JP2014107524A - Acf sticking apparatus and acf sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ACF sticking apparatus and an ACF sticking method capable of precisely sticking an ACF tape piece to a target sticking position on a substrate.SOLUTION: The ACF sticking apparatus performs positioning of an ACF tape piece 4s which is formed on a base tape BT above a substrate 2. The ACF sticking apparatus calculates a movement amount "m" of the ACF tape piece 4s which is moved in a horizontal direction along a conveyance direction of a tape Tp by a tape conveyer unit 22 when a press tool 30 presses down the tape Tp to stick the ACF tape piece 4s to the substrate 2. The ACF sticking apparatus performs positioning of the ACF tape piece 4s while considering the calculated movement amount "m" of the tape Tp in the horizontal direction along the conveyance direction by the tape conveyer unit 22.

Description

  The present invention relates to an ACF adhering apparatus and an ACF adhering method for press-bonding an ACF tape section formed on a base tape by making a cut in an ACF tape to a substrate.

  Conventionally, an ACF adhering apparatus is known as an apparatus for crimping an ACF (Anisotropic Conductive Film) tape section (ACF tape section) made of an anisotropic conductive film on a substrate to the substrate. The tape member formed by laminating the ACF tape on one side of the tape is transported, and the ACF tape section formed on the base tape with the cuts in the ACF tape of the tape member is horizontally placed above the target attachment site on the substrate. The tape member conveying means positioned in the posture and the crimping tool for crimping the ACF tape slice positioned in the horizontal posture on the substrate above the target attaching portion are configured.

  In such an ACF adhering apparatus, when the ACF tape slice is pressure-bonded to the substrate, the ACF tape slice is aligned so that one end of the ACF tape slice and one end of the target affixed portion are aligned in the vertical direction. After the positioning, the crimping tool is lowered so that the ACF tape section is attached to the target application site.

Japanese Patent No. 4769341

  However, in the ACF adhering apparatus, there is a space in the height direction between the ACF tape slice positioned above the substrate and the substrate, and the ACF tape slice is attached to the tape member as the crimping tool descends. Since the tape is moved in the horizontal direction along the transport direction of the tape member by the transport means, one end of the ACF tape section and one end of the target pasting site in a state where the crimping tool presses the ACF tape section onto the substrate. In some cases, the ACF tape sections may not be matched with each other, and the ACF tape section may be attached in a state of being displaced with respect to the target attachment site.

  Accordingly, an object of the present invention is to provide an ACF attaching apparatus and an ACF attaching method capable of attaching an ACF tape section to a target attaching portion on a substrate with high accuracy.

  The ACF adhering device according to claim 1 includes a substrate holding unit that holds a substrate, a tape member conveying unit that performs a conveying operation of a tape member formed by laminating an ACF tape on a base tape, and the tape member conveying unit. A section forming means for forming an ACF tape section on the base tape by making a cut in the ACF tape of the transported tape member, and controlling the operation of the tape member transport section, and the section forming section controls the base tape. Section positioning control means for positioning the ACF tape section formed thereon above the substrate held by the substrate holder, and above the ACF tape section positioned above the substrate by the section positioning control means ACF adhering device provided with a crimping tool that descends from the above and crimps the ACF tape section onto the substrate The section positioning control means follows the direction in which the tape member is transported by the tape member transport means by pressing down the tape member when the crimping tool crimps the ACF tape section to the substrate. The amount of movement of the ACF tape piece moved in the horizontal direction is calculated, and the position of the ACF tape piece is determined in consideration of the calculated amount of movement of the ACF tape piece in the horizontal direction along the transport direction of the tape member. Do.

  The ACF adhering apparatus according to claim 2 is the ACF adhering apparatus according to claim 1, wherein the section positioning means transports the tape member of the calculated ACF tape section to the ACF tape section. The position is shifted in the direction opposite to the direction in which the ACF tape section moves as the crimping tool is lowered by the amount of movement in the horizontal direction along the direction.

