜視図である。It is a perspective view which shows an example of the protection member which protects the surface of a to-be-processed object and a to-be-processed object. チャックテーブルに保持された被加工物を研削砥石で研削している状態を示す断面図である。It is sectional drawing which shows the state which is grinding by the grinding stone the to-be-processed object hold | maintained at the chuck table. 研削砥石の回転軌跡と研削水の排出位置とが重ならない状態を説明する説明図である。It is an explanatory view explaining the state where the rotation locus of a grinding wheel and the discharge position of grinding water do not overlap. 研削された被加工物の裏面上から研削水が排出されている状態を示す断面図である。It is sectional drawing which shows the state in which grinding water is discharged | emitted from on the back surface of the ground to-be-processed object.

図１に示す被加工物Ｗは、例えば、シリコンを母材とする外形が円形板状の半導体ウエーハであり、その表面Ｗａには、デバイス領域Ｗａ１と、デバイス領域Ｗａ１を囲繞する外周余剰領域Ｗａ２とが設けられている。外周余剰領域Ｗａ２は、図１において、被加工物Ｗの表面Ｗａ中の二点鎖線で示す仮想線Ｌ１よりも外側の領域である。デバイス領域Ｗａ１は、直交差する複数の分割予定ラインＳで格子状に区画されており、格子状に区画された各領域にはＩＣ等のデバイスＤがそれぞれ形成されている。被加工物Ｗの裏面Ｗｂは、研削加工が施される被研削面なる。なお、被加工物Ｗはシリコン以外にガリウムヒ素、サファイア、窒化ガリウム又はシリコンカーバイド等で構成されていてもよい。   The workpiece W shown in FIG. 1 is, for example, a semiconductor wafer having a circular plate-like outer shape having silicon as a base material, and a device region Wa1 and an outer peripheral surplus region Wa2 surrounding the device region Wa1 on the surface Wa. And are provided. The outer periphery surplus area Wa2 is an area outside the virtual line L1 indicated by a two-dot chain line in the surface Wa of the workpiece W in FIG. 1. The device area Wa1 is partitioned in a grid shape by a plurality of planned division lines S which are orthogonal to each other, and devices D such as ICs are respectively formed in each of the domains divided in a grid shape. The back surface Wb of the workpiece W is a surface to be ground to be ground. The workpiece W may be made of gallium arsenide, sapphire, gallium nitride, silicon carbide or the like in addition to silicon.

以下に、本発明に係る研削方法を実施して図１に示す被加工物Ｗを所定の厚さまで研削する場合の各ステップについて説明する。   Below, each step in the case of carrying out the grinding method according to the present invention and grinding the workpiece W shown in FIG. 1 to a predetermined thickness will be described.

（１）表面保護ステップ
被加工物Ｗに研削加工が施されるにあたって、被加工物Ｗの表面Ｗａには、例えば、被加工物Ｗと略同径の円形の保護部材Ｔ１が貼着されて、デバイス領域Ｗａ１及び外周余剰領域Ｗａ２は保護部材Ｔ１で覆われ保護された状態になる。保護部材Ｔ１は、例えば、基材層と粘着層とを備える粘着テープであるが、これに限定されるものではなく、ガラス基板等の剛性を有するハードプレートを接着剤で表面Ｗａに貼着して保護部材としてもよいし、表面Ｗａに液体の樹脂を塗布してから該樹脂に熱を加える又は紫外線を照射する等して、該樹脂を硬化させて、被加工物Ｗの表面Ｗａを覆う保護部材を形成してもよい。 (1) Surface Protection Step When the workpiece W is subjected to grinding, for example, a circular protective member T1 having substantially the same diameter as the workpiece W is attached to the surface Wa of the workpiece W. The device area Wa1 and the peripheral excess area Wa2 are covered and protected by the protection member T1. The protective member T1 is, for example, an adhesive tape including a base material layer and an adhesive layer, but is not limited to this, and a hard plate having rigidity such as a glass substrate is adhered to the surface Wa with an adhesive. May be a protective member, or a liquid resin may be applied to the surface Wa and then heat may be applied to the resin or ultraviolet light may be applied to cure the resin to cover the surface Wa of the workpiece W. A protective member may be formed.

