JP2019036705A - Smd式ledディライトレスパッケージ方法 - Google Patents
Smd式ledディライトレスパッケージ方法 Download PDFInfo
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- JP2019036705A JP2019036705A JP2018041220A JP2018041220A JP2019036705A JP 2019036705 A JP2019036705 A JP 2019036705A JP 2018041220 A JP2018041220 A JP 2018041220A JP 2018041220 A JP2018041220 A JP 2018041220A JP 2019036705 A JP2019036705 A JP 2019036705A
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- 238000000034 method Methods 0.000 title claims abstract description 74
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 239000003292 glue Substances 0.000 claims abstract description 105
- 238000007789 sealing Methods 0.000 claims abstract description 85
- 238000000465 moulding Methods 0.000 claims abstract description 25
- 229920001296 polysiloxane Polymers 0.000 claims description 62
- 230000005484 gravity Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 6
- 229910052710 silicon Inorganic materials 0.000 abstract 6
- 239000010703 silicon Substances 0.000 abstract 6
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- 238000005516 engineering process Methods 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (1)
- SMD式LEDディライトレスパッケージ方法であって、チップを取り付け、ブラケットを設置し、ブラケットのキャビティにLEDチップを設置するステップと、キャビティに封止グルーを塗りつぶし、封止グルーをベーキング硬化するステップと、グルーを注入し、透明シリコーン点を硬化後の封止グルーに付け、透明シリコーンの中部を凸面にするステップと、ブラケットを上下反対的に置き、ブラケットのキャビティを下に向かれ、透明シリコーンを重力の作用下で流れさせ、透明シリコーンをベーキングし硬化させレンズに形成させるステップと、を含み、成型ステップには、ベーキングの温度は75-85セルシウスであり、成型ステップには、ブラケットを支えるための材料ボックスも含まれており、成型ステップには、オーブンで透明シリコーンをベーキングし、レンズの発光角度は60-90度であり、レンズは半球状または水滴状であり、封止グルーステップには、オーブンベーキングを使用し、ベーキングの温度は130-160セルシウスであり、封止グルーは蛍光グルーであり、封止グルーステップの前に、蛍光グルーを制作するステップを包含し、蛍光粉をシリコーンに入れ、混ぜて、封止グルーをキャビティに均等的に塗りつぶすことを特徴とするSMD式LEDディライトレスパッケージ方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710708934.4A CN107452855B (zh) | 2017-08-17 | 2017-08-17 | 贴片led无模封装方法 |
CN201710708934.4 | 2017-08-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019036705A true JP2019036705A (ja) | 2019-03-07 |
JP6556280B2 JP6556280B2 (ja) | 2019-08-07 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018041220A Active JP6556280B2 (ja) | 2017-08-17 | 2018-03-07 | Smd式ledディライトレスパッケージ方法 |
Country Status (2)
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JP (1) | JP6556280B2 (ja) |
CN (1) | CN107452855B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113471179A (zh) * | 2021-06-11 | 2021-10-01 | 五邑大学 | 色温可调的cob led光源及其制造方法 |
CN114137455B (zh) * | 2021-11-25 | 2024-02-27 | 中国科学院合肥物质科学研究院 | 一种安装在法兰面的电光转换装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108160422B (zh) * | 2017-12-28 | 2019-01-29 | 旭宇光电(深圳)股份有限公司 | 大功率led透镜注胶方法 |
CN110718617A (zh) * | 2019-10-08 | 2020-01-21 | 郑州森源新能源科技有限公司 | 一种led荧光胶快速定型方法、led封装方法 |
Citations (10)
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JP2004119583A (ja) * | 2002-09-25 | 2004-04-15 | Seiko Epson Corp | 光学素子の製造方法 |
