|
JPH04248642A
(ja)
*
|
1991-01-18 |
1992-09-04 |
Kenneth W Iobst |
メモリ集積回路のｐｉｍチップおよびその制御方法
|
|
US5901304A
(en)
|
1997-03-13 |
1999-05-04 |
International Business Machines Corporation |
Emulating quasi-synchronous DRAM with asynchronous DRAM
|
|
US6336159B1
(en)
|
1997-06-25 |
2002-01-01 |
Intel Corporation |
Method and apparatus for transferring data in source-synchronous protocol and transferring signals in common clock protocol in multiple agent processing system
|
|
US6510503B2
(en)
|
1998-07-27 |
2003-01-21 |
Mosaid Technologies Incorporated |
High bandwidth memory interface
|
|
US6622235B1
(en)
|
2000-01-03 |
2003-09-16 |
Advanced Micro Devices, Inc. |
Scheduler which retries load/store hit situations
|
|
CA2316590A1
(en)
|
2000-08-23 |
2002-02-23 |
Celestica International Inc. |
System and method for using a synchronous device with an asynchronous memory controller
|
|
US7412553B2
(en)
|
2002-01-10 |
2008-08-12 |
O2Micro International Limited |
Enhanced protocol conversion system capable of providing offloaded protocol instruction processing
|
|
US7296112B1
(en)
|
2002-12-10 |
2007-11-13 |
Greenfield Networks, Inc. |
High bandwidth memory management using multi-bank DRAM devices
|
|
JP4383148B2
(ja)
|
2003-11-25 |
2009-12-16 |
株式会社日立製作所 |
処理オフロード機能モジュールを備えた磁気ディスクアレイ装置
|
|
US7363406B2
(en)
|
2004-12-08 |
2008-04-22 |
Motorola, Inc. |
Dynamic access scheduling memory controller
|
|
US8386722B1
(en)
*
|
2008-06-23 |
2013-02-26 |
Google Inc. |
Stacked DIMM memory interface
|
|
US9542352B2
(en)
|
2006-02-09 |
2017-01-10 |
Google Inc. |
System and method for reducing command scheduling constraints of memory circuits
|
|
DE112007000101C9
(de)
|
2006-05-29 |
2017-08-10 |
Certgate Gmbh |
Verfahren zur Kommunikation mit einer Multifunktionsspeicherkarte
|
|
US20080001271A1
(en)
|
2006-06-30 |
2008-01-03 |
Sony Ericsson Mobile Communications Ab |
Flipped, stacked-chip IC packaging for high bandwidth data transfer buses
|
|
US8117415B2
(en)
*
|
2006-09-18 |
2012-02-14 |
Sandisk Il Ltd. |
Storage device estimating a completion time for a storage operation
|
|
US20080162855A1
(en)
|
2006-12-29 |
2008-07-03 |
Tessil Thomas |
Memory Command Issue Rate Controller
|
|
US7865660B2
(en)
|
2007-04-16 |
2011-01-04 |
Montage Technology Group Ltd. |
Calibration of read/write memory access via advanced memory buffer
|
|
US8024511B2
(en)
|
2007-08-31 |
2011-09-20 |
Siemens Industry, Inc. |
Systems, devices, and/or methods to access synchronous RAM in an asynchronous manner
|
|
US8042082B2
(en)
|
2007-09-12 |
2011-10-18 |
Neal Solomon |
Three dimensional memory in a system on a chip
|
|
US7921272B2
(en)
|
2007-10-05 |
2011-04-05 |
International Business Machines Corporation |
Monitoring patterns of processes accessing addresses in a storage device to determine access parameters to apply
|
|
US7747803B2
(en)
*
|
2007-11-28 |
2010-06-29 |
International Business Machines Corporation |
Device, system, and method of handling delayed transactions
|
|
US8289760B2
(en)
*
|
2008-07-02 |
2012-10-16 |
Micron Technology, Inc. |
Multi-mode memory device and method having stacked memory dice, a logic die and a command processing circuit and operating in direct and indirect modes
|
|
US7855931B2
(en)
|
2008-07-21 |
2010-12-21 |
