JP2019057610A - Mounting apparatus for electronic component and manufacturing method for display member - Google Patents

Abstract

To preferably image an alignment mark of a display panel formed on a light-shielding film via visible light, even in the case of imaging the alignment mark through the light-shielding film.SOLUTION: A mounting apparatus for an electronic component comprises: a stage for placing a display panel including an alignment mark provided on a light-shielding film; a crimp head that holds an electronic component and mounts the electronic component on a marginal part of the display panel placed on the stage; an imaging unit for imaging, through the light-shielding film, the alignment mark provided on the marginal part of the display panel placed on the stage; and a light irradiation unit for irradiating the alignment mark with red light from the side opposite to the imaging unit across the light-shielding film when imaging the alignment mark using the imaging unit.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component mounting apparatus and a display member manufacturing method.

  An outer lead bonding apparatus is known as an electronic component mounting apparatus for mounting an electronic component on a display panel in a manufacturing process of a display member such as a liquid crystal display or an organic EL display (see Patent Document 1).

  In such an apparatus, an electronic component held by a pressure-bonding head is mounted on a display panel placed on a stage by heating and pressing through an anisotropic conductive film. In this mounting, the display panel and the electronic component are connected so as to ensure electrical connection between the plurality of terminals provided on the display panel and the plurality of leads provided on the electronic component. Alignment is performed.

  This alignment is achieved by using a camera from below to align the alignment marks provided at both ends of the terminals of the display panel placed on the stage and the alignment marks provided at both ends of the leads of the electronic component. This is performed by recognizing the relative positions of the images by simultaneously capturing images (see Patent Document 2).

  By the way, in a display member such as a liquid crystal display, it is preferred that a display area as an area in which an image is displayed is as large as possible with respect to the outer size. For this reason, in the display panel which is a component part of the display member, the display area tends to be as large as possible with respect to the outer size. As a result, in the display panel, the width of the area between the outer edge and the display area, which is also the area where the above-described terminals and alignment marks are provided, the so-called frame area is narrowed. Something about .0mm has also appeared.

  Many of the display members that incorporate such a narrow frame display panel into a casing employ a design in which the frame area is exposed without being covered with the casing for the purpose of improving aesthetics. In the display panel employed in such a display member, the frame is blackened by providing a black matrix as a light shielding film provided in the display area so as to extend to the frame area that has been transparent in the past. There is something.

  However, when an electronic component is to be mounted on a display panel in which the frame region is blackened, the above-described electronic component mounting apparatus has a problem that the alignment mark cannot be recognized. In other words, as described above, the alignment mark is provided on the display panel. The alignment mark is provided on the surface on which the electronic component is mounted in the frame region, that is, the upper surface of the frame region in a state where the display panel is placed on the stage. On the other hand, the plaque matrix is provided on the surface opposite to the surface on which the electronic component is mounted, that is, on the lower surface of the display panel including the frame region. For this reason, as described above, if the alignment mark on the upper surface of the display panel is to be imaged by the camera from the lower side, the image cannot be captured because it is blocked by the black matrix.

  As a countermeasure to this, it is conceivable to arrange a camera for imaging the alignment mark of the display panel on the upper side. However, since a camera, which is a relatively large piece of equipment, must be arranged above the space in which the display panel is conveyed, the mechanism for supporting the camera becomes large and complicated. In this case, the cameras must be provided separately for the imaging of the display panel and for the imaging of the electronic components. Therefore, there is a risk that the relative positions of the two cameras will shift with time and the mounting accuracy may be reduced. Have.

  As another countermeasure, it is also conceivable to image the alignment mark by transmission illumination using infrared light. However, when infrared light is used, a camera for infrared light is required. However, a camera for infrared light has a shallower depth of focus than a camera for visible light of the same magnification, and warps the display panel. When there is a undulation, the alignment mark tends to deviate from the depth of focus. For this reason, the recognition accuracy of the alignment mark is lowered, and the mounting accuracy may be lowered. In addition, since the infrared light camera is expensive compared to the visible light camera, the apparatus price is expensive, which is not preferable.

JP 2006-135082 A JP 2001-284408 A

  Accordingly, an object of the present invention is to allow the alignment mark of the display panel formed on the light shielding film to be well imaged with visible light even when the alignment mark is imaged through the light shielding film. An electronic component mounting apparatus and a method for manufacturing a display member are provided.

  An electronic component mounting apparatus according to an embodiment is an electronic component mounting apparatus that mounts an electronic component on a display panel in which an alignment mark is provided on a light-shielding film, and the stage for mounting the display panel in a horizontal state And a crimping head for holding the electronic component and mounting the electronic component on the edge of the display panel placed in a state where the edge provided with the alignment mark on the stage protrudes, When imaging the alignment mark provided on the edge of the display panel placed on the stage through the light-shielding film, and imaging the alignment mark with the imaging unit, A light irradiating unit configured to irradiate red light toward the alignment mark from a side opposite to the imaging unit with a light shielding film interposed therebetween.

