JP2018206995A - Cutting method for package substrate - Google Patents

Abstract

To provide a cutting method for a package substrate, by which variations in the depth of a groove formed in the package substrate along a dividing line can be restricted.SOLUTION: A cutting method for a package substrate comprises: a holding step ST1 in which a package substrate is held by a chuck table; a first measurement step ST2 in which the height of an upper surface of the package substrate is measured along a first dividing line; a first groove formation step ST3 in which a cut groove is formed along the dividing line on the basis of the height measured in the first measurement step ST2; a second measurement step ST4 in which the height of an uncut upper surface, along the dividing line, of the package substrate warp of which has been mitigated in the first groove formation step ST3 is measured; a second groove formation step ST5 in which a cut groove is formed along the dividing line on the basis of the height measured in the second measurement step ST4; and a dividing step ST7 in which the package substrate is divided into individual package chips.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a method for cutting a package substrate.

  A semiconductor device mounted on various electronic devices is covered with a mold resin to form a package device chip. The package device chip is manufactured by mounting a device chip on a resin or metal frame, further covering the device chip with a mold resin to form a package substrate, and dividing the package substrate along a division line.

  Since the mold resin is a thermoplastic resin, the package substrate shrinks and changes its shape when the mold resin is cured by cooling. For this reason, since it becomes difficult to hold the package substrate in a warped state when it is divided into package device chips, the processing method such as dividing the package substrate into large regions and then dividing into individual package device chips is improved. (For example, refer to Patent Document 1 and Patent Document 2).

JP-A-5-335411 JP 2013-254867 A

  When a package substrate with warpage is divided, it can be divided if it can be held by a table, but when a groove with a predetermined depth is formed with a cutting blade, the warpage is gradually released and flattened as the groove is formed. Therefore, it is necessary to adjust the depth of the groove according to the relief of warpage.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a cutting method of a package substrate that can suppress variations in the depth of grooves formed in a division planned line of the package substrate. For the purpose.

  In order to solve the above-described problems and achieve the object, a cutting method for a package substrate of the present invention includes a first division planned line extending in a first direction and a second division extending in a second direction. A package substrate cutting method for forming a groove having a predetermined depth along a predetermined division line on a package substrate on which device chips are mounted in a plurality of regions partitioned by a predetermined line. A holding step for holding the holding surface of the table; a first measuring step for measuring at least one line of the height of the upper surface of the package substrate held by the chuck table along the first division line; and Based on the height measured in the measurement step, a cutting blade positioned at a height at which the groove having the predetermined depth is formed, and the division-scheduled line whose height was measured in the first measurement step is measured. A first groove forming step for forming the groove in the package substrate along the line, and measuring the height of the upper surface of the undivided line to be cut of the package substrate in which the warp is relaxed by the first groove forming step A second measuring step and the cutting blade positioned at a height to form a groove of the predetermined depth based on the height measured in the second measuring step, and the height in the second measuring step. A second groove forming step for forming the groove in the package substrate along the division line measured, and cutting the center of the groove with a cutting blade having a thickness smaller than the width of the groove. A dividing step of dividing the package chip into individual package chips.

  In the package substrate cutting method, in the first measurement step and the second measurement step, the height of the package substrate may be measured along the planned division line using a laser displacement meter.

  In the cutting method of the package substrate, the package substrate includes a metal frame including electrodes of a predetermined thickness protruding from the division planned line toward the device chip in each region on which the device chip is mounted, and the metal frame A resin sealing portion that seals the device chip mounted on the surface, and a cut surface of the electrode is formed in a stepped shape by the groove and the dividing groove formed in the dividing step, and is applied to the electrode The contact area of the adhesive may be increased.

  The cutting method of the package substrate of the present invention has an effect that it is possible to suppress the variation in the depth of the groove formed in the division line of the package substrate.