  The ACF adhering device according to claim 3 is the ACF adhering device according to claim 1 or 2, wherein an amount of movement of the ACF tape slice moving in a horizontal direction along a conveying direction of the tape member is , Based on the length in the width direction of the crimping surface of the crimping tool and the thickness of the substrate.

  A method for attaching an ACF according to claim 4 includes a substrate holding step for holding a substrate, a cut in the ACF tape of a tape member formed by laminating an ACF tape on a base tape, and an ACF tape slice on the base tape. A section forming step for positioning the ACF tape section formed on the base tape, a section positioning step for positioning the ACF tape section formed above the substrate held in the substrate holding step, and a section of the ACF tape section positioned above the substrate. A crimping step of lowering the crimping tool from above and crimping the ACF tape segment to the substrate. In the segment positioning step, the crimping tool is used to crimp the ACF tape segment to the substrate by the crimping tool. Horizontal direction along the transport direction of the tape member by pushing down the tape member Wherein it is the moved ACF calculates the amount of movement of the tape sections, in consideration of the movement amount in the horizontal direction along the conveying direction of the tape member of the calculated the ACF tape sections for positioning the ACF tape sections.

  The ACF adhering method according to claim 5 is the ACF adhering method according to claim 4, wherein in the section positioning step, the ACF tape section is transported to the calculated tape member of the ACF tape section. The position is shifted in the direction opposite to the direction in which the ACF tape section moves as the crimping tool is lowered by the amount of movement in the horizontal direction along the direction.

  The ACF attaching method according to claim 6 is the ACF tape attaching method according to claim 4 or 5, wherein the ACF tape section moves in a horizontal direction along a conveying direction of the tape member. Is calculated based on the length in the width direction of the crimping surface of the crimping tool and the thickness of the substrate.

  In the present invention, in positioning the ACF tape slice above the substrate, the amount of movement in the horizontal direction along the transport direction of the tape member that is moved by the crimping tool pushing the ACF tape slice downward is calculated. The ACF tape section is positioned by taking into account the amount of movement of the ACF tape section in the horizontal direction along the transport direction of the tape member. For this reason, in the final application site of the ACF tape slice on the substrate by the crimping tool, one end of the ACF tape slice matches one end of the target application site, and the target application site on the substrate. The ACF tape section can be attached with high accuracy.

The front view of the ACF sticking apparatus in one embodiment of this invention The side view of the ACF sticking apparatus in one embodiment of this invention The fragmentary top view of the ACF sticking apparatus in one embodiment of this invention The block diagram which shows the control system of the ACF sticking apparatus in one embodiment of this invention (A) (b) Operation | movement explanatory drawing of the affixing operation | work of the ACF tape piece which the ACF affixing apparatus in one embodiment of this invention performs The elements on larger scale of the ACF sticking apparatus in one embodiment of this invention (A) (b) (c) Operation explanatory drawing of ACF pasting work which the ACF pasting device in one embodiment of the present invention performs (A) (b) (c) Operation explanatory drawing of ACF pasting work which the ACF pasting device in one embodiment of the present invention performs (A) (b) (c) Operation explanatory drawing of ACF pasting work which the ACF pasting device in one embodiment of the present invention performs

  Embodiments of the present invention will be described below with reference to the drawings. 1, 2 and 3 constitute a liquid crystal panel production line together with an electrode cleaning device arranged on the upstream process side, a temporary crimping device and a main crimping device arranged on the downstream process side, etc. After receiving the substrate 2 as the liquid crystal panel substrate from the apparatus on the upstream process side, a plurality of target pasting sites 3 (each target pasting site 3 is provided on the edge of the upper surface of the substrate 2). A piece of ACF tape 4 (ACF tape piece 4s) made of an anisotropic conductive film is pressure-bonded to each of a plurality of electrodes 3a), and then the substrate 2 is transferred to a downstream process apparatus. . In the ACF bonding apparatus 1 according to the present embodiment, the ACF tape 4 is supplied in the state of a tape member Tp formed by laminating the ACF tape 4 on the base tape BT, as shown in the enlarged view in FIG.