  The display member manufacturing method according to the present embodiment is a display member manufacturing method for manufacturing a display member by mounting an electronic component on a display panel in which an alignment mark is provided on a light shielding film. A mounting step of mounting the display panel on the stage on which the panel for mounting is placed with the edge provided with the alignment mark protruding, and the alignment mark provided on the edge. The imaging panel is configured to irradiate red light from the side of the display panel where the alignment mark is provided, and to image the alignment mark from the side opposite to the alignment mark with the light-shielding film interposed therebetween, and the imaging step Based on the image of the alignment mark, the display panel and the electronic component are relatively aligned, and the electronic component is mounted on the edge. Characterized in that it comprises a mounting step.

  According to the present invention, even when the alignment mark of the display panel formed on the light shielding film is imaged through the light shielding film, the alignment mark can be favorably imaged with visible light. Even in such a display panel, electronic components can be mounted with high accuracy.

It is a front view which shows schematic structure of the mounting apparatus of the electronic component of embodiment. It is an AA arrow side view of the mounting device of the electronic component shown in FIG. It is a figure which expands and shows the principal part of the temporary crimping | compression-bonding apparatus in the mounting apparatus of embodiment. It is a figure which expands and shows the principal part of this crimping | compression-bonding apparatus in the mounting apparatus of embodiment.

  Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be described with reference to the drawings. Note that the position and size of each component are merely convenient for easy understanding of the structure.

  Here, in the method of imaging an alignment mark by visible light, specifically, white light transmitted by a conventional electronic component mounting apparatus, the alignment mark provided on the black matrix is imaged. There was a problem that it was difficult.

As a result of intensive studies, the inventors have discovered that an alignment mark provided on a black matrix can be imaged by using a specific color of visible light. That is, the inventors conducted an imaging experiment in which an alignment mark provided on the black matrix was imaged by transmission illumination of white light, blue light, green light, and red light, and alignment was performed by transmission illumination of red light. I found that the mark can be imaged.
[Configuration of electronic component mounting equipment]
FIG. 1 is a plan view showing a configuration of an electronic component mounting apparatus according to an embodiment, and FIG. 2 is a side view of the electronic component mounting apparatus shown in FIG. The electronic component mounting apparatus 1 shown in FIGS. 1 and 2 is used for manufacturing a constituent member (display member) of a display device such as a liquid crystal display panel. That is, the mounting apparatus 1 mounts an electronic component W such as COF punched from the carrier tape T on a liquid crystal panel P as a display panel via an anisotropic conductive tape F as a bonding member. It is an apparatus used for manufacturing a display member in which an electronic component W is mounted on P.

The mounting apparatus 1 according to the embodiment includes a punching device 10 (10A, 10B) for punching an electronic component W from a carrier tape T, an intermittent rotary transport device 20 that sucks and holds the punched electronic component W, and transports the electronic component W while intermittently rotating. Anisotropic conductive tape adhering device (joining member) that adheres an anisotropic conductive tape F to an electronic component W that is disposed at an intermittent stop position in the conveying path by the rotary conveying device 20 and is conveyed by the intermittent rotating conveying device 20 Adhesion device 30, liquid crystal panel P by temporary pressure bonding device 40, temporary pressure bonding device 40 for temporarily pressure bonding electronic component W with anisotropic conductive tape F bonded to liquid crystal panel P via anisotropic conductive tape F A main crimping device 50 for final crimping the electronic component W temporarily crimped onto the first, a first delivery device 60 for delivering the electronic component W between the punching device 10 and the intermittent rotation conveying device 20, an intermittent rotation A second delivery device 70 that delivers the electronic component W between the feeding device 20 and the provisional crimping device 40, a punching device 10, an intermittent rotary conveyance device 20, an anisotropic conductive tape adhering device 30, and a provisional crimping. The controller 40 is configured to include a control device 80 that controls the operation of each unit such as the device 40, the main crimping device 50, the first delivery device 60, and the second delivery device 70.
(Punching device 10)
The punching device 10 is for punching an electronic component W such as COF from the carrier tape T, and includes a first punching device 10A and a second punching device 10B. The first punching device 10A and the second punching device 10B have the same configuration, and are arranged in a horizontally reversed state when viewed from the front of the device. The first and second punching devices 10A and 10B are used one by one so that the carrier tape T of the other punching devices 10A and 10B can be exchanged while the punching device 10A or 10B is punching. It has become.

