JP2019045418A - 高さ検出装置、及びレーザー加工装置 - Google Patents
高さ検出装置、及びレーザー加工装置 Download PDFInfo
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- H—ELECTRICITY
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
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- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
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- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Abstract
【解決手段】本発明によれば、光源61と、第1の光路に配設された被加工物10に集光する集光器65と、第1の光路6aの光を第2の光路6bに分岐するビームスプリッター641と、第2の光路6bに光を反射しビームスプリッター641を経由して第1の光路6aに光を戻すミラー67と、被加工物10の上面で反射した光とミラー67によって戻された光の干渉光を分岐する光分岐部62と、第3の光路6cに配設され干渉光に基づいて被加工物10の高さを算出する算出手段7と、から構成され、算出手段7は、選択部692によって選択された波長帯の干渉光をイメージセンサー71で捕えて被加工物10の高さを算出する、高さ検出装置6。
【選択図】図2
Description
(波長820〜870nmの光)が第1の回析格子694で回析されダイクロイックミラー695を透過してイメージセンター71に到達する。
レーザー :YVO4 パルスレーザー
波長 :1064nm
繰り返し周波数 :100kHz
パルス出力 :2.5μJ
集光スポット径 :φ1μm
加工送り速度 :100mm/秒
3:チャックテーブル機構
36:チャックテーブル
37:加工送り手段
38:第1の割り出し送り手段
4:レーザー光線照射ユニット支持機構
42:可動支持基台
43:第2の割り出し送り手段
5:高さ検出兼レーザー照射ユニット
53:第1の集光点位置調整手段
6:高さ検出手段
61:光源
62:第1の光分岐部
63:コリメーションレンズ
64:第2の光分岐部
65、66:集光レンズ
67: ミラー
68:コリメーションレンズ
69:波長帯分岐部
691、695:ダイクロイックミラー
692:選択部
692a:第1の選択部
692b:第2の選択部
693:第1のバンドパスフィルター
694:第1の回析格子
697:第2のバンドパスフィルター
698:第2の回析格子
70:集光レンズ
71:メージセンサー
80:制御手段
81:表示手段
9:レーザー光線照射手段
91:パルスレーザー光線発振手段
92:ダイクロイックミラー
10:半導体ウエーハ
Claims (4)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物の上面高さを検出する高さ検出手段と、を少なくとも備えた分光干渉型の高さ検出装置であって、
該高さ検出手段は、所定幅の波長帯を有する光を第1の光路に発する光源と、
該第1の光路に配設され該保持手段に保持された被加工物に集光する集光器と、
該光源と該集光器との間に配設され該第1の光路の光を第2の光路に分岐するビームスプリッターと、
該第2の光路に配設され基本となる光路長を生成して該第2の光路に光を反射し該ビームスプリッターを経由して該第1の光路に光を戻すミラーと、
該ビームスプリッターと該光源との間に配設され該保持手段に保持された被加工物の上面で反射し該集光器を介して該第1の光路に戻された光と該ミラーによって戻された光の干渉光を該第1の光路から第3の光路に分岐する光分岐部と、
該第3の光路に配設され該干渉光に基づいて被加工物の高さを算出する算出手段と、
から少なくとも構成され、
該算出手段は、
該光源が発する波長帯の光を少なくとも2つの波長帯に分岐する波長帯分岐部と、該波長帯分岐部において分岐されたいずれかの光を選択する選択部と、を備え、
該選択部によって選択された波長帯の干渉光をイメージセンサーで捕えて被加工物の高さを算出する、高さ検出装置。 - 該波長帯分岐部は、
該光源が発する所定の波長域の光を少なくとも2つの波長帯に分岐する第1の波長帯の光を透過し、第2の波長帯の光を反射するダイクロイックミラーと、
該第1の波長帯の光路に配設されノイズ光を除去する第1のバンドパスフィルターと、該第1のバンドパスフィルターからの光を該第1の波長帯で分散する第1の回析格子と、
該第2の波長帯の光路に配設されノイズ光を除去する第2のバンドパスフィルターと、該第2のバンドパスフィルターからの光を該第2の波長帯で分散する第2の回析格子と、
から構成され、
該選択部は、該第1の波長帯の光路と該第2の波長帯の光路とのいずれかを遮光する遮光板で構成されている、請求項1に記載の高さ検出装置。 - 該算出手段は、算出された高さ情報を被加工物の座標に基づいて記憶する記憶部を含む請求項1、又は2に記載の高さ検出装置。
- 請求項3に記載された高さ検出装置を備えたレーザー加工装置であって、
該保持手段に保持された被加工物を加工するレーザー光線を発振する発振器と、該発振器が発振したレーザー光線を該集光器に導く光学系と、該集光器に配設され該記憶部に記憶された高さ情報に基づいて該集光器を該保持手段に保持された被加工物に接近及び離反させる駆動部を備えたレーザー加工装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
