JP2010172999A - Machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a machining device for reducing device size by disposing a strut part at a proper position. <P>SOLUTION: This machining device includes a base 31 having a roughly rectangular placing face 31a, a turn table 37 arranged on the placing face 31a and disposed to rotate freely, a chuck table 51 arranged on the turn table 37 to rotate freely and having a holding face 54a holding a semiconductor wafer W, machining units 33, 34, 35 machining the semiconductor wafer W held by the holding face 54a, and side strut parts 42, 43, 44 supporting the machining units 33, 34, 35 to advance/retreat toward the holding face 54a and disposed at the vicinity of the turn table 37 at a corner side of the placing face 31a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a processing apparatus for processing a semiconductor wafer held on a chuck table on a turntable.

  In recent years, the diameter of a semiconductor wafer, which is a workpiece, has increased from 300 mm to 450 mm, and the diameters of the turntable, chuck table, and grindstone are also increased accordingly, which increases the size of the entire processing apparatus. There is a problem.

  Accordingly, in order to solve this problem, there is known a technique for reducing the size of the apparatus by bringing the processing position by the grindstone closer to the rotation center of the turntable (see, for example, Patent Document 1). As shown in FIG. 6, the processing apparatus 91 includes a turntable 94 in which two chuck tables 93 are disposed on a base 92 and a support column 96 in which a processing unit 95 is installed. The support column 96 extends in the short direction of the base 92 behind the turntable 94, and supports the machining unit 95 above the chuck table 93 so as to be movable up and down.

  At this time, the chuck table 93 and the grindstone 97 are in a positional relationship in which straight lines passing through the rotation center C3 of the turntable 94 cross from the respective rotation centers C1 and C2. Due to the positional relationship between the chuck table 93 and the grindstone 97, the processing position by the grindstone 97 is brought close to the rotation center C3 of the turntable 94, thereby reducing the size of the apparatus.

JP 2006-75929 A

  However, in the above-described conventional processing apparatus 91, the support column 96 is arranged to extend in the short direction of the base 92 behind the turntable 94. The base 92 is enlarged in the longitudinal direction by the amount of the arrangement space, and it has been difficult to further reduce the size of the apparatus.

  This invention is made | formed in view of such a situation, and it aims at providing the processing apparatus which can reduce apparatus size by arrange | positioning a support | pillar part in an appropriate position.

  The processing apparatus according to the present invention includes a base having a substantially polygonal arrangement surface, a turntable disposed on the arrangement surface and rotatably disposed, and rotatably disposed on the turntable to hold a workpiece. A chuck table having a holding surface, a machining unit for machining the workpiece held on the holding surface, and supporting the machining unit so as to be able to advance and retreat toward the holding surface, and the turn on the corner side of the arrangement surface. And a support column disposed close to the table.

  According to this configuration, since the column portion supporting the processing unit is disposed close to the turntable on the corner side of the arrangement surface which is an excess space between the arrangement surface of the base and the turntable, the arrangement surface is widened and the column is extended. It is not necessary to secure the arrangement space for the department. Therefore, the apparatus size can be reduced by arranging the support column in the surplus space between the arrangement surface of the base and the turntable.

  Further, in the processing apparatus according to the present invention, an opening is formed in the center of the turntable, and a central support portion is disposed inside the opening, and the support portion is connected to the central support portion by the connecting portion. The processing unit is supported via the connecting portion.

  Further, in the processing apparatus according to the present invention, the strut portion includes two or more struts, each supporting the processing unit, connecting a single strut portion and the central strut portion, and the remaining strut portions and the central strut portion. The support column is disposed close to the turntable so that the straight line connecting the two and the straight line is perpendicular to each other.

  Further, the present invention provides the above processing apparatus, further comprising three or more guide portions for guiding the processing unit in the advancing / retreating direction, wherein the workpiece is moved by the processing unit on a plane perpendicular to the advancing / retreating direction of the processing unit. The processed portion includes the position of the center of gravity of the virtual surface with the installation position of the three or more guide portions as a vertex.

