JP2019029244A - 保護素子 - Google Patents
保護素子 Download PDFInfo
- Publication number
- JP2019029244A JP2019029244A JP2017148897A JP2017148897A JP2019029244A JP 2019029244 A JP2019029244 A JP 2019029244A JP 2017148897 A JP2017148897 A JP 2017148897A JP 2017148897 A JP2017148897 A JP 2017148897A JP 2019029244 A JP2019029244 A JP 2019029244A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- electrode
- alloy
- electrodes
- fuse element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000007769 metal material Substances 0.000 claims abstract description 20
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 6
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 229910000597 tin-copper alloy Inorganic materials 0.000 claims description 6
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims description 6
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 230000004927 fusion Effects 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/12—Two or more separate fusible members in parallel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
Abstract
【解決手段】絶縁基板11と、この絶縁基板に設けた複数の電極12と、この電極のうち所定電極の間に充填した低融点金属の電極充填材13と、所定電極の間を橋設しかつ電極充填材の上部を覆ったヒューズエレメント14とを備え、電極充填材は、その溶融温度が該ヒューズエレメントの液相線温度以下の金属材から構成された。
【選択図】図1
Description
11、21・・・絶縁基板、
12、22・・・電極、
13、23・・・電極充填材、
14、24・・・ヒューズエレメント、
15、25・・・蓋体、
26・・・発熱素子。
Claims (6)
- 絶縁基板と、この絶縁基板に設けた複数の電極と、この電極のうち所定電極の間に充填した低融点金属の電極充填材と、前記所定電極の間を橋設しかつ電極充填材の上部を覆ったヒューズエレメントとを備え、電極充填材は、その溶融温度が前記ヒューズエレメントの液相線温度以下の金属材から構成された電極充填材付き保護素子。
- 前記絶縁基板の片面にさらに発熱素子を設けた請求項1に記載の電極充填材付き保護素子。
- 前記電極充填材は、錫基合金、錫−鉛合金、錫−銅合金、錫−銀合金、錫−銀−銅合金の群から選択された請求項1または請求項2に記載の電極充填材付き保護素子。
- 前記電極充填材は、はんだペーストにより充填形成した金属材、はんだボールにより充填形成した金属材、部分メッキにより充填形成した金属材の群から選択された請求項1ないし請求項3の何れか一つに記載の電極充填材付き保護素子。
- 前記ヒューズエレメントは、錫基合金、錫−鉛合金、錫−銅合金、錫−銀合金、錫−銀−銅合金の群から選択された請求項1ないし請求項4の何れか一つに記載の電極充填材付き保護素子。
- 前記ヒューズエレメントは、組成の異なる複数の金属材を組み合わせた複合材からなる請求項5に記載の電極充填材付き保護素子。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017148897A JP6912314B2 (ja) | 2017-08-01 | 2017-08-01 | 保護素子 |
CN201880039037.1A CN110741457B (zh) | 2017-08-01 | 2018-07-31 | 保护元件 |
PCT/JP2018/028659 WO2019026904A1 (ja) | 2017-08-01 | 2018-07-31 | 保護素子 |
KR1020197034414A KR102373602B1 (ko) | 2017-08-01 | 2018-07-31 | 보호 소자 |
TW107126621A TWI676202B (zh) | 2017-08-01 | 2018-08-01 | 保護元件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017148897A JP6912314B2 (ja) | 2017-08-01 | 2017-08-01 | 保護素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019029244A true JP2019029244A (ja) | 2019-02-21 |
JP6912314B2 JP6912314B2 (ja) | 2021-08-04 |
Family
ID=65232710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017148897A Active JP6912314B2 (ja) | 2017-08-01 | 2017-08-01 | 保護素子 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6912314B2 (ja) |
KR (1) | KR102373602B1 (ja) |
CN (1) | CN110741457B (ja) |
TW (1) | TWI676202B (ja) |
WO (1) | WO2019026904A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020140845A (ja) * | 2019-02-28 | 2020-09-03 | ショット日本株式会社 | 保護素子 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI820279B (zh) * | 2019-12-26 | 2023-11-01 | 日商迪睿合股份有限公司 | 保護元件及電池組 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005505110A (ja) * | 2001-10-03 | 2005-02-17 | メタラー テクノロジーズ インターナショナル エス.アー. | ヒューズ要素及びその製造方法 |
US20090189730A1 (en) * | 2008-01-30 | 2009-07-30 | Littelfuse, Inc. | Low temperature fuse |
JP2015053260A (ja) * | 2013-08-07 | 2015-03-19 | デクセリアルズ株式会社 | 保護素子及びバッテリパック |
JP2015053271A (ja) * | 2009-09-04 | 2015-03-19 | 乾坤科技股▲ふん▼有限公司 | 保護装置 |
JP2016001549A (ja) * | 2014-06-11 | 2016-01-07 | デクセリアルズ株式会社 | スイッチ素子及びスイッチ回路 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112012004855T5 (de) * | 2011-11-22 | 2014-09-11 | Nec Schott Components Corporation | Temperatursicherung und Schleifelektrode verwendet für eine Temperatursicherung |
JP2015079608A (ja) | 2013-10-16 | 2015-04-23 | エヌイーシー ショット コンポーネンツ株式会社 | 保護素子用ヒューズエレメント材およびそれを利用した回路保護素子 |
-
2017
- 2017-08-01 JP JP2017148897A patent/JP6912314B2/ja active Active
-
2018
- 2018-07-31 WO PCT/JP2018/028659 patent/WO2019026904A1/ja active Application Filing
- 2018-07-31 KR KR1020197034414A patent/KR102373602B1/ko active IP Right Grant
- 2018-07-31 CN CN201880039037.1A patent/CN110741457B/zh active Active
- 2018-08-01 TW TW107126621A patent/TWI676202B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005505110A (ja) * | 2001-10-03 | 2005-02-17 | メタラー テクノロジーズ インターナショナル エス.アー. | ヒューズ要素及びその製造方法 |
US20090189730A1 (en) * | 2008-01-30 | 2009-07-30 | Littelfuse, Inc. | Low temperature fuse |
JP2015053271A (ja) * | 2009-09-04 | 2015-03-19 | 乾坤科技股▲ふん▼有限公司 | 保護装置 |
JP2015053260A (ja) * | 2013-08-07 | 2015-03-19 | デクセリアルズ株式会社 | 保護素子及びバッテリパック |
JP2016001549A (ja) * | 2014-06-11 | 2016-01-07 | デクセリアルズ株式会社 | スイッチ素子及びスイッチ回路 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020140845A (ja) * | 2019-02-28 | 2020-09-03 | ショット日本株式会社 | 保護素子 |
JP7050019B2 (ja) | 2019-02-28 | 2022-04-07 | ショット日本株式会社 | 保護素子 |
Also Published As
Publication number | Publication date |
---|---|
WO2019026904A1 (ja) | 2019-02-07 |
CN110741457A (zh) | 2020-01-31 |
TWI676202B (zh) | 2019-11-01 |
CN110741457B (zh) | 2022-06-07 |
KR20190141719A (ko) | 2019-12-24 |
JP6912314B2 (ja) | 2021-08-04 |
TW201921398A (zh) | 2019-06-01 |
KR102373602B1 (ko) | 2022-03-14 |
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