JP2019001997A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019001997A5 JP2019001997A5 JP2018101052A JP2018101052A JP2019001997A5 JP 2019001997 A5 JP2019001997 A5 JP 2019001997A5 JP 2018101052 A JP2018101052 A JP 2018101052A JP 2018101052 A JP2018101052 A JP 2018101052A JP 2019001997 A5 JP2019001997 A5 JP 2019001997A5
- Authority
- JP
- Japan
- Prior art keywords
- euv
- iodine
- incorporation
- atoms
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/623,892 US10495968B2 (en) | 2017-06-15 | 2017-06-15 | Iodine-containing polymers for chemically amplified resist compositions |
| US15/623,892 | 2017-06-15 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019001997A JP2019001997A (ja) | 2019-01-10 |
| JP2019001997A5 true JP2019001997A5 (enExample) | 2020-09-10 |
| JP6913055B2 JP6913055B2 (ja) | 2021-08-04 |
Family
ID=64656848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018101052A Active JP6913055B2 (ja) | 2017-06-15 | 2018-05-25 | 化学増幅型レジスト組成物のためのヨウ素含有ポリマー |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10495968B2 (enExample) |
| JP (1) | JP6913055B2 (enExample) |
| KR (1) | KR102127645B1 (enExample) |
| CN (1) | CN109134263A (enExample) |
| TW (1) | TWI751336B (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI745445B (zh) * | 2016-10-05 | 2021-11-11 | 日商東京應化工業股份有限公司 | 光阻組成物及光阻圖型形成方法、高分子化合物，及共聚物 |
| JP6963979B2 (ja) * | 2016-12-14 | 2021-11-10 | 住友化学株式会社 | 樹脂、レジスト組成物及びレジストパターンの製造方法 |
| JP7044011B2 (ja) * | 2017-09-13 | 2022-03-30 | 信越化学工業株式会社 | 重合性単量体、重合体、レジスト材料、及びパターン形成方法 |
| JP7264020B2 (ja) * | 2018-12-27 | 2023-04-25 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| JP7351256B2 (ja) * | 2019-06-17 | 2023-09-27 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| TWI837443B (zh) * | 2019-12-31 | 2024-04-01 | 南韓商羅門哈斯電子材料韓國公司 | 塗料組成物、經塗覆的基底及形成電子裝置的方法 |
| JP7509071B2 (ja) * | 2020-04-28 | 2024-07-02 | 信越化学工業株式会社 | ヨウ素化芳香族カルボン酸型ペンダント基含有ポリマー、レジスト材料及びパターン形成方法 |
| US12085855B2 (en) * | 2020-04-30 | 2024-09-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Resin, photoresist composition, and method of manufacturing semiconductor device |
| TWI772001B (zh) | 2020-04-30 | 2022-07-21 | 台灣積體電路製造股份有限公司 | 樹脂、光阻組成物和半導體裝置的製造方法 |
| KR20230012474A (ko) * | 2020-05-15 | 2023-01-26 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 화합물, (공)중합체, 조성물, 레지스트패턴 형성방법, 그리고 화합물 및 (공)중합체의 제조방법 |
| US12510821B2 (en) | 2020-05-21 | 2025-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist composition and method of forming photoresist pattern |
| JP7789494B2 (ja) * | 2020-06-01 | 2025-12-22 | 住友化学株式会社 | 化合物、樹脂、レジスト組成物及びレジストパターンの製造方法 |
| TWI849314B (zh) * | 2020-06-01 | 2024-07-21 | 日商住友化學股份有限公司 | 化合物、樹脂、抗蝕劑組成物及抗蝕劑圖案的製造方法 |
| JP2022008152A (ja) * | 2020-06-25 | 2022-01-13 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| US12276910B2 (en) | 2020-07-15 | 2025-04-15 | Dupont Electronic Materials International, Llc | Photoresist compositions and pattern formation methods |
| JP7375697B2 (ja) | 2020-07-17 | 2023-11-08 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| JP7351268B2 (ja) | 2020-07-17 | 2023-09-27 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
| JP7696243B2 (ja) * | 2020-07-21 | 2025-06-20 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7728113B2 (ja) * | 2020-07-21 | 2025-08-22 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7691872B2 (ja) * | 2020-07-28 | 2025-06-12 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7686481B2 (ja) * | 2020-07-28 | 2025-06-02 | 住友化学株式会社 | カルボン酸塩、カルボン酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7691871B2 (ja) * | 2020-07-28 | 2025-06-12 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP7686480B2 (ja) * | 2020-07-28 | 2025-06-02 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| CN117377909B (zh) * | 2021-08-26 | 2024-08-13 | 三井化学株式会社 | 防护膜、防护膜组件、曝光原版、曝光装置和防护膜的制造方法 |
| US20230103685A1 (en) * | 2021-09-30 | 2023-04-06 | Rohm And Haas Electronic Materials Llc | Iodine-containing acid cleavable compounds, polymers derived therefrom, and photoresist compositions |
| US12572076B2 (en) | 2022-11-28 | 2026-03-10 | Rohm And Haas Electronic Materials Korea Ltd | Photoresist underlayer composition |