Micron Technology, Inc. |
Memory system and method using stacked memory device dice, and system using the memory system
|
|
JP5331427B2
(ja)
*
|
2008-09-29 |
2013-10-30 |
株式会社日立製作所 |
半導体装置
|
|
JP2010146252A
(ja)
*
|
2008-12-18 |
2010-07-01 |
Nec Engineering Ltd |
Ｄｄｒメモリコントローラ
|
|
US8576714B2
(en)
*
|
2009-05-29 |
2013-11-05 |
Futurewei Technologies, Inc. |
System and method for relay node flow control in a wireless communications system
|
|
JP2011081732A
(ja)
*
|
2009-10-09 |
2011-04-21 |
Elpida Memory Inc |
半導体装置及びその調整方法並びにデータ処理システム
|
|
US8473695B2
(en)
|
2011-03-31 |
2013-06-25 |
Mosys, Inc. |
Memory system including variable write command scheduling
|
|
US8819687B2
(en)
|
2010-05-07 |
2014-08-26 |
Advanced Micro Devices, Inc. |
Scheduling for multiple memory controllers
|
|
US9251873B1
(en)
|
2010-05-20 |
2016-02-02 |
Kandou Labs, S.A. |
Methods and systems for pin-efficient memory controller interface using vector signaling codes for chip-to-chip communications
|
|
US8683148B2
(en)
*
|
2010-06-30 |
2014-03-25 |
Sandisk Il Ltd. |
Status indication when a maintenance operation is to be performed at a memory device
|
|
US8314807B2
(en)
|
2010-09-16 |
2012-11-20 |
Apple Inc. |
Memory controller with QoS-aware scheduling
|
|
US8321627B1
(en)
|
2011-10-06 |
2012-11-27 |
Google Inc. |
Memory operation command latency management
|
|
WO2013153577A1
(en)
|
2012-04-12 |
2013-10-17 |
Hitachi, Ltd. |
Data transfer method and storage system adopting data transfer method
|
|
KR101975534B1
(ko)
*
|
2012-09-11 |
2019-05-07 |
삼성전자주식회사 |
연산기능을 갖는 반도체 메모리 장치
|
|
US9201777B2
(en)
|
2012-12-23 |
2015-12-01 |
Advanced Micro Devices, Inc. |
Quality of service support using stacked memory device with logic die
|
|
BR122016006765B1
(pt)
*
|
2013-03-15 |
2022-02-01 |
Intel Corporation |
Aparelho acoplado ao módulo de memória, sistema de memória e método
|
|
US9734097B2
(en)
|
2013-03-15 |
2017-08-15 |
Micron Technology, Inc. |
Apparatuses and methods for variable latency memory operations
|
|
WO2014193376A1
(en)
*
|
2013-05-30 |
2014-12-04 |
Hewlett-Packard Development Company, L.P. |
Separate memory controllers to access data in memory
|
|
KR102094902B1
(ko)
*
|
2013-07-08 |
2020-03-30 |
삼성전자주식회사 |
액티브 상태에서 인터페이스 모드를 전환하는 스토리지 시스템 및 ufs 시스템
|
|
US9535831B2
(en)
|
2014-01-10 |
2017-01-03 |
Advanced Micro Devices, Inc. |
Page migration in a 3D stacked hybrid memory
|
|
US20150270015A1
(en)
|
2014-03-19 |
2015-09-24 |
Micron Technology, Inc. |
Memory mapping
|
|
US9696920B2
(en)
|
2014-06-02 |
2017-07-04 |
Micron Technology, Inc. |
Systems and methods for improving efficiencies of a memory system
|
|
US9436397B2
(en)
*
|
2014-09-23 |
2016-09-06 |
Sandisk Technologies Llc. |
Validating the status of memory operations
|
|
US9836277B2
(en)
*
|
2014-10-01 |
2017-12-05 |
Samsung Electronics Co., Ltd. |
In-memory popcount support for real time analytics
|
|
KR20160063726A
(ko)
|
2014-11-27 |
2016-06-07 |
에스케이하이닉스 주식회사 |
메모리 장치 및 이를 포함하는 메모리 시스템
|
|
KR101782501B1
(ko)
*
|
2014-12-10 |
2017-09-27 |
주식회사 엘지화학 |
고흡수성 수지의 제조 방법
|
|
US20160210174A1
(en)
|
2015-01-15 |
2016-07-21 |
Microsoft Corporation |
Hybrid Scheduler and Power Manager
|
|
WO2016118615A1
(en)
|
2015-01-20 |
2016-07-28 |
Ultrata Llc |
Object memory data flow instruction execution