  Further, the present invention provides the processing apparatus, wherein the processing unit includes a pair of guide portions that guide the processing unit in the advance / retreat direction, and a processing portion of the workpiece by the processing unit on a plane perpendicular to the advance / retreat direction of the processing unit. Includes a part of a straight line connecting the installation positions of the pair of guide portions.

  Further, the present invention provides the processing apparatus, wherein the processing unit includes a grindstone having a ring-shaped processing surface, and the processing surface of the grindstone and the workpiece are on a plane perpendicular to the advancing / retreating direction of the processing unit. The processed part that contacts with the arc is an arcuate region.

  The present invention further includes a ball screw mechanism that moves the processing unit in the forward / backward direction by receiving a driving force in the processing apparatus, and the ball screw mechanism is on a plane perpendicular to the forward / backward direction of the processing unit. The processing unit is disposed close to the processing portion of the workpiece.

  Further, in the processing apparatus according to the present invention, the turntable is supported by a base on the outer peripheral edge side, and the chuck table has a table part and an inclination mechanism for adjusting the inclination of the table part, The tilt mechanism is a support position of the table portion at a position corresponding to two points among three vertices of a triangle having a center of gravity of the table portion on a plane perpendicular to the advancing / retreating direction of the processing unit. A first movable support portion and a second movable support portion that are movable in the forward / backward direction, and a fixed support portion that fixes the support position of the table portion at a position corresponding to the remaining one point. The fixed support portion is positioned closer to the outer peripheral edge of the turntable than the first movable support portion and the second movable support portion.

  Further, the present invention provides the processing apparatus, wherein the fixed support portion is more than the first movable support portion and the second movable support portion on a plane perpendicular to the advancing / retreating direction of the processing unit. The unit is disposed close to the machining portion of the workpiece.

  According to the present invention, in the processing apparatus, the chuck table has a conical holding surface having a rotation center as a vertex.

  According to the present invention, in the processing apparatus, the arrangement surface is formed in a substantially rectangular shape.

  According to the present invention, it is possible to reduce the size of the apparatus by arranging the support column at an appropriate position.

It is a figure which shows embodiment of the processing apparatus which concerns on this invention, and is an external appearance perspective view of a semiconductor wafer. It is a figure which shows embodiment of the processing apparatus which concerns on this invention, and is an external appearance perspective view of a processing apparatus. It is a figure which shows embodiment of the processing apparatus which concerns on this invention, and is an upper surface schematic diagram of a processing apparatus. It is a figure which shows embodiment of the processing apparatus which concerns on this invention, and is a fragmentary sectional view of a chuck table. It is a figure which shows embodiment of the processing apparatus which concerns on this invention, and is a figure for demonstrating the positional relationship of each structure of a wafer processing unit. It is a figure which shows the prior art example of the processing apparatus which concerns on this invention. It is a figure which shows embodiment of the processing apparatus which concerns on this invention, and is a cross-sectional schematic diagram of a turntable.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The processing apparatus according to the present embodiment is intended to reduce the size of the apparatus by disposing the support column in the surplus space between the arrangement surface on the base and the turntable. First, before describing a processing apparatus according to an embodiment of the present invention, a semiconductor wafer to be processed will be briefly described. FIG. 1 is an external perspective view of a semiconductor wafer according to an embodiment of the present invention. FIG. 1 shows a state in which the back surface of the semiconductor wafer is directed upward.

  As shown in FIG. 1, the semiconductor wafer W is formed in a substantially disc shape, and is partitioned into a plurality of regions by unscheduled division lines (not shown) arranged on the surface in a lattice shape. A device 88 such as an IC or LSI is formed in the center of the semiconductor wafer W in each region partitioned by the division lines. A protective tape 89 is attached to the surface of the semiconductor wafer W, and the device 88 is protected by the protective tape 89 when the back surface of the semiconductor wafer W is processed. The semiconductor wafer W configured in this way is carried into the processing apparatus 1 while being accommodated in the carry-in cassette 4 (see FIG. 2).

