JP2019050272A - 記憶装置 - Google Patents
記憶装置 Download PDFInfo
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- JP2019050272A JP2019050272A JP2017173296A JP2017173296A JP2019050272A JP 2019050272 A JP2019050272 A JP 2019050272A JP 2017173296 A JP2017173296 A JP 2017173296A JP 2017173296 A JP2017173296 A JP 2017173296A JP 2019050272 A JP2019050272 A JP 2019050272A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/40—EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
- H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/0502—Disposition
- H01L2224/05025—Disposition the internal layer being disposed on a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4502—Disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/50—EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
図1は、第1実施形態に係る記憶装置1を示す模式断面図である。記憶装置1は、例えば、NAND型フラシュメモリ装置であり、3次元配置されたメモリセルを含むメモリセルアレイMCAと、駆動回路CUAと、を備える。メモリセルアレイMCAは、駆動回路CUAの上に設けられる。なお、図1では、簡単のために、各要素間を電気的に絶縁する絶縁膜を省略している。
図6(a)および(b)は、第2実施形態に係る記憶装置5を模式的に示す部分断面図である。図6(a)は、ソース線BSL上に積層された選択ゲートSGS、ワード線WLおよび選択ゲートSGDの断面を示す模式図である。図6(b)は、図6(a)中に示す6B−6B線に沿った断面を示す模式図である。
Claims (9)
- 基板上に配置された第1回路素子を含む回路と、
前記回路の上方に設けられ、金属ワイヤをボンディング可能な領域を有するパッド電極を含む配線層と、
前記回路と前記配線層との間に位置し、前記回路から前記配線層に向かう第1方向に積層された複数の電極層と、
前記第1方向に延びる半導体ピラーと、
前記複数の電極層と前記半導体ピラーとの間に配置された記憶部と、
を備え、
前記第1回路素子は、前記第1方向に見て、前記パッド電極と重なる位置に配置された記憶装置。 - 前記第1方向に延在し、前記配線層に含まれる配線と前記回路とを電気的に接続する第1コンタクトプラグをさらに備え、
前記第1コンタクトプラグは、前記パッド電極と前記回路との間に位置する請求項1記載の記憶装置。 - 前記パッド電極と前記回路との間に設けられ、前記第1方向の厚さが前記半導体ピラーの前記第1方向の長さよりも厚い絶縁体をさらに備え、
前記第1コンタクトプラグは、前記絶縁体を貫いて前記第1方向に延びる請求項2記載の記憶装置。 - 前記回路と前記複数の電極層との間に設けられ、前記半導体ピラーに接続された導電層をさらに備え、
前記回路は、前記基板と前記導電層との間に設けられ、前記第1回路素子に接続された配線を含み、
前記第1コンタクトプラグは、前記配線に電気的に接続される請求項2記載の記憶装置。 - 前記回路と前記複数の電極層との間に設けられ、前記半導体ピラーに接続された導電層をさらに備え、
前記第1コンタクトプラグは、前記複数の電極層および前記導電層を貫いて前記第1方向に延びる請求項2記載の記憶装置。 - 前記パッド電極と前記回路との間に設けられ、前記第1方向の厚さが前記半導体ピラーの前記第1方向の長さよりも厚い絶縁体をさらに備えた請求項1記載の記憶装置。
- 前記回路と前記複数の電極層との間に設けられ、前記半導体ピラーに接続された導電層と、
前記複数の電極層を貫いて前記第1方向に延び、前記導電層に接続された第3コンタクトプラグと、
をさらに備え、
前記第3コンタクトプラグは、前記回路と前記パッド電極との間に位置する請求項1記載の記憶装置。 - 基板上に配置された第1回路素子を含む回路と、
前記周辺回路の一部の上方に設けられ、金属ワイヤをボンディング可能な領域を有するパッド電極を含む配線層と、
前記周辺回路の他部の上方に設けられ、前記周辺回路から前記配線層に向かう第1方向に積層された複数の電極層と、
前記第1方向に延びる半導体ピラーと、
前記複数の電極層と前記半導体ピラーとの間に配置された記憶部と、
を備え、
前記第1回路素子は、前記第1方向に見て、前記パッド電極と重なる位置に配置された記憶装置。 - 前記周辺回路の一部は、電源回路である請求項8記載の記憶装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017173296A JP6832817B2 (ja) | 2017-09-08 | 2017-09-08 | 記憶装置 |
US15/906,760 US10784217B2 (en) | 2017-09-08 | 2018-02-27 | Memory device |
US16/999,340 US20200381381A1 (en) | 2017-09-08 | 2020-08-21 | Memory device |
Applications Claiming Priority (1)
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JP2017173296A JP6832817B2 (ja) | 2017-09-08 | 2017-09-08 | 記憶装置 |
Publications (2)
Publication Number | Publication Date |
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JP2019050272A true JP2019050272A (ja) | 2019-03-28 |
JP6832817B2 JP6832817B2 (ja) | 2021-02-24 |
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JP (1) | JP6832817B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022534538A (ja) * | 2019-07-08 | 2022-08-01 | 長江存儲科技有限責任公司 | ディープアイソレーション構造体を備えた3次元メモリデバイス |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020035985A (ja) * | 2018-08-31 | 2020-03-05 | キオクシア株式会社 | 半導体記憶装置 |
US10580795B1 (en) * | 2019-08-15 | 2020-03-03 | Micron Technology, Inc. | Microelectronic devices including staircase structures, and related memory devices and electronic systems |
WO2021035408A1 (en) | 2019-08-23 | 2021-03-04 | Yangtze Memory Technologies Co., Ltd. | Non-volatile memory device and manufacturing method thereof |