FIG. 1 is a plan view of a package substrate to be processed by the package substrate cutting method according to the first embodiment. FIG. 2 is a rear view of the package substrate shown in FIG. FIG. 3 is a side view of the package substrate shown in FIG. FIG. 4 is another side view of the package substrate shown in FIG. FIG. 5 is a plan view showing a state where the package substrate shown in FIG. 1 is supported by an annular frame. FIG. 6 is a perspective view showing a package chip obtained by dividing the package substrate shown in FIG. FIG. 7 is a perspective view illustrating an example of a configuration example of a cutting apparatus used in the cutting method of the package substrate according to the first embodiment. FIG. 8 is a flowchart illustrating the package substrate cutting method according to the first embodiment. FIG. 9 is a side view showing in cross section a part of the first measurement step of the cutting method of the package substrate shown in FIG. FIG. 10 is a plan view showing a first measurement step of the package substrate cutting method shown in FIG. FIG. 11 is a side view showing in cross section a part of the first groove forming step of the package substrate cutting method shown in FIG. 12 is a plan view showing a first groove forming step of the package substrate cutting method shown in FIG. FIG. 13 is a side view showing a part of a second measurement step of the cutting method of the package substrate shown in FIG. 8 in cross section. FIG. 14 is a plan view showing a second measurement step of the cutting method of the package substrate shown in FIG. FIG. 15 is a side view showing, in section, a part of the second groove forming step of the package substrate cutting method shown in FIG. FIG. 16 is a plan view showing a second groove forming step of the package substrate cutting method shown in FIG. FIG. 17 is a side view showing a dividing step of the cutting method of the package substrate shown in FIG. FIG. 18 is a flowchart illustrating a package substrate cutting method according to the second embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A package substrate cutting method according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a package substrate to be processed by the package substrate cutting method according to the first embodiment. FIG. 2 is a rear view of the package substrate shown in FIG. FIG. 3 is a side view of the package substrate shown in FIG. FIG. 4 is another side view of the package substrate shown in FIG. FIG. 5 is a plan view showing a state where the package substrate shown in FIG. 1 is supported by an annular frame. FIG. 6 is a perspective view showing a package chip obtained by dividing the package substrate shown in FIG.

  The cutting method of the package substrate according to the first embodiment is a processing method of the package substrate 200 shown in FIGS. 1, 2, 3, 4 and 5, and the package substrate 200 is individually packaged as shown in FIG. It is also a method of dividing into 300.

  As shown in FIG. 1, a package substrate 200 to be processed by the package substrate cutting method according to the first embodiment includes a plurality of first division planned lines 201 extending in a first direction and a first direction. On the other hand, a device chip 204 indicated by a dotted line in FIGS. 1, 3 and 4 is mounted in a plurality of regions 203 partitioned by a second division planned line 202 extending in a second direction orthogonal to the second direction. In addition, the package substrate 200 includes a metal frame 210 and a resin sealing portion 220 as shown in FIGS.

  The metal frame 210 is made of metal and is a flat plate having a rectangular planar shape. The metal frame 210 is provided with a device region 211 and a non-device region 212 surrounding the device region 211. In the first embodiment, three device areas 211 are provided, but the number of device areas 211 is not limited to three. The device region 211 includes a plurality of first division planned lines 201, a plurality of second division planned lines 202, and a region 203 on which the device chip 204 is mounted. In addition, the metal frame 210 includes an electrode 213 having a predetermined thickness protruding from the division lines 201 and 202 toward the device chip 204 in each region 203 on which the device chip 204 is mounted. In other words, the electrode 213 is disposed on each of the scheduled division lines 201 and 202.

  The resin sealing portion 220 is made of a thermoplastic resin and seals the device chip 204 mounted on the surface 214 of the metal frame 210. As shown in FIGS. 2, 3, and 4, the resin sealing portion 220 seals (covers) the entire device region 211 including the device chip 204 on the surface 214 side of the metal frame 210 on which the device chip 204 is mounted. )doing. In addition, the resin sealing portion 220 has a state in which the region 203 on which the device chip 204 is mounted and the electrode 213 are exposed on the back surface 215 side of the back surface 214 of the metal frame 210 as shown in FIG. The division lines 201 and 202 are sealed.

  The package substrate 200 has the dicing tape 230 attached to the front surface 214 side, and the outer edge of the dicing tape 230 is attached to the annular frame 240, so that the annular frame is exposed with the back surface 215 exposed as shown in FIG. The dicing tape 230 supports the 240 openings. As shown in FIG. 3 and FIG. 4, the package substrate 200 has the metal frame 210 and the resin sealing portion 220 as viewed from the side due to the difference in thermal shrinkage between the metal frame 210 and the resin sealing portion 220. It is curved.