（２）保持ステップ
表面Ｗａが保護部材Ｔ１で覆われた被加工物Ｗは、図２に示す研削装置２に搬送される。研削装置２は、被加工物Ｗを吸引保持するチャックテーブル３と、被加工物Ｗを回転する研削砥石４２ｂで研削する研削手段４とを備えている。チャックテーブル３は、例えば、その外形が円形状であり、ポーラス部材等からなり被加工物Ｗを吸引保持する保持部３０と、保持部３０を支持する枠体３１とを備える。保持部３０は、真空発生装置及びコンプレッサー等からなる図示しない吸引源に配管及びロータリージョイント等を介して連通しており、図示しない吸引源が吸引することで生み出された吸引力が保持面３０ａに伝達されることで、チャックテーブル３は保持面３０ａ上で被加工物Ｗを吸引保持する。 (2) Holding Step The workpiece W whose surface Wa is covered by the protective member T1 is conveyed to the grinding device 2 shown in FIG. The grinding apparatus 2 is provided with a chuck table 3 for sucking and holding the workpiece W, and a grinding means 4 for grinding the workpiece W with a rotating grinding wheel 42 b. The chuck table 3 includes, for example, a holding portion 30 having a circular outer shape and made of a porous member or the like and holding the workpiece W by suction, and a frame 31 supporting the holding portion 30. The holding unit 30 communicates with a suction source (not shown) including a vacuum generator and a compressor via a pipe, a rotary joint and the like, and a suction force generated by suction by the suction source (not shown) is applied to the holding surface 30a. By being transmitted, the chuck table 3 sucks and holds the workpiece W on the holding surface 30a.

チャックテーブル３は、図示しないＹ軸方向送り手段によって、Ｙ軸方向に往復移動可能となっている。また、チャックテーブル３の底面側には回転軸３３の一端が接続されており、この回転軸３３の他端にはモータ３４が接続されている。回転軸３３は、鉛直方向（Ｚ軸方向）に対して４５度〜１８０度の角度に傾斜しており、チャックテーブル３も回転軸３３の傾斜角度と同角度だけ鉛直方向に対して傾斜している。モータ３４が回転軸３３を回転させることで、チャックテーブル３も所定の角度に傾斜した回転軸３３の軸心周りに回転する。   The chuck table 3 can be reciprocated in the Y axis direction by Y axis direction feeding means (not shown). Further, one end of a rotating shaft 33 is connected to the bottom surface side of the chuck table 3, and a motor 34 is connected to the other end of the rotating shaft 33. The rotation axis 33 is inclined at an angle of 45 degrees to 180 degrees with respect to the vertical direction (Z-axis direction), and the chuck table 3 is also inclined with respect to the vertical direction by the same angle as the inclination angle of the rotation axis 33 There is. As the motor 34 rotates the rotation shaft 33, the chuck table 3 also rotates around the axis of the rotation shaft 33 which is inclined at a predetermined angle.

研削手段４は、回転軸４０と、回転軸４０を回転駆動する図示しないモータと、回転軸４０の下端に接続された円形状のマウント４１と、マウント４１の下面に着脱可能に接続された研削ホイール４２とを備える。そして、研削ホイール４２は、ホイール基台４２ａと、ホイール基台４２ａの底面の外周部に環状に配設された略直方体形状の複数の研削砥石４２ｂとを備える。研削砥石４２ｂは、例えば、レジンボンドやメタルボンド等でダイヤモンド砥粒等が固着されて成形されている。環状に配列された研削砥石４２ｂは、例えば、その最外周の直径が被加工物Ｗのデバイス領域Ｗａ１の半径より大きくデバイス領域Ｗａ１の直径より小さくなるように、かつ、その最内周の直径がデバイス領域Ｗａ１の半径より小さくなるように形成されている。   The grinding means 4 includes a rotating shaft 40, a motor (not shown) for driving the rotating shaft 40 to rotate, a circular mount 41 connected to the lower end of the rotating shaft 40, and a grinding removably connected to the lower surface of the mount 41. And a wheel 42. The grinding wheel 42 includes a wheel base 42 a and a plurality of substantially rectangular parallelepiped grinding wheels 42 b annularly disposed on the outer peripheral portion of the bottom surface of the wheel base 42 a. The grinding wheel 42b is formed, for example, by adhering diamond abrasive grains or the like by resin bonding, metal bonding or the like. For example, the diameter of the innermost circumference of the grinding wheel 42b annularly arranged is such that the diameter of the outermost circumference is larger than the radius of the device area Wa1 of the workpiece W and smaller than the diameter of the device area Wa1. It is formed to be smaller than the radius of the device region Wa1.

