JP2019073382A - Roll body - Google Patents

Abstract

To provide a roll body capable of suppressing a misalignment of a sheet in a width direction, while suppressing adhesion between mounting substrates.SOLUTION: There is provided a roll body 1 in which a sheet 2 with metal layers elongated in the longitudinal direction are wound in a roll shape, the sheet 2 with the metal layers including: a substrate assembly sheet 3 in which a plurality of mounting substrates 7 are partitioned for respectively mounting imaging devices; and a first metal layer 4a and a second metal layer 4b disposed on the upper side of the substrate assembly sheet 3. A total thickness of the mounting substrates 7 is 60 μm or less, and the first metal layer 4a and the second metal layer 4b are fixed onto one lateral side region 6a and the other lateral side region 6b of the substrate assembly sheet 3, respectively.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a roll body, and more particularly, to a roll body obtained by winding a substrate assembly sheet including a plurality of mounting substrates.

  Conventionally, a flexible printed circuit board is manufactured by a roll-to-roll process from the viewpoint of production efficiency. Specifically, a long base insulating layer to be a base material is prepared, a plurality of wires and a cover insulating layer are sequentially formed thereon, and finally a plurality of flexible wires are wound around a winding roll. The long sheet on which the circuit board is formed is formed in a roll shape.

  Such a roll-like sheet may be in close contact with the lower surface of another flexible printed circuit board on which the upper surface of one flexible printed circuit board is stacked on the upper side. Therefore, when the sheet is pulled out from the roll shape, a part of the upper surface or the lower surface of one flexible printed circuit board is peeled off and damaged.

  Therefore, Patent Document 1 discloses a manufacturing method in which the first spacer is interposed between the printed circuit boards to be wound in the step of winding in a roll shape. In the manufacturing method of Patent Document 1, in the roll sheet, the first spacer is interposed between one printed circuit board and the other printed circuit board disposed on the upper side, so that they contact each other There is nothing to do. Therefore, when the printed circuit board is pulled out from the roll shape, damage to the printed circuit board can be suppressed.

Unexamined-Japanese-Patent No. 2003-37352

  However, in the manufacturing method of Patent Document 1, since the first spacer is sandwiched between the roll-shaped printed circuit boards (long sheets) in the winding step, the first spacer may be displaced in the width direction. Along with that, the printed circuit board stacked on the first spacer is also shifted in the width direction, and as a result, the sheet is shifted in the width direction in the entire roll body. For example, the sheet protrudes to one side in the width direction at the radial center of the roll body, and the sheet protrudes to the other side in the width direction at the radially outermost side of the roll body. Such a roll body shifted in the width direction is inferior in workability in the subsequent drawing process.

  In addition, the displacement of the sheet in the roll body occurs particularly in the manufacture of an imaging element mounting substrate used for an imaging device (such as a camera module) mounted on a mobile phone or the like. That is, with the demand for downsizing of the mobile phone, the imaging device for the mobile phone is required to be further thinned, and in response thereto, the imaging element mounting substrate is thinned. And in the case of a long sheet on which a plurality of thin flexible wiring circuit boards are formed, the displacement of the sheet will be even larger.

  An object of the present invention is to provide a roll body capable of suppressing displacement of a sheet in the width direction while suppressing adhesion between mounting substrates.

  The present invention [1] is a roll body in which a long sheet long in the longitudinal direction is wound in a roll, and the long sheet is divided into a plurality of mounting boards for mounting electronic components. Substrate assembly sheet, and a metal layer disposed on one side in the thickness direction of the substrate assembly sheet, the total thickness of the mounting substrate is 60 μm or less, and the metal layer is the substrate assembly It includes a roll body fixed to both ends of the sheet in the orthogonal direction orthogonal to the longitudinal direction.

  According to this roll body, the metal layer is disposed on one side in the thickness direction of the substrate assembly sheet, so that one mounting substrate is prevented from being in direct contact with another mounting substrate stacked on the upper side thereof. can do. Therefore, in the roll body, adhesion between mounting substrates can be suppressed.

  In addition, the metal layer is fixed to both ends in the orthogonal direction of the substrate assembly. Therefore, the metal layer can be prevented from being shifted in the orthogonal direction with respect to the substrate assembly. Therefore, the shift of the sheet in the width direction can be suppressed.

  The present invention [2] includes the roll body according to [1], wherein the metal layer is continuous in the longitudinal direction.

