JP2018505561A5 - - Google Patents

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Publication number
JP2018505561A5
JP2018505561A5 JP2017541608A JP2017541608A JP2018505561A5 JP 2018505561 A5 JP2018505561 A5 JP 2018505561A5 JP 2017541608 A JP2017541608 A JP 2017541608A JP 2017541608 A JP2017541608 A JP 2017541608A JP 2018505561 A5 JP2018505561 A5 JP 2018505561A5
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JP
Japan
Prior art keywords
elongated features
radially aligned
outer edge
processing chamber
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017541608A
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English (en)
Japanese (ja)
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JP2018505561A (ja
JP6711838B2 (ja
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Publication date
Priority claimed from US14/616,647 external-priority patent/US20160230269A1/en
Application filed filed Critical
Publication of JP2018505561A publication Critical patent/JP2018505561A/ja
Publication of JP2018505561A5 publication Critical patent/JP2018505561A5/ja
Application granted granted Critical
Publication of JP6711838B2 publication Critical patent/JP6711838B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017541608A 2015-02-06 2016-01-06 静電チャック表面の半径方向外側パッド設計 Active JP6711838B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/616,647 US20160230269A1 (en) 2015-02-06 2015-02-06 Radially outward pad design for electrostatic chuck surface
US14/616,647 2015-02-06
PCT/US2016/012362 WO2016126360A1 (en) 2015-02-06 2016-01-06 Radially outward pad design for electrostatic chuck surface

Publications (3)

Publication Number Publication Date
JP2018505561A JP2018505561A (ja) 2018-02-22
JP2018505561A5 true JP2018505561A5 (https=) 2019-02-14
JP6711838B2 JP6711838B2 (ja) 2020-06-17

Family

ID=56564492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017541608A Active JP6711838B2 (ja) 2015-02-06 2016-01-06 静電チャック表面の半径方向外側パッド設計

Country Status (7)

Country Link
US (1) US20160230269A1 (https=)
EP (1) EP3254307B1 (https=)
JP (1) JP6711838B2 (https=)
KR (1) KR102619126B1 (https=)
CN (2) CN107208261A (https=)
TW (1) TWI685916B (https=)
WO (1) WO2016126360A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9646843B2 (en) * 2014-12-08 2017-05-09 Applied Materials, Inc. Tunable magnetic field to improve uniformity
KR102669903B1 (ko) * 2016-08-30 2024-05-28 주성엔지니어링(주) 기판 처리 장치
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
KR102359591B1 (ko) * 2017-06-16 2022-02-08 주성엔지니어링(주) 진공용 회전 전기 커넥터
JP7208168B2 (ja) * 2017-06-16 2023-01-18 チュソン エンジニアリング カンパニー,リミテッド 基板処理装置及び真空回転電気コネクタ
CN108538776B (zh) * 2018-03-29 2021-11-16 北京北方华创微电子装备有限公司 静电卡盘及其制造方法
KR102862930B1 (ko) 2018-06-22 2025-09-19 어플라이드 머티어리얼스, 인코포레이티드 반도체 웨이퍼 프로세싱에서 웨이퍼 후면 손상을 최소화하는 방법들
JP7134826B2 (ja) * 2018-10-11 2022-09-12 東京エレクトロン株式会社 静電チャックの生産方法
CN110158029B (zh) * 2019-07-05 2020-07-17 北京北方华创微电子装备有限公司 掩膜结构和fcva设备
WO2022265882A1 (en) * 2021-06-14 2022-12-22 Lam Research Corporation Frontside and backside pressure monitoring for substrate movement prevention
CN117836899A (zh) * 2021-08-13 2024-04-05 阳光技术有限责任公司 用于如离子和同位素生产等高真空应用的磁旋转装置
KR20240090158A (ko) 2021-10-01 2024-06-21 샤인 테크놀로지스 엘엘씨 이온 수집을 위한 섬유질 격자를 갖는 이온 생성 시스템
JP2023176711A (ja) * 2022-05-31 2023-12-13 日本特殊陶業株式会社 基板保持部材
EP4599483A1 (en) * 2022-10-03 2025-08-13 Elevated Materials Germany GmbH Web coating method and vented cooling drum with integral electrostatic clamping
US12600682B2 (en) 2022-11-11 2026-04-14 Applied Materials, Inc. Monolithic substrate support having porous features and methods of forming the same

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US5646814A (en) * 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5825607A (en) * 1996-05-08 1998-10-20 Applied Materials, Inc. Insulated wafer spacing mask for a substrate support chuck and method of fabricating same
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP3859937B2 (ja) * 2000-06-02 2006-12-20 住友大阪セメント株式会社 静電チャック
US7161121B1 (en) * 2001-04-30 2007-01-09 Lam Research Corporation Electrostatic chuck having radial temperature control capability
KR100422444B1 (ko) * 2001-05-29 2004-03-12 삼성전자주식회사 정전 척에 설치되는 웨이퍼 공간 지지장치 및 그 제조방법
US6946403B2 (en) * 2003-10-28 2005-09-20 Axcelis Technologies, Inc. Method of making a MEMS electrostatic chuck
KR100666039B1 (ko) * 2003-12-05 2007-01-10 동경 엘렉트론 주식회사 정전척
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
JP5069452B2 (ja) * 2006-04-27 2012-11-07 アプライド マテリアルズ インコーポレイテッド 二重温度帯を有する静電チャックをもつ基板支持体
US8422193B2 (en) * 2006-12-19 2013-04-16 Axcelis Technologies, Inc. Annulus clamping and backside gas cooled electrostatic chuck
US7576018B2 (en) * 2007-03-12 2009-08-18 Tokyo Electron Limited Method for flexing a substrate during processing
JP2010521820A (ja) * 2007-03-12 2010-06-24 東京エレクトロン株式会社 基板内での処理の均一性を改善するための動的な温度背面ガス制御
US7667944B2 (en) * 2007-06-29 2010-02-23 Praxair Technology, Inc. Polyceramic e-chuck
TWI475594B (zh) * 2008-05-19 2015-03-01 恩特格林斯公司 靜電夾頭
KR101582785B1 (ko) * 2008-08-12 2016-01-07 어플라이드 머티어리얼스, 인코포레이티드 정전 척 조립체
US8861170B2 (en) * 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
NL2009189A (en) * 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
JP6396408B2 (ja) * 2013-03-15 2018-09-26 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 静電チャックの修理および改修のための方法および装置

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