また、回転軸４０は、チャックテーブル３の回転軸３３と同様に鉛直方向（Ｚ軸方向）に対して４５度〜１８０度の角度に傾斜しており、研削手段４全体も鉛直方向に対して回転軸４０の傾斜角度と同角度だけ鉛直方向に傾斜している。即ち、例えば、チャックテーブル３の回転軸３３が４５度鉛直方向に対して傾斜している場合には、回転軸４０も鉛直方向に対して４５度傾斜しており、研削砥石４２ｂはチャックテーブル３の保持面３０ａと直交する回転軸４０の軸心周りに回転しつつ被加工物Ｗの裏面Ｗｂを研削していく。
鉛直方向に所定角度傾斜している研削手段４は、傾斜しているチャックテーブル３の保持面３０ａと離間する又は接近する方向（回転軸４０の軸方向）に図示しない研削送り手段によって移動可能となっている。 Further, the rotation shaft 40 is inclined at an angle of 45 degrees to 180 degrees with respect to the vertical direction (Z-axis direction) similarly to the rotation shaft 33 of the chuck table 3, and the entire grinding means 4 is also relative to the vertical direction. It is inclined in the vertical direction by the same angle as the inclination angle of the rotation shaft 40. That is, for example, when the rotation axis 33 of the chuck table 3 is inclined 45 degrees relative to the vertical direction, the rotation axis 40 is also inclined 45 degrees with respect to the vertical direction. The back surface Wb of the workpiece W is ground while rotating around the axis of the rotation axis 40 orthogonal to the holding surface 30a of the workpiece W.
The grinding means 4 inclined at a predetermined angle in the vertical direction can be moved by a grinding feed means (not shown) in a direction (axial direction of the rotation shaft 40) moving away from or approaching the holding surface 30a of the inclined chuck table 3 It has become.

回転軸４０の内部には、研削水の通り道となる流路４３が回転軸４０の軸方向に貫通して形成されている。この流路４３はマウント４１を通り、ホイール基台４２ａの底面において研削砥石４２ｂに向かって研削水を噴出できるようにその下端側が開口している。また、流路４３の上端側には、純水等の研削水を流路４３に供給する研削水供給手段４４が連通している。   A flow path 43, which is a passage for grinding water, is formed in the rotation shaft 40 so as to penetrate in the axial direction of the rotation shaft 40. The flow path 43 passes through the mount 41, and the lower end side is opened so that the grinding water can be jetted toward the grinding stone 42b on the bottom surface of the wheel base 42a. Further, on the upper end side of the flow path 43, a grinding water supply means 44 for supplying grinding water such as pure water to the flow path 43 is in communication.

図２に示すように、保持ステップにおいては、まず、保護部材Ｔ１が表面Ｗａに貼着された被加工物Ｗが、例えば回転軸３３が鉛直方向に対して４５度の角度に傾斜した状態のチャックテーブル３の保持面３０ａの中心と被加工物Ｗの中心とが略合致し裏面Ｗｂが露出するようにして、保持面３０ａ上に載置される。そして、図示しない吸引源により生み出される吸引力が、保持面３０ａに伝達されることにより、チャックテーブル３が保持面３０ａで被加工物Ｗの保護部材Ｔ１側を吸引保持した状態になる。   As shown in FIG. 2, in the holding step, first, the workpiece W with the protective member T1 attached to the surface Wa is in a state where, for example, the rotation shaft 33 is inclined at an angle of 45 degrees with respect to the vertical direction. The center of the holding surface 30a of the chuck table 3 and the center of the workpiece W substantially coincide with each other and the back surface Wb is exposed, and the wafer W is placed on the holding surface 30a. Then, the suction force generated by a suction source (not shown) is transmitted to the holding surface 30a, so that the chuck table 3 sucks and holds the protection member T1 side of the workpiece W on the holding surface 30a.