  The first and second punching devices 10A and 10B are respectively a supply reel 11 on which a carrier tape T before punching is wound, and a mold device 12 that punches an electronic component W from the carrier tape T supplied from the supply reel 11. And a take-up reel 13 for taking up the carrier tape T from which the electronic component W has been punched out by the mold apparatus 12. The direction of the carrier tape T fed from the supply reel 11 is changed by a plurality of guide rollers 14 and sprockets 15 and is sent to the take-up reel 13 via the mold device 12. The sprocket 15 is disposed in front of the mold apparatus 12 in the conveyance direction of the carrier tape T, and the carrier tape T is conveyed with respect to the mold apparatus 12 while conveying the carrier tape T by rotation driving by a drive motor (not shown). Positioning is possible.

The mold apparatus 12 includes an upper mold 12a and a lower mold 12b disposed to face the upper mold 12a. The upper mold 12a includes a punch 12c on the lower surface thereof. On the other hand, the lower die 12b is formed with a die hole 12d penetrating in the vertical direction into which the punch 12c enters. The electronic component W is punched from the carrier tape T by moving the upper mold 12a in the vertical direction in a state where the carrier tape T is supplied and positioned with respect to such a mold apparatus 12. A suction hole (not shown) is provided on the tip surface of the punch 12c so that the punched electronic component W can be sucked and held.
(Intermittent rotary transfer device 20)
In the intermittent rotation conveying device 20, four arm portions 21 having the same shape are arranged so as to be orthogonal to each other, and the index table 22 having a cross shape in plan view and the index table 22 are intermittently driven to rotate at 90 ° intervals. And a rotation drive unit 23. A holding head 24 that sucks and holds the electronic component W is provided at the tip of each arm portion 21 of the index table 22. The four stop positions A, B, C, and D every 90 ° of the index table 22 are the reception position A for receiving the electronic component W punched by the punching device 10 and the electronic component W held by the holding head 24. Gaging / cleaning position B for positioning (gauging) and cleaning, adhesion position C for attaching anisotropic conductive tape F to electronic component W held by holding head 24, A delivery position D for delivering the electronic component W on which the anisotropic conductive tape F is adhered to the temporary crimping device 40 is set.
(Anisotropic conductive tape attaching device 30)
The anisotropic conductive tape adhering device 30 is provided corresponding to the adhering position C of the intermittent rotary conveying device 20, and a tape-like member S in which the anisotropic conductive tape F is adhered and supported on the release tape R is provided. The supply reel 31 wound, the sticking head 32 disposed at a position facing the holding head 24 positioned at the sticking position C, and the release tape R after the anisotropic conductive tape F has been peeled off. A collection unit 33 to be accommodated, a plurality of guide units 34 for guiding the tape-like member S supplied from the supply reel 31 to the collection unit 33 along a conveyance path passing through the sticking position C, and a plurality of guide units 34 is disposed downstream of the sticking position C in the transport path of the tape-shaped member S, and is reciprocated along the transport direction of the tape-shaped member S to intermittently transport the tape-shaped member S by a predetermined length. Chuck feed part 35 and tape Than adhering position C of the transport path of timber S is disposed on the upstream side, and a cutting unit 36 which cuts only the anisotropic conductive tape F of tape-like member S, a.

The sticking head 32 is anisotropically cut to a predetermined length on the lead (not shown) of the electronic component W held by the holding head 24 positioned at the sticking position C and transported and positioned to the sticking position C. A sticking tool 32a for pressing the conductive conductive tape F, an elevating drive unit 32b for moving the sticking tool 32a up and down, and a built-in sticking tool 32a. And a heater (not shown) for attaching the tape F to the leads of the electronic component W.
(Temporary crimping device 40)
The temporary pressure bonding apparatus 40 will be described with reference to FIG. 3A and 3B are enlarged views of the main part of the temporary pressure bonding apparatus 40, FIG. 3A is a side view, and FIG. 3B is a plan view.

  The temporary crimping device 40 sucks and holds the electronic component W to which the anisotropic conductive tape F is stuck by the anisotropic conductive tape sticking device 30 and temporarily crimps the liquid crystal panel P to the temporary crimping head as a crimping head. When the electronic component W is temporarily pressure-bonded to the liquid crystal panel P on the stage 42 by the head 41, the stage 42 for holding and positioning the liquid crystal panel P, and the temporary pressure bonding head 41, the electronic component W in the liquid crystal panel P is mounted. The first position recognition for recognizing the relative position of the back-up part 43 that supports the edge to be held from the lower side, the liquid crystal panel P held by the stage 42, and the electronic component W held by the temporary pressure bonding head 41 A unit 44.

  The temporary press-bonding head 41 includes a pressing tool 41a that holds the electronic component W from the upper surface side, an X direction that is one direction along the horizontal direction, and a Y direction that is orthogonal to the X direction in the horizontal direction. The tool driving unit 41b is moved in the Z direction, which is a vertical direction orthogonal to the horizontal direction, and the θ direction, which is a rotation direction about the Z direction, and the pressure tool 41a is heated in the pressure tool 41a. And a heater (not shown).

