TWI684000B - 產生檢查配方的方法及其系統 - Google Patents

產生檢查配方的方法及其系統 Download PDF

Info

Publication number
TWI684000B
TWI684000B TW107130368A TW107130368A TWI684000B TW I684000 B TWI684000 B TW I684000B TW 107130368 A TW107130368 A TW 107130368A TW 107130368 A TW107130368 A TW 107130368A TW I684000 B TWI684000 B TW I684000B
Authority
TW
Taiwan
Prior art keywords
design
noise
group
segment
data
Prior art date
Application number
TW107130368A
Other languages
English (en)
Chinese (zh)
Other versions
TW201930862A (zh
Inventor
艾莉兒 徐卡林
摩西 安薩雷
艾爾 內斯坦
徐羅摩 圖布爾
馬克 傑士荷
艾拉德 寇罕
Original Assignee
以色列商應用材料以色列公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 以色列商應用材料以色列公司 filed Critical 以色列商應用材料以色列公司
Publication of TW201930862A publication Critical patent/TW201930862A/zh
Application granted granted Critical
Publication of TWI684000B publication Critical patent/TWI684000B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30168—Image quality inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW107130368A 2017-09-11 2018-08-30 產生檢查配方的方法及其系統 TWI684000B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/701,371 2017-09-11
US15/701,371 US10290087B2 (en) 2017-09-11 2017-09-11 Method of generating an examination recipe and system thereof

Publications (2)

Publication Number Publication Date
TW201930862A TW201930862A (zh) 2019-08-01
TWI684000B true TWI684000B (zh) 2020-02-01

Family

ID=65631243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107130368A TWI684000B (zh) 2017-09-11 2018-08-30 產生檢查配方的方法及其系統

Country Status (5)

Country Link
US (1) US10290087B2 (enExample)
JP (1) JP6629934B2 (enExample)
KR (1) KR102079022B1 (enExample)
CN (1) CN109558620B (enExample)
TW (1) TWI684000B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10872406B2 (en) * 2018-04-13 2020-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Hot spot defect detecting method and hot spot defect detecting system
US10853932B2 (en) * 2019-01-16 2020-12-01 Applied Material Israel, Ltd. Method of defect detection on a specimen and system thereof
KR102433186B1 (ko) * 2019-04-12 2022-08-18 레고 에이/에스 안정성 체크 장치, 방법 및 컴퓨터 프로그램 제품
KR102341778B1 (ko) 2019-04-12 2021-12-22 레고 에이/에스 조립식 완구의 조립 순서 결정 및 매뉴얼 생성 방법
CN110148131B (zh) * 2019-05-28 2023-04-25 易诚高科（大连）科技有限公司 一种针对oled屏的mura检测方法
US11619592B2 (en) * 2019-07-09 2023-04-04 KLA Corp. Selecting defect detection methods for inspection of a specimen
US11120546B2 (en) 2019-09-24 2021-09-14 Kla Corporation Unsupervised learning-based reference selection for enhanced defect inspection sensitivity
US11615993B2 (en) * 2019-11-21 2023-03-28 Kla Corporation Clustering sub-care areas based on noise characteristics
JP7475901B2 (ja) * 2020-03-09 2024-04-30 アプライド マテリアルズ イスラエル リミテッド 試験片上の欠陥検出の方法およびそのシステム
US11022566B1 (en) * 2020-03-31 2021-06-01 Applied Materials Israel Ltd. Examination of a semiconductor specimen
US11631179B2 (en) * 2020-06-30 2023-04-18 Applied Materials Israel Ltd. Segmentation of an image of a semiconductor specimen
US11307150B2 (en) * 2020-08-17 2022-04-19 Applied Materials Israel Ltd. Automatic optimization of an examination recipe
US11828714B2 (en) * 2020-09-30 2023-11-28 Applied Materials Israel Ltd. Image acquisition by an electron beam examination tool for metrology measurement
KR20220118627A (ko) 2021-02-19 2022-08-26 장서희 들이쉼과 내쉼을 달리하는 마스크
US11887296B2 (en) * 2021-07-05 2024-01-30 KLA Corp. Setting up care areas for inspection of a specimen
US20240331132A1 (en) * 2021-07-09 2024-10-03 Asml Netherlands B.V. Method and system for anomaly-based defect inspection
IL288309B (en) * 2021-11-22 2022-05-01 Applied Materials Israel Ltd Mask testing for the production of semiconductor samples
CN114399508A (zh) * 2022-03-25 2022-04-26 杭州广立微电子股份有限公司 晶圆数据的处理方法、装置、电子装置和存储介质
US20240428395A1 (en) * 2023-06-26 2024-12-26 Applied Materials Israel Ltd. Optimization of a metrology algorithm for examination of semiconductor specimens
WO2025196881A1 (ja) * 2024-03-18 2025-09-25 株式会社日立ハイテク 欠陥分類装置および欠陥分類方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100074516A1 (en) * 2006-12-04 2010-03-25 Tokyo Electron Limited Defect detecting apparatus, defect detecting method, information processing apparatus, information processing method, and program therefor
TW201321911A (zh) * 2011-09-12 2013-06-01 應用材料以色列公司 產生用於製造工具之配方的方法及其系統