  According to this roll body, since the metal layer is continuously present in the longitudinal direction, it is possible to suppress the adhesion between the mounting substrates and the displacement of the sheets over the entire longitudinal direction of the long sheet.

  The present invention [3] includes the roll body according to [1] or [2], wherein the thickness of the metal layer is 20% or more and 150% or less with respect to the total thickness of the mounting substrate. .

  According to this roll body, adhesion between mounting substrates can be suppressed while suppressing an excessive increase in the diameter of the roll body.

  The present invention [4] is any one of [1] to [3], wherein the diameter at the end in the orthogonal direction of the roll body is larger than the diameter at the central portion in the orthogonal direction of the roll body. It contains the roll body described.

  According to this roll body, it is possible to suppress the adhesion between the mounting substrates and the displacement of the sheet over the entire length of the long sheet in the longitudinal direction.

  The roll body of the present invention can suppress the displacement of the sheet in the width direction while suppressing the adhesion between the mounting substrates.

FIG. 1 shows a perspective view of a first embodiment of a roll body of the present invention. FIG. 2 shows a plan view of the sheet with a metal layer of the roll shown in FIG. FIG. 3 shows an AA cross section of FIG. 4A-E show the manufacturing method of the roll body shown in FIG. 1, FIG. 4A is a process of preparing a metal sheet, FIG. 4B is a process of forming a base insulating layer, FIG. 4C forms a conductor pattern. A process, FIG. 4D shows a process of forming a cover insulating layer, and FIG. 4E shows a process of forming a metal layer. FIG. 5 shows a cross-sectional view of the roll shown in FIG. FIG. 6 shows a side view of the roll shown in FIG. FIG. 7 shows a side view of a mounting apparatus using a mounting substrate obtained from the roll shown in FIG. FIG. 8 shows a modification of the roll body shown in FIG. 1 (a form in which the metal layer protrudes to the outside of the substrate assembly sheet). FIG. 9 shows a modified example of the roll body shown in FIG. 1 (a form in which the metal layer has a ladder-shaped pattern). FIG. 10 shows a modified example of the roll body shown in FIG. 1 (a form in which the metal layer has a mesh-shaped pattern). FIG. 11 shows a plan view of a sheet with a metal layer of a second embodiment of a roll body shown in the present invention.

  In FIG. 2, the vertical direction in the drawing is the longitudinal direction (first direction), and the lower side of the drawing is one side in the longitudinal direction (one side in the first direction), and the upper side in the drawing is the other side in the longitudinal direction (the other side in the first direction). is there. Note that one longitudinal side is the downstream side in the winding direction, and the other longitudinal side is the upstream side in the winding direction. The left-right direction in the drawing is the width direction (second direction orthogonal to the first direction), and the left side in the drawing is one side in the width direction (one side in the second direction), and the right side in the drawing is the other side in the longitudinal direction ). The paper thickness direction is the vertical direction (thickness direction, third direction orthogonal to the first direction and the second direction), and the paper front side is the upper side (thickness direction one side, third direction one side), and the paper rear side is It is the lower side (thickness direction other side, third direction other side). Specifically, it conforms to the directional arrow in each figure.

First Embodiment
1. Roll Body A first embodiment of the roll body of the present invention will be described with reference to FIGS.

  In the roll body 1 of the first embodiment shown in FIG. 1, the sheet 2 with a metal layer as a long sheet is wound in a roll shape. The sheet with metal layer 2 includes a substrate assembly sheet 3 and metal layers 4 fixed to both ends of the upper side (one side in the thickness direction).

(Board assembly sheet)
As shown in FIG. 2, the substrate assembly sheet 3 is formed in a sheet shape elongated in the longitudinal direction, and is divided into the mounting substrate region 5 and the end region 6.

  The mounting substrate region 5 is located at the center in the width direction of the substrate assembly sheet 3 and is a region in which a plurality of mounting substrates 7 are formed. In the mounting board area 5, the plurality of mounting boards 7 are aligned at intervals in the longitudinal direction and the width direction.

  The mounting board 7 is a flexible printed circuit board for mounting an electronic component, and includes a plurality of electronic component connection terminals 15, a plurality of external component connection terminals 16, and a wiring 17 as described later.