  The stage 42 includes a placement part 42a for placing the liquid crystal panel P, and a stage drive part 42b for moving the placement part 42a in the X, Y, Z, and θ directions. Although illustration is omitted, a plurality of suction holes for sucking and holding the liquid crystal panel P are formed on the placement surface on which the liquid crystal panel P is placed in the placement portion 42a. It can be held by suction.

  The backup unit 43 is mounted with the electronic component W by the backup tool 43a having a flat support surface formed slightly longer than the length of the electronic component W in the width direction (X direction in FIG. And a guide rail 43b extending along the X direction and an X-direction moving device 43c that supports the backup unit 43 and moves along the guide rail 43b. As a result, the backup tool 43a can move according to the position where the electronic component W is temporarily crimped when the temporary crimping head 41 temporarily crimps the electronic component W to the edge of the liquid crystal panel P.

When the first position recognition unit 44 images the alignment mark PA1 provided on the edge of the liquid crystal panel P placed on the placement part 42a, and the imaging part 44a images the alignment mark PA1. And a light irradiator 44b that irradiates red light toward the alignment mark PA1 from the side opposite to the imaging unit 44a. Here, at the edge of the liquid crystal panel P, as shown in FIG. 3B, a plurality of terminals PE for electrical connection with the electronic component W are provided, and on both sides of the row of the terminals PE. Are provided with first alignment marks PA1 for aligning the terminals PE and the plurality of leads of the electronic component W, respectively. Therefore, the imaging units 44a are arranged one by one, that is, in pairs, on both sides of the backup tool 43a on the X-direction moving device 43c in accordance with the arrangement interval of the alignment marks PA1. The imaging unit 44a is a visible light CCD camera. When the imaging unit 44a images the alignment mark PA1, the alignment mark (not shown) of the electronic component W provided corresponding to the alignment mark PA1 is taken together in the field of view of the imaging unit 44a. The imaging unit 44a also images the alignment mark of the electronic component W at the same time. On the other hand, as shown in FIG. 3A, the light irradiation unit 44b is positioned immediately above the pair of imaging units 44a in the Y direction, and in the X direction, as indicated by a two-dot chain line in FIG. 3B. It has a size that can cover the entire area where the pair of imaging units 44a are arranged, and is supported by the temporary pressure-bonding head 42 so as to be movable in the X direction integrally with the pressing tool 41a. The captured image of the imaging unit 44a is sent to the control device 80, and relative position recognition between the liquid crystal panel P and the electronic component W is performed by the control device 80 using a recognition technique such as a known pattern matching method. . That is, the control device 80 takes part in the first position recognition unit 44. Note that the edge portion of the liquid crystal panel P is provided with second alignment marks PA <b> 2 used for alignment in the main crimping device 50 at both ends thereof.
(Main crimping device 50)
The present crimping apparatus 50 will be described with reference to FIG. FIG. 4 is an enlarged view of the main part of the crimping apparatus, FIG. 4 (A) is a side view, and FIG. 4 (B) is a plan view. In FIG. 4B, illustration of a main pressure-bonding head 52 described later is omitted.

  The main pressure bonding apparatus 50 includes a stage 51 for holding and positioning the liquid crystal panel P on which the electronic component W is temporarily pressure bonded, and a main pressure bonding head 52 as a pressure bonding head for main pressure bonding of the electronic component W to the liquid crystal panel P. And a back-up portion 53 that is disposed on the lower side of the main pressure bonding head 52 so as to be opposed to the main pressure bonding head 52 and supports the temporarily bonded edge portion of the electronic component W in the liquid crystal panel P from the lower side during the main pressure bonding. And a second position recognition unit 54 for recognizing the position of the liquid crystal panel P.

  As shown in FIG. 4, the stage 51 includes a placement unit 51a for placing the liquid crystal panel P and a stage drive unit 51b for moving the placement unit 51a in the X, Y, Z, and θ directions. The placement portion 51a is a member having a rectangular shape in plan view, and a plurality of suction holes (not shown) are formed on the placement surface (upper surface) on which the liquid crystal panel P is placed, and the placed liquid crystal The panel P can be sucked and held.

  The main crimping head 52 includes a pressing tool 52a that presses the electronic component W temporarily bonded to the liquid crystal panel P from the upper surface side, a tool driving unit 52b that moves the pressing tool 52a in the Z-axis direction, and a pressing tool. And a heater (not shown) for heating 52a. The backup unit 53 is provided at a position directly below the pressure tool 52a of the main pressure bonding head 52, and has a backup tool 53a formed to a length equivalent to the pressure tool 52a, and a support member 53b that supports the backup tool 53a. Have. The upper end surface of the backup tool 53a is formed on a flat surface that supports the lower surface of the edge portion on which the electronic component W of the liquid crystal panel P placed on the placement portion 51a is temporarily press-bonded.