KR20210028438A (ko) | 2019-09-04 | 2021-03-12 | 삼성전자주식회사 | 메모리 장치 |
US11289467B2 (en) | 2019-09-04 | 2022-03-29 | Samsung Electronics Co., Ltd. | Memory device |
KR20220002490A (ko) | 2019-10-17 | 2022-01-06 | 양쯔 메모리 테크놀로지스 씨오., 엘티디. | 배면 격리 구조들을 갖는 3차원 메모리 디바이스들 |
JP2021118252A (ja) | 2020-01-24 | 2021-08-10 | キオクシア株式会社 | 半導体装置およびその製造方法 |
JP2022037583A (ja) | 2020-08-25 | 2022-03-09 | キオクシア株式会社 | 半導体装置およびフォトマスク |
JP2022049822A (ja) | 2020-09-17 | 2022-03-30 | キオクシア株式会社 | 半導体記憶装置 |
WO2023028853A1 (en) * | 2021-08-31 | 2023-03-09 | Yangtze Memory Technologies Co., Ltd. | Memory devices having vertical transistors and methods for forming the same |
JP2023043704A (ja) * | 2021-09-16 | 2023-03-29 | キオクシア株式会社 | 半導体記憶装置 |
Citations (7)
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JP2015028982A (ja) * | 2013-07-30 | 2015-02-12 | 株式会社東芝 | 不揮発性記憶装置およびその製造方法 |
US20150129878A1 (en) * | 2013-11-08 | 2015-05-14 | Yoo-Cheol Shin | Semiconductor device |
US20160086967A1 (en) * | 2014-09-19 | 2016-03-24 | Jae-Eun Lee | Nonvolatile memory device |
US20160307632A1 (en) * | 2015-04-16 | 2016-10-20 | Samsung Electronics Co., Ltd. | Semiconductor device including cell region stacked on peripheral region and method of fabricating the same |
US20160307910A1 (en) * | 2015-04-15 | 2016-10-20 | Jae-Ick SON | Memory device having cell over periphery (cop) structure, memory package and method of manufacturing the same |
JP2017098428A (ja) * | 2015-11-25 | 2017-06-01 | 株式会社東芝 | 半導体記憶装置 |
US20170179027A1 (en) * | 2015-12-17 | 2017-06-22 | Samsung Electronics Co., Ltd. | Memory device having cell over periphery structure and memory package including the same |
Family Cites Families (3)
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US9035371B2 (en) | 2012-09-05 | 2015-05-19 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device |
JP6203152B2 (ja) | 2014-09-12 | 2017-09-27 | 東芝メモリ株式会社 | 半導体記憶装置の製造方法 |
TWI724506B (zh) | 2018-09-04 | 2021-04-11 | 日商東芝記憶體股份有限公司 | 半導體記憶裝置 |
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2017
- 2017-09-08 JP JP2017173296A patent/JP6832817B2/ja active Active
-
2018
- 2018-02-27 US US15/906,760 patent/US10784217B2/en active Active
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2020
- 2020-08-21 US US16/999,340 patent/US20200381381A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015028982A (ja) * | 2013-07-30 | 2015-02-12 | 株式会社東芝 | 不揮発性記憶装置およびその製造方法 |
US20150129878A1 (en) * | 2013-11-08 | 2015-05-14 | Yoo-Cheol Shin | Semiconductor device |
US20160086967A1 (en) * | 2014-09-19 | 2016-03-24 | Jae-Eun Lee | Nonvolatile memory device |
US20160307910A1 (en) * | 2015-04-15 | 2016-10-20 | Jae-Ick SON | Memory device having cell over periphery (cop) structure, memory package and method of manufacturing the same |
US20160307632A1 (en) * | 2015-04-16 | 2016-10-20 | Samsung Electronics Co., Ltd. | Semiconductor device including cell region stacked on peripheral region and method of fabricating the same |
JP2017098428A (ja) * | 2015-11-25 | 2017-06-01 | 株式会社東芝 | 半導体記憶装置 |
US20170179027A1 (en) * | 2015-12-17 | 2017-06-22 | Samsung Electronics Co., Ltd. | Memory device having cell over periphery structure and memory package including the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022534538A (ja) * | 2019-07-08 | 2022-08-01 | 長江存儲科技有限責任公司 | ディープアイソレーション構造体を備えた3次元メモリデバイス |
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US20200381381A1 (en) | 2020-12-03 |
US20190081017A1 (en) | 2019-03-14 |
JP6832817B2 (ja) | 2021-02-24 |
US10784217B2 (en) | 2020-09-22 |
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