TW201924503A - Roll body - Google Patents

Abstract

This roll body is obtained by winding a long sheet which is long in the longitudinal direction into a roll. The long sheet is provided with: a substrate aggregate sheet in which a plurality of mounting substrates for mounting electronic components are demarcated; and a metal layer which is provided to one side of the substrate aggregate sheet in the thickness direction. The total thickness of the mounting substrates is 60 [mu]m or lower. The metal layer is affixed to both ends of the substrate aggregate sheet in an orthogonal direction orthogonal to the longitudinal direction.

Description

Roller

The present invention relates to a roller body, and more specifically, to a roller body formed by winding a substrate assembly sheet including a plurality of mounting substrates.

From the past, from the viewpoint of production efficiency, the flexible printed circuit board is manufactured by the roll-to-roll process. Specifically, a long base insulating layer as a base material is prepared, a plurality of wirings and a covering insulating layer are sequentially formed thereon, and finally it is wound on a take-up roller, thereby forming a plurality of flexible The long sheet of the printed circuit board is formed into a roll shape.

In such a roll-shaped sheet, the upper surface of one flexible printed circuit board may be in close contact with the lower surface of another flexible printed circuit board stacked on the upper side. Therefore, when the sheet is pulled out from the roll shape, a part of the upper or lower surface of the flexible printed circuit board may be peeled off and damaged.

Therefore, Patent Document 1 discloses a manufacturing method in which the first spacer is interposed between the wound circuit boards in the step of winding into a roll. However, in the manufacturing method of Patent Document 1, the first separator is interposed between one printed circuit board and the other printed circuit board disposed on the upper side of the rolled sheet, so it does not Contact each other. Therefore, when the printed circuit board is pulled out from the roll, damage to the printed circuit board can be suppressed. [Prior Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2003-37352

[Problems to be solved by the invention]

However, in the manufacturing method of Patent Document 1, in the winding step, the first spacer is sandwiched between the rolled circuit board (the long sheet), so the first spacer may occur in the width The case of deviation. Along with this, the printed circuit board stacked on the first spacer is also shifted in the width direction, and as a result, the sheet is shifted in the width direction in the entire roller body. For example, at the radial center of the roller body, the sheet protrudes to one side in the width direction, and at the radially outermost side of the roller body, the sheet protrudes to the other side in the width direction. Such a roll body deviated in the width direction deteriorates workability in the subsequent drawing step.

In addition, the deviation of the sheet material in the roller body occurs particularly in the manufacture of an imaging element mounting substrate used in an imaging device (camera module, etc.) mounted on a mobile phone or the like. That is, with the demand for miniaturization of mobile phones, the camera device for mobile phones is required to be further thinned, and accordingly, the imaging element mounting substrate can be made thinner. In addition, in the long sheet formed with a plurality of thin flexible printed circuit boards, the deviation of the sheet will further occur.

The invention provides a roller body capable of suppressing the close contact of mounting substrates and suppressing the deviation of the sheet material in the width direction. [Technical means to solve the problem]

The present invention [1] includes a roller body which is formed by winding a long long sheet into a roll in the longitudinal direction, and the long sheet is provided with: a substrate assembly sheet for dividing into A plurality of mounting substrates for mounting electronic parts; and a metal layer, which is arranged on the thickness direction side of the substrate assembly sheet; the total thickness of the mounting substrate is 60 μm or less, and the metal layer is fixed to the substrate assembly sheet Both ends of the material in the orthogonal direction orthogonal to the longitudinal direction.

According to this roller body, the metal layer is disposed on the side in the thickness direction of the substrate assembly sheet, so it is possible to suppress direct contact between one mounting substrate and another mounting substrate stacked on the upper side. Thereby, in the roller body, the adhesion of the mounting substrates to each other can be suppressed.

In addition, the metal layer is fixed to both ends of the substrate assembly in the orthogonal direction. Therefore, it is possible to suppress the metal layer from shifting in the orthogonal direction with respect to the substrate assembly. With this, the deviation of the sheet material in the width direction can be suppressed.

The invention [2] includes the roller body according to [1], wherein the metal layer is continuous in the longitudinal direction.

According to this roller body, the metal layer exists continuously in the longitudinal direction, so that it is possible to suppress the adhesion of the mounting substrates and the deviation of the sheets in the entire longitudinal direction of the long sheet.

The present invention [3] includes the roller body according to [1] or [2], wherein the thickness of the metal layer is 20% or more and 150% or less relative to the total thickness of the mounting substrate.