JP2005129879A (ja) * | 2003-10-20 | 2005-05-19 | Toshimiki Okura | 発光素子および受光素子のレンズ形成法 |
JP2007184616A (ja) * | 2006-01-05 | 2007-07-19 | Samsung Electro-Mechanics Co Ltd | 発光ダイオードパッケージの製造方法 |
JP2012199345A (ja) * | 2011-03-21 | 2012-10-18 | Sekisui Chem Co Ltd | 光半導体装置用レンズ材料、光半導体装置及び光半導体装置の製造方法 |
JP2013225597A (ja) * | 2012-04-23 | 2013-10-31 | Mitsubishi Electric Corp | 発光装置の製造方法及び発光装置 |
US20150357533A1 (en) * | 2013-02-19 | 2015-12-10 | Michael A. Tischler | Engineered-phosphor led packages and related methods |
DE102014108377A1 (de) * | 2014-06-13 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
JP2017011257A (ja) * | 2015-03-31 | 2017-01-12 | 日亜化学工業株式会社 | 発光装置とそれを用いた発光モジュール |
JP2017085125A (ja) * | 2008-06-24 | 2017-05-18 | シャープ株式会社 | 発光装置 |
JP2017092258A (ja) * | 2015-11-10 | 2017-05-25 | 株式会社カネカ | リモートフォスファー型半導体発光装置及びその製法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101320775B (zh) * | 2008-07-21 | 2012-05-23 | 晶能光电(江西)有限公司 | Led封装过程中的固化方法 |
CN101452986A (zh) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | 白光发光二极管器件的封装结构和方法 |
CN101916806A (zh) * | 2010-06-18 | 2010-12-15 | 深圳市瑞丰光电子股份有限公司 | Led封装方法及采用该方法封装成的led封装结构 |
CN102270713A (zh) * | 2011-07-28 | 2011-12-07 | 深圳市聚飞光电股份有限公司 | Led封装方法及led |
CN103131190B (zh) * | 2013-02-05 | 2015-07-01 | 广州市爱易迪新材料科技有限公司 | 一种led封装用的双组份自成型透镜硅胶及其封装工艺 |
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2017
- 2017-08-17 CN CN201710708934.4A patent/CN107452855B/zh active Active
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2018
- 2018-03-07 JP JP2018041220A patent/JP6556280B2/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004119583A (ja) * | 2002-09-25 | 2004-04-15 | Seiko Epson Corp | 光学素子の製造方法 |
JP2005129879A (ja) * | 2003-10-20 | 2005-05-19 | Toshimiki Okura | 発光素子および受光素子のレンズ形成法 |
JP2007184616A (ja) * | 2006-01-05 | 2007-07-19 | Samsung Electro-Mechanics Co Ltd | 発光ダイオードパッケージの製造方法 |
JP2017085125A (ja) * | 2008-06-24 | 2017-05-18 | シャープ株式会社 | 発光装置 |
JP2012199345A (ja) * | 2011-03-21 | 2012-10-18 | Sekisui Chem Co Ltd | 光半導体装置用レンズ材料、光半導体装置及び光半導体装置の製造方法 |
JP2013225597A (ja) * | 2012-04-23 | 2013-10-31 | Mitsubishi Electric Corp | 発光装置の製造方法及び発光装置 |
US20150357533A1 (en) * | 2013-02-19 | 2015-12-10 | Michael A. Tischler | Engineered-phosphor led packages and related methods |
DE102014108377A1 (de) * | 2014-06-13 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
JP2017011257A (ja) * | 2015-03-31 | 2017-01-12 | 日亜化学工業株式会社 | 発光装置とそれを用いた発光モジュール |
JP2017092258A (ja) * | 2015-11-10 | 2017-05-25 | 株式会社カネカ | リモートフォスファー型半導体発光装置及びその製法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113471179A (zh) * | 2021-06-11 | 2021-10-01 | 五邑大学 | 色温可调的cob led光源及其制造方法 |
CN114137455B (zh) * | 2021-11-25 | 2024-02-27 | 中国科学院合肥物质科学研究院 | 一种安装在法兰面的电光转换装置 |
Also Published As
Publication number | Publication date |
---|---|
CN107452855B (zh) | 2018-05-29 |
CN107452855A (zh) | 2017-12-08 |
JP6556280B2 (ja) | 2019-08-07 |
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