JP2019054244A5 - - Google Patents

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Publication number
JP2019054244A5
JP2019054244A5 JP2018170330A JP2018170330A JP2019054244A5 JP 2019054244 A5 JP2019054244 A5 JP 2019054244A5 JP 2018170330 A JP2018170330 A JP 2018170330A JP 2018170330 A JP2018170330 A JP 2018170330A JP 2019054244 A5 JP2019054244 A5 JP 2019054244A5
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JP
Japan
Prior art keywords
conductor
insulator
transistor
oxide
opening
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Granted
Application number
JP2018170330A
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English (en)
Japanese (ja)
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JP7237498B2 (ja
JP2019054244A (ja
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Publication of JP2019054244A publication Critical patent/JP2019054244A/ja
Publication of JP2019054244A5 publication Critical patent/JP2019054244A5/ja
Priority to JP2023030990A priority Critical patent/JP2023063331A/ja
Application granted granted Critical
Publication of JP7237498B2 publication Critical patent/JP7237498B2/ja
Priority to JP2025019835A priority patent/JP2025065417A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018170330A 2017-09-15 2018-09-12 半導体装置、および半導体装置の作製方法 Active JP7237498B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023030990A JP2023063331A (ja) 2017-09-15 2023-03-01 半導体装置
JP2025019835A JP2025065417A (ja) 2017-09-15 2025-02-10 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017177386 2017-09-15
JP2017177386 2017-09-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023030990A Division JP2023063331A (ja) 2017-09-15 2023-03-01 半導体装置

Publications (3)

Publication Number Publication Date
JP2019054244A JP2019054244A (ja) 2019-04-04
JP2019054244A5 true JP2019054244A5 (enExample) 2021-10-21
JP7237498B2 JP7237498B2 (ja) 2023-03-13

Family

ID=65722467

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018170330A Active JP7237498B2 (ja) 2017-09-15 2018-09-12 半導体装置、および半導体装置の作製方法
JP2023030990A Withdrawn JP2023063331A (ja) 2017-09-15 2023-03-01 半導体装置
JP2025019835A Pending JP2025065417A (ja) 2017-09-15 2025-02-10 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023030990A Withdrawn JP2023063331A (ja) 2017-09-15 2023-03-01 半導体装置
JP2025019835A Pending JP2025065417A (ja) 2017-09-15 2025-02-10 半導体装置

Country Status (5)

Country Link
US (2) US11296085B2 (enExample)
JP (3) JP7237498B2 (enExample)
KR (1) KR102597945B1 (enExample)
TW (2) TWI836584B (enExample)
WO (1) WO2019053558A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210257290A1 (en) * 2020-02-19 2021-08-19 Nanya Technology Corporation Semiconductor device with connecting structure and method for fabricating the same
US12080557B2 (en) * 2021-08-30 2024-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method for forming 2-D material semiconductor device with improved source/drain electrodes and gate dielectric
KR102851120B1 (ko) * 2022-01-20 2025-08-28 삼성디스플레이 주식회사 표시패널
WO2025163450A1 (ja) * 2024-01-31 2025-08-07 株式会社半導体エネルギー研究所 半導体装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5064747B2 (ja) 2005-09-29 2012-10-31 株式会社半導体エネルギー研究所 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法
JP5078246B2 (ja) 2005-09-29 2012-11-21 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
EP1998373A3 (en) 2005-09-29 2012-10-31 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device having oxide semiconductor layer and manufacturing method thereof
KR102057221B1 (ko) 2009-09-16 2019-12-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
KR101943293B1 (ko) 2009-10-16 2019-01-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 표시 장치 및 전자 장치
KR20220153647A (ko) 2009-10-29 2022-11-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101752348B1 (ko) 2009-10-30 2017-06-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2011192801A (ja) 2010-03-15 2011-09-29 Elpida Memory Inc キャパシタ素子とキャパシタ素子の製造方法および半導体装置
TWI602303B (zh) 2011-01-26 2017-10-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
CN103348464B (zh) 2011-01-26 2016-01-13 株式会社半导体能源研究所 半导体装置及其制造方法
WO2012102182A1 (en) 2011-01-26 2012-08-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5933300B2 (ja) * 2011-03-16 2016-06-08 株式会社半導体エネルギー研究所 半導体装置
US8932913B2 (en) 2011-04-22 2015-01-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US8916868B2 (en) 2011-04-22 2014-12-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8809854B2 (en) 2011-04-22 2014-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8878288B2 (en) * 2011-04-22 2014-11-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9842842B2 (en) * 2014-03-19 2017-12-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and semiconductor device and electronic device having the same
KR102481037B1 (ko) 2014-10-01 2022-12-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 배선층 및 그 제작 방법
JP2016225613A (ja) * 2015-05-26 2016-12-28 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の駆動方法
US10424671B2 (en) 2015-07-29 2019-09-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, circuit board, and electronic device
US9825177B2 (en) * 2015-07-30 2017-11-21 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of a semiconductor device using multiple etching mask
US9741400B2 (en) * 2015-11-05 2017-08-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, electronic device, and method for operating the semiconductor device
US10411013B2 (en) 2016-01-22 2019-09-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and memory device

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