According to the roller body, excessive increase in the diameter of the roller body can be suppressed, and the adhesion of the mounting substrates to each other can be suppressed.

The invention [4] includes the roller body according to any one of [1] to [3], wherein the diameter of the end portion of the roller body in the orthogonal direction is larger than the central portion of the roller body in the orthogonal direction The diameter.

According to the roller body, it is possible to suppress the adhesion of the mounting substrates and the deviation of the sheets in the entire longitudinal direction of the long sheet. [Effect of invention]

The roller body of the present invention can suppress the adhesion of the mounting substrates to each other, and can suppress the deviation of the sheet material in the width direction.

In FIG. 2, the vertical direction on the paper surface is the longitudinal direction (first direction), the lower side of the paper surface is one side in the longitudinal direction (one side in the first direction), and the upper surface side is the other side in the longitudinal direction (the other side in the first direction). Furthermore, one side in the longitudinal direction is the downstream side in the winding direction, and the other side in the longitudinal direction is the upstream side in the winding direction. The left-right direction of the paper is the width direction (the second direction orthogonal to the first direction), the left side of the paper is the width direction side (the second direction side), and the right side of the paper surface is the other side in the longitudinal direction (the other side in the second direction) . The paper thickness direction is up and down (thickness direction, the third direction orthogonal to the first direction and the second direction), the front side of the paper surface is the upper side (the thickness direction side, the third direction side), and the inner side of the paper surface is the lower side Side (the other side in the thickness direction, the other side in the third direction). The specific directions are based on the direction arrows in the figures.

<First Embodiment> 1. Roller body Referring to FIGS. 1 to 6, a first embodiment of the roller body of the present invention will be described.

The roller body 1 of the first embodiment shown in FIG. 1 winds a sheet 2 with a metal layer as a long sheet into a roll shape. The sheet 2 with a metal layer includes a substrate assembly sheet 3 and metal layers 4 fixed to both ends of the upper side (thickness side).

(Substrate assembly sheet) As shown in FIG. 2, the substrate assembly sheet 3 is formed into a long sheet shape in the longitudinal direction, and is divided into a mounting substrate region 5 and an end region 6.

The mounting substrate area 5 is located in the center in the width direction of the substrate assembly sheet 3, and a plurality of mounting substrates 7 are formed. In the mounting board region 5, a plurality of mounting boards 7 are arranged in a line at intervals along the longitudinal direction and the width direction.

The mounting substrate 7 is a flexible wiring circuit board for mounting electronic components, and as described below, includes a plurality of electronic component connection terminals 15, a plurality of external component connection terminals 16, and wiring 17.

The end region 6 is located on both outer sides in the width direction of the substrate assembly sheet 3 (that is, one end side in the width direction and the other end side in the width direction), and is a region where the metal layer 4 is disposed. The end region 6 includes one region 6a in the width direction and the other region 6b in the width direction. The one-side region 6 a in the width direction is formed to be continuous from one end in the width direction of the mounting board region 5 and to reach one end of the substrate assembly sheet 3. The other side region 6 b in the width direction is formed to be continuous from the other end edge in the width direction of the mounting substrate region 5 and reach the other end edge of the substrate assembly sheet 3. The width of one area 6a in the width direction and the width of the other area 6b in the width direction are the same as each other, and each of the widths of the substrate assembly sheet 3 is, for example, 1% or more, preferably 3% or more, and, for example, 20% or less, preferably 15% or less.

As shown in FIG. 3, the substrate assembly sheet 3 includes a base insulating layer 10, a conductor pattern 11, and a cover insulating layer 12 in this order in the thickness direction.

The base insulating layer 10 is disposed on the uppermost layer of the substrate assembly sheet 3. The base insulating layer 10 constitutes an outer shape of the substrate assembly sheet 3, and is formed in a generally rectangular shape in plan view extending in a long shape in the longitudinal direction. The upper surface of the base insulating layer 10 is formed flat. The base insulating layer 10 has a plurality of electronic component connection terminal openings 13 and a plurality of external component connection terminal openings 14 for each mounting substrate 7 of the mounting substrate area 5 one by one.

The plurality of openings 13 for connecting terminals of electronic components are used to expose the connecting terminals 15 of electronic components from the upper surface. The plurality of electronic component connection terminal openings 13 are arranged at a substantially central portion of the mounting substrate 7 at regular intervals so as to form a rectangular frame shape. That is, the plurality of electronic component connection terminal openings 13 are provided so as to correspond to the plurality of terminals 35 (described below) of the mounted electronic component. The electronic component connection terminal opening 13 penetrates the base insulating layer 10 in the thickness direction and has a substantially circular shape in plan view.