  The end region 6 is located on both sides in the width direction of the substrate assembly sheet 3 (that is, one end in the width direction and the other end in the width direction), and is a region in which the metal layer 4 is disposed. The end region 6 includes a width direction one side region 6 a and a width direction other side region 6 b. The width direction one side region 6 a is formed to extend from one width direction end edge of the mounting substrate region 5 to reach one end edge of the substrate assembly sheet 3. The other widthwise side region 6 b is continuous with the other end of the mounting substrate region 5 in the widthwise direction and is formed to reach the other end of the substrate assembly sheet 3. The width in the width direction one side region 6a and the width in the width direction other side region 6b are identical to each other, and for example, 1% or more, preferably 3% or more with respect to the width of the substrate assembly sheet 3 For example, it is at most 20%, preferably at most 15%.

  As shown in FIG. 3, the substrate assembly sheet 3 includes the base insulating layer 10, the conductor pattern 11, and the cover insulating layer 12 in the thickness direction.

  The base insulating layer 10 is disposed on the top layer of the substrate assembly sheet 3. The base insulating layer 10 forms the outer shape of the substrate assembly sheet 3 and is formed in a generally rectangular shape in plan view extending in the longitudinal direction. The upper surface of the base insulating layer 10 is formed to be flat. The base insulating layer 10 has a plurality of electronic component connection terminal openings 13 and a plurality of external component connection terminal openings 14 for each mounting substrate 7 of the mounting substrate region 5.

  The plurality of electronic component connection terminal openings 13 are openings for exposing the electronic component connection terminals 15 from the top surface. The plurality of electronic component connection terminal openings 13 are arranged at substantially the central portion of the mounting substrate 7 at regular intervals so as to have a rectangular frame shape. That is, the plurality of electronic component connection terminal openings 13 are provided to correspond to the plurality of terminals 35 (described later) of the electronic component to be mounted. The electronic component connection terminal opening 13 penetrates the insulating base layer 10 in the thickness direction, and has a substantially circular shape in plan view.

  The plurality of external component connection terminal openings 14 are openings for exposing the external component connection terminals 16 from the top surface. The plurality of external component connection terminal openings 14 are arranged at one end portion in the longitudinal direction of the mounting substrate 7 at intervals in the width direction. That is, the plurality of external component connection terminal openings 14 are provided to correspond to the plurality of terminals of the external component to be electrically connected. The external component connection terminal opening 14 penetrates the insulating base layer 10 in the thickness direction, and has a substantially rectangular shape (rectangular shape) in plan view.

  The base insulating layer 10 is formed of an insulating material. Examples of the insulating material include synthetic resins such as polyimide resin, polyamideimide resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, polyvinyl chloride resin and the like. Preferably, the base insulating layer 10 is formed of polyimide resin.

  The thickness of the base insulating layer 10 is, for example, 1 μm or more, preferably 5 μm or more, and for example, 30 μm or less, preferably 10 μm or less, more preferably 8 μm or less.

  The conductor pattern 11 is provided below the base insulating layer 10 so as to be in contact with the lower surface of the base insulating layer 10. The conductor pattern 11 includes a plurality of electronic component connection terminals 15, a plurality of external component connection terminals 16, and a plurality of wirings 17 for each mounting substrate 7 of the mounting substrate region 5.

  The plurality of electronic component connection terminals 15 are terminals for electrically connecting to an electronic component such as an imaging device 31 (described later). The plurality of electronic component connection terminals 15 are arranged at intervals in the center portion of the mounting substrate 7 so as to form a rectangular frame. That is, the electronic component connection terminal 15 is disposed inside the electronic component connection terminal opening 13. The electronic component connection terminal 15 has a substantially circular shape in a plan view, and the upper surface thereof is exposed from the upper surface of the base insulating layer 10.

  The plurality of external component connection terminals 16 are terminals for electrically connecting to external components (shown) such as a motherboard and a power supply. The plurality of external component connection terminals 16 are arranged at the end portion (longitudinal one end portion) of the mounting substrate 7 at intervals in the width direction. That is, the external component connection terminal 16 is disposed inside the external component connection terminal opening 14. The external component connection terminal 16 has a substantially rectangular shape (rectangular shape) in plan view, and the upper surface is exposed from the upper surface of the base insulating layer 10.

