JP2019050376A5 - - Google Patents

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Publication number
JP2019050376A5
JP2019050376A5 JP2018169481A JP2018169481A JP2019050376A5 JP 2019050376 A5 JP2019050376 A5 JP 2019050376A5 JP 2018169481 A JP2018169481 A JP 2018169481A JP 2018169481 A JP2018169481 A JP 2018169481A JP 2019050376 A5 JP2019050376 A5 JP 2019050376A5
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Japan
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design
noise
group
segmentation
data
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JP2018169481A
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Japanese (ja)
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JP2019050376A (ja
JP6629934B2 (ja
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Priority claimed from US15/701,371 external-priority patent/US10290087B2/en
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JP2018169481A 2017-09-11 2018-09-11 試験方策を生成する方法およびそのシステム Active JP6629934B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/701,371 US10290087B2 (en) 2017-09-11 2017-09-11 Method of generating an examination recipe and system thereof
US15/701,371 2017-09-11

Publications (3)

Publication Number Publication Date
JP2019050376A JP2019050376A (ja) 2019-03-28
JP2019050376A5 true JP2019050376A5 (enExample) 2019-07-04
JP6629934B2 JP6629934B2 (ja) 2020-01-15

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JP2018169481A Active JP6629934B2 (ja) 2017-09-11 2018-09-11 試験方策を生成する方法およびそのシステム

Country Status (5)

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US (1) US10290087B2 (enExample)
JP (1) JP6629934B2 (enExample)
KR (1) KR102079022B1 (enExample)
CN (1) CN109558620B (enExample)
TW (1) TWI684000B (enExample)

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US10872406B2 (en) * 2018-04-13 2020-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Hot spot defect detecting method and hot spot defect detecting system
US10853932B2 (en) 2019-01-16 2020-12-01 Applied Material Israel, Ltd. Method of defect detection on a specimen and system thereof
KR102433186B1 (ko) * 2019-04-12 2022-08-18 레고 에이/에스 안정성 체크 장치, 방법 및 컴퓨터 프로그램 제품
CN110148131B (zh) * 2019-05-28 2023-04-25 易诚高科（大连）科技有限公司 一种针对oled屏的mura检测方法
US11619592B2 (en) * 2019-07-09 2023-04-04 KLA Corp. Selecting defect detection methods for inspection of a specimen
US11120546B2 (en) * 2019-09-24 2021-09-14 Kla Corporation Unsupervised learning-based reference selection for enhanced defect inspection sensitivity
US11615993B2 (en) * 2019-11-21 2023-03-28 Kla Corporation Clustering sub-care areas based on noise characteristics
JP7475901B2 (ja) * 2020-03-09 2024-04-30 アプライド マテリアルズ イスラエル リミテッド 試験片上の欠陥検出の方法およびそのシステム
US11022566B1 (en) * 2020-03-31 2021-06-01 Applied Materials Israel Ltd. Examination of a semiconductor specimen
US11631179B2 (en) 2020-06-30 2023-04-18 Applied Materials Israel Ltd. Segmentation of an image of a semiconductor specimen
US11307150B2 (en) * 2020-08-17 2022-04-19 Applied Materials Israel Ltd. Automatic optimization of an examination recipe
US11828714B2 (en) * 2020-09-30 2023-11-28 Applied Materials Israel Ltd. Image acquisition by an electron beam examination tool for metrology measurement
KR20220118627A (ko) 2021-02-19 2022-08-26 장서희 들이쉼과 내쉼을 달리하는 마스크
US11887296B2 (en) * 2021-07-05 2024-01-30 KLA Corp. Setting up care areas for inspection of a specimen
IL288309B (en) * 2021-11-22 2022-05-01 Applied Materials Israel Ltd Mask testing for the production of semiconductor samples
CN114399508A (zh) * 2022-03-25 2022-04-26 杭州广立微电子股份有限公司 晶圆数据的处理方法、装置、电子装置和存储介质
WO2025196881A1 (ja) * 2024-03-18 2025-09-25 株式会社日立ハイテク 欠陥分類装置および欠陥分類方法

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JP3678133B2 (ja) * 2000-10-30 2005-08-03 株式会社日立製作所 検査システムおよび半導体デバイスの製造方法
JP4133047B2 (ja) * 2002-07-05 2008-08-13 シャープ株式会社 補正マスクパターン検証装置および補正マスクパターン検証方法
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JP2004354605A (ja) * 2003-05-28 2004-12-16 Matsushita Electric Ind Co Ltd 半導体設計レイアウトパタン生成方法および図形パタン生成装置
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JP4065893B1 (ja) * 2006-12-04 2008-03-26 東京エレクトロン株式会社 欠陥検出装置、欠陥検出方法、情報処理装置、情報処理方法及びそのプログラム
US7877722B2 (en) * 2006-12-19 2011-01-25 Kla-Tencor Corp. Systems and methods for creating inspection recipes
JP5366110B2 (ja) * 2007-05-16 2013-12-11 独立行政法人産業技術総合研究所 マイクロリアクターおよびその製造方法
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JP5460662B2 (ja) * 2011-09-07 2014-04-02 株式会社日立ハイテクノロジーズ 領域決定装置、観察装置または検査装置、領域決定方法および領域決定方法を用いた観察方法または検査方法
US9141730B2 (en) * 2011-09-12 2015-09-22 Applied Materials Israel, Ltd. Method of generating a recipe for a manufacturing tool and system thereof
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US9098891B2 (en) * 2013-04-08 2015-08-04 Kla-Tencor Corp. Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology
US9727047B2 (en) * 2014-10-14 2017-08-08 Kla-Tencor Corp. Defect detection using structural information
US10140698B2 (en) * 2015-08-10 2018-11-27 Kla-Tencor Corporation Polygon-based geometry classification for semiconductor mask inspection
US11205119B2 (en) * 2015-12-22 2021-12-21 Applied Materials Israel Ltd. Method of deep learning-based examination of a semiconductor specimen and system thereof
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
CN106096217A (zh) * 2016-08-17 2016-11-09 北京道亨时代科技有限公司 一种配网线路的设计方法和设计系统
US10296702B2 (en) * 2017-03-15 2019-05-21 Applied Materials Israel Ltd. Method of performing metrology operations and system thereof

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