JP6572322B2 - 電気めっき浴用の添加剤としてのアミンモノマー及び飽和複素環部分を含有するポリマーの反応生成物 - Google Patents
電気めっき浴用の添加剤としてのアミンモノマー及び飽和複素環部分を含有するポリマーの反応生成物 Download PDFInfo
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- JP6572322B2 JP6572322B2 JP2017552482A JP2017552482A JP6572322B2 JP 6572322 B2 JP6572322 B2 JP 6572322B2 JP 2017552482 A JP2017552482 A JP 2017552482A JP 2017552482 A JP2017552482 A JP 2017552482A JP 6572322 B2 JP6572322 B2 JP 6572322B2
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- branched
- linear
- copper
- alkyl
- nitrogen
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- Expired - Fee Related
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- 0 C*C(C(*)(C(N1*(C)C)=O)I)C1=O Chemical compound C*C(C(*)(C(N1*(C)C)=O)I)C1=O 0.000 description 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1092—Polysuccinimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
好ましい部分はまた、以下:
ポリサクシミド(2.4g、24.7ミリモル)及び20mLのジメチルホルムアミド(DMF)を、三つ口フラスコ丸底フラスコに添加した。5mLのDMF中のアミノプロピルイミダゾール(3.24g、25.9ミリモル)を、窒素雰囲気下で撹拌しながら0.5時間にわたって滴下して添加した。混合物を室温で12時間撹拌した。次いで、溶媒を蒸発させ、生成物を、アセトンを用いて洗浄して、DMFの残渣及びあらゆる未反応アミノプロピルイミダゾールを除去した。未精製生成物の分子量を、Mn=4594及びMw=9206になるように決定した。
上述の銅電気めっき工程を、各浴中で同一の反応生成物を使用して繰り返したが、量を変動させた。加えて、銅浴に添加された光沢剤の量は、以下の表に示されるように、1ppmまたは3ppmのいずれかであった。電気めっき状態は、実施例1及びめっきされた基板の種類と同一であった。結果は表3に示される。
三つ口丸底フラスコに、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を添加した。次いで、5mLのDMF中の式:
三つ口丸底フラスコに、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を添加した。5mLのDMF中の式:
三つ口丸底フラスコに、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を添加した。5mLのDMF中の式:
三つ口丸底フラスコに、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を添加した。5mLのDMF中の式:
三つ口丸底フラスコに、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を添加した。5mLのDMF中の式:
三つ口丸底フラスコに、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を三つ口フラスコに添加した。5mLのDMF中の式:
三つ口丸底に、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を添加した。5mLのDMF中の式:
三つ口丸底フラスコに、25ミリモルのポリサクシミド及び20mLのジメチルホルムアミド(DMF)を添加した。5mLのDMF中の式:
Claims (1)
- 下記式(XIII):
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2015/077683 WO2016172852A1 (en) | 2015-04-28 | 2015-04-28 | Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018196130A Division JP6637570B2 (ja) | 2018-10-17 | 2018-10-17 | 電気めっき浴用の添加剤としてのアミンモノマー及び飽和複素環部分を含有するポリマーの反応生成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018517794A JP2018517794A (ja) | 2018-07-05 |
JP2018517794A5 JP2018517794A5 (ja) | 2018-11-29 |
JP6572322B2 true JP6572322B2 (ja) | 2019-09-04 |
Family
ID=57199669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017552482A Expired - Fee Related JP6572322B2 (ja) | 2015-04-28 | 2015-04-28 | 電気めっき浴用の添加剤としてのアミンモノマー及び飽和複素環部分を含有するポリマーの反応生成物 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10604856B2 (ja) |
EP (1) | EP3289003A4 (ja) |
JP (1) | JP6572322B2 (ja) |
KR (1) | KR101936107B1 (ja) |
CN (1) | CN107531899A (ja) |
TW (1) | TWI632175B (ja) |
WO (1) | WO2016172852A1 (ja) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3846380A (en) | 1972-10-31 | 1974-11-05 | M Teranishi | Polyamino acid derivatives and compositions containing same |
FR2403076A1 (fr) * | 1977-09-14 | 1979-04-13 | Oreal | Nouvelles compositions cosmetiques a base d'amides de l'acide polyaspartique |
FR2726963B1 (fr) | 1994-11-15 | 1996-12-06 | Europ Equip Menager | Foyer de cuisson a induction |
DE69626589T2 (de) | 1995-10-05 | 2004-02-12 | Mitsui Chemicals, Inc. | Polymer, Verfahren zur Herstellung, Haarbehandlungszusammensetzungen und kosmetische Zusammensetzungen |
JP3590217B2 (ja) * | 1995-10-05 | 2004-11-17 | 三井化学株式会社 | ポリアスパラギン酸誘導体、その製造方法、毛髪処理剤組成物及び香粧品組成物 |
DE19631379A1 (de) * | 1996-08-02 | 1998-02-05 | Basf Ag | Wasserlösliche oder wasserdispergierbare Polyasparaginsäure-Derivate, ihre Herstellung und ihre Verwendung |
US7166688B1 (en) * | 2000-07-08 | 2007-01-23 | Lidochem, Inc. | Chelation compositions |
US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
US6800188B2 (en) | 2001-05-09 | 2004-10-05 | Ebara-Udylite Co., Ltd. | Copper plating bath and plating method for substrate using the copper plating bath |
CA2451368A1 (en) * | 2001-08-03 | 2003-02-20 | The Procter & Gamble Company | Polyaspartate derivatives for use in detergent compositions |
US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
KR101134610B1 (ko) * | 2004-08-18 | 2012-04-09 | 에바라 유지라이토 가부시키가이샤 | 동도금용 첨가제 및 이를 이용한 전자회로기판의 제조방법 |
US20060205919A1 (en) * | 2005-03-09 | 2006-09-14 | Graham Swift | Derivatives of end capped polysuccinimides |
EP1741804B1 (en) | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Electrolytic copper plating method |
-
2015
- 2015-04-28 WO PCT/CN2015/077683 patent/WO2016172852A1/en active Application Filing
- 2015-04-28 KR KR1020177032803A patent/KR101936107B1/ko active IP Right Grant
- 2015-04-28 JP JP2017552482A patent/JP6572322B2/ja not_active Expired - Fee Related
- 2015-04-28 EP EP15890232.0A patent/EP3289003A4/en not_active Withdrawn
- 2015-04-28 CN CN201580078476.XA patent/CN107531899A/zh active Pending
- 2015-04-28 US US15/560,228 patent/US10604856B2/en not_active Expired - Fee Related
-
2016
- 2016-04-01 TW TW105110604A patent/TWI632175B/zh not_active IP Right Cessation
-
2020
- 2020-01-17 US US16/745,544 patent/US11732374B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3289003A1 (en) | 2018-03-07 |
KR20170137177A (ko) | 2017-12-12 |
TWI632175B (zh) | 2018-08-11 |
KR101936107B1 (ko) | 2019-01-08 |
EP3289003A4 (en) | 2018-11-21 |
US11732374B2 (en) | 2023-08-22 |
US20180135194A1 (en) | 2018-05-17 |
WO2016172852A1 (en) | 2016-11-03 |
JP2018517794A (ja) | 2018-07-05 |
TW201638148A (zh) | 2016-11-01 |
US20200149175A1 (en) | 2020-05-14 |
CN107531899A (zh) | 2018-01-02 |
US10604856B2 (en) | 2020-03-31 |
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