  The plurality of wires 17 are provided to correspond to the plurality of electronic component connection terminals 15 and the plurality of external component connection terminals 16. Specifically, the wiring 17 is integrally formed with the electronic component connection terminal 15 and the external component connection terminal 16 so as to connect them. That is, one end of the wiring 17 is continuous with the electronic component connection terminal 15, and the other end of the wiring 17 is continuous with the external component connection terminal 16 to electrically connect them.

  Examples of the material of the conductor pattern 11 include metal materials such as copper, silver, gold, nickel or alloys containing them, and solder. Preferably, copper is mentioned.

  The thickness of the conductor pattern 11 is, for example, 1 μm or more, preferably 3 μm or more, and for example, 15 μm or less, preferably 10 μm or less, more preferably 8 μm or less, from the viewpoint of suppression of warpage and handleability. is there.

  The width of the wiring 17 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

  The cover insulating layer 12 is provided below the base insulating layer 10 and the conductor pattern 11 so as to cover the conductor pattern 11. That is, the cover insulating layer 12 is disposed in contact with the lower surface and the side surface of the conductive pattern 11 and the lower surface of the base insulating layer 10 exposed from the conductive pattern 11. The outer shape of the cover insulating layer 12 is formed to be substantially the same as the outer shape of the base insulating layer 10.

  The cover insulating layer 12 is formed of an insulating material similar to the insulating material described above in the base insulating layer 10, and is preferably formed of a polyimide resin.

  The thickness of the cover insulating layer 12 is, for example, 1 μm or more, preferably 2 μm or more, and for example, 30 μm or less, preferably 10 μm or less, more preferably 5 μm or less.

  The total thickness (maximum thickness) of the substrate assembly sheet 3, that is, the total thickness of the mounting substrate 7 is 60 μm or less, preferably 40 μm or less, more preferably 20 μm or less, further preferably 10 μm from the viewpoint of thinning Or less, and for example, 1 μm or more, preferably 5 μm or more.

(Metal layer)
The metal layer 4 is arranged in the end region 6 of the substrate assembly sheet 3. The metal layer 4 includes the first metal layer 4 a and the second metal layer 4 b at both ends in the outer direction of the substrate assembly sheet 3.

  The first metal layer 4a is disposed on the upper surface of the widthwise one side region 6a. That is, the first metal layer 4a is disposed at an interval in the width direction one side of the mounting substrate 7 disposed at the most in the width direction one side. One widthwise one end edge of the first metal layer 4a coincides with one widthwise one end edge of the substrate assembly sheet 3 in a plan view. The first metal layer 4a is formed in a generally rectangular shape in plan view extending in the longitudinal direction.

  The second metal layer 4 b is disposed on the upper surface of the widthwise other side region 6 b. That is, the second metal layer 4 b is disposed at the other side in the width direction than the mounting substrate 7 disposed at the other side in the width direction, at an interval. The other widthwise end edge of the second metal layer 4b coincides with the other widthwise end edge of the substrate assembly sheet 3 in plan view. The second metal layer 4b is formed in the same shape (the same width) as the first metal layer 4a, and is formed in a generally rectangular shape in plan view extending in the longitudinal direction. That is, the second metal layer 4b is disposed so as to be line-symmetrical to the first metal layer 4a on the basis of a center line passing through the center of the substrate assembly sheet 3 in the width direction.

  Examples of the material of the metal layer 4 include metal materials such as stainless steel, 42 alloy, aluminum, copper alloy and the like. Preferably, stainless steel is mentioned. Thereby, the substrate assembly sheet 3 (base insulating layer 10) can be firmly fixed to the metal layer 4 in the method of manufacturing the roll body 1 described later.

  The thickness of the metal layer 4 is 60 μm or less, preferably 40 μm or less, more preferably 20 μm or less, still more preferably 10 μm or less, and for example, 1 μm or more, preferably 5 μm or more. The thickness of the metal layer 4 is, for example, 20% or more, preferably 50% or more, more preferably 80% or more, for example, 150% or less, with respect to the total thickness of the mounting substrate 7. Preferably, it is 100% or less. By making the thickness of the metal layer 4 less than or equal to the above upper limit, it is possible to suppress an excessive increase in the diameter φ1 (see FIG. 6) of both widthwise end portions of the roll body 1. Further, by setting the thickness of the metal layer 4 to the above lower limit or more, in the roll state, the contact between the upper surface of one mounting substrate 7 and the lower surface of the other mounting substrate 7 stacked on the upper side is suppressed. Since it can do, adhesion of mounting board 7 comrades can be controlled.