| KR20240087381A (ko) * | 2022-12-12 | 2024-06-19 | 삼성전자주식회사 | 포토레지스트 상층막용 조성물 및 이를 이용한 패턴형성방법 |
| JPWO2024142556A1 (enExample) * | 2022-12-26 | 2024-07-04 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS617314A (ja) | 1984-06-20 | 1986-01-14 | Kureha Chem Ind Co Ltd | 高屈折率レンズ |
| GB9410578D0 (en) | 1994-05-26 | 1994-07-13 | London Hospital Med Coll | Novel (meth)acrylate monomers and denture base compositions prepared therefrom |
| DE4419386C2 (de) * | 1994-05-30 | 1996-09-19 | Ivoclar Ag | Röntgenopake Ester und Amide iodsubstituierter Benzoesäure sowie deren Verwendung zur Herstellung von Dentalmaterialien |
| US5679710A (en) | 1994-11-01 | 1997-10-21 | London Hospital Medical College | High refractive index and/or radio-opaque resins systems |
| EP1843800B1 (en) * | 2005-01-14 | 2009-05-13 | Henkel AG & Co. KGaA | Radiopaque cyanoacrylate compositions |
| US8003079B2 (en) * | 2005-04-05 | 2011-08-23 | Bar-Ilan University | Core and core-shell nanoparticles containing iodine for X-ray imaging |
| EP2094324A1 (en) | 2006-10-31 | 2009-09-02 | Universiteit Maastricht | Two component bone cement composition for vertebroplasty |
| EP3482776B1 (en) * | 2010-08-06 | 2020-07-15 | Endoshape, Inc. | Radiopaque shape memory polymers for medical devices |
| CA2899309A1 (en) * | 2013-02-08 | 2014-08-14 | Endoshape, Inc. | Radiopaque polymers for medical devices |
| JP6163438B2 (ja) | 2014-02-27 | 2017-07-12 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法、及び、電子デバイス、並びに、感活性光線性又は感放射線性樹脂組成物、及び、レジスト膜 |
-
2017
- 2017-06-15 US US15/623,892 patent/US10495968B2/en active Active
-
2018
- 2018-05-17 TW TW107116738A patent/TWI751336B/zh active
- 2018-05-25 JP JP2018101052A patent/JP6913055B2/ja active Active
- 2018-05-31 CN CN201810553627.8A patent/CN109134263A/zh active Pending
- 2018-06-01 KR KR1020180063303A patent/KR102127645B1/ko active Active
-
2019
- 2019-11-12 US US16/681,142 patent/US10901316B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6913055B2 (ja) | 化学増幅型レジスト組成物のためのヨウ素含有ポリマー | |
| TW200801049A (en) | Lactone-containing compound, polymer, resist composition, and patterning process | |
| JP2013510204A5 (enExample) | ||
| Akae et al. | Cyclodextrin‐Based [3] Rotaxane‐Crosslinked Fluorescent Polymer: Synthesis and De‐Crosslinking Using Size Complementarity | |
| JPS5994B2 (ja) | 感光性組成物 | |
| TW200628977A (en) | Photosensitive resin composition and photosensitive dry film by the use thereof | |
| KR20160124769A (ko) | 광증감 화학 증폭형 레지스트 재료 및 이를 이용한 패턴 형성 방법, 반도체 디바이스, 리소그래피용 마스크와, 나노임프린트용 템플릿 | |
| TW200621811A (en) | Fluorinated monomer having cyclic structure, making method, polymer, photoresist composition and patterning process | |
| Tao et al. | Preparation of bentonite–poly [(acrylic acid)‐acrylamide] water superabsorbent by photopolymerization | |
| Cen et al. | Emerging trends in the chemistry of polymeric resists for extreme ultraviolet lithography | |
| EP2329320A4 (en) | POSITIVE RESIST COMPOSITION FOR IMMERSION EXPOSURE AND STRUCTURAL FORMING PROCESS | |
| Bharti Shukla et al. | Adsorption of anionic dyes on a reversibly swelling cationic superabsorbent polymer | |
| JPWO2020067118A1 (ja) | チオキサントン骨格を有するジアルキルペルオキシド、該化合物を含有する重合性組成物 | |
| JP2009258506A5 (enExample) | ||
| JP6680290B2 (ja) | 重合体およびポジ型レジスト組成物 | |
| KR102641396B1 (ko) | 중합체 및 포지티브형 레지스트 조성물 | |
| JPWO2016132723A1 (ja) | 重合体およびポジ型レジスト組成物 | |
| JP6844549B2 (ja) | レジストパターン形成方法および現像条件の決定方法 | |
| TW200506530A (en) | Photoresist composition and low-molecular and high-molecular compounds used in the photoresist composition | |
| JP2014178573A5 (enExample) | ||
| TW200745010A (en) | Compound having acid dissociable group and radiation sensitive composition containing the same | |
| JP2003140345A5 (enExample) | ||
| DE602004000069D1 (de) | Fluorinated Acrylic Verbindungen, ihre Herstellungsverfahren und diese enthaltende Photoresistzusammensetzungen | |
| ANDO et al. | DFT calculations of photoabsorption spectra for alicyclic and heterocyclic compounds in the VUV region | |
| Matsuzawa et al. | Challenges to Overcome Trade-off between High Resolution and High Sensitivity in EUV Lithography |