  In the package substrate 200, the center of the cutting groove 400 is cut after the cutting groove 400 having a predetermined depth indicated by the dotted line in FIG. 6 is divided into package chips 300 shown in FIG. In the package chip 300 shown in FIG. 6, the region 203 on which the device chip 204 is mounted is disposed at the center, and the electrode 213 is disposed at the outer edge. Further, the package chip 300 is provided with a stepped portion 223 having a constant distance 222 from the surface 221 of the resin sealing portion 220 over its entire length at the outer edge, and the outer surface including the cut surface of the electrode 213 is stepped. Forming. The package chip 300 is provided with a stepped portion 223, and the contact surface of the adhesive is increased by forming the cut surface of the electrode 213 in a step shape. The distance 222 corresponds to a predetermined depth.

  Next, a cutting apparatus used in the package substrate cutting method according to the first embodiment will be described. FIG. 7 is a perspective view illustrating an example of a configuration example of a cutting apparatus used in the cutting method of the package substrate according to the first embodiment.

  The cutting apparatus 1 is an apparatus that cuts the cutting blade 22 into the respective division planned lines 201 and 202 of the package substrate 200 and forms the cutting grooves 400 in the respective division planned lines 201 and 202. In the first embodiment, the depth of the cutting groove 400 formed by the cutting device 1 is constant over the entire length of the cutting groove 400.

  As shown in FIG. 7, the cutting apparatus 1 includes a chuck table 10 that sucks and holds the package substrate 200 with the holding surface 11, a cutting unit 20 that forms a cutting groove 400 in the package substrate 200 held on the chuck table 10, An X-axis moving unit (not shown) that is a machining feed unit, a Y-axis moving unit 40 that is an indexing feed unit, a Z-axis moving unit 50 that is a cutting feed unit, and a control unit 100 are provided.

  The chuck table 10 holds the package substrate 200 by placing the package substrate 200 before processing on the holding surface 11. The chuck table 10 has a disk shape in which a portion constituting the holding surface 11 is formed of porous ceramic or the like, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown) and placed on the holding surface 11. The package substrate 200 is held by suction. Around the chuck table 10, a plurality of clamp portions 12 that sandwich the annular frame 240 around the package substrate 200 are arranged. Further, the chuck table 10 is movable by an X-axis moving unit, and is rotated about an axis parallel to the Z-axis direction which is a vertical direction by a rotation driving source (not shown). The rotational drive source is moved in the X-axis direction parallel to the horizontal direction by the X-axis moving unit.

  The X-axis moving unit moves the chuck table 10 in the X-axis direction, which is the machining feed direction parallel to the holding surface 11, thereby moving the chuck table 10 and the cutting unit 20 relatively along the X-axis direction. To do. The Y-axis moving unit 40 moves the cutting unit 20 in the Y-axis direction, which is an indexing feed direction that is parallel to the holding surface 11 and orthogonal to the X-axis direction, so that the chuck table 10 and the cutting unit 20 are relatively moved. Indexing and feeding are performed along the Y-axis direction. The Z-axis moving unit 50 moves the cutting unit 20 in the Z-axis direction that is a cutting feed direction orthogonal to the holding surface 11, thereby cutting the chuck table 10 and the cutting unit 20 relatively along the Z-axis direction. To send.

  The X-axis moving unit, the Y-axis moving unit 40, and the Z-axis moving unit 50 are known ball screws 41 and 51 that are provided so as to be rotatable around the axis, and a known ball screw that rotates the ball screws 41 and 51 around the axis. And the known guide rails 43 and 53 for supporting the chuck table 10 or the cutting unit 20 movably in the X-axis direction, the Y-axis direction, or the Z-axis direction.

