JP2018505561A5 - - Google Patents

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Publication number
JP2018505561A5
JP2018505561A5 JP2017541608A JP2017541608A JP2018505561A5 JP 2018505561 A5 JP2018505561 A5 JP 2018505561A5 JP 2017541608 A JP2017541608 A JP 2017541608A JP 2017541608 A JP2017541608 A JP 2017541608A JP 2018505561 A5 JP2018505561 A5 JP 2018505561A5
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JP
Japan
Prior art keywords
elongated features
radially aligned
outer edge
processing chamber
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017541608A
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English (en)
Japanese (ja)
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JP6711838B2 (ja
JP2018505561A (ja
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Publication date
Priority claimed from US14/616,647 external-priority patent/US20160230269A1/en
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Publication of JP2018505561A publication Critical patent/JP2018505561A/ja
Publication of JP2018505561A5 publication Critical patent/JP2018505561A5/ja
Application granted granted Critical
Publication of JP6711838B2 publication Critical patent/JP6711838B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017541608A 2015-02-06 2016-01-06 静電チャック表面の半径方向外側パッド設計 Active JP6711838B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/616,647 2015-02-06
US14/616,647 US20160230269A1 (en) 2015-02-06 2015-02-06 Radially outward pad design for electrostatic chuck surface
PCT/US2016/012362 WO2016126360A1 (en) 2015-02-06 2016-01-06 Radially outward pad design for electrostatic chuck surface

Publications (3)

Publication Number Publication Date
JP2018505561A JP2018505561A (ja) 2018-02-22
JP2018505561A5 true JP2018505561A5 (https=) 2019-02-14
JP6711838B2 JP6711838B2 (ja) 2020-06-17

Family

ID=56564492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017541608A Active JP6711838B2 (ja) 2015-02-06 2016-01-06 静電チャック表面の半径方向外側パッド設計

Country Status (7)

Country Link
US (1) US20160230269A1 (https=)
EP (1) EP3254307B1 (https=)
JP (1) JP6711838B2 (https=)
KR (1) KR102619126B1 (https=)
CN (2) CN114686834A (https=)
TW (1) TWI685916B (https=)
WO (1) WO2016126360A1 (https=)

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Publication number Priority date Publication date Assignee Title
US9646843B2 (en) * 2014-12-08 2017-05-09 Applied Materials, Inc. Tunable magnetic field to improve uniformity
KR102669903B1 (ko) * 2016-08-30 2024-05-28 주성엔지니어링(주) 기판 처리 장치
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
KR102359591B1 (ko) * 2017-06-16 2022-02-08 주성엔지니어링(주) 진공용 회전 전기 커넥터
JP7208168B2 (ja) * 2017-06-16 2023-01-18 チュソン エンジニアリング カンパニー,リミテッド 基板処理装置及び真空回転電気コネクタ
CN108538776B (zh) * 2018-03-29 2021-11-16 北京北方华创微电子装备有限公司 静电卡盘及其制造方法
WO2019245727A1 (en) 2018-06-22 2019-12-26 Applied Materials, Inc. Methods of minimizing wafer backside damage in semiconductor wafer processing
JP7134826B2 (ja) * 2018-10-11 2022-09-12 東京エレクトロン株式会社 静電チャックの生産方法
CN110158029B (zh) * 2019-07-05 2020-07-17 北京北方华创微电子装备有限公司 掩膜结构和fcva设备
KR20240021679A (ko) * 2021-06-14 2024-02-19 램 리써치 코포레이션 기판 운동 방지를 위한 전면 및 후면 압력 모니터링
CN117836899A (zh) * 2021-08-13 2024-04-05 阳光技术有限责任公司 用于如离子和同位素生产等高真空应用的磁旋转装置
KR20240090158A (ko) 2021-10-01 2024-06-21 샤인 테크놀로지스 엘엘씨 이온 수집을 위한 섬유질 격자를 갖는 이온 생성 시스템
JP2023176711A (ja) * 2022-05-31 2023-12-13 日本特殊陶業株式会社 基板保持部材
JP2025539558A (ja) * 2022-10-03 2025-12-05 エレベイテッド マテリアルズ ジャーマニー ゲーエムベーハー ウェブコーティング方法および一体型静電クランプを備えた換気冷却ドラム
US12600682B2 (en) 2022-11-11 2026-04-14 Applied Materials, Inc. Monolithic substrate support having porous features and methods of forming the same

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US5646814A (en) * 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5825607A (en) * 1996-05-08 1998-10-20 Applied Materials, Inc. Insulated wafer spacing mask for a substrate support chuck and method of fabricating same
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP3859937B2 (ja) * 2000-06-02 2006-12-20 住友大阪セメント株式会社 静電チャック
US7161121B1 (en) * 2001-04-30 2007-01-09 Lam Research Corporation Electrostatic chuck having radial temperature control capability
KR100422444B1 (ko) * 2001-05-29 2004-03-12 삼성전자주식회사 정전 척에 설치되는 웨이퍼 공간 지지장치 및 그 제조방법
US6946403B2 (en) * 2003-10-28 2005-09-20 Axcelis Technologies, Inc. Method of making a MEMS electrostatic chuck
KR100666039B1 (ko) * 2003-12-05 2007-01-10 동경 엘렉트론 주식회사 정전척
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
JP5069452B2 (ja) * 2006-04-27 2012-11-07 アプライド マテリアルズ インコーポレイテッド 二重温度帯を有する静電チャックをもつ基板支持体
US8422193B2 (en) * 2006-12-19 2013-04-16 Axcelis Technologies, Inc. Annulus clamping and backside gas cooled electrostatic chuck
US7576018B2 (en) * 2007-03-12 2009-08-18 Tokyo Electron Limited Method for flexing a substrate during processing
WO2008112673A2 (en) * 2007-03-12 2008-09-18 Tokyo Electron Limited Dynamic temperature backside gas control for improved within-substrate processing uniformity
US7667944B2 (en) * 2007-06-29 2010-02-23 Praxair Technology, Inc. Polyceramic e-chuck
TWI475594B (zh) * 2008-05-19 2015-03-01 恩特格林斯公司 靜電夾頭
WO2010019430A2 (en) * 2008-08-12 2010-02-18 Applied Materials, Inc. Electrostatic chuck assembly
US8861170B2 (en) * 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
NL2009189A (en) * 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
US9349630B2 (en) * 2013-03-15 2016-05-24 Applied Materials, Inc. Methods and apparatus for electrostatic chuck repair and refurbishment

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