  In the present embodiment, a semiconductor wafer W such as a silicon wafer or GaAs will be described as an example of the workpiece. However, the present invention is not limited to this configuration, and ceramic, glass, sapphire inorganic substrate, The workpiece may be a plate metal or resin ductile material, or various processed materials that require a micron order flatness on the order of submicrons.

  Next, a processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 2 is an external perspective view of the processing apparatus according to the embodiment of the present invention. FIG. 3 is a schematic top view of the wafer processing unit according to the embodiment of the present invention. FIG. 4 is a partial cross-sectional view of the chuck table according to the embodiment of the present invention. In the following description, an example in which the entire back surface of the semiconductor wafer is processed flat and thinned will be described. However, the present invention can be applied to a structure in which only the outer peripheral edge of the back surface of the semiconductor wafer is left and thinned. is there.

  As shown in FIG. 2, the processing apparatus 1 carries in a semiconductor wafer W before processing, a loading / unloading unit 2 for unloading the processed semiconductor wafer W, and a semiconductor wafer W loaded from the loading / unloading unit 2. It comprises a wafer processing unit 3 for grinding and polishing the back surface. The carry-in / carry-out unit 2 has a rectangular parallelepiped base 11, on which the cassette placing portions 12 and 13 on which the carry-in cassette 4 and the carry-out cassette 5 are placed project forward from the front surface 11a. It is provided to do.

  The cassette mounting portion 12 functions as a carry-in entrance, and the carry-in cassette 4 in which the semiconductor wafer W before processing is accommodated is placed. The cassette mounting portion 13 functions as a carry-out port, and the carry-out cassette 5 in which the processed semiconductor wafer W is accommodated is placed. On the upper surface of the base 11, a carry-in / carry-out arm 14 is provided facing the cassette mounting parts 12, 13, and an alignment unit 15 and a spinner cleaning unit 16 are provided adjacent to the carry-in / carry-out arm 14. . Further, on the upper surface of the base 11, a wall portion 17 protrudes upward on the opposite side of the alignment portion 15 and the spinner cleaning portion 16 with the loading / unloading arm 14 interposed therebetween. 18 is installed. A transfer unit 19 attached to a cover (not shown) of the carry-in / carry-out unit 2 is disposed above the base 11.

  The loading / unloading arm 14 loads the unprocessed semiconductor wafer W from the loading cassette 4 mounted on the cassette mounting unit 12 to the alignment unit 15 and mounts it on the cassette mounting unit 13 from the spinner cleaning unit 16. The processed semiconductor wafer W is stored in the unloaded cassette 5. The alignment unit 15 includes a temporary placement table 21 and a plurality of positioning pins 22 (six in the drawing) that can move in the radial direction with respect to the center of the temporary placement table 21.

  The positioning unit 15 performs positioning by moving a plurality of positioning pins 22 toward the center of the temporary placement table 21 with respect to the unprocessed semiconductor wafer W placed on the temporary placement table 21. The spinner cleaning unit 16 has a spinner cleaning table 24, rotates the processed semiconductor wafer W placed on the spinner cleaning table 24 in the base 11, and cleans it by spraying cleaning water. The transfer unit 19 transfers the unprocessed semiconductor wafer W aligned on the temporary placement table 21 to the chuck table 51 of the wafer processing unit 3 and also processes the processed semiconductor wafer W placed on the chuck table 51. Is transferred to the spinner cleaning table 24.