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JP2017171143A JP6953242B2 (ja) | 2017-09-06 | 2017-09-06 | 高さ検出装置、及びレーザー加工装置 |
TW107126860A TWI768091B (zh) | 2017-09-06 | 2018-08-02 | 高度檢測裝置及雷射加工裝置 |
MYPI2018702918A MY198102A (en) | 2017-09-06 | 2018-08-17 | Height detecting apparatus and laser processing apparatus |
SG10201807224SA SG10201807224SA (en) | 2017-09-06 | 2018-08-24 | Height detecting apparatur and laser processing apparatus |
DE102018214743.4A DE102018214743A1 (de) | 2017-09-06 | 2018-08-30 | Höhenerfassungsvorrichtung und laserbearbeitungsvorrichtung |
US16/117,855 US11361996B2 (en) | 2017-09-06 | 2018-08-30 | Height detecting apparatus and laser processing apparatus |
CN201811023780.6A CN109465541B (zh) | 2017-09-06 | 2018-09-04 | 高度检测装置和激光加工装置 |
KR1020180105921A KR102593879B1 (ko) | 2017-09-06 | 2018-09-05 | 높이 검출 장치 및 레이저 가공 장치 |
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US (1) | US11361996B2 (ja) |
JP (1) | JP6953242B2 (ja) |
KR (1) | KR102593879B1 (ja) |
CN (1) | CN109465541B (ja) |
DE (1) | DE102018214743A1 (ja) |
MY (1) | MY198102A (ja) |
SG (1) | SG10201807224SA (ja) |
TW (1) | TWI768091B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112658473A (zh) * | 2019-09-27 | 2021-04-16 | 株式会社迪思科 | 激光加工装置 |
KR20220018424A (ko) | 2020-08-06 | 2022-02-15 | 토와 가부시기가이샤 | 절단 장치 및 절단품의 제조 방법 |
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JP2021010936A (ja) * | 2019-07-09 | 2021-02-04 | 株式会社ディスコ | レーザ加工装置 |
JP7270216B2 (ja) * | 2019-08-23 | 2023-05-10 | パナソニックIpマネジメント株式会社 | レーザ加工装置、レーザ加工方法、および補正データ生成方法 |
JP7339086B2 (ja) * | 2019-09-11 | 2023-09-05 | 株式会社ディスコ | 計測装置 |
JP2022065259A (ja) * | 2020-10-15 | 2022-04-27 | 株式会社ディスコ | レーザー加工装置 |
JP2022077223A (ja) * | 2020-11-11 | 2022-05-23 | 株式会社ディスコ | レーザー加工装置 |
CN113369682A (zh) * | 2021-06-28 | 2021-09-10 | 成都飞机工业(集团)有限责任公司 | 一种用于激光加工的光路系统集成装置 |
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CN112658473A (zh) * | 2019-09-27 | 2021-04-16 | 株式会社迪思科 | 激光加工装置 |
JP7408332B2 (ja) | 2019-09-27 | 2024-01-05 | 株式会社ディスコ | レーザー加工装置 |
KR20220018424A (ko) | 2020-08-06 | 2022-02-15 | 토와 가부시기가이샤 | 절단 장치 및 절단품의 제조 방법 |
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CN109465541A (zh) | 2019-03-15 |
KR20190027333A (ko) | 2019-03-14 |
KR102593879B1 (ko) | 2023-10-24 |
TW201921546A (zh) | 2019-06-01 |
TWI768091B (zh) | 2022-06-21 |
SG10201807224SA (en) | 2019-04-29 |
US11361996B2 (en) | 2022-06-14 |
MY198102A (en) | 2023-08-01 |
US20190074221A1 (en) | 2019-03-07 |
CN109465541B (zh) | 2021-11-19 |
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JP6953242B2 (ja) | 2021-10-27 |
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