  1, 2, and 3, the ACF adhering apparatus 1 attaches the ACF tape slice 4 s to the substrate holding unit 11 that holds the substrate 2 on the base 10 and the substrate 2 that is held by the substrate holding unit 11. A pressure-sensitive head 12 and a backup stage 13 that serves as a base when the ACF tape slice 4 s is attached to the substrate 2 by the pressure-bonding head 12 are provided.

  The substrate holding part 11 extends on the base 10 in the X-axis direction (left and right direction as viewed from an operator not shown) and is movable along the X-axis table 14a and is movable in the Y-axis direction (front and rear as viewed from the operator). The substrate is composed of a Y-axis table 14b extending in the direction), a θ table 14c that is movable along the Y-axis table 14b and is movable up and down and rotatable about the vertical axis (Z-axis) with respect to the Y-axis table 14b. It is moved in the horizontal plane by the part moving mechanism 14. The pressure bonding head 12 is supported by a frame 15 provided on the base 10, and the backup stage 13 is erected on the rear side of the substrate holding portion 11 on the base 10.

  In FIG. 1 and FIG. 2, the plate-like base portion 20 of the crimping head 12 is fixed to the frame 15, and a tape supply reel 21 is attached to the upper front portion of the base portion 20. The tape supply reel 21 is driven by a supply reel drive motor 21 a provided on the back side of the base portion 20 to feed and supply the tape member Tp.

  In FIG. 1, a tape member transport unit 22 that transports the tape member Tp supplied by the tape supply reel 21 is provided on the front surface of the base unit 20. The tape member transport section 22 is a pair of feed rollers that perform a feeding operation of the tape member Tp by rotating across a portion (base tape BT) from which the ACF tape 4 is removed of the tape member Tp supplied by the tape supply reel 21. 23, a plurality of tape guide rollers (first guide roller 24a, second guide roller 24b, third guide roller 24c) and a feed roller for guiding the tape member Tp fed by the pair of feed rollers 23 onto a predetermined path. 23 comprises a tape collecting section 25 that sucks and collects the previous base tape BT sent by 23.

  In FIG. 1, the first guide roller 24a among the plurality of guide rollers is movable in a roller moving groove 20a formed in the upper left portion of the base portion 20 so as to extend in the vertical direction, and an urging member (not shown). Is biased upward. The second guide roller 24b is provided below the first guide roller 24a and on the lower left side of the base portion 20, and the third guide roller 24c is located on the right side of the second guide roller 24b and includes the base portion 20. It is provided in the lower right part of. The pair of feed rollers 23 is provided above the third guide roller 24c and aligned in the left-right direction at the center on the right side of the base portion 20.

  The region between the second guide roller 24b and the third guide roller 24c of the tape member Tp conveyed by the tape member conveyance unit 22 is movable in the horizontal direction, and the ACF tape 4 is removed from the tape member Tp. A peeling portion 27 including a pair of peeling pins 26 (which may be rollers) sandwiching the portion (base tape BT) is provided.

  The feed roller 23 feeds the tape member Tp by rotating the feed roller drive motor 23a (FIG. 2) provided on the back surface side of the base portion 20, and the tape collecting portion 25 is provided on the back surface side of the base portion 20. Then, the suction operation of the base tape BT is performed by the operation of the tape collecting unit driving unit 25a (FIG. 2).

  The tape member Tp fed out from the tape supply reel 21 is given an appropriate tension by the first guide roller 24a being biased upward in the roller moving groove 20a, and the first guide roller 24a and the second guide roller 24b, the left region of the base portion 20 is held in a vertically extending posture, and the lower region of the base portion 20 is horizontally (left and right) between the second guide roller 24b and the peeling portion 27. It is held in the extended posture. Further, the tape member Tp is held between the third guide roller 24c and the feed roller 23 in a posture in which the right region of the base portion 20 extends in the vertical direction.

