JP2018517794A5 - - Google Patents

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Publication number
JP2018517794A5
JP2018517794A5 JP2017552482A JP2017552482A JP2018517794A5 JP 2018517794 A5 JP2018517794 A5 JP 2018517794A5 JP 2017552482 A JP2017552482 A JP 2017552482A JP 2017552482 A JP2017552482 A JP 2017552482A JP 2018517794 A5 JP2018517794 A5 JP 2018517794A5
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JP
Japan
Prior art keywords
ppm
reaction product
bath
amount
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017552482A
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English (en)
Japanese (ja)
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JP6572322B2 (ja
JP2018517794A (ja
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Application filed filed Critical
Priority claimed from PCT/CN2015/077683 external-priority patent/WO2016172852A1/en
Publication of JP2018517794A publication Critical patent/JP2018517794A/ja
Publication of JP2018517794A5 publication Critical patent/JP2018517794A5/ja
Application granted granted Critical
Publication of JP6572322B2 publication Critical patent/JP6572322B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017552482A 2015-04-28 2015-04-28 電気めっき浴用の添加剤としてのアミンモノマー及び飽和複素環部分を含有するポリマーの反応生成物 Expired - Fee Related JP6572322B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/077683 WO2016172852A1 (en) 2015-04-28 2015-04-28 Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018196130A Division JP6637570B2 (ja) 2018-10-17 2018-10-17 電気めっき浴用の添加剤としてのアミンモノマー及び飽和複素環部分を含有するポリマーの反応生成物

Publications (3)

Publication Number Publication Date
JP2018517794A JP2018517794A (ja) 2018-07-05
JP2018517794A5 true JP2018517794A5 (enExample) 2018-11-29
JP6572322B2 JP6572322B2 (ja) 2019-09-04

Family

ID=57199669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017552482A Expired - Fee Related JP6572322B2 (ja) 2015-04-28 2015-04-28 電気めっき浴用の添加剤としてのアミンモノマー及び飽和複素環部分を含有するポリマーの反応生成物

Country Status (7)

Country Link
US (2) US10604856B2 (enExample)
EP (1) EP3289003A4 (enExample)
JP (1) JP6572322B2 (enExample)
KR (1) KR101936107B1 (enExample)
CN (1) CN107531899A (enExample)
TW (1) TWI632175B (enExample)
WO (1) WO2016172852A1 (enExample)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846380A (en) * 1972-10-31 1974-11-05 M Teranishi Polyamino acid derivatives and compositions containing same
FR2403076A1 (fr) * 1977-09-14 1979-04-13 Oreal Nouvelles compositions cosmetiques a base d'amides de l'acide polyaspartique
FR2726963B1 (fr) 1994-11-15 1996-12-06 Europ Equip Menager Foyer de cuisson a induction
US5686066A (en) * 1995-10-05 1997-11-11 Mitsui Toatsu Chemicals, Inc. Polyaspartic acid Zwitterionic derivatives, preparation processes thereof, hair-treating compositions and cosmetic compositions
JP3590217B2 (ja) * 1995-10-05 2004-11-17 三井化学株式会社 ポリアスパラギン酸誘導体、その製造方法、毛髪処理剤組成物及び香粧品組成物
DE19631379A1 (de) * 1996-08-02 1998-02-05 Basf Ag Wasserlösliche oder wasserdispergierbare Polyasparaginsäure-Derivate, ihre Herstellung und ihre Verwendung
US7166688B1 (en) * 2000-07-08 2007-01-23 Lidochem, Inc. Chelation compositions
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US6800188B2 (en) 2001-05-09 2004-10-05 Ebara-Udylite Co., Ltd. Copper plating bath and plating method for substrate using the copper plating bath
JP2004537627A (ja) * 2001-08-03 2004-12-16 ザ プロクター アンド ギャンブル カンパニー 洗剤組成物に使用するためのポリアスパルテート誘導体
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
KR101134610B1 (ko) * 2004-08-18 2012-04-09 에바라 유지라이토 가부시키가이샤 동도금용 첨가제 및 이를 이용한 전자회로기판의 제조방법
US20060205919A1 (en) * 2005-03-09 2006-09-14 Graham Swift Derivatives of end capped polysuccinimides
EP1741804B1 (en) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method

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