The plurality of external component connection terminal openings 14 are openings for exposing the external component connection terminals 16 from the upper surface. A plurality of external component connection terminal openings 14 are arranged at an end in the longitudinal direction of the mounting substrate 7 at regular intervals in the width direction. That is, the plurality of external component connection terminal openings 14 are provided so as to correspond to the plurality of terminals of the external component electrically connected. The external component connection terminal opening 14 penetrates the base insulating layer 10 in the thickness direction and has a substantially rectangular shape (rectangular shape) in plan view.

The base insulating layer 10 is formed of an insulating material. Examples of the insulating material include polyimide resin, polyimide amide imide resin, acrylic resin, polyether nitrile resin, polyether tar resin, polyethylene terephthalate resin, and polyethylene naphthalate. Synthetic resins such as diester resins and polyvinyl chloride resins. It is preferable that the base insulating layer 10 is formed of polyimide resin.

The thickness of the base insulating layer 10 is, for example, 1 μm or more, preferably 5 μm or more, and for example, 30 μm or less, preferably 10 μm or less, and more preferably 8 μm or less.

The conductor pattern 11 is provided on the lower side of the base insulating layer 10 so as to be in contact with the lower surface of the base insulating layer 10. The conductor pattern 11 includes a plurality of electronic component connection terminals 15, a plurality of external component connection terminals 16, and a plurality of wires 17 for each of the mounting substrates 7 of the mounting substrate area 5.

The plurality of electronic component connection terminals 15 are terminals for electrically connecting with electronic components such as an imaging element 31 (described below). The plurality of electronic component connection terminals 15 are arranged in a central portion of the mounting substrate 7 at regular intervals in a rectangular frame shape. That is, the electronic component connection terminal 15 is arranged inside the electronic component connection terminal opening 13. The electronic component connection terminal 15 has a substantially circular shape in plan view, and its upper surface is exposed from the upper surface of the base insulating layer 10.

The plurality of external component connection terminals 16 are terminals for electrically connecting with external components (illustration) such as a motherboard and a power supply. A plurality of external component connection terminals 16 are arranged at an end (a longitudinal end) of the mounting substrate 7 in a line with each other at intervals in the width direction. That is, the external component connection terminal 16 is arranged inside the external component connection terminal opening 14. The external component connection terminal 16 has a substantially rectangular shape (rectangular shape) in plan view, and its upper surface is exposed from the upper surface of the base insulating layer 10.

The plurality of wirings 17 are provided so as to correspond to the plurality of electronic component connection terminals 15 and the plurality of external component connection terminals 16. Specifically, the wiring 17 is integrally formed with the electronic component connection terminal 15 and the external component connection terminal 16 so as to be integral with it. That is, one end of the wiring 17 is continuous with the electronic component connection terminal 15, and the other end of the wiring 17 is continuous with the external component connection terminal 16 to connect it isoelectrically.

Examples of the material of the conductor pattern 11 include metal materials such as copper, silver, gold, nickel, alloys containing the same, and solder. Preferably, copper is mentioned.

From the viewpoint of suppression of warpage and handling, the thickness of the conductor pattern 11 is, for example, 1 μm or more, preferably 3 μm or more, and for example, 15 μm or less, preferably 10 μm or less, more preferably 8 Below μm.

The width of the wiring 17 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

The cover insulating layer 12 is provided under the base insulating layer 10 and the conductor pattern 11 so as to cover the conductor pattern 11. That is, the cover insulating layer 12 is arranged in contact with the lower surface and side surfaces of the conductor pattern 11 and the lower surface of the base insulating layer 10 exposed from the conductor pattern 11. The outer shape of the cover insulating layer 12 is formed to be substantially the same as the outer shape of the base insulating layer 10.

The cover insulating layer 12 is formed of the same insulating material as described above for the base insulating layer 10, and is preferably formed of polyimide resin.

The thickness of the cover insulating layer 12 is, for example, 1 μm or more, preferably 2 μm or more, and for example, 30 μm or less, preferably 10 μm or less, and more preferably 5 μm or less.

From the viewpoint of thinning, the total thickness (maximum thickness) of the substrate assembly sheet 3, that is, the total thickness of the mounting substrate 7 is 60 μm or less, preferably 40 μm or less, more preferably 20 μm or less, and It is more preferably 10 μm or less, and, for example, 1 μm or more, and preferably 5 μm or more.