  The tape member transport unit 22 rotates the feed roller 23 in the forward direction while sucking the portion (base tape BT) from which the ACF tape 4 is removed of the tape member Tp that is fed out by the tape supply reel 21 by the tape recovery unit 25. Thus, the tape member Tp can be transported in a predetermined direction (a direction from the second guide roller 24b side to the peeling portion 27 side, arrow A shown in FIG. 1). That is, in the present embodiment, the tape member transport unit 22 is a tape member transport unit that performs a transport operation of the tape member Tp formed by laminating the ACF tape 4 on the base tape BT.

  Only the portion of the ACF tape 4 of the tape member Tp is located below the front surface of the base portion 20 and sandwiches the tape member Tp guided in the horizontal direction by the second guide roller 24b and the peeling portion 27 from the vertical direction. A tape cutting unit 28 is provided which forms a cut ACF tape section 4s on the base tape BT.

  In the lower region of the tape member Tp extending in the horizontal direction between the second guide roller 24b and the peeling portion 27, the tape cutting unit 28 is in the vertical direction (that is, the direction perpendicular to the surface of the tape member Tp. The arrow shown in FIG. B) is configured to include a cutter 28a configured to be movable and a backing plate portion 28b provided at a position facing the cutter 28a up and down across the tape member Tp. The cutter 28a is moved upward to apply the tape member Tp. When pressed against the plate portion 28b, only the ACF tape 4 of the tape member Tp is cut by the cutter 28a. As described above, the tape cutting unit 28 is a section forming unit that forms a cut in the ACF tape section 4s on the base tape BT by making a cut in the ACF tape 4 of the tape member Tp transported by the tape member transport section 22.

  In FIG. 1, a tool lifting cylinder 29 with a piston rod 29 a directed downward is provided at the center of the front surface of the base portion 20 and below the tape supply reel 21, and the lower end of the piston rod 29 a of the tool lifting cylinder 29. Is attached with a crimping tool 30 having a shape extending in the X-axis direction.

  As shown in FIGS. 1 and 2, the crimping tool 30 is located above the backup stage 13, and when lowered from the upper position to the lower position by the tool elevating cylinder 29, the second guide roller 24 b and the peeling portion 27 are disposed. The tape member Tp held in the horizontal position is pushed downward to approach the upper surface of the backup stage 13. For this reason, when the substrate 2 is in contact with the upper surface of the backup stage 13, the ACF tape section 4 s is positioned below the crimping tool 30, and the crimping tool 30 is lowered in that state. The ACF tape slice 4s is pressed against the substrate 2 and attached (bonded). In the crimping tool 30, a heater 31 (FIGS. 1 and 2) for heating the crimping tool 30 before the ACF tape slice 4s is crimped to the substrate 2 is provided.

  In FIG. 1, a mark imaging camera 32 with an imaging field of view directed downward is provided on the right side of the base portion 20. The mark imaging camera 32 images from above the positioning mark 2m (FIG. 3) on the substrate 2 that has been moved below the imaging field of view by the substrate holding unit moving mechanism.

  The movement operation of the substrate holding unit 11 in the horizontal plane is performed when the control device 40 included in the ACF adhering apparatus 1 controls the operation of the substrate holding unit moving mechanism 14 (FIG. 4).

  The operation of transporting the tape member Tp by the tape member transport unit 22 (specifically, the operation of aligning the ACF tape section 4s formed on the base tape BT to a predetermined position) is provided on the base unit 20. Based on the information on the rotational speed of one of the feed rollers 23 detected by the rotational speed detection sensor 41 (FIG. 4) and the data on the radius of the feed roller 23, the controller 40 supplies the supply reel drive motor 21a and the feed roller drive motor. This is done by controlling the operation of 23a and the tape recovery unit drive unit 25a (FIG. 4).

  The half cutting operation of the ACF tape 4 by the tape cutting unit 28 is performed by the control device 40 moving the cutter 28a up and down (FIG. 4), and the raising and lowering operation of the crimping tool 30 is performed by the control device 40 operating the tool lifting cylinder 29. This is done by performing control (FIG. 4). The heating control of the heater 31 provided in the crimping tool 30 is performed by the control device 40 (FIG. 4).

