JP2019014800A5 - - Google Patents
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- JP2019014800A5 JP2019014800A5 JP2017132145A JP2017132145A JP2019014800A5 JP 2019014800 A5 JP2019014800 A5 JP 2019014800A5 JP 2017132145 A JP2017132145 A JP 2017132145A JP 2017132145 A JP2017132145 A JP 2017132145A JP 2019014800 A5 JP2019014800 A5 JP 2019014800A5
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- 239000000203 mixture Substances 0.000 claims description 19
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 12
- 125000006736 (C6-C20) aryl group Chemical group 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- -1 hydrogen siloxane Chemical class 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 3
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 claims description 2
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017132145A JP7130316B2 (ja) | 2017-07-05 | 2017-07-05 | 硬化性ポリオルガノシロキサン組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017132145A JP7130316B2 (ja) | 2017-07-05 | 2017-07-05 | 硬化性ポリオルガノシロキサン組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019014800A JP2019014800A (ja) | 2019-01-31 |
| JP2019014800A5 true JP2019014800A5 (enrdf_load_stackoverflow) | 2020-05-21 |
| JP7130316B2 JP7130316B2 (ja) | 2022-09-05 |
Family
ID=65358444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017132145A Active JP7130316B2 (ja) | 2017-07-05 | 2017-07-05 | 硬化性ポリオルガノシロキサン組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7130316B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7285238B2 (ja) * | 2020-08-14 | 2023-06-01 | 信越化学工業株式会社 | シリコーン接着剤組成物、及びシリコーンゴム硬化物 |
| CA3226985A1 (en) * | 2021-07-19 | 2023-01-26 | Momentive Performance Materials Inc. | Ultraviolet ray-activated liquid silicone composition for optical application |
| JP7697363B2 (ja) * | 2021-12-24 | 2025-06-24 | 信越化学工業株式会社 | 太陽電池モジュール |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006063092A (ja) | 2004-07-29 | 2006-03-09 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤 |
| EP2452994A1 (en) | 2010-11-12 | 2012-05-16 | Shin-Etsu Chemical Co., Ltd. | Addition curable silicone adhesive composition |
| US9540551B2 (en) | 2010-12-22 | 2017-01-10 | Momentive Performance Materials Japan Llc | Heat-curable polyorganosiloxane composition and use thereof |
| JP2013159671A (ja) | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP5414931B1 (ja) | 2013-06-20 | 2014-02-12 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 二剤型の硬化性ポリオルガノシロキサン組成物及びその使用 |
| JP5308564B1 (ja) | 2012-06-22 | 2013-10-09 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 二剤型の硬化性ポリオルガノシロキサン組成物及びその使用 |
| US20150337188A1 (en) | 2012-06-22 | 2015-11-26 | Momentive Performance Materials Japan Llc | Two-pack curable polyorganosiloxane composition and use thereof |
| JP6105966B2 (ja) | 2013-02-15 | 2017-03-29 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| CN105229783B (zh) | 2013-05-29 | 2018-06-22 | 道康宁东丽株式会社 | 半导体器件和用于密封半导体元件的可固化有机硅组合物 |
| US9909007B2 (en) | 2013-08-29 | 2018-03-06 | Dow Corning Corporation | Curable silicone composition, cured product thereof, and optical semiconductor device |
| WO2015050251A1 (ja) | 2013-10-04 | 2015-04-09 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 硬化性ポリオルガノシロキサン組成物の硬化物、硬化性ポリオルガノシロキサン組成物を用いた接着体、硬化性ポリオルガノシロキサン組成物を用いた接着体の製造方法、並びにその使用 |
| JP6440208B2 (ja) | 2013-10-17 | 2018-12-19 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および光半導体装置 |
| JP6393659B2 (ja) | 2015-05-26 | 2018-09-19 | 信越化学工業株式会社 | 付加硬化型シリコーン組成物および半導体装置 |
| EP3133105B1 (en) | 2015-07-31 | 2020-12-09 | Shin-Etsu Chemical Co., Ltd. | Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package |
| EP3473677B1 (en) | 2016-06-15 | 2021-08-04 | Momentive Performance Materials Japan LLC | Curable polyorganosiloxane composition and use thereof |
| JP6649494B2 (ja) | 2016-09-01 | 2020-02-19 | ダウ・東レ株式会社 | 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物 |
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2017
- 2017-07-05 JP JP2017132145A patent/JP7130316B2/ja active Active