(Metal layer) The metal layer 4 is arranged in the end region 6 of the substrate assembly sheet 3. The metal layer 4 includes a first metal layer 4a and a second metal layer 4b at both ends of the substrate assembly sheet 3 in the outer direction.

The first metal layer 4a is disposed on the upper surface of the one region 6a in the width direction. That is, the first metal layer 4a is arranged at an interval with respect to the width direction side of the mounting substrate 7 arranged on the side closest to the width direction. The one end in the width direction of the first metal layer 4 a corresponds to the one end in the width direction of the substrate assembly sheet 3 in plan view. The first metal layer 4a is formed in a substantially rectangular shape in plan view extending in the longitudinal direction.

The second metal layer 4b is disposed on the upper surface of the other region 6b in the width direction. That is, the second metal layer 4b is arranged at an interval on the other side in the width direction than the mounting substrate 7 arranged on the other side in the width direction. The other end of the second metal layer 4b in the width direction coincides with the other end of the substrate assembly sheet 3 in the width direction in plan view. The second metal layer 4b is formed in the same shape (same width) as the first metal layer 4a, and is formed in a substantially rectangular shape in plan view extending in the longitudinal direction. That is, the second metal layer 4b is arranged so as to be in line symmetry with the first metal layer 4a with the center line passing through the center of the substrate assembly sheet 3 in the width direction as a reference.

Examples of the material of the metal layer 4 include metal materials such as stainless steel, 42 alloy, aluminum, and copper alloy. Preferably, stainless steel is mentioned. Thereby, in the manufacturing method of the roller body 1 described below, the substrate assembly sheet 3 (base insulating layer 10) can be firmly fixed to the metal layer 4.

The thickness of the metal layer 4 is, for example, 60 μm or less, preferably 40 μm or less, more preferably 20 μm or less, particularly preferably 10 μm or less, and for example, 1 μm or more, preferably 5 μm or more. The thickness of the metal layer 4 relative to the total thickness of the mounting substrate 7 is, for example, 20% or more, preferably 50% or more, more preferably 80% or more, and for example 150% or less, preferably 100% or less . By setting the thickness of the metal layer 4 below the upper limit, the diameter f1 (see FIG. 6) of both ends of the roller body 1 in the width direction can be suppressed from excessively increasing. In addition, by setting the thickness of the metal layer 4 to be above the lower limit, in the rolled state, the contact between the upper surface of one mounting substrate 7 and the lower surface of the other mounting substrate 7 stacked on the upper side thereof can be suppressed, so the mounting can be suppressed The substrates 7 are in close contact with each other.

The width of the first metal layer 4a or the second metal layer 4b relative to the width of the substrate assembly sheet 3 is, for example, 1% or more, preferably 3% or more, and, for example, 20% or less, preferably 15% the following. Specifically, it is, for example, 2 mm or more, preferably 10 mm or more, and, for example, 60 mm or less, preferably 40 mm or less.

(Manufacturing method of roller body) The roller body 1 can be manufactured by making the sheet 2 with a metal layer, and then winding the sheet 2 with a metal layer.

As shown in FIGS. 4A to 4E, the method of manufacturing the metal layer-attached sheet 2 includes, for example, a metal sheet preparation step, a substrate assembly sheet forming step, and a metal layer forming step. Each forming step (FIGS. 4B to 4E) is performed in a roll-to-roll manner.

[Metal Sheet Preparation Step] In the metal sheet preparation step, as shown in FIG. 4A, the metal sheet 23 is prepared.

The metal sheet 23 is a sheet made of metal that is elongated in the longitudinal direction, and is processed into the metal layer 4 by the following metal layer forming step. That is, the material and thickness of the metal sheet 23 are the same as those of the metal layer 4. In addition, the width of the metal sheet 23 is the same as the width of the substrate assembly sheet 3. Furthermore, the upper surface of the metal sheet 23 is formed flat (smooth). The metal sheet 23 is wound into a roll shape for use in the next step (FIG. 4B).

[Substrate assembly sheet forming step] In the substrate assembly sheet forming step, as shown in FIGS. 4B to 4D, the substrate assembly sheet 3 is formed on the upper surface of the metal sheet 23. That is, on the upper surface of the metal sheet 23, the base insulating layer 10, the conductor pattern 11, and the cover insulating layer 12 are formed in this order.

First, as shown in FIG. 4B, the base insulating layer 10 is formed on the upper surface of the metal sheet 23. Specifically, the base insulating layer 10 having openings (the electronic component connection terminal opening 13 and the external component connection terminal opening 14) is formed on the upper surface of the metal sheet 23.