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323541A (ja) * 1999-05-13 2000-11-24 Tokyo Seimitsu Co Ltd 被検査物の外観検査方法及び装置
JP3678133B2 (ja) * 2000-10-30 2005-08-03 株式会社日立製作所 検査システムおよび半導体デバイスの製造方法
JP4133047B2 (ja) * 2002-07-05 2008-08-13 シャープ株式会社 補正マスクパターン検証装置および補正マスクパターン検証方法
JP4233397B2 (ja) * 2002-10-01 2009-03-04 株式会社東京精密 画像欠陥検査方法、画像欠陥検査装置及び外観検査装置
JP2004354605A (ja) * 2003-05-28 2004-12-16 Matsushita Electric Ind Co Ltd 半導体設計レイアウトパタン生成方法および図形パタン生成装置
JP2006162954A (ja) * 2004-12-07 2006-06-22 Dainippon Screen Mfg Co Ltd パターン形成用データ
JP2006284433A (ja) * 2005-04-01 2006-10-19 Tokyo Seimitsu Co Ltd 外観検査装置及び外観検査方法
US7801353B2 (en) 2006-02-01 2010-09-21 Applied Materials Israel, Ltd. Method for defect detection using computer aided design data
JP5427609B2 (ja) * 2006-12-19 2014-02-26 ケーエルエー−テンカー・コーポレーション 検査レシピ作成システムおよびその方法
JP5366110B2 (ja) * 2007-05-16 2013-12-11 独立行政法人産業技術総合研究所 マイクロリアクターおよびその製造方法
JP4799574B2 (ja) * 2008-02-29 2011-10-26 株式会社東芝 線状パターンの検知方法および装置
US20090304244A1 (en) * 2008-06-06 2009-12-10 Applied Spectral Imaging Ltd. Method and a system for presenting sections of a histological specimen
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
JP5498258B2 (ja) * 2010-05-20 2014-05-21 株式会社東芝 欠陥解析方法、欠陥解析装置、欠陥解析システム、およびプログラム
JP5460662B2 (ja) * 2011-09-07 2014-04-02 株式会社日立ハイテクノロジーズ 領域決定装置、観察装置または検査装置、領域決定方法および領域決定方法を用いた観察方法または検査方法
US9599575B2 (en) 2012-02-07 2017-03-21 Applied Materials Israel, Ltd. System, a method and a computer program product for CAD-based registration
US9098891B2 (en) * 2013-04-08 2015-08-04 Kla-Tencor Corp. Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology
US9727047B2 (en) * 2014-10-14 2017-08-08 Kla-Tencor Corp. Defect detection using structural information
US10140698B2 (en) * 2015-08-10 2018-11-27 Kla-Tencor Corporation Polygon-based geometry classification for semiconductor mask inspection
TWI797699B (zh) * 2015-12-22 2023-04-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US10127651B2 (en) * 2016-01-15 2018-11-13 Kla-Tencor Corporation Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
CN106096217A (zh) * 2016-08-17 2016-11-09 北京道亨时代科技有限公司 一种配网线路的设计方法和设计系统
US10296702B2 (en) * 2017-03-15 2019-05-21 Applied Materials Israel Ltd. Method of performing metrology operations and system thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100074516A1 (en) * 2006-12-04 2010-03-25 Tokyo Electron Limited Defect detecting apparatus, defect detecting method, information processing apparatus, information processing method, and program therefor
TW201321911A (zh) * 2011-09-12 2013-06-01 應用材料以色列公司 產生用於製造工具之配方的方法及其系統

Also Published As

Publication number Publication date
KR20190029484A (ko) 2019-03-20
CN109558620B (zh) 2020-09-11
KR102079022B1 (ko) 2020-02-19
JP6629934B2 (ja) 2020-01-15
CN109558620A (zh) 2019-04-02
US20190080447A1 (en) 2019-03-14
TW201930862A (zh) 2019-08-01
JP2019050376A (ja) 2019-03-28
US10290087B2 (en) 2019-05-14

Similar Documents

Publication Publication Date Title
TWI750553B (zh) 對樣本的缺陷檢測的方法及其系統
TW201930862A (zh) 產生檢查配方的方法及其系統
CN111443094B (zh) 样本检验的方法及其系统
KR102083706B1 (ko) 반도체 검사 레시피 생성, 결함 리뷰 및 계측을 위한 적응적 샘플링
KR102110634B1 (ko) 자유형의 주의 영역들을 사용한 웨이퍼 검사
CN108463875B (zh) 使用具有晶片图像数据的设计数据改进半导体晶片检验器的缺陷敏感度
TWI597689B (zh) 使用表面形貌屬性之缺陷分類
JP2017523390A (ja) 検査のための高解像度フルダイイメージデータの使用
US9851714B2 (en) Method of inspecting a specimen and system thereof
TWI734720B (zh) 檢查晶圓之系統及方法
CN106537449A (zh) 确定样本上的关注区域的坐标
TW201517192A (zh) 晶片對資料庫的影像檢測方法
CN110892516A (zh) 识别晶片上的干扰缺陷的来源
TW202139133A (zh) 半導體樣本的檢查
TW202044097A (zh) 用於測試影像與設計對準之設計檔案選擇
CN113632136B (zh) 用于半导体应用的参考图像产生
US10296702B2 (en) Method of performing metrology operations and system thereof
CN118821703A (zh) 检验半导体样本的系统、方法及非暂时性计算机可读介质
TW202500985A (zh) 用於半導體試樣的量測偏差分析
JP7475901B2 (ja) 試験片上の欠陥検出の方法およびそのシステム