（３）研削ステップ
次いで、被加工物Ｗを保持したチャックテーブル３が、鉛直方向に対して４５度の角度に傾斜した状態の研削手段４の下までＹ軸方向へ移動して、研削手段４に備える研削ホイール４２と被加工物Ｗとの位置合わせがなされる。この位置合わせは、例えば、被加工物Ｗの外周余剰領域Ｗａ２の内周縁、すなわち裏面Ｗｂにおいて仮想線Ｌ１と研削砥石４２ｂの回転軌道の最外周の一部とが重なり、かつ、研削砥石４２ｂの回転軌道が被加工物Ｗの回転中心を通るように行われる。さらに、本研削ステップにおいて、後述する研削砥石４２ｂから脱落した砥粒を含む研削水の排出位置は、鉛直方向に対して４５度傾いたチャックテーブル３の図２、３に示す最下点となる。したがって、図３に点線で示す研削砥石４２ｂの回転軌跡と研削水の排出位置とが重ならないようにするべく、図２に示すように、例えば研削砥石４２ｂが被加工物Ｗの＋Ｙ方向側の排出位置から中央を基準とした反対側の−Ｙ方向側の所定の位置に位置付けられる。なお、研削砥石４２ｂの位置付けは、本実施形態における例に限定されるものではなく、被加工物Ｗの裏面Ｗｂにおいて図３に一点鎖線で示すいずれかの回転軌跡を描く所定位置に研削砥石４２ｂを位置付け、脱落した砥粒を含む研削水の排出位置と研削砥石４２ｂの回転軌跡とが重ならないようにしてもよい。 (3) Grinding step Subsequently, the chuck table 3 holding the workpiece W is moved in the Y-axis direction to below the grinding means 4 in a state inclined at an angle of 45 degrees with respect to the vertical direction, The grinding wheel 42 and the workpiece W are aligned with each other. In this alignment, for example, the imaginary line L1 and a part of the outermost periphery of the rotation track of the grinding wheel 42b overlap on the inner peripheral edge of the outer peripheral surplus area Wa2 of the workpiece W, ie, the back surface Wb The rotation path is performed so as to pass through the rotation center of the workpiece W. Furthermore, in the main grinding step, the discharge position of the grinding water containing the abrasive grains dropped from the grinding stone 42b described later is the lowest point shown in FIGS. 2 and 3 of the chuck table 3 inclined 45 degrees with respect to the vertical direction. . Therefore, for example, as shown in FIG. 2, the grinding wheel 42b is on the + Y direction side of the workpiece W so that the rotation trajectory of the grinding wheel 42b shown by the dotted line in FIG. It is positioned at a predetermined position on the opposite -Y direction side with reference to the center from the discharge position. The positioning of the grinding wheel 42b is not limited to the example in the present embodiment, and the grinding wheel 42b is drawn at a predetermined position on the back surface Wb of the workpiece W, which has any rotation locus shown in FIG. The position of discharge of the grinding water containing the dropped abrasive grains and the rotation trajectory of the grinding wheel 42b may not overlap.

図２に示すように、研削砥石４２ｂと被加工物Ｗとの位置合わせが行われた後、図示しないモータが回転軸４０を回転駆動するのに伴って研削砥石４２ｂが回転する。また、研削手段４がチャックテーブル３の保持面３０ａに接近する図２に示す矢印Ｅ方向へと研削送りされ、回転する研削砥石４２ｂが被加工物Ｗの裏面Ｗｂに当接することで裏面Ｗｂの研削が行われる。また、研削加工中は、チャックテーブル３が鉛直方向に対して４５度の角度で傾斜した回転軸３３の軸心周りに回転するのに伴って、チャックテーブル３上に保持された被加工物Ｗも回転する。   As shown in FIG. 2, after the alignment between the grinding wheel 42 b and the workpiece W is performed, the grinding wheel 42 b rotates as the motor (not shown) rotationally drives the rotating shaft 40. Further, the grinding means 4 is ground and fed in the direction of arrow E shown in FIG. 2 approaching the holding surface 30a of the chuck table 3, and the rotating grinding wheel 42b abuts on the back surface Wb of the workpiece W. Grinding is performed. Further, during grinding, the workpiece W held on the chuck table 3 as the chuck table 3 rotates around the axis of the rotary shaft 33 inclined at an angle of 45 degrees with respect to the vertical direction. Also rotate.

研削加工中は、例えば、被加工物Ｗの回転中心が、常に研削砥石４２ｂの回転軌道の最外周よりも内側でかつ回転軌道の内周より外側に位置するようにして、研削砥石４２ｂが回転する。更に、その研削砥石４２ｂの回転軌道の最外周が、被加工物Ｗの外周余剰領域Ｗａ２に対応する裏面Ｗｂの外周領域に接触しないように、すなわち、仮想線Ｌ１よりも大きく外側にはみ出さないよう研削砥石４２ｂが回転する。そのため、研削砥石４２ｂが被加工物Ｗのデバイス領域Ｗａ１に対応する裏面Ｗｂの中央領域を円形の凹状に研削していき、図４に示すように、デバイス領域Ｗａ１に対応する裏面Ｗｂの中央領域に円形凹部Ｗｂ１が形成される。また、被加工物Ｗの裏面Ｗｂに、外周余剰領域Ｗａ２に対応し円形凹部Ｗｂ１を囲繞するリング状補強部Ｗｂ２が＋Ｚ方向に向かって突出するように形成される。   During the grinding process, for example, the grinding wheel 42b is rotated such that the rotation center of the workpiece W is always located inside the outermost circumference of the rotation track of the grinding wheel 42b and outside the inner circumference of the rotation track. Do. Furthermore, the outermost circumference of the rotation track of the grinding stone 42b is not in contact with the outer peripheral area of the back surface Wb corresponding to the outer peripheral surplus area Wa2 of the workpiece W, that is, does not extend beyond the virtual line L1. The grinding wheel 42b rotates. Therefore, the grinding wheel 42b grinds the central region of the back surface Wb corresponding to the device region Wa1 of the workpiece W into a circular concave shape, and as shown in FIG. 4, the central region of the back surface Wb corresponding to the device region Wa1 A circular recess Wb1 is formed in the Further, on the back surface Wb of the workpiece W, a ring-shaped reinforcing portion Wb2 corresponding to the outer peripheral surplus area Wa2 and surrounding the circular recess Wb1 is formed to protrude in the + Z direction.