Specifically, as a material of the base insulating layer 10, a varnish of photosensitive insulating material (for example, photosensitive polyimide) is applied to the entire upper surface of the metal sheet 23 and dried to form a base Film (base insulating layer). Thereafter, the base film is exposed through a photomask having a pattern corresponding to the openings (13, 14). Thereafter, the basal coating is developed, and if necessary, heated to harden it.

Thereby, the metal sheet 23 (and even the metal layer 4) is fixed to the base insulating layer 10.

Next, as shown in FIG. 4C, the conductor pattern 11 is formed on the upper surface of the base insulating layer 10. Specifically, the conductor pattern 11 is formed on the upper surface of the base insulating layer 10 and the upper surface of the metal sheet 23 exposed from the openings (13, 14).

Examples of the method for forming the conductor pattern 11 include an addition method and a subtraction method.

Next, as shown in FIG. 4D, a cover insulating layer 12 is formed on the upper surfaces of the conductor pattern 11 and the base insulating layer 10. Specifically, a cover insulating layer 12 is formed on the upper surface and side surfaces of the conductor pattern 11 and the upper surface of the base insulating layer 10 exposed from the conductor pattern 11.

The forming method of the cover insulating layer 12 is implemented in the same manner as the forming method of the base insulating layer 10, for example.

Thereby, in a state supported by the metal sheet 23, the substrate assembly sheet 3 provided with the base insulating layer 10, the conductor pattern 11 and the covering insulating layer 12 is obtained.

[Metal layer forming step] In the metal layer forming step, as shown in FIG. 4E, the metal sheet 23 is processed to form the metal layer 4. Specifically, a part of the metal sheet 23 is removed.

For example, the center portion and both end edges in the width direction of the metal sheet 23 are removed by well-known etching.

With this, the metal layer 4 including the first metal layer 4 a and the second metal layer 4 b is formed, and the metal-coated sheet 2 including the metal layer 4 and the substrate assembly sheet 3 is obtained. Furthermore, by turning the obtained sheet 2 with a metal layer upside down, it becomes the sheet 2 with a metal layer shown in FIG. 3.

In the sheet with a metal layer shown in FIG. 3, the first metal layer 4 a and the second metal layer 4 b are fixed on the upper side of the end region 6 of the substrate assembly sheet 3. That is, the first metal layer 4a and the second metal layer 4b are in contact with the upper surface of the base insulating layer 10 of the end region 6 (the one region 6a in the width direction or the other region 6b in the width direction) with their lower surfaces In this way, it is fixed on the upper surface of the end region 6.

Furthermore, the term “fixation” refers to applying the material of the substrate assembly sheet 3 (specifically, the material of the base insulating layer 10) to the metal sheet 23 (and even the metal layer 4) as described above. Drying, whereby the metal layer 4 is then fixed to the surface of the substrate assembly sheet 3 (specifically, the surface of the base insulating layer 10), excluding the simple placement of the metal layer 4 on the substrate assembly sheet 3 surface.

[Winding Step] The long-shaped sheet 2 with a metal layer obtained by the above steps is wound on a take-up roll by a known method. With this, the roller body 1 is manufactured.

(Roller Body) In the roller body 1, as shown in FIG. 1, a long sheet 2 with a metal layer is wound. That is, in the cross-sectional view, as shown in FIG. 5, the continuous metal-coated sheet 2 is stacked in the vertical direction.

In the cross-sectional view, the upper surface of the metal layer 4 of the sheet 2a with a metal layer is in contact with the lower surface of the end region 6 of the substrate assembly sheet 3b of the sheet 2 with a metal layer disposed on the upper side .

Furthermore, the upper surface of the mounting substrate region 5 of the substrate assembly sheet 3 of one metal layer-attached sheet 2a is not below the mounting substrate region 5 of the substrate assembly sheet 3 of another metal layer sheet 2b The surface is in contact with it, and it is arranged at intervals with it. In addition, the substantially central portion of the mounting substrate region 5 of the substrate assembly sheet 3 of the metal layer-attached sheets 2a and 2b is slightly recessed toward the lower side (radial center). That is, the lower end of the mounting substrate region 5 of the substrate assembly sheet 3 is located below the lower end of the end region 6 of the substrate assembly sheet 3.

Referring to FIG. 6, the diameter f1 of the end region 6 (end in the orthogonal direction) of the roller body is larger than the diameter f2 of the mounting substrate region 5 (central part in the orthogonal direction) of the roller body 1, and f1 is relative to f2 (f1 / f2 ) For example, 1.02 or more, preferably 1.05 or more, and, for example, 2.5 or less, preferably 2.0 or less.