  The peeling portion 27 is a standby position (the position shown in FIG. 1, which is located on the right side of the crimping tool 30) when the peeling device driving mechanism 27 a (FIG. 4) provided in the base portion 20 is controlled by the control device 40. Position) and the left peeling position (position reaching the lower end R1 of the crimping tool 30 in FIG. 5A) in the horizontal direction.

  The imaging operation control by the mark imaging camera 32 is performed by the control device 40 (FIG. 4), and the image data captured by the mark imaging camera 32 is sent to the control device 40 and recognized by the image recognition unit 40a (FIG. 4). .

  When affixing the ACF tape slice 4s formed on the base tape BT to the target affixing site 3 on the substrate 2, the control device 40 performs a transport operation of the tape member Tp (in FIG. 5A). After the ACF tape slice 4s is positioned above the substrate 2 held by the substrate holder 11 (FIG. 5A), the crimping tool 30 is lowered from above the ACF tape slice 4s (FIG. 5). 5 (b), the ACF tape slice 4s is pressed against the substrate 2 by pressing the ACF tape slice 4s onto the substrate 2 while pushing down the tape member Tp with the crimping tool 30 (FIG. 5B). ).

  In this way, the control device 40 controls the operation of the tape member transport unit 22, and the substrate holding unit 11 holds the ACF tape slice 4s formed on the base tape BT by the tape cutting unit 28 serving as the slice forming unit. It functions as a section positioning control means for positioning above the substrate 2, and the crimping tool 30 descends from above the ACF tape section 4s positioned above the substrate 2 by the control device 40 as the section positioning control means. The section 4s is pressure-bonded to the substrate 2.

  In the operation of attaching the ACF tape slice 4s to the substrate 2 as described above, the portion of the tape member Tp sandwiched between the pair of feed rollers 23 is fixed. While being pushed down, the tape member Tp is pulled out from the tape supply reel 21, and along with this, the ACF tape slice 4s is along the transport direction of the tape member Tp by the tape member transport unit 22 from the initial position where the tape member Tp is positioned. It is pressed onto the substrate 2 at a position moved in the horizontal direction (rightward). Here, when the ACF tape section 4s is pressed against the substrate 2 by the crimping tool 30, the left end portion P1 of the ACF tape section 4s matches the left end portion Q1 of the target attachment site 3 on the substrate 2 (FIG. 5). Since (b)) is ideal, in the embodiment in the present embodiment, the ACF tape slice 4s that moves in the horizontal direction along the transport direction of the tape member Tp as the crimping tool 30 descends. The movement amount “m” (FIGS. 5A and 6) is calculated in advance, and the calculated movement amount “m” in the horizontal direction along the transport direction of the tape member Tp of the ACF tape slice 4s is taken into account. The ACF tape slice 4s is positioned.

  Specifically, the left end portion P1 of the ACF tape piece 4s is located to the left of the left end portion Q1 of the target attachment site 3 (that is, opposite to the direction in which the ACF tape piece 4s moves as the crimping tool 30 is lowered). In this direction, the position is shifted by the amount of movement “m”. In this way, the ACF tape slice 4s moves to the right by the moving amount “m” until the crimping tool 30 descends and presses the ACF tape slice 4s onto the substrate 2. When the tape slice 4s is pressed against the substrate 2 by the crimping tool 30, the left end portion P1 of the ACF tape slice 4s and the left end portion Q1 of the target pasting portion 3 come to coincide with each other.

  By the way, the moving amount “m” of the ACF tape slice 4s can be calculated as follows. In FIG. 6, the distance between the peeling portion 27 located at the standby position and the right end R2 of the crimping tool 30 is “S0”, and the peeling portion 27 located at the standby position when the ACF tape slice 4s is pressed against the substrate 2. And the right end R2 of the crimping tool 30 is “S1”, the amount of movement “m” in the horizontal direction along the transport direction of the tape member Tp of the ACF tape section 4s is the separation portion 27 and the ACF tape. Since this corresponds to a change in length along the tape member Tp between the left end portion P1 of the intercept 4s, the relationship m = S1-S0 is established.

