JP2013154443A - Device and method for grinding plate-like member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer grinding device capable of improving performance of grinding, while suppressing an increase in installation space associated with an increase in wafer size as much as possible.SOLUTION: A grinding device 1 includes: a support means 2 having a support surface 22 for supporting a wafer WF from a front surface side; a grinding means 3 for grinding a rear side of the wafer WF using a grinding member 31 including a grinding base 32 and grindstone chips 33 provided at predetermined intervals along an outer peripheral direction of the grinding base 32; a slurry supply means 4 for supplying slurry into a space surrounded by the grinding base 32, the grindstone chips 33 and the rear side of the wafer WF; and a moving means 5 for relatively moving the support means 2 and the grinding member 31 to adjust the thickness of the wafer WF after grinding, wherein the support surface 22 is a slope inclined with respect to a horizontal plane, and the moving means 5 relatively moves the support means 2 and the grinding member 31 in a direction perpendicular to the slope and in a direction parallel to the slope.

Description

  The present invention relates to a plate-like member grinding apparatus and a grinding method.

Conventionally, a configuration for grinding a semiconductor wafer (hereinafter sometimes referred to as a “wafer”) is known (see, for example, Patent Document 1 and Patent Document 2).
In the configuration of Patent Document 1, one surface is provided with a plurality of chuck tables installed on a turntable parallel to a horizontal plane (a surface orthogonal to the direction of gravity), and a wafer adsorbed and fixed to the chuck table is ground with a cup-type grindstone doing.
In the configuration of Patent Document 2, a pair of work pressing rollers that support the wafer from both sides and four work guide rollers that support the outer edge of the wafer are used to hold the wafer so that the surface to be ground is orthogonal to the horizontal plane. doing. And while rotating a wafer centering on the rotating shaft parallel to a horizontal surface, both surfaces of a wafer are ground with a cup type grindstone. Further, during this grinding, a grinding liquid (slurry) in which abrasive grains are dispersed in the liquid is supplied to the inside of the cup-type grindstone, and cooling water is sprayed toward a contact portion between the wafer and the cup-type grindstone. .

JP 2010-67783 A Japanese Patent No. 3776624

However, in the configuration as disclosed in Patent Document 1, since the wafer placed so that the surface to be ground is parallel to the horizontal plane is ground, the larger the diameter of the wafer, the larger the wafer as viewed from above in the direction of gravity. A dedicated area such as a mounting surface, a wafer transfer path, and a wafer stock area becomes large, and an area for installing a grinding apparatus becomes large. In particular, the diameter of recent wafers has been increased, and in some cases, there is a disadvantage that it becomes impossible to install a grinding apparatus in a predetermined space.
Further, in the configuration as in Patent Document 2, the wafer held so that the surface to be ground is orthogonal to the horizontal plane is ground, so that the grinding liquid that accumulates in the cup-type grindstone due to the influence of gravity opposes gravity (upward). This makes it difficult to improve the grinding ability.

  An object of the present invention is to provide a plate-shaped member grinding apparatus and a grinding method capable of suppressing an increase in installation area accompanying an increase in the size of the plate-shaped member as much as possible and improving the grinding ability.

  In order to achieve the above-mentioned object, a plate-like member grinding apparatus according to the present invention is provided along a peripheral direction of a plate-like grinding base and a support means having a support surface for supporting the plate-like member from one surface side. A grinding means for grinding the other surface of the plate-like member by a cup-type grinding member having a plurality of or a single grindstone, and the grinding base, the grindstone, and the other surface of the plate-like member are surrounded. A first grinding fluid supply means for supplying a first grinding fluid into the space; and a moving means for adjusting the thickness of the plate member after grinding by relatively moving the supporting means and the grinding member. The surface is an inclined surface that is inclined with respect to a horizontal plane, and the moving means adopts a configuration in which the supporting means and the grinding member are relatively moved in a direction parallel to the inclined surface.

At this time, it is preferable that the grinding apparatus for a plate-like member of the present invention further includes a second grinding fluid supply means for supplying a second grinding fluid into the space from above the support surface.
In the plate member grinding apparatus of the present invention, the support means supports the side surface of the plate member rising from the supported surface, and positions the plate member relative to the support means at a predetermined position. It is preferable that a positioning means is provided.
Furthermore, it is preferable that the plate-shaped member grinding apparatus of the present invention further includes receiving means for receiving the plate-shaped member when the support of the support means is released.