The second position recognition unit 54 includes a first imaging unit 54a and a second imaging unit 54b, and light irradiation units 54c and 54d provided corresponding to the first and second imaging units 54a and 54b, respectively. Have The first and second imaging units 54a and 54b are cameras that image the alignment mark PA2 of the liquid crystal panel P, and are CCD cameras for visible light. The light irradiation units 54c and 54d are light irradiation units that emit red light. These light irradiators 54c and 54d are spaced apart from each other by the edge where the edge of the liquid crystal panel P placed on the placement part 51a can enter the position directly above the first and second imaging parts 54a and 54b. Thus, they are integrally supported with the corresponding imaging units 54a and 54b. In addition, the imaging units 54a and 54b and the light irradiation units 54c and 54d are shown in a retracted position located outside the liquid crystal panel P shown by a solid line and a broken line in FIG. It can be moved between the imaging position of the alignment mark PA2 indicated by a two-dot chain line in FIG. The captured images of the imaging units 54a and 54b are sent to the control device 80, and the position of the alignment mark PA2, that is, the liquid crystal panel P is recognized by the control device 80 using a recognition technique such as a known pattern matching method. That is, the control device 80 takes part in the second position recognition unit 54.
(First delivery device 60)
The first delivery device 60 receives the electronic component W punched from the carrier tape T from the lower side and receives the receiving portion 61 and the position directly below the die device 12 of the punching devices 10A and 10B. And an X, Y, Z, and θ drive unit 62 for moving to a position directly below the holding head 24 of the intermittent rotary conveyance device 20 positioned at the position A.
(Second delivery device 70)
The second delivery device 70 includes a receiving portion 71 that holds and holds the electronic component W from the lower side, and a position directly below the holding head 24 of the intermittent rotary conveyance device 20 where the receiving portion 71 is positioned at the delivery position D, and provisional pressure bonding. An X, Y, Z, and θ driving unit 72 for moving the apparatus 40 to a position just below the provisional pressure-bonding head 41.
(Control device 80)
The control device 80 includes a storage unit 81. In the storage unit 81, various loads for controlling each unit such as the load and heating temperature in the temporary crimping device 40, the load and heating temperature in the main crimping device 50, and the reference position information of the alignment marks PA1 and PA2 are stored. Control information is stored. In accordance with the control information stored in the storage unit 81, the control device 80 performs the punching device 10, the intermittent rotary conveyance device 20, the anisotropic conductive tape sticking device 30, the temporary pressure bonding device 40, the main pressure bonding device 50, and the first delivery. The operation of each unit such as the device 60 and the second delivery device 70 is controlled.

  In the present embodiment, the liquid crystal panel P is a so-called black frame liquid crystal panel P in which a black matrix is formed in a frame region including an edge portion on which the electronic component W is mounted. In such a liquid crystal panel P, alignment marks PA1 and PA2 are also formed on the black matrix. For this reason, even if the alignment marks PA1 and PA2 on the upper surface side of the frame area of the liquid crystal panel P are placed on the placement portions 42a and 51a in an attempt to be seen from the lower side of the liquid crystal panel P, they are blocked by the black matrix. It cannot be visually recognized. Therefore, it is difficult to image the alignment marks PA1 and PA2 from the lower side of the liquid crystal panel P with a visible light camera (imaging units 44a, 54a, and 54b). Therefore, in the present embodiment, a light irradiation unit 44b that irradiates red light of visible light on the opposite side of the black matrix with respect to the imaging units 44a, 54a, and 54b, that is, on the upper side of the liquid crystal panel P, 54c and 54d are arranged. As such a light irradiation part 44b, 54c, 54d, the light source comprised by arrange | positioning several red LED in a matrix form or zigzag form can be used.

The light irradiators 44b, 54c, and 54d were set so that the illuminance of infrared light applied to the alignment marks PA1 and PA2 of the liquid crystal panel P was 10,000 lux (lx) or more. That is, the inventor investigated the relationship between the illuminance of the red light applied to the alignment mark and the recognition rate of the alignment mark for the alignment mark provided on the black matrix. The results are shown in Table 1. The illuminance was measured using an illuminometer at the position where the alignment mark was placed. The recognition rate is a ratio of the number of images in which the alignment mark can be recognized among 200 images obtained by imaging the alignment mark 200 times by the imaging unit.
(Table 1)

  Further, the light irradiators 44b, 54c, and 54d have the above-described illuminance within a range in which the positions of the alignment marks PA1 and PA2 may be shifted due to the positioning error of the liquid crystal panel P or the like (hereinafter referred to as “variation range”). For example, it was configured to ensure 10,000 lux or more. For example, when the light source is composed of a plurality of red LEDs, each LED has the highest luminous intensity at the central portion thereof, and the luminous intensity is lower at the periphery. Therefore, if the distance between the LEDs is wide, the required illuminance cannot be obtained at the position facing the intermediate portion between the LED and the LED even if the necessary illuminance is obtained at the position facing the central portion of the LED. Can happen. Therefore, in consideration of the illuminance distribution of individual LEDs, the spacing between the LEDs is set such that, for example, illuminance of 10,000 lux or more can be obtained even at a position facing the intermediate portion between the LEDs. It was set.