研削加工中は、研削水Ｍを回転軸４０中の流路４３を通して研削砥石４２ｂと被加工物Ｗとの接触部位に対して供給して、研削砥石４２ｂと被加工物Ｗの裏面Ｗｂとの接触部位を冷却・洗浄する。該接触部位に到達した洗浄水は、チャックテーブル３の回転により発生する遠心力によって研削屑及び研削砥石４２ｂから脱落した砥粒と共に各研削砥石４２ｂ同士の隙間から外部に流れ出る。そして、本発明に係る研削方法においては、鉛直方向に対して４５度傾いたチャックテーブル３上に吸引保持される被加工物Ｗの傾斜によって、研削砥石４２ｂから脱落した砥粒を含む研削水Ｍは円形凹部Ｗｂ１上を図４に示す排出位置に向かって流れていく。そして、研削水Ｍは被加工物Ｗの傾斜によって加速されて、排出位置においてリング状補強部Ｗｂ２を乗り越えて被加工物Ｗ外へと排出される。また、研削水Ｍの排出位置と研削砥石４２ｂとの回転軌跡とは重なっていないため、研削砥石４２ｂによって脱落した砥粒を含む研削水Ｍの排出が妨げられることはない。
研削水Ｍを供給しつつ被加工物Ｗを所望の厚さになるまで研削した後、研削手段４が被加工物Ｗから離間し研削が終了する。 During the grinding process, the grinding water M is supplied to the contact portion between the grinding wheel 42b and the workpiece W through the flow path 43 in the rotating shaft 40, and the grinding wheel 42b and the back surface Wb of the workpiece W Cool and clean the contact area. The washing water that has reached the contact area flows out of the gap between the grinding wheels 42b together with the grinding debris and the abrasive grains dropped from the grinding wheel 42b by the centrifugal force generated by the rotation of the chuck table 3. And, in the grinding method according to the present invention, the grinding water M including the abrasive grains dropped from the grinding stone 42b due to the inclination of the workpiece W sucked and held on the chuck table 3 inclined 45 degrees with respect to the vertical direction. Flows on the circular recess Wb1 toward the discharge position shown in FIG. Then, the grinding water M is accelerated by the inclination of the workpiece W, passes over the ring-shaped reinforcing portion Wb 2 at the discharge position, and is discharged to the outside of the workpiece W. Further, since the discharge position of the grinding water M and the rotation trajectory of the grinding wheel 42b do not overlap, the discharging of the grinding water M including the abrasive grains dropped off by the grinding wheel 42b is not hindered.
After grinding the workpiece W to a desired thickness while supplying the grinding water M, the grinding means 4 is separated from the workpiece W, and the grinding is completed.