Here, the length in the width direction (X-axis direction) of the crimping surface (lower surface) of the crimping tool 30 attached to the tool lifting cylinder 29 (this is equal to the length of the portion of the tape member Tp that contacts the crimping tool 30). ) Is “W”, the vertical distance between the tape member Tp (denoted by Tp1 in FIG. 6) before being pressed down by the crimping tool 30 and the upper surface of the backup stage 13 is “H”, and the thickness of the substrate 2 Is “T”, and the horizontal distance between the peeling portion 27 located at the standby position and the left end of the crimping tool 30 is “K”, “S1” is the ACF tape section 4s pushed down by the crimping tool 30. Using the downward movement amount “HT” in consideration of the thickness “T” of the substrate 2,
S1 = √ {(H−T) ² + (S0) ² }
Since S0 = K−W, S1 = √ {(HT) ² + (K−W) ² }
It is. Therefore, the movement amount “m” uses “H”, “T”, “K” and “W”,
m = √ {(HT) ² + (K−W) ² } + W−K
It can be expressed as.

  Here, the length “W” in the width direction of the crimping tool 30 and the thickness “T” of the substrate 2 are values that can vary normally, but the distances “H” and “K” are the ACF adhering apparatus 1. As a result, the amount of movement “m” by which the ACF tape section 4s moves in the horizontal direction along the transport direction of the tape member Tp is “H” and “K” as known values. This can be calculated based on the length “W” of the crimping surface of the tool 30 in the width direction and the thickness “T” of the substrate 2. The above “H” and “K” are stored in the storage unit (not shown) of the control device 40 as unique values of the ACF sticking apparatus 1, and “W” and “T” are set by the operator before starting the ACF sticking work. It is assumed to be stored in the storage unit by an input operation. Since the ACF tape section 4s has a thickness, the downward movement amount of the ACF tape section 4s pushed down by the crimping tool 30 is not strictly “HT”, but the thickness of the ACF tape section 4s is “H”. Since the value is extremely small with respect to the value of “−T”, the thickness of the ACF tape slice 4s is ignored in the above calculation formula, and the downward movement amount of the ACF tape slice 4s is equal to “HT”.

  Next, with reference to FIG. 7 to FIG. 9, an operation (ACF attachment method) of pressure bonding the ACF tape slice 4 s to each target attachment portion 3 on the substrate 2 held by the substrate holding unit 11 by the ACF attachment device 1. The execution procedure will be described.

  In the ACF pasting operation, the control device 40 first holds the substrate 2 on the substrate holder 11 (substrate holding step). Then, the operation of the substrate holding unit moving mechanism 14 is controlled to move the substrate 2 in the horizontal plane direction, and the two mark marks 2m provided on the substrate 2 are imaged by the mark imaging camera 32 to recognize the image, The position is calculated.

  After calculating the positions of the two positioning marks 2m, the control device 40 grasps the entire position of the substrate 2 based on the result. Then, the lower surface of the substrate 2 is brought into contact with the upper surface of the backup stage 13, and one end portion (the left end portion Q1) of the target attaching portion 3 on the substrate 2 from which the ACF tape slice 4s is to be attached will be attached. ) Is moved immediately below one end (left end R1) of the crimping tool 30 to control the operation of the substrate holder moving mechanism 14 and move the substrate 2 (FIG. 7A). Process).

  When the control device 40 moves the substrate 2 so that the left end portion Q1 of the target pasting portion 3 on the substrate 2 is positioned immediately below the left end portion R1 of the crimping tool 30, the control device 40 performs the transport operation of the tape member Tp (see FIG. 7 (a), the arrow C1), the length from the head of the ACF tape 4 on the base tape BT to the cutter 28a of the tape cutting unit 28 corresponds to the length L0 in the X-axis direction of the target attachment site 3 The predetermined length L1 is set (FIG. 7A). Then, the tape cutting unit 28 is operated to make a cut in the ACF tape 4 (arrow B shown in FIG. 7B), and an ACF tape slice 4s having a length L1 is formed on the base tape BT (FIG. 7 ( b) Section formation step).