|
|
JP2018517201A
(ja)
|
2015-04-08 |
2018-06-28 |
ティントリ・インコーポレーテッドＴｉｎｔｒｉ Ｉｎｃｏｒｐｏｒａｔｅｄ |
仮想マシンのためのネイティブなストレージサービス品質
|
|
US9443561B1
(en)
|
2015-05-21 |
2016-09-13 |
Advanced Micro Devices, Inc. |
Ring networks for intra- and inter-memory I/O including 3D-stacked memories
|
|
US20160379686A1
(en)
|
2015-06-29 |
2016-12-29 |
Microsoft Technology Licensing, Llc |
Server systems with hardware accelerators including stacked memory
|
|
US10540588B2
(en)
|
2015-06-29 |
2020-01-21 |
Microsoft Technology Licensing, Llc |
Deep neural network processing on hardware accelerators with stacked memory
|
|
US9633748B2
(en)
|
2015-08-17 |
2017-04-25 |
Micron Technology, Inc. |
Multi-channel testing
|
|
US9818458B1
(en)
*
|
2015-09-23 |
2017-11-14 |
Intel Corporation |
Techniques for entry to a lower power state for a memory device
|
|
FR3042049A1
(enExample)
|
2015-10-01 |
2017-04-07 |
Upmem |
|
|
KR101814577B1
(ko)
*
|
2015-10-16 |
2018-01-03 |
삼성전자주식회사 |
프로세싱-인-메모리를 이용한 명령어 처리 방법 및 그 장치
|
|
US10528613B2
(en)
|
2015-11-23 |
2020-01-07 |
Advanced Micro Devices, Inc. |
Method and apparatus for performing a parallel search operation
|
|
WO2017120270A1
(en)
|
2016-01-04 |
2017-07-13 |
Gray Research LLC |
Massively parallel computer, accelerated computing clusters, and two dimensional router and interconnection network for field programmable gate arrays, and applications
|
|
US20170206033A1
(en)
*
|
2016-01-19 |
2017-07-20 |
SK Hynix Inc. |
Mechanism enabling the use of slow memory to achieve byte addressability and near-dram performance with page remapping scheme
|
|
KR101735590B1
(ko)
*
|
2016-01-22 |
2017-05-15 |
한양대학교 산학협력단 |
트랜잭션 추출 장치 및 방법
|
|
US11079936B2
(en)
*
|
2016-03-01 |
2021-08-03 |
Samsung Electronics Co., Ltd. |
3-D stacked memory with reconfigurable compute logic
|
|
US10430244B2
(en)
|
2016-03-28 |
2019-10-01 |
Micron Technology, Inc. |
Apparatuses and methods to determine timing of operations
|
|
US20170289850A1
(en)
|
2016-04-01 |
2017-10-05 |
Intel Corporation |
Write delivery for memory subsystem with narrow bandwidth repeater channel
|
|
US10453502B2
(en)
|
2016-04-04 |
2019-10-22 |
Micron Technology, Inc. |
Memory bank power coordination including concurrently performing a memory operation in a selected number of memory regions
|
|
US10083722B2
(en)
|
2016-06-08 |
2018-09-25 |
Samsung Electronics Co., Ltd. |
Memory device for performing internal process and operating method thereof
|
|
US10416896B2
(en)
*
|
2016-10-14 |
2019-09-17 |
Samsung Electronics Co., Ltd. |
Memory module, memory device, and processing device having a processor mode, and memory system
|
|
US10268389B2
(en)
*
|
2017-02-22 |
2019-04-23 |
Micron Technology, Inc. |
Apparatuses and methods for in-memory operations
|
|
US10169261B1
(en)
|
2017-08-29 |
2019-01-01 |
International Business Machines Corporation |
Address layout over physical memory
|
|
US10741239B2
(en)
|
2017-08-31 |
2020-08-11 |
Micron Technology, Inc. |
Processing in memory device including a row address strobe manager
|
|
US10346092B2
(en)
*
|
2017-08-31 |
2019-07-09 |
Micron Technology, Inc. |
Apparatuses and methods for in-memory operations using timing circuitry
|
|
US10416927B2
(en)
*
|
2017-08-31 |
2019-09-17 |
Micron Technology, Inc. |
Processing in memory
|