JP2018525789A5 - - Google Patents
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- Publication number
- JP2018525789A5 JP2018525789A5 JP2018507554A JP2018507554A JP2018525789A5 JP 2018525789 A5 JP2018525789 A5 JP 2018525789A5 JP 2018507554 A JP2018507554 A JP 2018507554A JP 2018507554 A JP2018507554 A JP 2018507554A JP 2018525789 A5 JP2018525789 A5 JP 2018525789A5
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- polymer thick
- copper conductor
- conductor composition
- film copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229920000642 polymer Polymers 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 8
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000003960 organic solvent Substances 0.000 claims description 7
- 239000003381 stabilizer Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 3
- 239000005642 Oleic acid Substances 0.000 description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562204581P | 2015-08-13 | 2015-08-13 | |
| US62/204,581 | 2015-08-13 | ||
| US14/862,254 | 2015-09-23 | ||
| US14/862,254 US9637647B2 (en) | 2015-08-13 | 2015-09-23 | Photonic sintering of a polymer thick film copper conductor composition |
| PCT/US2016/046116 WO2017027493A1 (en) | 2015-08-13 | 2016-08-09 | Photonic sintering of a polymer thick film copper conductor composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018525789A JP2018525789A (ja) | 2018-09-06 |
| JP2018525789A5 true JP2018525789A5 (https=) | 2019-07-25 |
| JP6737873B2 JP6737873B2 (ja) | 2020-08-12 |
Family
ID=56741183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018507554A Expired - Fee Related JP6737873B2 (ja) | 2015-08-13 | 2016-08-09 | ポリマー厚膜銅導体組成物の光焼結 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9637647B2 (https=) |
| EP (1) | EP3335223B1 (https=) |
| JP (1) | JP6737873B2 (https=) |
| CN (1) | CN108140442B (https=) |
| WO (1) | WO2017027493A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5941588B2 (ja) * | 2014-09-01 | 2016-06-29 | Ｄｏｗａエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
| US10347388B2 (en) * | 2015-03-05 | 2019-07-09 | Namics Corporation | Conductive copper paste, conductive copper paste cured film, and semiconductor device |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0170063B1 (en) | 1984-07-31 | 1988-08-24 | Mitsubishi Petrochemical Co., Ltd. | Copper-type conductive coating composition |
| JPH064791B2 (ja) | 1985-09-30 | 1994-01-19 | タツタ電線株式会社 | 導電塗料 |
| DE3782522T2 (de) | 1986-03-31 | 1993-06-03 | Tatsuta Densen Kk | Leitfaehige kupferpastenzusammensetzung. |
| JPS62230869A (ja) | 1986-03-31 | 1987-10-09 | Tatsuta Electric Wire & Cable Co Ltd | 半田付可能な導電塗料 |
| JPS6420276A (en) | 1987-07-15 | 1989-01-24 | Mitsubishi Petrochemical Co | Copper-containing electroconductive coating composition |
| US5064469A (en) | 1989-10-03 | 1991-11-12 | Akzo N.V. | Preparation of oxidation resistant metal powder |
| JP2702796B2 (ja) * | 1990-02-23 | 1998-01-26 | 旭化成工業株式会社 | 銀合金導電性ペースト |
| JPH0412595A (ja) | 1990-05-02 | 1992-01-17 | Mitsubishi Petrochem Co Ltd | 導電性ペースト組成物 |
| JPH0565456A (ja) * | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
| US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
| US7348373B2 (en) * | 2004-01-09 | 2008-03-25 | E.I. Du Pont De Nemours And Company | Polyimide compositions having resistance to water sorption, and methods relating thereto |
| US7169330B2 (en) * | 2004-02-25 | 2007-01-30 | E. I. Du Pont De Nemours And Company | Composition of conductive paste |
| US7820097B2 (en) | 2004-11-24 | 2010-10-26 | Ncc Nano, Llc | Electrical, plating and catalytic uses of metal nanomaterial compositions |
| CN1835129B (zh) * | 2005-03-16 | 2010-04-28 | E.I.内穆尔杜邦公司 | 导电性浆状组合物 |
| US8945686B2 (en) | 2007-05-24 | 2015-02-03 | Ncc | Method for reducing thin films on low temperature substrates |
| EP2053615B1 (en) * | 2006-08-04 | 2013-10-16 | I.S.T. Corporation | Conductive paste, and conductive coating film and conductive film using the same |
| US8506849B2 (en) | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| US20110180137A1 (en) | 2010-01-25 | 2011-07-28 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
| EP2549488B1 (en) | 2010-03-18 | 2016-06-08 | Furukawa Electric Co., Ltd. | Electrically conductive paste, and electrically conductive connection member produced using the paste |
| US8419981B2 (en) | 2010-11-15 | 2013-04-16 | Cheil Industries, Inc. | Conductive paste composition and electrode prepared using the same |
| JP6028727B2 (ja) * | 2011-05-18 | 2016-11-16 | 戸田工業株式会社 | 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜 |
| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| EP2785792B1 (en) | 2011-12-02 | 2015-08-12 | E. I. du Pont de Nemours and Company | Conductive metal composition |
| JP5700864B2 (ja) * | 2013-05-15 | 2015-04-15 | 石原ケミカル株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
| US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
| JP2015032493A (ja) * | 2013-08-05 | 2015-02-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびそれを用いる導電膜の製造方法 |
-
2015
- 2015-09-23 US US14/862,254 patent/US9637647B2/en not_active Expired - Fee Related
-
2016
- 2016-08-09 WO PCT/US2016/046116 patent/WO2017027493A1/en not_active Ceased
- 2016-08-09 JP JP2018507554A patent/JP6737873B2/ja not_active Expired - Fee Related
- 2016-08-09 EP EP16754362.8A patent/EP3335223B1/en active Active
- 2016-08-09 CN CN201680058463.0A patent/CN108140442B/zh not_active Expired - Fee Related
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