JP2019071498A - 光電モジュール及びその製造方法 - Google Patents
光電モジュール及びその製造方法 Download PDFInfo
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- JP2019071498A JP2019071498A JP2019024066A JP2019024066A JP2019071498A JP 2019071498 A JP2019071498 A JP 2019071498A JP 2019024066 A JP2019024066 A JP 2019024066A JP 2019024066 A JP2019024066 A JP 2019024066A JP 2019071498 A JP2019071498 A JP 2019071498A
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- layer
- photoelectric
- metal layer
- transparent structure
- photoelectric module
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
10 臨時マウント
12 粘着層
14 光電ユニット
140 側面
141 第一上表面
142 第一金属層
142a 第一延伸部
143 第一下表面
144 第二金属層
144a 第二延伸部
145 発光構造
145a 基板
145b 第一電気層
146 第一ワイヤパッド
147 保護層
148 第二ワイヤパッド
149a 第一誘電層
149b 第二誘電層
16 第一透明構造
161 第一透明層
162 第二上表面
163 第二透明層
164 斜面
165 第三透明層
166 第二下表面
168 第二辺
170 第一接触層
170a 接続部
18 第二透明構造
182 第三下表面
184 第一辺
186 面取り
1802 第二接触層
1804、2006 第一隔離層
1902 第一包み層
1904 第三波長変換層
1906 第二包み層
2 導電構造
212 第一開口
214 第二開口
22 第一絶縁層
24 反射層
26 第二絶縁層
28 電極
281 第一沈下区域
282、2014 第一導電層
283 第一平坦区域
284、2016 第二導電層
285 第二沈下区域
286 斜面角
287 第二平坦区域
288 第一充填部
289 第二充填部
2002 第一導線構造
2004 第一包み構造
2008 第二導線構造
2012 第二隔離層
30 晶種層
32 第一フォトマスク
34 電着層
36 第二フォトマスク
40 凹部
60、70、80 鏡面
90、172 絶縁拡散層
92 発散表面
112、2010 第一波長変換層
114 第二波長変換層
122 窓口層
130 光源生成装置
131 光源
132 電源供給システム
133 制御モジュール
1400 バックライトモジュール
1401 光学モジュール
150 発光装置
151 LED
152 サブマウント
153 基板
156 半田
158 電気接続構造
155 電極
d1 第一間隔
d2 第二間隔
d3 第三間隔
d4 第四間隔
W1 第一幅
W2 第二幅
Claims (10)
- 光電モジュールであって、
上表面を有し、かつ上面視において仮想中心線を有する光電ユニットと、
前記上表面に位置し、かつ第一延伸部を含む第一金属層と、
前記上表面に位置する第二金属層と、
前記光電ユニットを囲み、かつ前記上表面を露出させる透明構造と、
前記第一延伸部および前記透明構造を覆う絶縁散乱層と、を含み、
前記第一延伸部が前記仮想中心線を越えて前記第二金属層へ延伸する、光電モジュール。 - 前記第二金属層は、前記仮想中心線を越えて前記第一金属層へ延伸する第二延伸部を含む、請求項1に記載の光電モジュール。
- 一部の前記第一金属層および前記第一延伸部を覆う保護層をさらに含む、請求項1に記載の光電モジュール。
- 前記保護層の上に位置し、かつ前記第一金属層と直接接触する導電層をさらに含む、請求項3に記載の光電モジュール。
- 前記導電層と前記第一延伸部が部分的に重なる、請求項4に記載の光電モジュール。
- 前記絶縁散乱層は前記第一金属層と前記第二金属層との間に位置する、請求項4に記載の光電モジュール。
- 前記透明構造は蛍光体を含む、請求項1に記載の光電モジュール。
- 前記絶縁散乱層は反射材料を含む、請求項1に記載の光電モジュール。
- 前記光電ユニットは側表面および下表面を含み、
前記透明構造は前記側表面および前記下表面を覆う、請求項1に記載の光電モジュール。 - 前記絶縁散乱層は前記透明構造の側表面を覆わない、請求項9に記載の光電モジュール。
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