  On the other hand, the plate member grinding method of the present invention comprises a support means having a support surface for supporting the plate member from one surface side, and a plurality or a single piece provided along the outer peripheral direction of the plate-like grinding base. A grinding method for a plate-like member in which the other surface of the plate-like member is ground by a cup-type grinding member provided with a grindstone, wherein the support surface is an inclined surface inclined with respect to a horizontal plane, and the grinding base The first grinding fluid is supplied into a space surrounded by the grindstone and the other surface of the plate-shaped member, and the support means and the grinding member are relatively moved in a direction parallel to the inclined surface to form the plate-shaped The structure of grinding a member is adopted.

According to the present invention as described above, the plate-like member is supported so that the surface to be ground (the other surface) is inclined with respect to the horizontal plane. Therefore, even if the size of the plate-like member increases, An increase in the area of the support surface of the plate-like member when viewed can be suppressed, and an increase in the installation area of the grinding device can be suppressed as much as possible.
Further, since the surface to be ground is inclined with respect to the horizontal plane, it becomes easy to supply the grinding liquid in the direction against the gravity (upward), and the grinding ability can be improved.

At this time, if the second grinding fluid supply means is provided, the falling speed of the second grinding fluid flowing down the ground surface under the influence of gravity is slower than the conventional configuration in which the ground surface is orthogonal to the horizontal plane. The second grinding fluid can be retained on the surface to be ground for a long time, so that the supply amount of the second grinding fluid can be saved and the surface to be ground is ground by the influence of gravity compared to the conventional configuration in which the surface to be ground is parallel to the horizontal surface. Since the flow rate of the second grinding fluid flowing on the surface is increased, the temperature of the second grinding fluid can be prevented from rising, and the cooling efficiency of the plate-like member by the second grinding fluid can be improved.
Moreover, if a positioning means is provided, a plate-shaped member can be positioned easily.
Furthermore, if a receiving means for receiving the plate-like member when the support means is released is provided, the plate-like member will fall and be damaged when the supporting force of the plate-like member is cut off for some reason. Can be prevented.

The perspective view of the grinding device concerning the embodiment of the present invention. Sectional drawing of a grinding device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In each of the drawings, the shape and arrangement of each component are exaggerated for easy understanding of the contents of the present invention.
For example, when directions such as up, down, left, right, near side, and back are shown without referring to a reference figure in this embodiment, all are based on FIG. In addition, the X axis, the Y axis, and the Z axis in this specification are in a relationship of being orthogonal to each other, the X axis and the Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Further, in the case of indicating a direction in each axis, “+” is an arrow direction of each axis, and “−” is a direction opposite to the arrow.
1 and 2, a grinding apparatus 1 supports a wafer WF as a plate-like member from the surface WFA side on which a circuit as one surface is provided, and grinds a back surface WFB as the other surface. . A protective sheet (not shown) is attached to the front surface WFA of the wafer WF. The grinding apparatus 1 includes a supporting means 2 that supports the wafer WF from the front surface WFA side, a grinding means 3 that grinds the back surface WFB of the wafer WF by the grinding member 31, and a space AG surrounded by the grinding member 31 and the wafer WF. Slurry supply means 4 as first grinding liquid supply means for supplying the slurry LG as the first grinding liquid, moving means 5 for relatively moving the support means 2 and the grinding means 3, and the wafer WF to be ground by the grinding means 3 The cooling water supply means 6 as the second grinding liquid supply means for supplying the cooling water LC as the second grinding liquid to the back surface WFB side, and the receiving means for receiving the wafer WF when the support of the support means 2 is released 7 and an articulated robot 8 as a drive device capable of sucking and holding the wafer WF by an arm 81 connected to suction holding means (not shown) such as a decompression pump and a vacuum ejector. The provided, with the entirety of which is provided in the housing can housing the CA the wafer cassette 10, the overall operation by a personal computer or a sequencer, etc. unillustrated control means is configured to be controlled.