  When the control device 40 forms the ACF tape slice 4s on the base tape BT, the control device 40 carries the tape member Tp (arrow C2 shown in FIG. 7C), and positions the ACF tape slice 4s above the substrate 2. (Section positioning step). At this time, the control device 40 calculates the movement amount “m” of the ACF tape slice 4s in the above-described procedure, and the horizontal movement amount “m” of the calculated ACF tape slice 4s along the transport direction of the tape member Tp. ”Is shifted in the direction opposite to the direction in which the ACF tape section 4s moves as the crimping tool 30 descends (here, leftward) (FIG. 7C). Note that the calculation of the movement amount “m” is not limited to that performed when the tape member Tp is transported as described above, and may be performed before the start of production work.

  When the controller 40 positions the ACF tape slice 4s above the substrate 2, the controller 30 lowers the crimping tool 30 previously heated by the heater 31 from the upper position to the lower position (arrow D1 shown in FIG. 8A). ), The ACF tape slice 4s is pressed against the substrate 2 together with the base tape BT, and is crimped to the target attachment site 3 on the substrate 2 (FIG. 8A). Crimping process). When the ACF tape slice 4s is crimped to the target application site 3 on the substrate 2, the control device 40 raises the crimping tool 30 (FIG. 8B, arrow D2 shown in the figure), and the crimping tool 30 is moved to the ACF tape slice. It is separated from 4s (FIG. 8B).

  As described above, in the state where the crimping tool 30 is raised from the lower position to the upper position, as shown in FIG. 8B, the tape member Tp (ACF) from both ends of the ACF tape section 4s crimped onto the substrate 2 is obtained. Since the base tape BT) is inclined and extended on the right side of the tape section 4s, the control device 40 moves the peeling tool 27 horizontally from the standby position to the peeling position after raising the crimping tool 30. Then, the base tape BT is peeled from the ACF tape slice 4s that is pressure-bonded to the substrate 2 (arrow E1 shown in FIG. 8C) (FIG. 8C. Peeling step). When the base tape BT is peeled off, the tape supply reel 21 winds up the tape member Tp pulled out when the crimping tool 30 is lowered, so that the portion of the tape member Tp between the second guide roller 24b and the peeling portion 27 is After returning to the horizontal posture, the control device 40 moves the peeling portion 27 from the peeling position in the direction opposite to that at the time of peeling (arrow E2 shown in FIG. 9A), and puts the peeling portion 27 in the standby position. Return (FIG. 9A).

  When the control device 40 peels the base tape BT from the ACF tape section 4s as described above, the left end portion Q1 of the target attaching portion 3 to which the ACF tape section 4s is to be attached is the left end of the crimping tool 30. The board | substrate 2 is moved so that it may be located just under part R1 (FIG.9 (b). Arrow F shown in a figure. Board | substrate movement process). Then, the tape member Tp is transported (arrow C3 shown in FIG. 9C), and the predetermined length from the head of the ACF tape 4 on the base tape BT to the cutter 28a of the tape cutting unit 28 is described above. Is set to L1 (FIG. 9C). Since this state is exactly the same as the state shown in FIG. 7A described above except that the target pasting site 3 is different, the ACF for all target pasting sites 3 on the substrate 2 is repeated by repeating the above steps. The tape slice 4s can be crimped.