2. Mounting substrate The sheet 2 with a metal layer is pulled out from the roller body 1 to singulate a plurality of mounting substrates 7 formed in the mounting substrate area 5. That is, the substrate assembly sheet 3 is cut along the outer shape of the plurality of mounting substrates 7.

Thereby, a plurality of mounting substrates 7 after being singulated are obtained. The mounting substrate 7 is a wiring circuit board for mounting electronic components (described below) such as the imaging element 31, and does not yet have electronic components.

Such a mounting substrate 7 is suitably used as a wiring circuit board for mounting an imaging element 31 (described below), for example. That is, the mounting substrate 7 is suitable for an imaging device such as a camera module.

3. Mounting device Using FIG. 7, the imaging device 30 will be described as an example of a mounting device including the mounting substrate 7. The imaging device 30 includes a mounting substrate 7, an imaging element 31 as an example of electronic components, a housing 32, an optical lens 33, and a filter 34.

The mounting substrate 7 is arranged such that the base insulating layer 10 is on the upper side and the cover insulating layer 12 is on the lower side.

The imaging element 31 is a semiconductor element that converts light into an electrical signal, and examples thereof include solid-state imaging elements such as CMOS (Complementary Metal Oxide Semiconductor) sensors and CCD (Charge Coupled Device) sensors. .

The imaging element 31 is formed in a flat plate shape that is substantially rectangular in plan view, and includes silicon such as a Si substrate, a photodiode (photoelectric conversion element) disposed thereon, and a color filter, which are not shown. A plurality of terminals 35 corresponding to the electronic component connection terminals 15 of the mounting substrate 7 are provided on the lower surface of the imaging element 31.

The imaging element 31 is mounted on the mounting substrate 7. That is, the terminal 35 of the imaging element 31 is flip-chip mounted on the corresponding electronic component connection terminal (imaging element connection terminal) 15 of the mounting substrate 7 via solder bumps 36 and the like. As a result, the imaging element 31 is disposed in the central portion of the mounting substrate 7 and is electrically connected to the electronic component connection terminal 15 of the mounting substrate 7.

The imaging element 31 is mounted on the mounting substrate 7 to constitute an imaging unit 37. That is, the imaging unit 37 includes the mounting substrate 7 and the imaging element 31 mounted on the mounting substrate 7.

The case 32 is arranged at a central portion of the mounting substrate 7 in a plan view so as to surround the imaging element 31 at a distance. The housing 32 has a cylindrical shape with a substantially rectangular shape in plan view. A fixing portion for fixing the optical lens 33 is provided on the upper end of the casing 32.

The optical lens 33 is arranged above the mounting substrate 7 with a space from the mounting substrate 7 and the imaging element 31. The optical lens 33 is formed in a substantially circular shape in plan view, and is fixed by a fixing portion so that light from the outside reaches the imaging element 31.

The filter 34 is disposed between the imaging element 31 and the optical lens 33 at an interval from the imaging element 31 and the optical lens 33, and is fixed to the housing 32.

4. Action effect The roller body 1 is formed by winding a sheet 2 with a metal layer that is elongated in the longitudinal direction in a roll shape, and the sheet 2 with a metal layer is provided with: a substrate assembly sheet 3, The plurality of mounting substrates 7 are divided; and the first metal layer 4 a and the second metal layer 22 are arranged on the upper side of the substrate assembly sheet 3. In addition, the total thickness of the mounting substrate 7 is 60 μm or less, and the first metal layer 4 a and the second metal layer 22 are fixed to the end region 6 (6 a, 6 b) of the substrate assembly sheet 3.

Therefore, the first metal layer 4a and the second metal layer 22 can prevent the upper surface of one mounting substrate 7a from directly contacting the lower surface of the other mounting substrate 7b stacked on the upper side thereof. With this, in the roller body 1, the mounting substrates 7 can be prevented from adhering to each other.

In addition, the first metal layer 4 a and the second metal layer 22 are fixed to the end region 6 of the substrate assembly sheet 3. Therefore, it is possible to suppress the first metal layer 4 a and the second metal layer 22 from shifting in the width direction relative to the substrate assembly sheet 3. With this, the deviation of the substrate assembly sheet 3 in the width direction can be suppressed.

In addition, the first metal layer 4a and the second metal layer 22 are continuous in the longitudinal direction.

Therefore, it is possible to suppress the adhesion of the mounting substrates 7 to each other in the entire length direction of the long metal-layer-attached sheet 2 and to suppress the deviation of the metal-layer-attached sheet 2 in the roller body 1.