  The cutting unit 20 accommodates a spindle motor (not shown) that rotates around an axis parallel to the Y-axis direction, and accommodates the spindle motor in the Y-axis direction and the Z-axis direction by the Y-axis moving unit 40 and the Z-axis moving unit 50. A spindle housing 21 to be moved and a cutting blade 22 attached to the spindle motor are provided. The cutting blade 22 is a cutting grindstone formed in an extremely thin ring shape, and is held by the chuck table 10 by being rotated by a spindle motor around an axis parallel to the Y-axis direction while supplying cutting water. The package substrate 200 is cut.

  Further, as shown in FIG. 7, the cutting apparatus 1 includes an imaging unit 60 and a measurement unit 70 attached to the spindle housing 21 of the cutting unit 20. Since the imaging unit 60 and the measurement unit 70 are attached to the spindle housing 21, they are moved in the Y-axis direction and the Z-axis direction integrally with the cutting unit 20 by the Y-axis movement unit 40 and the Z-axis movement unit 50.

  The image pickup unit 60 picks up an image of the package substrate 200 held on the chuck table 10 and is arranged at a position parallel to the cutting unit 20 in the X-axis direction. The imaging unit 60 is configured by a CCD camera that images the package substrate 200 held on the chuck table 10. The imaging unit 60 outputs an image obtained by imaging to the control unit 100.

  The measurement unit 70 measures the height of the upper surface of the package substrate 200 held on the chuck table 10 and is disposed at a position parallel to the cutting unit 20 and the imaging unit 60 in the X-axis direction. In the first embodiment, the measurement unit 70 is a laser displacement meter that measures the distance to the upper surface of the package substrate 200 by irradiating the upper surface of the package substrate 200 with a laser beam, but is not limited to the laser displacement meter. The measurement unit 70 is positioned at a preset position in the Z-axis direction, and measures the distance to the upper surface of the package substrate 200, whereby the height of the upper surface of the package substrate 200 from the holding surface 11 of the chuck table 10 is measured. Measure. The measurement unit 70 outputs the measurement result to the control unit 100.

  Further, the cutting apparatus 1 includes a cassette 80 that houses a plurality of package substrates 200 supported by the annular frame 240 and a transport unit (not shown) that transports the package substrate 200 between the cassette 80 and the chuck table 10.

  The control unit 100 controls each component described above of the cutting device 1 to cause the cutting device 1 to perform a processing operation on the package substrate 200. The control unit 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a read only memory (ROM) or a random access memory (RAM), and an input / output interface device. And a computer capable of executing a computer program. The arithmetic processing unit of the control unit 100 generates a control signal for controlling the cutting device 1 by executing a computer program stored in the ROM on the RAM. The arithmetic processing unit of the control unit 100 outputs the generated control signal to each component of the cutting device 1 via the input / output interface device. In addition, the control unit 100 is connected to a display unit (not shown) configured by a liquid crystal display device or the like that displays a processing operation state or an image, or an input unit used when an operator registers processing content information. . The input unit includes at least one of a touch panel provided on the display unit, a keyboard, and the like.

  Next, a method for cutting the package substrate according to the first embodiment will be described. FIG. 8 is a flowchart illustrating the package substrate cutting method according to the first embodiment. FIG. 9 is a side view showing in cross section a part of the first measurement step of the cutting method of the package substrate shown in FIG. FIG. 10 is a plan view showing a first measurement step of the package substrate cutting method shown in FIG. FIG. 11 is a side view showing in cross section a part of the first groove forming step of the package substrate cutting method shown in FIG. 12 is a plan view showing a first groove forming step of the package substrate cutting method shown in FIG. FIG. 13 is a side view showing a part of a second measurement step of the cutting method of the package substrate shown in FIG. 8 in cross section. FIG. 14 is a plan view showing a second measurement step of the cutting method of the package substrate shown in FIG. FIG. 15 is a side view showing, in section, a part of the second groove forming step of the package substrate cutting method shown in FIG. FIG. 16 is a plan view showing a second groove forming step of the package substrate cutting method shown in FIG. FIG. 17 is a side view showing a dividing step of the cutting method of the package substrate shown in FIG.