上記のように、本発明に係る研削方法においては、被加工物Ｗの表面Ｗａを保護部材Ｔ１で覆う表面保護ステップと、表面保護ステップを実施後、鉛直方向に対して４５度〜１８０度の角度に傾斜した回転軸３３で回転するチャックテーブル３の保持面３０ａで、被加工物Ｗの保護部材Ｔ１側を保持する保持ステップと、保持面３０ａと直交する回転軸４０で回転する研削砥石４２ｂでデバイス領域Ｗａ１に対応する被加工物Ｗの裏面Ｗｂを研削水Ｍを供給しながら研削して、円形凹部Ｗｂ１と外周余剰領域Ｗａ２に対応し円形凹部Ｗｂ１を囲繞するリング状補強部Ｗｂ２とを形成する研削ステップ、を備えているため、研削ステップでは、研削砥石４２ｂから脱落した砥粒を含む研削水Ｍの排出が被加工物Ｗの傾斜によって促されるので、研削中に研削砥石４２ｂが脱落砥粒を巻き込んでしまうことが減り、被加工物Ｗの裏面Ｗｂにスクラッチが形成されたり被加工物Ｗの割れが発生したりしてしまうことを防ぐことが可能となる。   As described above, in the grinding method according to the present invention, after the surface protection step of covering the surface Wa of the workpiece W with the protective member T1 and the surface protection step, 45 degrees to 180 degrees with respect to the vertical direction Holding step for holding the protection member T1 side of the workpiece W on the holding surface 30a of the chuck table 3 rotated by the rotation shaft 33 inclined at an angle, and grinding wheel 42b rotated on the rotation shaft 40 orthogonal to the holding surface 30a Then, the back surface Wb of the workpiece W corresponding to the device area Wa1 is ground while supplying the grinding water M, and the ring-shaped reinforcing portion Wb2 surrounding the circular recess Wb1 corresponding to the circular recess Wb1 and the outer periphery surplus region Wa2 is Since the grinding step includes discharging the grinding water M including the abrasive grains dropped from the grinding wheel 42b by the grinding step, the inclination of the workpiece W is promoted. It is possible to reduce that the grinding stone 42b is caught in the falling abrasive grains during grinding, and it is possible to prevent a scratch from being formed on the back surface Wb of the workpiece W or a crack of the workpiece W being generated. It becomes.

また、研削ステップにおいて、研削砥石４２ｂから脱落した砥粒を含む研削水Ｍの排出位置は回転軸３３の傾いたチャックテーブル３の最下点となるため、研削砥石４２ｂの回転軌跡と研削水Ｍの排出位置とが重ならないように研削砥石４２ｂを位置付けるものとすることで、研削砥石４２ｂから脱落した砥粒を含む研削水Ｍの排出がより効率よく行われるようになる。   Further, in the grinding step, the discharge position of the grinding water M including the abrasive grains dropped from the grinding wheel 42b is the lowest point of the chuck table 3 inclined by the rotating shaft 33, so the rotation trajectory of the grinding wheel 42b and the grinding water M By positioning the grinding wheel 42b so that it does not overlap with the discharge position, the grinding water M including abrasive grains dropped from the grinding wheel 42b can be discharged more efficiently.

なお、本発明に係る研削方法は上記実施形態に限定されるものではなく、また、添付図面に図示されている研削装置２の各構成についても、これに限定されず、本発明の効果を発揮できる範囲内で適宜変更可能である。例えば、研削砥石４２ｂと被加工物Ｗとの接触部位に対する研削水の供給を研削手段４の回転軸４０を通過させて行うのではなく、噴射ノズルを用いて外側から研削水を研削砥石４２ｂと被加工物Ｗとの接触部位に対して供給するものとしてもよい。   The grinding method according to the present invention is not limited to the above-described embodiment, and each component of the grinding apparatus 2 illustrated in the attached drawings is not limited to this, and the effects of the present invention are exhibited. It can change suitably within the limits which can be done. For example, instead of supplying the grinding water to the contact portion between the grinding wheel 42b and the workpiece W through the rotary shaft 40 of the grinding means 4, the grinding water can be ground from the outside using the injection nozzle It may be supplied to the contact portion with the workpiece W.

Ｗ：被加工物 Ｗａ：被加工物の表面 Ｗａ１：デバイス領域 Ｗａ２：外周余剰領域
Ｓ：分割予定ライン Ｄ：デバイス Ｗｂ：被加工物の裏面 Ｗｂ１：円形凹部 Ｗｂ２：リング状補強部 Ｔ１：保護部材
２：研削装置
３：チャックテーブル ３０：保持部 ３０ａ：保持面 ３１：枠体 ３３：回転軸 ３４：モータ
４：研削手段 ４０：回転軸 ４１：マウント ４２：研削ホイール ４２ａ：ホイール基台 ４２ｂ：研削砥石 ４３：流路 W: workpiece Wa: surface of workpiece Wa1: device region Wa2: peripheral excess region S: planned dividing line D: device Wb: back surface of workpiece Wb1: circular recess Wb2: ring-shaped reinforcing portion T1: protective member 2: Grinding device 3: Chuck table 30: Holding portion 30a: Holding surface 31: Frame 33: Rotating shaft 34: Motor 4: Grinding means 40: Rotating shaft 41: Mount 42: Grinding wheel 42a: Wheel base 42b: Grinding Stone 43: flow path

Claims (3)