  The width of the first metal layer 4a or the second metal layer 4b is, for example, 1% or more, preferably 3% or more, with respect to the width of the substrate assembly sheet 3, and for example, 20% or less, preferably Is less than 15%. Specifically, for example, 2 mm or more, preferably 10 mm or more, and for example, 60 mm or less, preferably 40 mm or less.

(Method of manufacturing roll body)
The roll body 1 can be manufactured by producing the sheet 2 with a metal layer and then winding the sheet 2 with a metal layer.

  The manufacturing method of the sheet 2 with a metal layer is provided with a metal sheet preparation process, a board | substrate aggregate sheet formation process, and a metal layer formation process, as shown to FIG. 4A-FIG. 4E. Each formation process (FIG. 4B-FIG. 4E) is implemented by roll to roll.

[Metal sheet preparation process]
In the metal layer preparing step, as shown in FIG. 4A, a metal sheet 23 is prepared.

  The metal sheet 23 is a sheet made of a metal elongated in the longitudinal direction, and is processed into the metal layer 4 in a metal layer forming step described later. That is, the material and thickness of the metal sheet 23 are the same as the material and thickness of the metal layer 4. Further, the width of the metal sheet 23 is the same as the width of the substrate assembly sheet 3. The upper surface of the metal sheet 23 is formed to be flat (smooth). The metal sheet 23 is wound in a roll to be subjected to the next step (FIG. 4B).

[Substrate assembly sheet forming process]
In the substrate assembly sheet forming step, as shown in FIGS. 4B to 4D, the substrate assembly sheet 3 is formed on the upper surface of the metal sheet 23. That is, the base insulating layer 10, the conductor pattern 11, and the cover insulating layer 12 are sequentially formed on the upper surface of the metal sheet 23.

  First, as shown in FIG. 4B, the insulating base layer 10 is formed on the upper surface of the metal sheet 23. Specifically, a base insulating layer 10 having openings (electronic component connection terminal openings 13 and external component connection terminal openings 14) is formed on the upper surface of the metal sheet 23.

  Specifically, as a material of the base insulating layer 10, a varnish (for example, photosensitive polyimide) of a photosensitive insulating material is applied to the entire upper surface of the metal sheet 23 and dried to form a base film (base insulating layer). Form Thereafter, the base film is exposed through a photomask having a pattern corresponding to the openings (13, 14). Thereafter, the base film is developed and heat-cured if necessary.

  Thereby, the metal sheet 23 (as a result, the metal layer 4) adheres to the insulating base layer 10.

  Next, as shown in FIG. 4C, the conductor pattern 11 is formed on the upper surface of the base insulating layer 10. Specifically, the conductor pattern 11 is formed on the upper surface of the insulating base layer 10 and the upper surface of the metal sheet 23 exposed from the openings (13, 14).

  Examples of the method of forming the conductor pattern 11 include an additive method and a subtractive method.

  Next, as shown in FIG. 4D, the cover insulating layer 12 is formed on the top surfaces of the conductor pattern 11 and the base insulating layer 10. Specifically, the cover insulating layer 12 is formed on the upper surface and the side surface of the conductor pattern 11 and the upper surface of the base insulating layer 10 exposed from the conductor pattern 11.

  The method of forming the cover insulating layer 12 is performed, for example, in the same manner as the method of forming the base insulating layer 10.

  Thus, the substrate assembly sheet 3 including the base insulating layer 10, the conductor pattern 11, and the cover insulating layer 12 is obtained in a state of being supported by the metal sheet 23.

[Metal layer formation process]
In the metal layer forming step, as shown in FIG. 4E, the metal sheet 23 is processed to form the metal layer 4. Specifically, part of the metal sheet 23 is removed.

  For example, the widthwise central portion and both end edges of the metal sheet 23 are removed by known etching.

  Thereby, the metal layer 4 provided with the first metal layer 4 a and the second metal layer 4 b is formed, and the metal layer provided sheet 2 provided with the metal layer 4 and the substrate assembly sheet 3 is obtained. In addition, the sheet 2 with a metal layer shown in FIG. 3 is obtained by vertically inverting the obtained sheet 2 with a metal layer.