In addition, the diameter f1 of the end region 6 of the roller body 1 is larger than the diameter f2 of the mounting substrate region 5 of the roller body 1.

Therefore, it is possible to suppress the adhesion of the mounting substrates 7 to each other in the entire length direction of the long metal-layer-attached sheet 2 and to suppress the deviation of the metal-layer-attached sheet 2 in the roller body 1.

5. Variations In the roller body 1 shown in FIGS. 1 to 3, the outer edge of the metal layer 4 in the width direction coincides with the edge of the substrate assembly sheet 3 in the width direction, but for example, as shown in the figure As shown in FIG. 8, the outer edge in the width direction of the metal layer 4 may be located outside the end in the width direction of the substrate assembly sheet 3 in a plan view.

Specifically, in the embodiment shown in FIG. 8, the end in the width direction of the first metal layer 4 a is located in the width direction side (protruding toward it) from the end in the width direction of the substrate assembly sheet 3 in plan view. ). In addition, the other end in the width direction of the second metal layer 4b is located on the side in the width direction (protruding toward it) relative to the other end in the width direction of the substrate assembly sheet 3 in plan view.

In the roller body 1 shown in FIGS. 1 and 2, the metal layer 4 is formed into a substantially rectangular shape in plan view that is continuous in the longitudinal direction, that is, unpatterned, but for example, as shown in FIGS. 9 to 10, the metal layer 4 Can also be patterned.

In the embodiment shown in FIG. 9, the metal layer 4 has a ladder shape. Specifically, a ladder-shaped pattern including a pair of straight portions 26 extending in the longitudinal direction and a plurality of connecting portions 27 connecting the same is continuous in the longitudinal direction.

In the embodiment shown in FIG. 10, the metal layer 4 has a mesh shape. Specifically, the lattice-shaped metal pattern is continuous in the longitudinal direction.

In addition, the substrate assembly sheet 3 of the roller body 1 shown in FIG. 2 includes the base insulating layer 10, the conductor pattern 11, and the cover insulating layer 12 in the thickness direction, that is, only one layer of the conductor pattern 11 is provided, but for example, the substrate assembly The body sheet 3 may also have a plurality of conductor patterns, which is not shown.

Specifically, the substrate assembly sheet 3 may include a base insulating layer 10, a conductor pattern 11 (first conductor pattern), a cover insulating layer 12 (first cover insulating layer), a second conductor pattern, and a second in the thickness direction The insulating cover layer may be provided with a base insulating layer 10, a conductor pattern 11 (first conductor pattern), a covering insulating layer 12 (first covering insulating layer), a second conductor pattern, a second covering insulating layer in the thickness direction, The third conductor pattern and the third cover insulating layer. The material and thickness of the second conductor pattern and the third conductor pattern are the same as those of the first conductor pattern. The materials and thickness of the second covering insulating layer and the third covering insulating layer are the same as those of the first covering insulating layer.

The total thickness of the mounting substrate 7 is also 60 μm or less as in the embodiment of FIG. 2.

The total thickness of the conductor patterns (for example, the total thickness of the first to second conductor patterns, the total thickness of the first to third conductor patterns) is, for example, 1 μm or more, preferably 3 μm or more, and for example, 15 μm or less, It is preferably 10 μm or less, and more preferably 8 μm or less.

<Second Embodiment> Referring to Fig. 11, the roller body 1 of the second embodiment will be described. In addition, in the roller body 1 of the second embodiment, the same members as those of the above-mentioned first embodiment are denoted by the same symbols, and the description thereof is omitted.

In the roller body 1 of the second embodiment, the sheet 2 with a metal layer includes an intermediate metal layer 24 in addition to the substrate assembly sheet 3 and the metal layer 4.

The substrate assembly sheet 3 includes: a plurality of (2) mounting board regions 5 which are arranged at intervals in the width direction; a plurality of end regions 6 (6a, 6b) which are arranged on a plurality of mounting boards The outer side of the area 5 in the width direction; and one or more (one) intermediate areas 8, which are arranged between the plurality of mounting substrate areas 5.

The intermediate metal layer 24 is fixed to the upper surface of the intermediate region 8. The intermediate metal layer 24 is formed in a substantially rectangular shape in plan view extending in the longitudinal direction.

The material and thickness of the intermediate metal layer 24 are the same as those of the metal layer 4. The width of the intermediate metal layer 24 is the same as or wider than the width of the metal layer 4, for example, it is more than 1 times and 3 times the width of the metal layer 4.