複数のデバイスが形成されたデバイス領域と該デバイス領域を囲繞する外周余剰領域とを表面に有する被加工物の裏面を研削砥石で研削する被加工物の研削方法であって、
被加工物の表面を保護部材で覆う表面保護ステップと、
該表面保護ステップを実施した後、鉛直方向に対して４５度〜１８０度の角度に傾斜した回転軸で回転するチャックテーブルの保持面で、被加工物の保護部材側を保持する保持ステップと、
該保持面と直交する回転軸で回転する研削砥石で該デバイス領域に対応する被加工物の裏面を研削水を供給しながら研削して、円形凹部と該外周余剰領域に対応し該円形凹部を囲繞するリング状補強部とを形成する研削ステップ、を備え、
該研削ステップでは、研削砥石から脱落した砥粒を含む研削水の排出が被加工物の傾斜によって促される研削方法。 A method of grinding a workpiece having a back surface of a workpiece having a device region in which a plurality of devices are formed and an outer peripheral surplus region surrounding the device region with a grinding stone,
A surface protection step of covering the surface of the workpiece with a protection member;
A holding step of holding the protective member side of the workpiece with a holding surface of a chuck table rotating on a rotation axis inclined at an angle of 45 degrees to 180 degrees with respect to the vertical direction after performing the surface protection step;
The back surface of the workpiece corresponding to the device area is ground while being supplied with grinding water by a grinding wheel rotating on a rotation axis orthogonal to the holding surface, and the circular recess is corresponded to the circular recess and the peripheral surplus region. Providing a grinding step to form a ring-shaped reinforcing portion to be enclosed,
In the grinding step, a grinding method in which discharge of grinding water including abrasive grains dropped from a grinding wheel is promoted by inclination of a workpiece. 前記保護部材は、粘着テープであることを特徴とする請求項１記載の研削方法。   The grinding method according to claim 1, wherein the protective member is an adhesive tape. 前記研削ステップにおいて、前記研削砥石から脱落した砥粒を含む研削水の排出位置は前記回転軸の傾いたチャックテーブルの最下点となるため、該研削砥石の回転軌跡と研削水の該排出位置とが重ならないように該研削砥石を位置付ける請求項１記載の研削方法。   In the grinding step, the discharge position of the grinding water containing the abrasive grains dropped from the grinding wheel is the lowest point of the chuck table inclined to the rotation axis, so the rotation locus of the grinding wheel and the discharge position of the grinding water The grinding method according to claim 1, wherein the grinding wheel is positioned so as not to overlap with each other.
JP2017198406A 2017-10-12 2017-10-12 Grinding method for workpieces Active JP7049801B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017198406A JP7049801B2 (en) 2017-10-12 2017-10-12 Grinding method for workpieces
SG10201808745WA SG10201808745WA (en) 2017-10-12 2018-10-03 Workpiece grinding method
US16/153,302 US20190111537A1 (en) 2017-10-12 2018-10-05 Workpiece grinding method
KR1020180119044A KR20190041414A (en) 2017-10-12 2018-10-05 Method for grinding a workpiece
TW107135335A TWI779109B (en) 2017-10-12 2018-10-08 Grinding method of workpiece
CN201811176230.8A CN109659226A (en) 2017-10-12 2018-10-10 The method for grinding of machined object
DE102018217410.5A DE102018217410A1 (en) 2017-10-12 2018-10-11 Workpiece grinding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017198406A JP7049801B2 (en) 2017-10-12 2017-10-12 Grinding method for workpieces

Publications (2)

Publication Number Publication Date
JP2019075408A true JP2019075408A (en) 2019-05-16
JP7049801B2 JP7049801B2 (en) 2022-04-07

Family

ID=65910039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017198406A Active JP7049801B2 (en) 2017-10-12 2017-10-12 Grinding method for workpieces

Country Status (7)