  The package substrate cutting method according to the first embodiment (hereinafter simply referred to as a cutting method) is a method of forming a cutting groove 400 having a predetermined depth along the planned dividing lines 201 and 202 on the package substrate 200. In this method, the package substrate 200 is divided into package chips 300. As shown in FIG. 8, the cutting method includes a holding step ST1, a first measuring step ST2, a first groove forming step ST3, a second measuring step ST4, a second groove forming step ST5, and a dividing step ST7. Is provided. The holding step ST1, the first measuring step ST2, the first groove forming step ST3, the second measuring step ST4, and the second groove forming step ST5 are performed using the cutting apparatus 1 shown in FIG. 1 measurement step ST2, 1st groove | channel formation step ST3, 2nd measurement step ST4, and 2nd groove | channel formation step ST5 are implemented.

(Holding step)
The holding step ST <b> 1 is a step of holding the package substrate 200 on the holding surface 11 of the chuck table 10. In the holding step ST1, the operator operates the input unit to register machining content information in the control unit 100, and the operator installs a cassette 80 containing a plurality of package substrates 200 supported by the annular frame 240 in the cutting apparatus 1. This operation is performed when there is an instruction to start a machining operation from the operator. In the holding step ST1, the control unit 100 causes the transport unit to take out one package substrate 200 from the cassette 80, place the taken package substrate 200 on the holding surface 11 via the dicing tape 230, and use the vacuum suction source. The package substrate 200 is sucked and held on the chuck table 10 by driving. The control unit 100 causes the clamp unit 12 to clamp the annular frame 240. The cutting method proceeds to the first measurement step ST2 after the holding step ST1.

(First measurement step)
The first measurement step ST <b> 2 is a step of measuring at least one line of the height of the upper surface of the package substrate 200 held on the chuck table 10 along the first scheduled division line 201. In the first measurement step ST2, the control unit 100 causes the image pickup unit 60 to pick up an image of the package substrate 200 held on the chuck table 10, performs alignment, and sets the first division planned line 201 in the X-axis direction by the rotational drive source. And parallel.

  In the first measurement step ST2, as shown by dotted lines in FIG. 9 and FIG. 10, the control unit 100 causes the Y-axis movement unit 40 to set one of the first planned divided lines 201 among the plurality of first divided planned lines 201. One end and the measurement unit 70 are opposed to each other. In the first measurement step ST2, the control unit 100 chucks the X-axis moving means so that the measurement unit 70 is directed to the other end of one first division planned line 201 as shown by a solid line in FIGS. While moving the table 10 in the direction of the arrow X1, the measurement unit 70 is made to measure the height of the upper surface of one first division planned line 201 for every predetermined distance set in advance. Thus, in the cutting method, in the first measurement step ST2, the height of the package substrate 200 is measured along the scheduled division lines 201 and 202 using the measurement unit 70 that is a laser displacement meter. The cutting method proceeds to the first groove forming step ST3 after the first measuring step ST2.

(First groove forming step)
The first groove forming step ST3 is a cutting blade 22 positioned at a height for forming the cutting groove 400 having a predetermined depth based on the height measured in the first measuring step ST2, and the first groove forming step ST3 is high in the first measuring step ST2. This is a step of forming the cutting groove 400 in the package substrate 200 along the planned division lines 201 and 202 for which the thickness is measured. In the first groove forming step ST3, the control unit 100 raises the cutting blade 22 by the Z-axis moving unit 50, and then the division planned line 201 whose height is measured by the X-axis moving unit in the immediately preceding first measurement step ST2. , 202 and the cutting blade 22 face each other.

  In the first groove forming step ST3, as shown by the dotted lines in FIGS. 11 and 12, the control unit 100 uses the Z-axis moving unit 50 to obtain the measurement result of the immediately preceding first measurement step ST2 while rotating the cutting blade 22. Based on this, the cutting blade 22 is lowered to a height at which the cutting groove 400 having a predetermined depth is formed. In the first groove forming step ST3, the control unit 100, as shown by the solid lines in FIGS. 11 and 12, the cutting blade 22 of the planned division lines 201 and 202 whose height is measured in the immediately preceding first measurement step ST2. The cutting blade 22 is cut into the package substrate 200 while the chuck table 10 is moved in the direction of the arrow X1 by the X-axis moving means toward the other end to form the cutting groove 400.