The support means 2 includes a support table 21 formed in a circular shape and having a support surface 22 that supports the wafer WF, and a pair of positioning means 24 that supports the outer edge of the wafer WF and positions the wafer WF at a predetermined position. Prepare.
The support table 21 is supported by the moving means 5 so that the support surface 22 is inclined with respect to the horizontal plane FH (surface perpendicular to the direction of gravity), and suction holding means (not shown) such as a decompression pump or a vacuum ejector. To hold the wafer WF by suction. The inclination angle θ of the support surface 22 with respect to the horizontal plane FH is not particularly limited unless it is approximately 0 ° and approximately 90 °. For example, when grinding a wafer WF having an outer diameter of 450 mm, the wafer WF having an outer diameter of 300 mm is leveled. Therefore, in order to make it smaller than the size when viewed from above in the direction of gravity, the inclination angle θ may be set to 48 ° or more. Here, the support surface 22 is a surface parallel to a surface in which the XY plane is inclined at an angle θ about the X axis, and an intersection line between the support surface 22 and the YZ plane is defined as an inclination axis θD, which is orthogonal to the inclination axis θD. Let the axis be the orthogonal axis CD. When directions are indicated on these axes, “+” is the arrow direction of each axis, and “−” is the opposite direction of the arrow, as described above.
The positioning means 24 is provided at two locations along the outer peripheral direction of the support table 21, and as indicated by reference numeral AA in FIG. 2, a linear motion motor 25 as a drive device provided in the recess 23 of the support table 21. And a positioning pin 27 provided on the output shaft 26 of the linear motor 25, and the positioning pin 27 is provided so as to protrude from the support surface 22.

  The grinding member 31 of the grinding means 3 is a so-called cup-type grinding comprising a substantially disc-shaped grinding base 32 and a grinding stone chip 33 as a plurality or a single grinding stone provided along the outer circumferential direction of the grinding base 32. It is a wheel. An output shaft 35 of a rotation motor 34 as a driving device is connected to the grinding base 32 of the grinding member 31, and a grinding liquid supply port 36 is provided substantially at the center of the grinding base 32, and the slurry supply means 4. Is configured to be able to be supplied into the space AG via the grinding fluid supply port 36.

  The moving means 5 includes an inclination direction moving means 51 for relatively moving the support means 2 and the grinding means 3 in the direction of the inclination axis θD, an orthogonal direction moving means 52 for relatively moving them in the orthogonal axis CD direction, and the X axis. X-axis direction moving means 53 that relatively moves in the direction, and rotating means 54 that relatively rotates them about the axis in the orthogonal axis CD direction.

The tilt direction moving means 51 is provided with a tilt direction linear motion motor 512 as a drive device supported by a frame (not shown) and extending in the tilt axis θD direction.
The orthogonal direction moving means 52 includes an orthogonal direction linear motion motor 522 as a drive device that extends in the orthogonal axis CD direction and is supported by the output shaft 513 of the tilt direction linear motion motor 512. A rotation motor 34 is supported on the slider 523.
The X-axis direction moving means 53 is supported by the frame FR and extends in the X-axis direction. The X-axis direction linearly moving motor 531 as a pair of driving devices arranged along the inclined axis θD direction, and these X-axis direction linear motions And a plate 533 supported by a slider 532 of the motor 531. A chamber extending in the X-axis direction at the tip of the upper surface 534 of the upper surface 534 of the plate 533 and capable of supplying the cooling water LC supplied from the cooling water supply means 6 to the support surface 22 via the cooling water supply slit 538. Is provided. The rotation means 54 includes a rotation motor 541 as a driving device provided in the center of a recess 535 formed in the plate 533, and the output shaft 542 of the rotation motor 541 is connected to the support surface 22 and the upper surface 534 of the plate 533. The support table 21 is supported so that they are substantially flush with each other.

The receiving means 7 includes a fall prevention guide 72 provided below the support means 2.
The fall prevention guide 72 extends in the X-axis direction and is formed in a substantially U shape in sectional view with an upper opening, and a cushioning means 73 such as rubber, resin, or sponge is provided inside the U shape.

  The articulated robot 8 can be a known 6-axis robot or the like, and can move the arm 81 in an arbitrary direction in a space of three orthogonal axes (X, Y, Z axes). The arm 81 is configured to be rotatable about an arbitrary direction as a central axis.