  In the sheet with a metal layer shown in FIG. 3, the first metal layer 4 a and the second metal layer 4 b are fixed to the upper side of the end region 6 of the substrate assembly sheet 3. That is, the lower surfaces of the first metal layer 4a and the second metal layer 4b are in contact with the upper surface of the base insulating layer 10 in the end region 6 (the width direction one side region 6a or the width direction other side region 6b). , Is fixed to the upper surface of the end region 6.

  In addition, as described above, fixing is performed by applying and drying the material of the substrate assembly sheet 3 (specifically, the material of the base insulating layer 10) on the metal sheet 23 (as a result, the metal layer 4). The metal layer 4 is adhered and fixed to the surface of the substrate assembly sheet 3 (specifically, the surface of the base insulating layer 10), and the metal layer 4 is simply attached to the surface of the substrate assembly sheet 3. It does not include placing.

[Winding process]
The long sheet with metal layer 2 obtained as described above is wound around a winding roll by a known method. Thereby, the roll body 1 is manufactured.

(Roll body)
In the roll body 1, as shown in FIG. 1, a long sheet 2 with a metal layer is wound. That is, in the cross-sectional view, as shown in FIG. 5, the continuous sheet 2 with a metal layer is stacked in the vertical direction.

  In the cross-sectional view, the upper surface of the metal layer 4 of one sheet 2a with a metal layer is in contact with the lower surface of the end region 6 of the substrate assembly sheet 3b of the other sheet 2 with a metal layer disposed above .

  The upper surface of the mounting substrate region 5 of the substrate assembly sheet 3 of one sheet 2a with a metal layer does not contact the lower surface of the mounting substrate region 5 of the substrate assembly sheet 3 of the other sheet 2b with a metal layer. They are oriented at intervals. Further, the substantially central portion of the mounting substrate region 5 of the substrate assembly sheet 3 of the metal layer coated sheets 2 a and 2 b is slightly depressed toward the lower side (center in the radial direction). That is, the lower end of the mounting substrate region 5 of the substrate assembly sheet 3 is located lower than the lower end of the end region 6 of the substrate assembly sheet 3.

  As shown in FIG. 6, the diameter φ1 at the end region 6 (the end in the orthogonal direction) of the roll is larger than the diameter φ2 at the mounting substrate region 5 (the center in the orthogonal direction) of the roll 1. For example, φ1 (φ1 / φ2) is 1.02 or more, preferably 1.05 or more, and for example, 2.5 or less, preferably 2.0 or less.

2. Mounting Substrate The sheet 2 with a metal layer is drawn out from the roll body 1, and the plurality of mounting substrates 7 formed in the mounting substrate region 5 are singulated. That is, the substrate assembly sheet 3 is cut along the outer shapes of the plurality of mounting substrates 7.

  Thereby, a plurality of separated mounting boards 7 are obtained. The mounting substrate 7 is a printed circuit board for mounting an electronic component (described later) such as the imaging device 31 and does not have the electronic component yet.

  Such a mounting board 7 is suitably used, for example, as a printed circuit board for mounting an imaging device 31 (described later). That is, the mounting substrate 7 is suitably used for an imaging device such as a camera module.

3. Mounting Device The imaging device 30 will be described as an example of a mounting device including the mounting substrate 7 with reference to FIG. 7. The imaging device 30 includes a mounting substrate 7, an imaging element 31 as an example of an electronic component, a housing 32, an optical lens 33, and a filter 34.

  The mounting substrate 7 is disposed so that the base insulating layer 10 is on the upper side and the cover insulating layer 12 is on the lower side.

  The imaging device 31 is a semiconductor device that converts light into an electrical signal, and examples thereof include solid-state imaging devices such as a CMOS sensor and a CCD sensor.

  The imaging device 31 is formed in a flat plate shape substantially rectangular in a plan view, and includes silicon such as a Si substrate, and a photodiode (photoelectric conversion device) and a color filter disposed thereon, although not shown. A plurality of terminals 35 corresponding to the electronic component connection terminals 15 of the mounting substrate 7 are provided on the lower surface of the imaging element 31.

  The imaging device 31 is mounted on the mounting substrate 7. That is, the terminals 35 of the imaging device 31 are flip chip mounted via the electronic component connection terminals (imaging device connection terminals) 15 of the corresponding mounting substrate 7, the solder bumps 36, and the like. Thus, the imaging device 31 is disposed at the central portion of the mounting substrate 7 and electrically connected to the electronic component connection terminal 15 of the mounting substrate 7.