  In the first groove forming step ST3, the control unit 100 makes the depth of the cutting groove 400 constant at the predetermined depth described above based on the height measured in the immediately preceding first measurement step ST2. For example, the cutting unit 20 is moved in the Z-axis direction by the Z-axis moving unit 50, as indicated by a one-dot chain line in FIG. In the package substrate 200, the warpage is alleviated by forming the cutting grooves 400 in the planned dividing lines 201 and 202 whose heights were measured in the first measurement step ST2 immediately before in the first groove formation step ST3, and the upper surface of the package substrate 200 is reduced. The height changes. The cutting method proceeds to the second measurement step ST4 after the first groove forming step ST3.

(Second measurement step)
The second measurement step ST4 is a step of measuring the heights of the upper surfaces of the uncut division planned lines 201 and 202 of the package substrate 200 whose warpage has been relaxed by the first groove forming step ST3. In the first embodiment, the second measurement step ST4 is adjacent to the planned division lines 201 and 202 whose height is measured in the first measurement step ST2 immediately before the division planned lines 201 and 202 where the cutting groove 400 is not formed. The heights of the upper surfaces of the scheduled dividing lines 201 and 202 are measured.

  In the second measurement step ST4, as shown by the dotted lines in FIGS. 13 and 14, the control unit 100 causes the Y-axis movement unit 40 and the like to be divided lines 201, whose height is measured in the immediately preceding first measurement step ST2, One end of the division planned lines 201 and 202 adjacent to 202 is opposed to the measurement unit 70. In the second measurement step ST4, as shown in FIGS. 13 and 14, the control unit 100 moves the chuck table 10 to the X-axis moving means so that the measurement unit 70 moves toward the other end of the scheduled division lines 201 and 202. While moving in the X1 direction, the measurement unit 70 is caused to measure the heights of the upper surfaces of the division planned lines 201 and 202 at predetermined distances set in advance. Thus, in the second measuring step ST4, the cutting method measures the height of the package substrate 200 along the scheduled division lines 201 and 202 using the measuring unit 70 that is a laser displacement meter. The cutting method proceeds to the second groove forming step ST5 after the second measuring step ST4.

(Second groove forming step)
The second groove forming step ST5 is a cutting blade 22 positioned at a height for forming a cutting groove 400 having a predetermined depth based on the height measured in the second measuring step ST4. This is a step of forming the cutting groove 400 in the package substrate 200 along the planned division lines 201 and 202 for which the thickness is measured. In the second groove forming step ST5, the control unit 100 raises the cutting blade 22 by the Z-axis moving unit 50, and then the division planned line 201 whose height is measured by the X-axis moving unit in the immediately preceding second measuring step ST4. , 202 and the cutting blade 22 face each other.

  In the second groove forming step ST5, as shown by the dotted lines in FIGS. 15 and 16, the control unit 100 uses the Z-axis moving unit 50 to obtain the measurement result of the immediately preceding second measurement step ST4 while rotating the cutting blade 22. Based on this, the cutting blade 22 is lowered to a height at which the cutting groove 400 having a predetermined depth is formed. In the second groove forming step ST5, the control unit 100, as shown by the solid lines in FIGS. 15 and 16, the cutting blade 22 of the planned dividing lines 201 and 202 whose height is measured in the immediately preceding second measuring step ST4. The cutting blade 22 is cut into the package substrate 200 while the chuck table 10 is moved in the direction of the arrow X1 by the X-axis moving means toward the other end to form the cutting groove 400.

  In the second groove forming step ST5, the control unit 100 makes the depth of the cutting groove 400 constant at the above-described predetermined depth based on the height measured in the immediately preceding second measurement step ST4. For example, the cutting unit 20 is moved in the Z-axis direction by the Z-axis moving unit 50 as shown by a one-dot chain line in FIG. The package substrate 200 is further reduced in warpage by forming the cutting grooves 400 in the planned dividing lines 201 and 202 whose heights were measured in the second measurement step ST4 immediately before in the second groove formation step ST5. The height of changes.