  In the grinding apparatus 1 as described above, as a procedure for grinding the wafer WF, first, when the wafer cassette 10 is placed in the casing CA by a transfer means (not shown), the articulated robot 8 moves the wafer WF with the arm 81. Is sucked out and taken out from the wafer cassette 10. Then, the articulated robot 8 supports two points on the outer edge of the wafer WF with the positioning pins 27 with respect to the support means 2 at the position indicated by the two-dot chain line in FIG. Then, the support unit 2 starts the suction holding of the wafer WF by the suction holding unit (not shown). Thereafter, the articulated robot 8 releases the suction holding of the wafer WF and separates the arm 81 from the wafer WF.

Then, the moving unit 5 drives the X-axis direction linear motor 531 and moves the support unit 2 in the −X-axis direction until the −X-axis direction tip of the wafer WF reaches the lower end of the −X-axis tip region of the grinding base 32. Move. Next, the grinding means 3 drives the rotation motor 34 to rotate the grinding member 31 and also drives the orthogonal direction linear motion motor 522 to move the grinding member 31 in the −CD direction to approach the wafer WF. At this time, the slurry supply unit 4 is driven to start supplying the slurry LG, and the cooling water supply unit 6 is driven to start supplying the cooling water LC.
Subsequently, when the driving of the orthogonal linear motion motor 522 by the grinding means 3 is continued, after the grindstone chip 33 contacts the back surface WFB of the wafer WF, the grindstone chip 33 grinds the wafer WF. When the detecting means (not shown) detects that the grindstone chip 33 has ground the wafer WF to a predetermined depth, the moving means 5 stops driving the orthogonal linear motor 522 and the moving means 5 rotates. The motor 541 is driven to rotate the support table 21.

Here, during grinding of the wafer WF by the grindstone chip 33, as shown in FIG. 2, the slurry LG is supplied into the space AG, and a part of the slurry LG is between the grindstone chips 33 adjacent to each other or the grindstone chip. Although it is discharged from between 33 and the wafer WF, most of it is accumulated in the space AG. At this time, since the support surface 22 is inclined with respect to the horizontal plane FH, the slurry LG tends to be dispersed on the surface to be ground of the wafer WF against gravity.
Further, since the support surface 22 is inclined with respect to the horizontal plane FH, the falling speed of the cooling water LC flowing down on the surface to be ground due to the influence of gravity is slower than when the support surface 22 is orthogonal to the horizontal plane. Thereby, the cooling water LC can be retained for a long time on the surface to be ground, and the supply amount of the cooling water LC can be saved. Furthermore, compared with the case where the support surface 22 is parallel to the horizontal plane, the falling speed of the cooling water LC flowing down on the surface to be ground due to the influence of gravity is increased. Thereby, it can suppress that the temperature of the said cooling water LC rises, and the cooling efficiency of the wafer WF by the said cooling water LC can be improved.

Then, when the driving of the rotation motor 541 by the moving unit 5 is continued and the wafer WF rotates once, the moving unit 5 stops the driving of the rotation motor 541 and drives the orthogonal linear motion motor 522 so that the grinding member 31 is driven. Is moved in the + CD direction to be separated from the wafer WF. Thereafter, the slurry supply means 4, the cooling water supply means 6, and the rotation motor 34 stop driving. Next, the moving means 5 drives the X-axis direction linear motion motor 531 to move the support table 21 in the + X-axis direction and stop it at the position indicated by the two-dot chain line in FIG. Thereafter, the articulated robot 8 holds the wafer WF by suction with the arm 81, the support means 2 releases the suction holding by the suction holding means, and stores the wafer WF in the wafer cassette 10. Then, the same operation as described above is repeated.
Here, when the wafer WF is supported by the support table 21, if the suction holding by the suction holding means is released for some reason, the wafer WF falls and the wafer WF is damaged. In the case of this embodiment, even if the suction holding by the suction holding means is canceled, the wafer WF is supported by the fall prevention guide 72 as shown by the two-dot chain line in FIG. There will be no inconvenience that will cause damage. Moreover, since the shock absorbing means 73 of the fall prevention guide 72 absorbs the impact when the wafer WF is supported, damage to the wafer WF can be suppressed.