Regarding the roller body 1 of the second embodiment, the same effects as the roller body 1 of the first embodiment are exhibited. Regarding the modification of the second embodiment, the modification of the first embodiment can also be applied.

As shown in the phantom line, the roller body 1 of the second embodiment is cut in the longitudinal direction so as to pass through the center of the width direction of the intermediate metal layer 24, and each of the two divided roller bodies In order to fix the metal layer 4 to the end region (the first metal layer 4a and the middle metal layer 24a on one side in the width direction, or the second metal layer 4b and the middle metal layer 24b on the other side in the width direction). As a result, the same effect as the roller body 1 of the first embodiment is exhibited in the divided roller body.

In addition, the above invention is provided as an exemplary embodiment of the present invention, but it is merely a mere illustration and should not be interpreted in a limited manner. Variations of the invention that can be understood by those skilled in the art are included in the scope of the following patent applications. [Industry availability]

The roller body of the present invention can be applied to various industrial products, for example, suitable for camera modules and other imaging devices.

1‧‧‧Roller

2‧‧‧Sheet with metal layer

2a‧‧‧Sheet with metal layer

2b‧‧‧Sheet with metal layer

3‧‧‧Substrate assembly sheet

4‧‧‧Metal layer

4a‧‧‧First metal layer

4b‧‧‧The second metal layer

5‧‧‧Mounting board area

6‧‧‧End area

6a‧‧‧One area in the width direction

6b‧‧‧The area on the other side in the width direction

7‧‧‧Mounting board

8‧‧‧Intermediate area

10‧‧‧Base insulation

11‧‧‧Conductor pattern

12‧‧‧covered insulation

13‧‧‧Electronic parts connection terminal opening

14‧‧‧External parts connecting terminal opening

15‧‧‧Electronic parts connection terminal

16‧‧‧External parts connection terminal

17‧‧‧Wiring

23‧‧‧Metal sheet

24‧‧‧Intermediate metal layer

24a‧‧‧ half of the middle metal layer in the width direction

24b‧‧‧The middle metal layer on the other side in the width direction

26‧‧‧Straight line

27‧‧‧Link

30‧‧‧Camera device

31‧‧‧Camera components

32‧‧‧Housing

33‧‧‧Optical lens

34‧‧‧filter

35‧‧‧terminal

36‧‧‧Solder bump

37‧‧‧Camera unit

f1‧‧‧Diameter

f2‧‧‧Diameter

Fig. 1 is a perspective view showing a first embodiment of the roller body of the present invention. Fig. 2 shows a plan view of the sheet with a metal layer of the roller body shown in Fig. 2 and Fig. 3 shows a cross-sectional view taken along line A-A in Fig. 2. 4A-E show the manufacturing method of the roll body shown in FIG. 1, FIG. 4A shows the step of preparing the metal sheet, FIG. 4B shows the step of forming the base insulating layer, FIG. 4C shows the step of forming the conductor pattern, and FIG. 4D shows the formation of the cover For the step of the insulating layer, FIG. 4E shows the step of forming the metal layer. Fig. 5 shows a cross-sectional view of the roller body shown in Fig. 1. Fig. 6 shows a side view of the roller body shown in Fig. 1. Fig. 7 shows a side view of a mounting device using a mounting substrate obtained from the roller body shown in Fig. 1. FIG. 8 shows a modified example of the roller body shown in FIG. 1 (the form in which the metal layer protrudes outside the substrate assembly sheet). FIG. 9 shows a variation of the roller body shown in FIG. 1 (the metal layer has a ladder-shaped pattern). FIG. 10 shows a modification of the roller body shown in FIG. 1 (the form in which the metal layer has a mesh-shaped pattern). 11 is a plan view of a sheet with a metal layer according to a second embodiment of the roller body shown in the present invention.

Claims (4)

A roll body characterized in that a long strip is wound in a roll shape in the longitudinal direction, and the strip is provided with: a substrate assembly sheet for dividing electronic components A plurality of mounting substrates of parts; and a metal layer, which is arranged on the thickness direction side of the substrate assembly sheet; the total thickness of the mounting substrate is 60 μm or less, the metal layer is fixed to Both ends of the orthogonal direction orthogonal to the above longitudinal direction. The roller body according to claim 1, wherein the metal layer is continuous in the longitudinal direction. The roller body according to claim 1, wherein the thickness of the metal layer is 20% or more and 150% or less relative to the total thickness of the mounting substrate. The roller body according to claim 1, wherein the diameter of the end portion of the roller body in the orthogonal direction is larger than the diameter of the center portion of the roller body in the orthogonal direction.