Country Link
US (1) US20190111537A1 (en)
JP (1) JP7049801B2 (en)
KR (1) KR20190041414A (en)
CN (1) CN109659226A (en)
DE (1) DE102018217410A1 (en)
SG (1) SG10201808745WA (en)
TW (1) TWI779109B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7204318B2 (en) * 2017-11-06 2023-01-16 株式会社ディスコ grinding wheel
JP7391476B2 (en) * 2020-03-17 2023-12-05 株式会社ディスコ Grinding method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224952A (en) * 1985-07-22 1987-02-02 Hitachi Seiko Ltd Method and device for grinding of plane
JP2008028027A (en) * 2006-07-19 2008-02-07 Disco Abrasive Syst Ltd Concave processing method of wafer
JP2011083888A (en) * 2009-09-17 2011-04-28 Asahi Glass Co Ltd Glass plate local polishing apparatus and method, and glass product manufacturing apparatus and method
JP2013154443A (en) * 2012-01-31 2013-08-15 Lintec Corp Device and method for grinding plate-like member
JP2014154774A (en) * 2013-02-12 2014-08-25 Disco Abrasive Syst Ltd Processing method
JP2015100865A (en) * 2013-11-22 2015-06-04 株式会社ディスコ Grinding device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5775983A (en) * 1995-05-01 1998-07-07 Applied Materials, Inc. Apparatus and method for conditioning a chemical mechanical polishing pad
US5665656A (en) * 1995-05-17 1997-09-09 National Semiconductor Corporation Method and apparatus for polishing a semiconductor substrate wafer
US6722962B1 (en) * 1997-04-22 2004-04-20 Sony Corporation Polishing system, polishing method, polishing pad, and method of forming polishing pad
US6705930B2 (en) * 2000-01-28 2004-03-16 Lam Research Corporation System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques
US6340326B1 (en) * 2000-01-28 2002-01-22 Lam Research Corporation System and method for controlled polishing and planarization of semiconductor wafers
JP2004074021A (en) * 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate cleaning unit
JP5390740B2 (en) 2005-04-27 2014-01-15 株式会社ディスコ Wafer processing method
JP4937674B2 (en) * 2006-08-16 2012-05-23 株式会社ディスコ Wafer etching method
JP4986568B2 (en) * 2006-10-11 2012-07-25 株式会社ディスコ Wafer grinding method
JP5820329B2 (en) * 2012-04-24 2015-11-24 光洋機械工業株式会社 Double-head surface grinding method and double-head surface grinding machine
JP6341709B2 (en) * 2014-03-18 2018-06-13 株式会社ディスコ Wafer processing method
KR20160115369A (en) * 2015-03-27 2016-10-06 주식회사 케이씨텍 Chemical mechanical polishing apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6224952A (en) * 1985-07-22 1987-02-02 Hitachi Seiko Ltd Method and device for grinding of plane
JP2008028027A (en) * 2006-07-19 2008-02-07 Disco Abrasive Syst Ltd Concave processing method of wafer
JP2011083888A (en) * 2009-09-17 2011-04-28 Asahi Glass Co Ltd Glass plate local polishing apparatus and method, and glass product manufacturing apparatus and method
JP2013154443A (en) * 2012-01-31 2013-08-15 Lintec Corp Device and method for grinding plate-like member
JP2014154774A (en) * 2013-02-12 2014-08-25 Disco Abrasive Syst Ltd Processing method
JP2015100865A (en) * 2013-11-22 2015-06-04 株式会社ディスコ Grinding device

Also Published As

Publication number Publication date
KR20190041414A (en) 2019-04-22
TW201914744A (en) 2019-04-16
CN109659226A (en) 2019-04-19
TWI779109B (en) 2022-10-01
JP7049801B2 (en) 2022-04-07
US20190111537A1 (en) 2019-04-18
DE102018217410A1 (en) 2019-04-18
SG10201808745WA (en) 2019-05-30

Similar Documents

Publication Publication Date Title
TWI732934B (en) Wafer processing method
TWI823988B (en) polishing pad
TWI534932B (en) Wafer transfer mechanism
JP6791579B2 (en) Wafers and wafer processing methods
JP7204318B2 (en) grinding wheel
TWI779109B (en) Grinding method of workpiece
JP6822857B2 (en) Carry-out mechanism
JP6999322B2 (en) Wafer grinding method
JP6044976B2 (en) Wafer processing method
JP2021068744A (en) Wafer processing method
JP6872382B2 (en) How to carry out processing equipment and wafers
JP2010074003A (en) Grinder and wafer grinding method
TWI834798B (en) Processing method of the workpiece
JP2020110906A (en) Processing method for workpiece
JP7191467B2 (en) Workpiece grinding method
JP7433709B2 (en) Cleaning equipment and cleaning method
JP2019081219A (en) Processing method for protective member
JP2019062147A (en) Protective member processing method
JP5000915B2 (en) Resin coating method and coating apparatus
JP2023114076A (en) Method for processing workpiece
JP2007136425A (en) Washing method and washing device
JP2023109277A (en) Grinding method
JP2023106812A (en) Processing method for bonded wafer
JP2022017674A (en) Polishing device and polishing method
JP2024000234A (en) Grinding method for work-piece

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200814

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210622

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210819

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220228

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220315

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220328

R150 Certificate of patent or registration of utility model

Ref document number: 7049801

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150