CN107531899A - 作为电镀浴添加剂的胺单体与含有饱和杂环部分的聚合物的反应产物 - Google Patents

作为电镀浴添加剂的胺单体与含有饱和杂环部分的聚合物的反应产物 Download PDF

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Publication number
CN107531899A
CN107531899A CN201580078476.XA CN201580078476A CN107531899A CN 107531899 A CN107531899 A CN 107531899A CN 201580078476 A CN201580078476 A CN 201580078476A CN 107531899 A CN107531899 A CN 107531899A
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CN
China
Prior art keywords
branched
straight
alkyl
chain
reaction product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580078476.XA
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English (en)
Chinese (zh)
Inventor
段铃丽
陈晨
孙彤
Z·I·尼亚齐姆贝托瓦
M·A·瑞兹尼克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
DuPont Electronic Materials International LLC
Original Assignee
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Dow Global Technologies LLC
Publication of CN107531899A publication Critical patent/CN107531899A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1092—Polysuccinimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201580078476.XA 2015-04-28 2015-04-28 作为电镀浴添加剂的胺单体与含有饱和杂环部分的聚合物的反应产物 Pending CN107531899A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/077683 WO2016172852A1 (en) 2015-04-28 2015-04-28 Reaction products of amine monomers and polymers containing saturated heterocyclic moieties as additives for electroplating baths

Publications (1)

Publication Number Publication Date
CN107531899A true CN107531899A (zh) 2018-01-02

Family

ID=57199669

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580078476.XA Pending CN107531899A (zh) 2015-04-28 2015-04-28 作为电镀浴添加剂的胺单体与含有饱和杂环部分的聚合物的反应产物

Country Status (7)

Country Link
US (2) US10604856B2 (enExample)
EP (1) EP3289003A4 (enExample)
JP (1) JP6572322B2 (enExample)
KR (1) KR101936107B1 (enExample)
CN (1) CN107531899A (enExample)
TW (1) TWI632175B (enExample)
WO (1) WO2016172852A1 (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846380A (en) * 1972-10-31 1974-11-05 M Teranishi Polyamino acid derivatives and compositions containing same
US5961965A (en) * 1996-08-02 1999-10-05 Basf Aktiengesellschaft Water-soluble or water-dispersible polyaspartic acid derivatives their preparation and their use
CN1108331C (zh) * 1995-10-05 2003-05-14 三井化学株式会社 聚合物及其制备方法,头发处理组合物和化妆品组合物
CN1997776A (zh) * 2004-08-18 2007-07-11 荏原优莱特科技股份有限公司 铜电镀用添加剂及采用该添加剂的电子电路基板的制法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2403076A1 (fr) * 1977-09-14 1979-04-13 Oreal Nouvelles compositions cosmetiques a base d'amides de l'acide polyaspartique
FR2726963B1 (fr) 1994-11-15 1996-12-06 Europ Equip Menager Foyer de cuisson a induction
JP3590217B2 (ja) * 1995-10-05 2004-11-17 三井化学株式会社 ポリアスパラギン酸誘導体、その製造方法、毛髪処理剤組成物及び香粧品組成物
US7166688B1 (en) * 2000-07-08 2007-01-23 Lidochem, Inc. Chelation compositions
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
TWI228156B (en) 2001-05-09 2005-02-21 Ebara Udylite Kk Copper-plating bath, method for electroplating substrate by using the same, and additives for the bath
CA2451368A1 (en) * 2001-08-03 2003-02-20 The Procter & Gamble Company Polyaspartate derivatives for use in detergent compositions
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20060205919A1 (en) * 2005-03-09 2006-09-14 Graham Swift Derivatives of end capped polysuccinimides
EP1741804B1 (en) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846380A (en) * 1972-10-31 1974-11-05 M Teranishi Polyamino acid derivatives and compositions containing same
CN1108331C (zh) * 1995-10-05 2003-05-14 三井化学株式会社 聚合物及其制备方法,头发处理组合物和化妆品组合物
US5961965A (en) * 1996-08-02 1999-10-05 Basf Aktiengesellschaft Water-soluble or water-dispersible polyaspartic acid derivatives their preparation and their use
CN1997776A (zh) * 2004-08-18 2007-07-11 荏原优莱特科技股份有限公司 铜电镀用添加剂及采用该添加剂的电子电路基板的制法

Also Published As

Publication number Publication date
KR20170137177A (ko) 2017-12-12
US20200149175A1 (en) 2020-05-14
US20180135194A1 (en) 2018-05-17
JP6572322B2 (ja) 2019-09-04
JP2018517794A (ja) 2018-07-05
EP3289003A1 (en) 2018-03-07
TWI632175B (zh) 2018-08-11
KR101936107B1 (ko) 2019-01-08
WO2016172852A1 (en) 2016-11-03
EP3289003A4 (en) 2018-11-21
TW201638148A (zh) 2016-11-01
US10604856B2 (en) 2020-03-31
US11732374B2 (en) 2023-08-22

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