  2 and 3, the wafer processing unit 3 processes the semiconductor wafer W by relatively rotating the rough grinding unit 33, the finish grinding unit 34, the polishing unit 35 and the chuck table 51 holding the semiconductor wafer W. Is configured to do. The wafer processing unit 3 has a rectangular parallelepiped base 31, and the loading / unloading unit 2 is connected to the front surface of the base 31. A ring-shaped turntable 37 having an opening 37a at the center is provided on the substantially rectangular arrangement surface 31a that is the upper surface of the base 31.

  Further, a central support column 41 is erected on the inner side of the opening 37 a of the turntable 37, and three side support columns 42, 43, 44 are provided on the three corners of the arrangement surface 31 a around the turntable 37. It is erected. At this time, the side column portions 42 and 44 are arranged to face each other with the central column portion 41 interposed therebetween, and the side column portions 43 are arranged in a direction orthogonal to a straight line connecting the side column portions 42 and 44. Has been. Further, the three side column portions 42, 43, 44 are connected to the central column portion 41 via the connection portions 46, 47, 48, respectively, and the side column portions 42, 43, 44, the connection portion 46, 47 and 48 and the center support | pillar part 41 form three portal-shaped support | pillar parts.

  As described above, in the wafer processing unit 3, the rough grinding unit 33, the finish grinding unit 34, and the polishing unit 35 are supported by the gate-shaped column portions, respectively, so that the respective side column portions 42, 43, 44 The rigidity with respect to the load of each processing unit is increased as compared with the configuration in which the processing unit is supported alone. Furthermore, since the rough grinding unit 33 and the finish grinding unit 34 are cantilevered at the connecting portions 46 and 47, respectively, moment force is generated in the side column portions 42 and 43 in the forward tilt direction. Since the side support portions 43 and 44 are disposed in the respective forward tilt directions of 43, the rigidity against the moment force is also enhanced. This configuration enables a more stable possibility.

  The substantially rectangular arrangement surface 31a does not need to be strictly rectangular, and when the turntable 37 is arranged, the side support portions 42, 43, and 44 are arranged at the four corners. Any configuration that can secure the surplus space may be used. Therefore, the corner of the arrangement surface 31a may be an arc, or one side of the arrangement surface 31a may partially swell laterally.

  Four chuck tables 51 are arranged on the upper surface of the turntable 37 at intervals of 90 degrees in the circumferential direction. The turntable 37 is connected to a rotation drive mechanism (not shown), and is intermittently rotated at 90 ° intervals in the D1 direction by the rotation drive mechanism. As a result, the four chuck tables 51 are provided at the transfer position for transferring the semiconductor wafer W to and from the transfer unit 19, the rough grinding position at which the semiconductor wafer W is opposed to the rough grinding unit 33, and the semiconductor wafer at the finish grinding unit 34. It is moved between a finish grinding position where W is opposed and a polishing position where the semiconductor wafer W is opposed to the polishing unit 35.

  The turntable 37 has an air bearing portion 37b on the outer peripheral edge side, and is supported by an opening edge portion of an opening portion 31b formed in the center of the base 31 (see FIG. 7). Further, the radially inner side of the air bearing portion 37b of the turntable 37 is a hollow portion 37c in which an opening portion 37a is formed, and is located inside the opening portion 31b. The air bearing portion 37b is supported via the air by forming an air gap with the opening edge of the base 31 by air supplied from the opening edge of the base 31 when rotating, and the base 31 when stopped. An air gap with the opening edge of the base 31 is eliminated, and it is supported directly on the opening edge of the base 31.

  As shown in FIG. 4A, the chuck table 51 includes a substantially disc-shaped table portion 52 and an inclination mechanism 53 that adjusts the inclination of the table portion 52. A circular recess 52a is formed at the center of the upper surface of the table portion 52, and a stepped portion 52b is formed along the outer periphery of the recess 52a. The stepped portion 52b is provided with a suction holding portion 54 for sucking and holding the semiconductor wafer W, and the holding surface 54a of the suction holding portion 54 is formed in a slowly inclined cone shape having the rotation center of the chuck table 51 as a vertex. Yes. The suction holding unit 54 is formed of a porous ceramic material, and is connected to a suction source (not shown) disposed in the base 31 through a recess 52a. When the semiconductor wafer W is sucked onto the holding surface 54a of the suction holding portion 54, the semiconductor wafer W also has a conical shape with a gentle inclination along the holding surface 54a.