  According to the embodiment as described above, since the support surface 22 is inclined with respect to the horizontal plane FH, even if the size of the wafer WF is increased, the area of the wafer WF is increased when viewed from above in the direction of gravity. It can suppress and the increase in the installation area of the grinding apparatus 1 can be suppressed. Further, the slurry LG can be easily dispersed on the surface to be ground of the wafer WF, and the grinding ability can be improved.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, the support surface 22 only needs to be inclined with respect to the horizontal plane FH, and the inclination angle θ of the support surface 22 with respect to the horizontal plane FH is 30 ° to 85 ° from the viewpoint of improving grinding ability and cooling ability. Is preferred.
Further, the relative movement of the support means 2 and the grinding means 3 in the X, θD, and CD directions may be all of the X, θD, and CD directions of the support means 2 in addition to the embodiment shown in the above embodiment. The movement in the direction is regulated, and the grinding means 3 is moved in all the X, θD, and CD directions, or in any direction, or all the X, θD, and CD directions in the grinding means 3 are selected. The movement in the direction is regulated, and the support means 2 is moved in all the X, θD, and CD directions, or in any direction, or the support means 2 and the grinding means 3 are moved in all the X, θD, and CD directions. It is good also as a structure moved to.
Further, the first grinding fluid supply means may be configured to supply the cooling water LC into the grinding member 31 as the first grinding fluid. In addition, the second grinding fluid supply means may or may not be configured to supply the slurry LG to the support surface 22 as the second grinding fluid.

Moreover, as a plate-shaped member in this invention, not only a glass plate, a steel plate, a resin plate, a board | substrate etc. but another member, the members, articles | goods, etc. of arbitrary forms can also be objected.
Further, the articulated robot 8 is limited as long as the wafer WF is taken out from the wafer cassette 10 and placed on the support means 2 or the wafer WF is supported from the support means 2 and stored in the wafer cassette 10. For example, a single-axis robot, a robot other than 6 axes such as 2 or 3 axes, a SCARA robot, or the like can be employed.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Grinding device 2 ... Support means 3 ... Grinding means 4 ... Slurry supply means (1st grinding fluid supply means)
5 ... Moving means 6 ... Cooling water supply means (second grinding fluid supply means)
DESCRIPTION OF SYMBOLS 7 ... Receiving means 22 ... Support surface 24 ... Positioning means 31 ... Grinding member 32 ... Grinding base 33 ... Grinding wheel chip (grinding stone)
LC ... cooling water (second grinding fluid)
LG ... Slurry (first grinding fluid)
WF ... Wafer (plate member)

Claims (5)

A support means having a support surface for supporting the plate-like member from one surface side;
A grinding means for grinding the other surface of the plate-like member by a cup-type grinding member provided with a plurality of or a single grindstone provided along the outer peripheral direction of the plate-like grinding base;
First grinding fluid supply means for supplying a first grinding fluid into a space surrounded by the grinding base, the grindstone, and the other surface of the plate member;
Moving means for adjusting the thickness of the plate-like member after grinding by relatively moving the support means and the grinding member;
The support surface is an inclined surface inclined with respect to a horizontal plane,
The plate-like member grinding apparatus, wherein the moving means relatively moves the support means and the grinding member in a direction parallel to the inclined surface.   2. The plate member grinding apparatus according to claim 1, further comprising a second grinding fluid supply unit configured to supply a second grinding fluid into the space from above the support surface.   The said support means is provided with the positioning means which positions the position of the said plate-shaped member with respect to the said support means to a predetermined position while supporting the side surface which stands | starts up from the to-be-supported surface in the said plate-shaped member. Or the grinding apparatus of the plate-shaped member of Claim 2.   The plate member grinding apparatus according to any one of claims 1 to 3, further comprising receiving means for receiving the plate member when the support means is released. The plate-like shape is obtained by a cup-type grinding member comprising a support means having a support surface for supporting the plate-like member from one surface side, and a plurality or a single grindstone provided along the outer peripheral direction of the plate-like grinding base. A method for grinding a plate-like member for grinding the other surface of the member,
The support surface is an inclined surface inclined with respect to a horizontal plane,
Supplying a first grinding liquid into a space surrounded by the grinding base, the grindstone, and the other surface of the plate-like member;
A plate-like member grinding method, wherein the plate-like member is ground by relatively moving the support means and the grinding member in a direction parallel to the inclined surface.

Images