  In the cutting method, after the second groove forming step ST5, the control unit 100 determines whether or not the cutting grooves 400 have been formed on all the planned dividing lines 201 and 202 (step ST6). In the cutting method, when the control unit 100 determines that the cutting grooves 400 are not formed in all the division lines 201 and 202 (step ST6: No), the control unit 100 returns to the first measurement step ST2. Thus, in the cutting method, the first measurement step ST2, the first groove formation step ST3, the second measurement step ST4, and the second groove formation step ST5 are sequentially performed until the cutting grooves 400 are formed on all the division lines 201 and 202. Repeatedly, the height measurement using the measurement unit 70 and the formation of the cutting groove 400 using the cutting blade 22 are alternately performed.

  Further, the cutting method is such that when the first measurement step ST2, the first groove forming step ST3, the second measurement step ST4, and the second groove forming step ST5 are repeated in order, the end of the plurality of first division planned lines 201 is determined. The height measurement and the formation of the cutting groove 400 are sequentially performed from the first division planned line 201, and after the cutting grooves 400 are formed in all the first division planned lines 201, the chuck table 10 is moved 90 degrees by a rotational drive source. After the rotation, the height measurement and the formation of the cutting groove 400 are performed in order from the second scheduled division line 202 at the end of the plurality of second scheduled division lines 202. In the cutting method, when the control unit 100 determines that the cutting grooves 400 have been formed in all the planned division lines 201 and 202 (step ST6: Yes), the cutting grooves 400 are formed in all the planned division lines 201 and 202. The package substrate 200 is accommodated in the cassette 80, and the process proceeds to the division step ST7.

  In the first embodiment, the cutting method proceeds to the division step ST7 when the cutting grooves 400 are formed in all the planned dividing lines 201 and 202 of all the package substrates 200 in the cassette 80. The division step ST7 may be performed immediately on the package substrate 200 in which the cutting grooves 400 are formed in the division lines 201 and 202.

(Division step)
The division step ST7 is a step of dividing the package substrate 200 into individual package chips 300 by cutting the center of the cutting groove 400 with a cutting blade 90 having a thickness smaller than the width of the cutting groove 400. In the first embodiment, in the division step ST7, after the package substrate 200 is conveyed to a cutting device 91 different from the cutting device 1 shown in FIG. 7, and the package substrate 200 is sucked and held on the chuck table 92 as shown in FIG. The cutting blade 90 is cut into the center of the cutting groove 400 until the cutting edge cuts into the dicing tape 230. In the dividing step ST7, a dividing groove 500 is formed at the center in the width direction of the cutting groove 400, and the package substrate 200 is divided into individual package chips 300. The individually divided package chips 300 are picked up from the dicing tape 230 by a pickup device (not shown). Further, as shown in FIG. 6, the package chip 300 divided into individual parts has a stepped portion 223 formed on the outer surface by the cutting groove 400 and the dividing groove 500 formed in the dividing step ST7, and the cut surface of the electrode 213 is formed. It is formed in steps.

  In the first embodiment, in the dividing step ST7, a cutting device different from the cutting device 1 shown in FIG. 7 is used. However, in the present invention, the cutting blade 22 of the cutting device 1 is replaced with the cutting blade 90 and the cutting device is used. 1 may be used. In the present invention, a cutting device including both the cutting unit 20 including the cutting blade 22 and the cutting unit including the cutting blade 90 may be used.

  As described above, in the cutting method according to the first embodiment, the height is measured along the scheduled division lines 201 and 202, and the cutting amount of the cutting blade 22 is set according to the height. In order to cope with the height that the warp of the package substrate 200 relaxes and changes as the film is formed, after the first groove forming step ST3 is performed, the second measuring step ST4 is performed and then the second groove forming step ST5 is performed. carry out. For this reason, the cutting method can form the cutting groove 400 while moving the cutting blade 22 in the Z-axis direction based on the height on the upper surface of the package substrate 200 in which the warpage is mitigated by the formation of the cutting groove 400. . As a result, the cutting method can keep the depth of the cutting groove 400 constant over the entire length of the division lines 201 and 202, and the cutting groove 400 formed on the division lines 201 and 202 of the package substrate 200 can be maintained. Variation in depth can be suppressed.

  In addition, since the cutting method according to the first embodiment forms the cutting groove 400 after measuring the heights of the upper surfaces of all the division lines 201 and 202, the cutting method is applied to all the division lines 201 and 202. The depth can be kept constant over the entire length of the cut groove 400 to be formed, and variations in the depth of the cut groove 400 formed in the division lines 201 and 202 of the package substrate 200 can be suppressed.