  Furthermore, it is preferable that the light irradiators 44b, 54c, 54d have an illuminance variation within ± 10% within the above-described variation range.

Note that the distance H (see FIG. 3A) from the light irradiation units 44b, 54c, and 54d to the upper surface of the liquid crystal panel P, that is, the alignment marks PA1 and PA2, is the light intensity of the light irradiation units 44b, 54c, and 54d. What is necessary is just to determine according to the illumination intensity of the light irradiated to alignment mark PA1, PA2. That is, the distance H may be set larger if the luminous intensity of the light irradiators 44b, 54c, 54d is larger, and the distance H may be set smaller if the luminous intensity is smaller. However, if the distance H is too small, there is a risk that the light irradiators 44b, 54c, 54d may interfere with moving members such as the liquid crystal panel P. In addition, since the illuminance is inversely proportional to the square of the distance H, if the distance H is too large, the height of the alignment marks PA1 and PA2 provided on the edge due to warpage or undulation of the liquid crystal panel P occurs. However, the variation in illuminance increases, and the necessary illuminance may not be obtained. Therefore, in the mounting apparatus 1, the luminous intensity of the light irradiation units 44b, 54c, and 54d may be set so that the distance H is about 25 mm to 50 mm.
[Description of operation]
Next, the operation of the mounting apparatus 1 of this embodiment will be described. First, the carrier tape T is supplied from the supply reel 11 of the first punching device 10 </ b> A, and the electronic component W is punched from the carrier tape T by the mold device 12. The punched electronic component W is sucked and held by the punch 12c. The electronic component W held by the punch 12c is transferred to the receiving portion 61 of the first transfer device 60 and transferred to the receiving position A of the intermittent rotary conveyance device 20. The electronic component W transferred to the receiving position A is delivered to the holding head 24 of the intermittent rotary conveyance device 20. The first delivery device 60 rotates the direction of the electronic component W by 90 ° during the transfer of the electronic component W to the receiving position A, thereby receiving the edge portion where the lead in the electronic component W is formed. The holding head 24 positioned at A is aligned with the direction along the outer side surface (Y direction).

  The electronic component W held by the holding head 24 is sequentially transferred to the gauging / cleaning position B, the sticking position C, and the delivery position D by the intermittent rotation of the index table 22. During the transfer, at the gauging / cleaning position B, the electronic component W is positioned with respect to the holding head 24 by abutment of a positioning mechanism (not shown), and is attached to a lead or the like by a cleaning mechanism such as a rotating brush (not shown). Dust cleaning is performed. Further, at the sticking position C, the anisotropic conductive tape F is stuck to the edge portion where the lead of the electronic component W is provided by the anisotropic conductive tape sticking device 30. When positioning and cleaning are performed at the gauging / cleaning position B, and the electronic component W to which the anisotropic conductive tape F is adhered is positioned at the delivery position D, the electronic component W is It is delivered to the receiving part 71 of the delivery device 70. The electronic component W delivered to the receiving part 71 is transferred to the delivery position to the pressure tool 41a of the temporary crimping apparatus 40 and delivered to the pressure tool 41a.

  On the other hand, in parallel with the above-described operation, the liquid crystal panel P is supplied and mounted on the mounting portion 42a of the stage 42 of the temporary pressure bonding apparatus 40 by a transport device (not shown). The liquid crystal panel P placed on the placement part 42a is sucked and held on the placement part 42a. When the liquid crystal panel P is sucked and held on the mounting portion 42a, the mounting portion 42a is moved by the tool driving portion 41b, and the liquid crystal panel is moved to a mounting position by the temporary pressure bonding head 41.

  On the other hand, the pressing tool 41a holding the electronic component W moves from the delivery position where the electronic component W is received to the mounting position. More specifically, as shown in FIG. 3B, the pressurizing tool 41a is located on the leftmost side in the edge, which is the part where the electronic component W is first mounted among the edges of the liquid crystal panel P. To the position corresponding to the row of terminals PE to be operated. Further, in synchronization with the movement of the pressurizing tool 41a, the backup tool 43a moves below the row of terminal PE located on the leftmost side. The pressurizing tool 41a and the backup tool 43a are sequentially moved to the row of terminal PEs located on the right side and are located on the rightmost side after completing the mounting of the electronic component W on the terminal PE located on the leftmost side. The electronic components W are sequentially mounted up to the row of terminals PE.