  The tilt mechanism 53 includes two movable support portions 55 and 56 and one fixed support portion 57, and supports the table portion 52 on the turntable 37 at three points (see FIG. 5). The movable support portions 55 and 56 are configured by a ball screw mechanism, and support the table portion 52 so as to be movable up and down. The fixed support part 57 supports the table part 52 at a fixed position. Accordingly, of the three support portions, the two movable support portions 55 and 56 move up and down, whereby the table portion 52 is inclined with the fixed support portion 57 as a fulcrum.

  Further, as shown in FIG. 4B, the tilt mechanism 53 tilts the table portion 52 in accordance with the gradient of the conical holding surface 54a of the suction holding portion 54 during rough grinding, for example, with respect to the grinding wheel 66. Then, adjustment is made so that a part of the semiconductor wafer W is parallel. In this way, the processed portion where the grinding wheel 66 and the semiconductor wafer W come into contact with each other becomes a region extending from the center of the semiconductor wafer W to the outer peripheral edge.

  2 and 3, the connecting portion 46 is provided with a pair of guide rails 62 that are parallel to each other in the vertical direction. The pair of guide rails 62 support a motor-driven movable housing 63 that supports the rough grinding unit 33. Are slidably arranged. Similarly, a pair of guide rails 72 and 82 and movable housings 73 and 83 are also provided in the connecting portions 47 and 48.

  Each movable housing 63, 73, 83 is provided with a nut portion (not shown), and ball screws 64, 74, 84 are screwed to these nut portions. The ball screws 64, 74, 84 are connected by a drive motor (not shown) provided in the connecting portions 46, 47, 48, and are driven to rotate by the drive motor to move the movable housings 63, 73, 83 in the vertical direction. Yes.

  The rough grinding unit 33 includes a movable housing 63, a spindle (not shown) that is driven by a motor, and a grinding wheel 66 that is detachably attached to the lower end of the spindle. The rough grinding unit 33 thins the semiconductor wafer W by roughly grinding the grinding wafer 66 in contact with the back surface of the semiconductor wafer W held on the rotated chuck table 51.

  The grinding wheel 66 is composed of a diamond wheel in which diamond abrasive grains are hardened with a binder such as a metal bond or a resin bond. The grinding wheel 66 is formed in a thin cylindrical shape and has a ring-shaped grinding surface. The finish grinding unit 34 has substantially the same configuration as that of the rough grinding unit 33, but a grinding wheel 76 having a fine particle size is used.

  The polishing unit 35 has substantially the same configuration as the rough grinding unit 33 and the finish grinding unit 34, but a polishing grindstone 86 formed of a foaming agent, fiber, or the like may be used instead of the grinding grindstone 66. is there. The polishing grindstone 86 has a circular polishing surface, and mirror processing is performed when the circular polishing surface is in sliding contact with the back surface of the semiconductor wafer W. By mirror processing of the semiconductor wafer W, mechanical damage generated in the semiconductor wafer W is removed and the bending strength is improved.

  Next, with reference to FIG. 5, the positional relationship of each component constituting the wafer processing unit will be described in detail. FIG. 5 is a diagram for explaining the positional relationship between the components of the wafer processing unit.

  As shown in FIG. 5, a turntable 37 is disposed on a placement surface 31a formed in a rectangular shape when viewed from above, and an excess space S is formed on the corner side of the placement surface 31a. By arranging the side column portions 42, 43, 44 in this surplus space S, it is not necessary to widen the arrangement surface 31a for the side column portions 42, 43, 44, so that the entire apparatus can be reduced in size. Is possible.