  The imaging element 31 constitutes the imaging unit 37 by being mounted on the mounting substrate 7. That is, the imaging unit 37 includes the mounting substrate 7 and the imaging element 31 mounted thereon.

  The housing 32 is disposed at the center of the mounting substrate 7 in plan view so as to surround the imaging device 31 with a space. The housing 32 has a cylindrical shape substantially rectangular in plan view. At the upper end of the housing 32, a fixing portion for fixing the optical lens 33 is provided.

  The optical lens 33 is disposed on the upper side of the mounting substrate 7 at a distance from the mounting substrate 7 and the imaging device 31. The optical lens 33 is formed in a substantially circular shape in a plan view, and is fixed by the fixing portion so that light from the outside reaches the imaging element 31.

  The filter 34 is disposed between the imaging device 31 and the optical lens 33 so as to be spaced therefrom and fixed to the housing 32.

4. The roll 1 is a roll in which a sheet 2 with a metal layer elongated in the longitudinal direction is wound in a roll, and the sheet 2 with a metal layer is a substrate on which a plurality of mounting substrates 7 are divided. The assembly sheet 3 and the first metal layer 4 a and the second metal layer 22 disposed on the upper side of the substrate assembly sheet 3 are provided. The total thickness of the mounting substrate 7 is 60 μm or less, and the first metal layer 4 a and the second metal layer 22 are fixed to the end region 6 (6 a, 6 b) of the substrate assembly sheet 3.

  For this reason, it can suppress that the 1st metal layer 4a and the 2nd metal layer 22 directly contact the lower surface of other mounting substrate 7b on which the upper surface of one mounting substrate 7a is laminated on the upper side. Therefore, in the roll body 1, the adhesion between the mounting substrates 7 can be suppressed.

  The first metal layer 4 a and the second metal layer 22 are fixed to the end region 6 of the substrate assembly sheet 3. Therefore, the first metal layer 4 a and the second metal layer 22 can be suppressed from being shifted in the width direction with respect to the substrate assembly sheet 3. Therefore, the shift | offset | difference of the board | substrate aggregate sheet 3 in the width direction can be suppressed.

  Further, the first metal layer 4a and the second metal layer 22 are continuous in the longitudinal direction.

  For this reason, while being able to suppress close_contact | adherence of mounting board 7 comrades over the length direction of the elongate sheet | seat 2 with a metal layer, the shift | offset | difference of the sheet | seat 2 with a metal layer in the roll body 1 can be suppressed.

  Further, the diameter φ1 in the end region 6 of the roll body 1 is larger than the diameter φ2 in the mounting substrate region 5 of the roll body 1.

  For this reason, while being able to suppress close_contact | adherence of mounting board 7 comrades over the length direction of the elongate sheet | seat 2 with a metal layer, the shift | offset | difference of the sheet | seat 2 with a metal layer in the roll body 1 can be suppressed.

5. Modified Example In the roll body 1 shown in FIGS. 1 to 3, the width direction outer edge of the metal layer 4 coincides with the width direction edge of the substrate assembly sheet 3 in plan view, for example, FIG. As shown in FIG. 2, the widthwise outer edge of the metal layer 4 may be located outside the widthwise edge of the substrate assembly sheet 3 in a plan view.

  Specifically, in the embodiment shown in FIG. 8, the widthwise one end edge of the first metal layer 4 a is located on one side in the width direction than the widthwise one end edge of the substrate assembly sheet 3 in plan view Protruding). Further, the other widthwise end edge of the second metal layer 4b is positioned (projected) on one side in the widthwise direction than the other widthwise edge of the substrate assembly sheet 3 in plan view.

  In the roll body 1 shown in FIGS. 1 and 2, the metal layer 4 is formed in a generally rectangular shape in plan view continuous in the longitudinal direction, that is, although not patterned, it is shown, for example, in FIGS. As such, the metal layer 4 may be patterned.

  In the embodiment shown in FIG. 9, the metal layer 4 has a ladder shape. Specifically, a ladder-shaped pattern including a pair of longitudinally extending straight portions 26 and a plurality of connecting portions 27 connecting these is continuous in the longitudinal direction.

  In the embodiment shown in FIG. 10, the metal layer 4 has a mesh shape. Specifically, the grid-like metal pattern is continuous in the longitudinal direction.