  When the pressing tool 41a is positioned at a position corresponding to the row of terminals PE located on the leftmost side of the edge of the liquid crystal panel P, first, the position of the liquid crystal panel P is corrected. That is, the imaging unit 44a of the position recognition unit 44 images the alignment mark PA1 provided on both sides of the terminal PE row. During this imaging, the alignment mark PA1 is irradiated with red light having an illuminance (22,000 lux in this embodiment) preset by the light irradiation unit 44b. The captured image of the imaging unit 44a is sent to the control device 80. The control device 80 recognizes the positions of the two alignment marks PA1 that have been imaged, and determines the positional deviation of the liquid crystal panel P in the X, Y, and θ directions with respect to the mounting position based on the position recognition results of the two alignment marks PA1. Then, the stage driving unit 42b is driven so as to eliminate this positional deviation, and the position of the liquid crystal panel P is corrected.

  Thereafter, the relative position between the liquid crystal panel P and the electronic component W is corrected. That is, as indicated by a two-dot chain line in FIG. 3A, the electronic component W held by the pressurizing tool 41a is slightly spaced from the edge of the liquid crystal panel P by driving the tool driving unit 41b. In this state, the alignment mark PA1 of the liquid crystal panel P and the alignment mark (not shown) of the electronic component W are simultaneously imaged by the imaging unit 44a. Also during this imaging, both alignment marks are irradiated with red light having an illuminance preset by the light irradiation unit 44b. The images of both alignment marks imaged by the imaging unit 44a are sent to the control device 80, and the control device 80 recognizes the relative positions of both alignment marks. The recognized relative position data is compared with relative position reference position data stored in advance in the storage unit 81, and based on the result, the liquid crystal panel P and the electronic component W are relative to each other in the X, Y, and θ directions. Misalignment is required. The control device 80 controls the tool driving unit 41b so as to eliminate the positional deviation based on the obtained relative positional deviation, and aligns the liquid crystal panel P and the electronic component W.

  After correcting the misalignment between the liquid crystal panel P and the electronic component W, the pressing tool 41a is lowered by the drive of the tool driving unit 41b. As a result, the electronic component W is heated and pressed to the liquid crystal panel P via the anisotropic conductive tape F and temporarily press-bonded at a preset heating temperature, pressure, and pressurization time.

  Such an operation is sequentially performed on each row of terminals PE at the edge of the liquid crystal panel P, and a plurality of electronic components W are temporarily bonded to the edge of the liquid crystal panel P.

  The liquid crystal panel P on which the electronic component W is temporarily press-bonded is transferred from the stage 42 to the stage 51 of the main press-bonding device 50 by a transfer device (not shown). When the liquid crystal panel P is placed on the placement portion 51a of the stage 51, the liquid crystal panel P is sucked and held by the placement portion 51a.

  When the liquid crystal panel P is held on the mounting portion 51a, the position of the liquid crystal panel P is recognized. That is, as indicated by a two-dot chain line in FIG. 4B, the second position recognition unit 54 moves to the imaging position of the alignment mark PA2, and the alignment mark PA2 is imaged by the imaging units 54a and 54b. At the time of this imaging, the alignment mark PA2 is irradiated with red light having an illuminance (22000 lux in this embodiment) preset by the light irradiation units 54c and 54d. The captured images of the imaging units 54 a and 54 b are sent to the control device 80. The control device 80 recognizes the position of the liquid crystal panel P by recognizing the position of each alignment mark PA2 based on the captured image. The control device 80 controls the stage driving unit 51b based on the recognized position of the liquid crystal panel P, and as shown by a two-dot chain line in FIG. Is positioned on the backup tool 53a. When the edge of the liquid crystal panel P is supported on the backup tool 53a, the pressurizing tool 52a is lowered by driving the tool driving unit 52b, and the liquid crystal panel P is heated at a preset heating temperature, pressurizing force, and pressurizing time. The electronic component W temporarily press-bonded to the main press-bonding is performed. When the main press-bonding is completed, the liquid crystal panel P on which the electronic component W is finally press-bonded, that is, the display member, is transported from the placement portion 51a to the next step by a carry-out device (not shown).

Such an operation is repeatedly executed until there is no liquid crystal panel P on which the electronic component W is to be mounted.
[Function and effect]
According to the mounting apparatus 1 of such an embodiment, the alignment marks PA1 and PA2 provided on the edge of the liquid crystal panel P placed on the placement parts 42a and 51a of the stages 42 and 51 are displayed on the imaging part 44a. , 54a, 54b irradiate red light from the light irradiation units 44b, 54c, 54d from the opposite side of the imaging units 44a, 54a, 54b with the black matrix interposed therebetween. I did it.