  As described above, in the ACF adhering apparatus 1 and the ACF adhering method using the ACF adhering apparatus 1 according to the present embodiment, the positioning tool 30 is positioned above the substrate 2 so that the crimping tool 30 is used as the ACF tape element. The horizontal movement amount “m” along the transport direction of the tape member Tp moved by pushing down 4s is calculated, and the calculated horizontal direction along the transport direction of the tape member Tp of the ACF tape slice 4s is calculated. The ACF tape segment 4s is positioned in consideration of the movement amount “m”. For this reason, one end portion (left end portion P1) of the ACF tape slice 4s and the target pasting portion 3 in the final pasting portion (target pasting portion 3) of the ACF tape slice 4s on the substrate 2 by the crimping tool 30. One end portion (left end portion Q1) matches, and the ACF tape section 4s can be attached to the target attaching portion 3 on the substrate 2 with high accuracy.

  Provided are an ACF adhering apparatus and an ACF adhering method capable of adhering an ACF tape section to a target application site on a substrate with high accuracy.

DESCRIPTION OF SYMBOLS 1 ACF sticking apparatus 2 Substrate 4 ACF tape 4s ACF tape section 11 Substrate holding part 22 Tape member conveyance part (tape member conveyance means)
28 Tape cutting unit (section forming means)
30 Crimping tool 40 Control device (section positioning control means)
Tp Tape member BT Base tape m Travel distance W Length of crimping surface of crimping tool in width direction T Thickness of substrate

Claims (6)

A substrate holder for holding the substrate;
A tape member transporting means for transporting a tape member formed by laminating an ACF tape on a base tape;
Section forming means for cutting the ACF tape of the tape member conveyed by the tape member conveying means to form an ACF tape section on the base tape;
A section positioning control means for controlling the operation of the tape member conveying means, and positioning the ACF tape section formed on the base tape by the section forming means above the substrate held by the substrate holding portion;
An ACF adhering device comprising: a crimping tool that descends from above the ACF tape segment positioned above the substrate by the segment positioning control means and crimps the ACF tape segment to the substrate;
The section positioning control means is configured to horizontally move the tape member along the transport direction of the tape member by the tape member transport means by pressing down the tape member when the crimping tool crimps the ACF tape section to the substrate. The movement amount of the ACF tape slice to be moved is calculated, and the ACF tape slice is positioned in consideration of the calculated movement amount of the ACF tape slice in the horizontal direction along the transport direction of the tape member. A characteristic ACF pasting apparatus.   The section positioning means moves the ACF tape section by moving the ACF tape section by the amount of movement of the calculated ACF tape section in the horizontal direction along the transport direction of the tape member as the crimping tool is lowered. The ACF adhering apparatus according to claim 1, wherein the ACF adhering apparatus is positioned by being shifted in a direction opposite to a moving direction.   The amount of movement of the ACF tape slice in the horizontal direction along the transport direction of the tape member is calculated based on the length in the width direction of the crimping surface of the crimping tool and the thickness of the substrate. The ACF sticking apparatus according to claim 1 or 2. A substrate holding step for holding the substrate;
A section forming step of forming a cut on the base tape by cutting the ACF tape of the tape member formed by laminating the ACF tape on the base tape;
A slice positioning step for positioning the ACF tape slice formed on the base tape above the substrate held in the substrate holding step;
A crimping step of lowering a crimping tool from above the ACF tape section positioned above the substrate and crimping the ACF tape section to the substrate;
In the section positioning step, when the ACF tape section is crimped to the substrate by the crimping tool, the crimping tool is moved in the horizontal direction along the transport direction of the tape member by pushing the tape member downward. The movement amount of the ACF tape section is calculated, and the ACF tape section is positioned in consideration of the calculated movement amount of the ACF tape section in the horizontal direction along the transport direction of the tape member. ACF pasting method.   In the section positioning step, the ACF tape section is moved by the amount of movement of the calculated ACF tape section in the horizontal direction along the transport direction of the tape member as the crimping tool is lowered. The ACF attachment method according to claim 4, wherein positioning is performed while being shifted in a direction opposite to a direction in which the lens moves.   The amount of movement of the ACF tape slice moving in the horizontal direction along the transport direction of the tape member is calculated based on the length in the width direction of the crimping surface of the crimping tool and the thickness of the substrate. The ACF tape affixing method according to claim 4 or 5.

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