  Further, the spaces between the side support columns 42, 43, 44 are open, and the rough grinding unit 33, the finish grinding unit 34, and the polishing unit 35 are arranged between the side support columns 42, 43, 44 on the base 31. Since it faces the surrounding work space, it is possible to improve workability such as maintenance work.

  The connecting portions 46, 47, and 48 extend in the radial direction of the turntable 37 from the side column portions 42, 43, and 44 toward the central column portion 41. A rough grinding unit 33, a finish grinding unit 34, and a polishing unit 35 are supported above the chuck table 51 via a pair of guide rails 62, 72, and 82 on one side surface of the coupling portions 46, 47, and 48. . At this time, the rough grinding unit 33 is supported at a position where substantially half of the rough grinding unit 33 overlaps the chuck table 51, and processes the semiconductor wafer W at a position close to the pair of guide rails 62.

  Specifically, as described above, the semiconductor wafer W is held in a gently inclined conical shape on the holding surface 54a of the chuck table 51, so that the processing portion P1 of the grinding wheel 66 with the ring-shaped grinding surface is An arc-shaped region is formed from the center of the semiconductor wafer W toward the outer peripheral edge. And the straight line L1 which connects the installation location of a pair of guide rail 62 is a positional relationship which crosses this process part P1.

  With such a positional relationship, since the pair of guide rails 62 receives the reaction force received from the processing portion P1 on the straight line L1 side via the rough grinding unit 33, the offset load acting on the pair of guide rails 62 is reduced, and the processing is performed. The plane accuracy of the portion P1 is improved and the processing quality is improved. Further, the finish grinding unit 34 is also supported by the pair of guide rails 62 in the same positional relationship as the rough grinding unit 33, and the planar accuracy of the processed portion is improved.

  The polishing unit 35 is supported so as to be positioned directly above the chuck table 51 by a pair of guide rails 82 installed at opposing positions. At this time, since the semiconductor wafer W is polished on the entire polishing surface of the polishing grindstone 86, the processed portion P3 becomes the entire polishing surface. Since the straight line L3 that connects the installation positions of the pair of guide rails 82 passes through the center of the machining portion P3, the unbalanced load that the pair of guide rails 82 receives from the machining portion P3 is reduced, and the plane accuracy of the machining portion P3 is improved and machining quality is improved. Will improve.

  Further, ball screws 64, 74, and 84 connected to the rough grinding unit 33, the finish grinding unit 34, and the polishing unit 35 via nuts (not shown) are provided in the connecting portions 46, 47, and 48, respectively. Among these, the ball screw 64 for the rough grinding unit 33 and the ball screw 74 for the finish grinding unit 34 are arranged close to the corresponding processed portions P1 and P2.

  As described above, by disposing the ball screws 64 and 74 close to the processed portions P1 and P2, the reaction force moment that increases as the distance between the ball screws 64 and 74 and the processed portions P1 and P2 increases is reduced. . With this configuration, a decrease in the driving force of the ball screw due to an increase in the reaction force moment received from the processed portions P1 and P2 is suppressed, and the driving force of the ball screws 64 and 74 is easily transmitted to the processed portions P1 and P2, thereby improving processing quality. It becomes possible. Therefore, the term “proximity” as used in the claims indicates a distance such that the driving force of the ball screw is not reduced by a reaction force moment from the processed portion.

  The chuck table 51 is supported by the two movable support portions 55 and 56 and the one fixed support portion 57 at a position that is a vertex of an equilateral triangle with the center of rotation as the center of gravity. At this time, the fixed support portion 57 is positioned closer to the outer peripheral edge side of the turntable 37 than the movable support portions 55 and 56. More specifically, the fixed support portion 57 is located above the air bearing portion 37b, and the movable support portions 55 and 56 are located above the hollow portion 37c. Furthermore, the fixed support portion 57 is disposed closer to the processed portions P1 and P2 than the movable support portions 55 and 56.