  Compared with other visible light, red light is superior in ability to transmit a light-shielding film such as a black matrix. Therefore, by using red light as transmitted illumination, an infrared camera, an X-ray camera, etc. Without using this special camera, the alignment marks PA1 and PA2 provided on the black matrix by the visible light camera can be well imaged through the black matrix.

  As a result, even in the liquid crystal panel P in which the alignment marks PA1 and PA2 are formed on the black matrix, the electronic component W can be accurately mounted without using a special camera.

  In addition, the illuminance of the red light applied to the alignment marks PA1 and PA2 by the light irradiation units 44b, 54c, and 54d is set to 10,000 lux or more. As a result, the imaging of the alignment marks PA1, PA2 by the imaging units 44a, 54a, 54b can be made more reliable, and the reliability of the mounting apparatus 1 can be improved.

In addition, a plurality of red LEDs constituting the light sources of the light irradiators 44b, 54c, and 54d were arranged so that an illuminance of 10,000 lux or more was obtained even at a position facing a portion between the LEDs. As a result, even if the alignment marks PA1 and PA2 positioned at the imaging positions by the imaging units 44a, 54a, and 54b have variations, the alignment marks PA1 and PA2 can be reliably imaged. The reliability of the mounting apparatus 1 can be further improved.
(Other embodiments)
In addition, this invention is not limited to said embodiment. For example, in the above-described mounting form, the display panel has been described as the liquid crystal panel P. However, the display panel is not limited to this, and other display panels such as an organic EL panel may be used. In short, any display panel in which the alignment mark is formed on a light shielding film such as a black matrix may be used.

  In addition, the electronic component is mounted on the display panel as described above as being temporarily crimped and then finally crimped. However, the present invention is not limited to this. For example, the crimping may be performed without temporarily crimping. In short, it is only necessary that electronic components can be mounted on the display panel.

  Moreover, although the anisotropic conductive tape F was demonstrated as sticking to the electronic component W, it is not restricted to this, You may make it stick to the liquid crystal panel P.

  As mentioned above, although embodiment of this invention was described, these are not intending limiting the range of invention. The above-described novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments are included in the scope and gist of the invention, and are included in the invention described in the claims.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 10 Punching apparatus 20 Intermittent rotary conveyance apparatus 30 Anisotropic conductive tape sticking apparatus 40 Temporary pressure bonding apparatus 41 Temporary pressure bonding head 41a Pressure tool 42 Stage 42a Mounting part 43 Backup part 44 1st position recognition unit 44a Imaging Unit 44b light irradiation unit 50 main pressing unit 51 stage 51a mounting unit 52 main pressing head 53 backup unit 54 second position recognition units 54a and 54b imaging unit 54c and 54d light irradiation unit 80 control unit 81 storage unit P liquid crystal panel Display panel)
W Electronic parts

Claims (6)

An electronic component mounting apparatus for mounting an electronic component on a display panel provided with an alignment mark on a light shielding film,
A stage for placing the display panel in a horizontal state;
A crimping head for holding the electronic component and mounting the electronic component on the edge of the display panel placed in a state where the edge provided with the alignment mark on the stage protrudes;
An imaging unit that images the alignment mark provided on the edge of the display panel placed on the stage through the light-shielding film;
When imaging the alignment mark with the imaging unit, a light irradiation unit that irradiates red light toward the alignment mark from the side opposite to the imaging unit with the light shielding film interposed therebetween,
An electronic component mounting apparatus comprising:   2. The electronic component mounting apparatus according to claim 1, wherein the light irradiation unit irradiates the red light so that an illuminance of the red light applied to the alignment mark is 10,000 lux or more. The irradiation unit includes a light source configured by arranging a plurality of red LEDs,
The plurality of red LEDs are arranged so that the illuminance of the red light irradiated to the alignment mark is 10,000 lux or more even at a position between adjacent red LEDs. Electronic component mounting equipment.   4. The electronic component mounting apparatus according to claim 1, wherein the imaging unit simultaneously images an alignment mark of the display panel and an alignment mark provided on the electronic component. 5. A display member manufacturing method for manufacturing a display member by mounting an electronic component on a display panel provided with an alignment mark on a light shielding film,
A placing step of placing the display panel on a stage on which the display panel is placed, with the edge provided with the alignment mark protruding;
The alignment mark provided at the edge is irradiated with red light from the side of the display panel where the alignment mark is provided, and the alignment mark is imaged from the opposite side of the alignment mark with the light shielding film interposed therebetween. An imaging process to
A mounting step of performing relative alignment between the display panel and the electronic component based on the image of the alignment mark imaged in the imaging step, and mounting the electronic component on the edge;
The manufacturing method of the member for a display characterized by comprising.   6. The method for manufacturing a display member according to claim 5, wherein the red light is applied to the alignment mark with an illuminance of 10,000 lux or more.

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