  Further, although the substrate assembly sheet 3 of the roll body 1 shown in FIG. 2 is provided with the base insulating layer 10, the conductor pattern 11 and the cover insulating layer 12 in the thickness direction, that is, only one conductor pattern 11 is provided. Although not shown, for example, the substrate assembly sheet 3 may have a multi-layered conductor pattern.

  Specifically, the substrate assembly sheet 3 includes the base insulating layer 10, the conductor pattern 11 (first conductor pattern), the cover insulating layer 12 (first cover insulating layer), the second conductor pattern, and the second cover insulating layer. The layer may be provided in the thickness direction, and the base insulating layer 10, the conductor pattern 11 (first conductor pattern), the cover insulating layer 12 (first cover insulating layer), the second conductor pattern, and the second cover insulating layer The third conductor pattern and the third cover insulating layer may be provided in the thickness direction. The material and thickness of the second conductor pattern and the third conductor pattern are the same as the material and thickness of the first conductor pattern. The material and thickness of the second cover insulating layer and the third cover insulating layer are the same as the material and thickness of the first cover insulating layer.

  The total thickness of the mounting substrate 7 is also 60 μm or less, as in the embodiment of FIG.

  The total thickness of the conductor patterns (for example, the total thickness of the first to third conductor patterns, the total thickness of the first to third conductor patterns) is, for example, 1 μm or more, preferably 3 μm or more, and for example, 15 μm or less Preferably, it is 10 micrometers or less, More preferably, it is 8 micrometers or less.

Second Embodiment
The roll body 1 of the second embodiment will be described with reference to FIG. In addition, in the roll body 1 of 2nd Embodiment, the same code | symbol is attached | subjected to the member similar to above-described 1st Embodiment, and the description is abbreviate | omitted.

  In the roll body 1 of the second embodiment, the sheet with metal layer 2 further includes an intermediate metal layer 24 in addition to the substrate assembly sheet 3 and the metal layer 4.

  The board assembly sheet 3 includes a plurality of (two) mounting substrate areas 5 spaced apart in the width direction and a plurality of end area 6 disposed in the width direction outer side of the plurality of mounting board areas 5 6a, 6b) and one or more (one) intermediate regions 8 disposed between the plurality of mounting substrate regions 5.

  The intermediate metal layer 24 is fixed to the upper surface of the intermediate region 8. The intermediate metal layer 24 is formed in a generally rectangular shape in plan view extending in the longitudinal direction.

  The material and thickness of the intermediate metal layer 24 are the same as the material and thickness of the metal layer 4. The width of the intermediate metal layer 24 is equal to or wider than the width of the metal layer 4, and is, for example, not less than 1 and not more than 3 times the width of the metal layer 4.

  Also with the roll body 1 of the second embodiment, the same effects as those of the roll body 1 of the first embodiment can be obtained. The modification of the first embodiment can also be applied to the modification of the second embodiment.

  When the roll body 1 of the second embodiment is cut in the longitudinal direction so as to pass through the center of the intermediate metal layer 24 in the width direction as shown by phantom lines, two split roll bodies are produced. Also in each of the split roll bodies, the metal layer 4 (the first metal layer 4a and the intermediate metal layer 24a on one side in the width direction, or the intermediate metal layer on the second metal layer 4b and the other side in the width direction) 24b) is fixed. Therefore, also in a division | segmentation roll body, there exists an effect similar to the roll body 1 of 1st Embodiment.

Reference Signs List 1 roll body 2 sheet with metal layer 3 substrate assembly sheet 4 metal layer 4 a first metal layer 4 b second metal layer 6 end region 7 mounting substrate

Claims (4)

It is a roll body in which a long sheet long in the longitudinal direction is wound in a roll,
The long sheet is
A board assembly sheet in which a plurality of mounting boards for mounting electronic components are partitioned;
And a metal layer disposed on one side in the thickness direction of the substrate assembly sheet.
The total thickness of the mounting substrate is 60 μm or less.
The roll body, wherein the metal layer is fixed to both ends of the substrate assembly sheet in a direction orthogonal to the longitudinal direction.   The roll body according to claim 1, wherein the metal layer is continuous in the longitudinal direction.   The roll body according to claim 1, wherein a thickness of the metal layer is 20% or more and 150% or less with respect to a total thickness of the mounting substrate.   The roll body according to any one of claims 1 to 3, wherein a diameter at an end of the roll body in the orthogonal direction is larger than a diameter at a central portion of the roll body in the orthogonal direction. .

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