  Due to such a positional relationship, of the movable support portions 55 and 56 and the fixed support portion 57, the fixed support portion 57 that is most resistant to pressing is the outer peripheral edge side of the turntable 37 constituting the air bearing (the opening edge of the base 31). Therefore, the tilt angle of the chuck table 51 can be firmly supported. Furthermore, by making the fixed support portion 57 close to the processed portions P1 and P2, the processing load from the processed portions P1 and P2 can be strongly received by the fixed support portion 57, and the tilt angle of the chuck table 51 is firmly supported. It becomes possible.

  As described above, according to the processing apparatus 1 according to the present embodiment, on the corner side of the arrangement surface 31a that is the surplus space S between the arrangement surface 31a of the base 31 and the turntable 37 of the wafer processing unit 3, Since the side column portions 42, 43, and 44 are arranged close to the turntable 37, it is not necessary to widen the arrangement surface 31a to secure an arrangement space for the side column portions. Therefore, by arranging the side struts 42, 43, 44 in the surplus space between the arrangement surface 31a of the base 31 and the turntable 37, the size of the apparatus can be reduced.

  In the present embodiment, each processing unit is supported by a pair of guide rails, but each processing unit may be supported by three or more guide rails. In this case, on the horizontal plane perpendicular to the vertical direction, the processing portion of each processing unit and the semiconductor wafer passes through the center of gravity of the virtual plane with the installation position of each guide rail as the apex. As a result, each guide rail receives the reaction force received from the machining part at the center of gravity position of the virtual plane via the machining unit, so that the uneven load acting on each guide rail is reduced and the plane accuracy of the machining part is improved. Is possible.

  In the above-described embodiment, the turntable 37 is supported by the air bearing. However, the present invention is not limited to this configuration. Any structure may be used as long as the turntable 37 is rotatably supported. For example, the turntable 37 may be mechanically supported by a bearing or the like.

  In the above-described embodiment, the gate-shaped support column is formed by the side support portion, the central support portion, and the connecting portion. However, the present invention is not limited to this configuration. It is only necessary that each processing unit can be supported. For example, each processing unit may be supported only by the side struts.

  In the above-described embodiment, the processing unit includes a rough grinding unit, a finish grinding unit, and a polishing unit as processing units. However, the present invention is not limited to this configuration, and has a configuration including at least one of them. I just need it.

  In the above-described embodiment, the entire back surface of the semiconductor wafer W is processed. However, the present invention is not limited to this configuration. Any structure may be used as long as the semiconductor wafer W is processed by grinding. For example, only the outer peripheral edge of the back surface of the semiconductor wafer W may be left and thinned. In this case, a small-diameter grindstone is used, and the holding surface of the chucking holding portion of the chuck table is flattened to hold the semiconductor wafer W flat.

  Further, in the above-described embodiment, by arranging the side struts in the surplus space located on the corner side of the base placement surface, the base is downsized according to the size of the turntable. However, it is not limited to this configuration. It is also possible to effectively use the remaining space for installing other components by arranging the side struts in the surplus space. With this configuration, it is possible to install other components without increasing the size of the base.

  In the above-described embodiment, the configuration in which the base has a substantially rectangular arrangement surface has been described as an example, but the configuration is not limited to this configuration. The shape may be any shape as long as an excess space can be formed on the corner side of the arrangement surface, and the arrangement surface may be substantially polygonal.

  The embodiment disclosed this time is illustrative in all respects and is not limited to this embodiment. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims for patent.

  As described above, the present invention has an effect that the size of the apparatus can be reduced by arranging the support column at an appropriate position, and in particular, the semiconductor held on the chuck table on the turntable. This is useful for a processing apparatus for processing a wafer.

