TWI800537B - Roller body - Google Patents

Roller body Download PDF

Info

Publication number
TWI800537B
TWI800537B TW107135372A TW107135372A TWI800537B TW I800537 B TWI800537 B TW I800537B TW 107135372 A TW107135372 A TW 107135372A TW 107135372 A TW107135372 A TW 107135372A TW I800537 B TWI800537 B TW I800537B
Authority
TW
Taiwan
Prior art keywords
roller body
roller
Prior art date
Application number
TW107135372A
Other languages
Chinese (zh)
Other versions
TW201924503A (en
Inventor
柴田周作
春田裕宗
若木秀一
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201924503A publication Critical patent/TW201924503A/en
Application granted granted Critical
Publication of TWI800537B publication Critical patent/TWI800537B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/28—Wound package of webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/10—Kinds or types of circular or polygonal cross-section without flanges, e.g. cop tubes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
TW107135372A 2017-10-18 2018-10-08 Roller body TWI800537B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-202075 2017-10-18
JP2017202075A JP7481794B2 (en) 2017-10-18 2017-10-18 Roll body

Publications (2)

Publication Number Publication Date
TW201924503A TW201924503A (en) 2019-06-16
TWI800537B true TWI800537B (en) 2023-05-01

Family

ID=66174353

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107135372A TWI800537B (en) 2017-10-18 2018-10-08 Roller body

Country Status (4)

Country Link
JP (1) JP7481794B2 (en)
CN (1) CN111133844B (en)
TW (1) TWI800537B (en)
WO (1) WO2019077991A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037352A (en) * 2001-07-25 2003-02-07 Nitto Denko Corp Method of manufacturing wiring circuit board
JP2013115119A (en) * 2011-11-25 2013-06-10 Nitto Denko Corp Compound solar cell and manufacturing method of the same, and compound solar cell module using the same and manufacturing method of the same
TWI423879B (en) * 2012-03-19 2014-01-21 Konica Minolta Advanced Layers An optical film roll body, and a method for manufacturing the polarizing plate using the same
US20140357012A1 (en) * 2012-03-16 2014-12-04 Jx Nippon Oil & Energy Corporation Manufacturing method and manufacturing device for optical substrate having concavo-convex pattern using film-shaped mold, and manufacturing method for device provided with optical substrate

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666087A (en) * 1979-11-05 1981-06-04 Suwa Seikosha Kk Method of manufacturing circuit mounting part using film carrier system
JP2005347618A (en) * 2004-06-04 2005-12-15 Fuji Photo Film Co Ltd Photosensitive web unit, and manufacturing apparatus and method of photosensitive laminate
JP4128998B2 (en) 2004-12-28 2008-07-30 日東電工株式会社 Wiring circuit board and manufacturing method thereof
CA2604052C (en) 2005-04-06 2014-07-08 Adamas Pharmaceuticals, Inc. Methods and compositions for the treatment of cns-related conditions
JP2007165707A (en) 2005-12-15 2007-06-28 Nitto Denko Corp Flexible wiring circuit board
JP4972487B2 (en) * 2007-01-31 2012-07-11 住友化学株式会社 Method for producing polymer film laminate
JP5087314B2 (en) 2007-05-18 2012-12-05 住友化学株式会社 Polymer film laminate, method for producing the same, and flexible wiring board using polymer film laminate.
JP5007211B2 (en) 2007-11-27 2012-08-22 日東電工株式会社 Manufacturing method of substance detection sensor
JP2009218466A (en) * 2008-03-12 2009-09-24 Sumitomo Metal Mining Co Ltd Sheet laminator and laminating method
JP2009259357A (en) 2008-04-18 2009-11-05 Nitto Denko Corp Production method of suspension board with circuit
JP4523051B2 (en) 2008-05-09 2010-08-11 日東電工株式会社 Method for manufacturing printed circuit board
JP2011021131A (en) * 2009-07-17 2011-02-03 Sumitomo Chemical Co Ltd Method for producing liquid crystalline polyester prepreg and liquid crystalline polyester prepreg
JP2011066147A (en) * 2009-09-16 2011-03-31 Nitto Denko Corp Wired-circuit-board assembly sheet and method of manufacturing the same
JP5752948B2 (en) 2011-02-01 2015-07-22 日東電工株式会社 Suspension board with circuit
JP2013193359A (en) 2012-03-21 2013-09-30 Sumitomo Chemical Co Ltd Method of manufacturing laminate
JP2014210959A (en) 2013-04-19 2014-11-13 日東電工株式会社 Plating apparatus, plating method, manufacturing method of wiring circuit board, and wiring circuit board
JP6180920B2 (en) 2013-12-19 2017-08-16 日東電工株式会社 Suspension board assembly sheet with circuit and manufacturing method thereof
TWM484792U (en) * 2014-03-03 2014-08-21 Flexium Interconnect Inc Fixture for chemical processing of tape type thin film product

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037352A (en) * 2001-07-25 2003-02-07 Nitto Denko Corp Method of manufacturing wiring circuit board
JP2013115119A (en) * 2011-11-25 2013-06-10 Nitto Denko Corp Compound solar cell and manufacturing method of the same, and compound solar cell module using the same and manufacturing method of the same
US20140357012A1 (en) * 2012-03-16 2014-12-04 Jx Nippon Oil & Energy Corporation Manufacturing method and manufacturing device for optical substrate having concavo-convex pattern using film-shaped mold, and manufacturing method for device provided with optical substrate
TWI423879B (en) * 2012-03-19 2014-01-21 Konica Minolta Advanced Layers An optical film roll body, and a method for manufacturing the polarizing plate using the same

Also Published As

Publication number Publication date
JP2019073382A (en) 2019-05-16
WO2019077991A1 (en) 2019-04-25
TW201924503A (en) 2019-06-16
JP7481794B2 (en) 2024-05-13
CN111133844B (en) 2024-03-29
CN111133844A (en) 2020-05-08

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