DESCRIPTION OF SYMBOLS 1 Processing apparatus 2 Loading / unloading unit 3 Wafer processing unit 31 Base 31a Arrangement surface 31b Opening 33 Rough grinding unit (processing unit)
34 Grinding unit (processing unit)
35 Polishing unit (processing unit)
37 Turntable 37a Opening 41 Central support part 42, 43, 44 Side support part (support part)
46, 47, 48 Connecting portion 51 Chuck table 52 Table portion 53 Inclination mechanism 54 Adsorption holding portion 54a Holding surface 55, 56 Movable support portion 57 Fixed support portion 62, 72, 82 Guide rail (guide portion)
64, 74, 84 Ball screw 66, 76 Grinding wheel (grinding wheel)
86 Abrasive wheel
W Semiconductor wafer (work)

Claims (11)

A base having a substantially polygonal arrangement surface;
A turntable disposed on the placement surface and rotatably disposed;
A chuck table rotatably disposed on the turntable and having a holding surface for holding a workpiece;
A machining unit for machining the workpiece held on the holding surface;
A processing apparatus comprising: a support unit that supports the processing unit so as to be capable of advancing and retreating toward the holding surface, and a column portion that is disposed close to the turntable on a corner side of the arrangement surface. The turntable has an opening at the center,
A central strut is disposed inside the opening,
The processing apparatus according to claim 1, wherein the support unit is connected to the central support unit by a connection unit, and supports the processing unit via the connection unit. The struts are two or more, each supporting the processing unit,
The strut portion is arranged close to the turntable so that a straight line connecting one strut portion and the central strut portion and a straight line connecting the remaining strut portions and the central strut portion are orthogonal to each other. The processing apparatus according to claim 2. Comprising three or more guide portions for guiding the processing unit in the advancing and retracting direction,
On a plane perpendicular to the advancing / retreating direction of the machining unit, a machining portion of the workpiece by the machining unit includes a centroid position of a virtual surface with an installation position of the three or more guide portions as a vertex. The processing apparatus according to any one of claims 1 to 3. A pair of guide portions for guiding the processing unit in the forward and backward direction;
2. The machining part of the workpiece by the machining unit on a plane perpendicular to the advancing / retreating direction of the machining unit includes a part of a straight line connecting the installation positions of the pair of guide parts. The processing apparatus according to claim 3. The processing unit has a grindstone having a ring-shaped processing surface,
6. The machine part according to claim 1, wherein on the plane perpendicular to the advancing / retreating direction of the machining unit, a machining part where the machining surface of the grindstone contacts the workpiece is an arcuate region. The processing apparatus as described in. A ball screw mechanism for receiving a driving force to move the processing unit in the forward / backward direction;
The said ball screw mechanism is arrange | positioned adjacent to the process part of the said workpiece | work by the said process unit on the plane perpendicular | vertical with respect to the advancing / retreating direction of the said process unit. The processing apparatus of crab. The turntable is supported by a base on the outer peripheral edge side,
The chuck table has a table part and an inclination mechanism for adjusting the inclination of the table part,
The tilt mechanism is a support position of the table portion at a position corresponding to two points among three vertices of a triangle having a center of gravity of the table portion on a plane perpendicular to the advancing / retreating direction of the processing unit. A first movable support portion and a second movable support portion that are movable in the forward / backward direction, and a fixed support portion that fixes the support position of the table portion at a position corresponding to the remaining one point. ,
The said fixed support part is located in the outer-periphery edge side of the said turntable rather than the said 1st movable support part and the said 2nd movable support part, The any one of Claims 1-7 characterized by the above-mentioned. The processing apparatus as described.   The fixed support portion is disposed closer to a processing portion of the workpiece by the processing unit than the first movable support portion and the second movable support portion on a plane perpendicular to the advancing / retreating direction of the processing unit. The processing apparatus according to claim 8, wherein the processing apparatus is provided.   The processing apparatus according to claim 1, wherein the chuck table has a conical holding surface having a rotation center as a vertex.   The processing device according to claim 1, wherein the arrangement surface has a substantially rectangular shape.

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