  In addition, since the cutting method according to the first embodiment measures the height of the package substrate 200 using the measurement unit 70 that is a laser displacement meter, the height measurement error can be suppressed, and the depth of the cutting groove 400 can be reduced. Variations in thickness can be suppressed.

  Further, the cutting method according to the first embodiment forms the cut surface of the electrode 213 of the package chip 300 in a stepped manner, so that the exposed area of the electrode 213 can be increased, and the mounting of the package chip 300 is facilitated. Can be achieved.

[Embodiment 2]
A package substrate cutting method according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 18 is a flowchart illustrating a package substrate cutting method according to the second embodiment. In FIG. 18, the same parts as those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the cutting method of the package substrate according to the second embodiment (hereinafter simply referred to as a cutting method), it is determined that the cutting groove 400 is not formed after the first groove forming step ST3 and in all the division lines 201 and 202 ( After step ST6: No), it is determined whether or not the cutting groove 400 has been formed in a predetermined number of predetermined dividing lines 201 and 202 after performing the immediately preceding measurement steps ST2 and ST4 (step ST8, step ST6). ST9) Except that, it is the same as the cutting method of the first embodiment.

  In the cutting method, after the first groove forming step ST3, the control unit 100 forms the cutting grooves 400 on the predetermined number of division planned lines 201 and 202 set in advance after performing the immediately preceding first measurement step ST2. If it is determined that there is not (step ST8: No), the process returns to the first groove forming step ST3, and the cutting groove 400 is formed in the next division lines 201 and 202. In the cutting method, the control unit 100 forms the cutting grooves 400 on the predetermined number of division planned lines 201 and 202 set in advance after the first measuring step ST2 immediately after the first groove forming step ST3. If it determines (step ST8: Yes), it will progress to 2nd measurement step ST4.

  As for the cutting method, after the control unit 100 determines that the cutting grooves 400 are not formed in all the planned division lines 201 and 202 (step ST6: No), after performing the immediately preceding second measurement step ST4, in advance. When it is determined that the cutting groove 400 is not formed on the predetermined number of scheduled dividing lines 201 and 202 (step ST9: No), the process returns to the second groove forming step ST5 and the next scheduled divided lines 201 and 202 are returned. A cutting groove 400 is formed on the surface. As for the cutting method, after the control unit 100 determines that the cutting grooves 400 are not formed in all the planned division lines 201 and 202 (step ST6: No), after performing the immediately preceding second measurement step ST4, in advance. When it is determined that the cutting groove 400 has been formed in the predetermined number of set division lines 201 and 202 (step ST9: Yes), the process returns to the first measurement step ST2.

  As described above, in the cutting method according to the second embodiment, after the height measurement using the measurement unit 70 is performed, the cutting grooves 400 are formed in the predetermined number of planned dividing lines 201 and 202 using the cutting blade 22, and then the measurement unit 400 is measured. 70 is used to measure the height. In the cutting method according to the second embodiment, the height is measured using the measurement unit 70 every time a predetermined number of cutting grooves 400 are formed. In the present invention, the predetermined number is determined according to an allowable variation in the depth of the cutting groove 400 formed in the division lines 201 and 202 of the package substrate 200.

  In the cutting method according to the second embodiment, as in the first embodiment, after the first groove forming step ST3 is performed, the second measuring step ST4 is performed and then the second groove forming step ST5 is performed. Therefore, in the cutting method, the depth of the cutting groove 400 can be kept constant over the entire length of the division lines 201 and 202, and the cutting groove 400 formed in the division lines 201 and 202 of the package substrate 200. Variation in depth can be suppressed.

  In the cutting method according to the second embodiment, the height is measured using the measurement unit 70 every time a predetermined number of cutting grooves 400 are formed. Therefore, the division lines 201 and 202 for performing the measurement steps ST2 and ST4 are measured. The number can be suppressed, and the time required for dividing the package substrate 200 can be suppressed.

[Modification]
Next, a method for cutting a package substrate according to a modification of the first and second embodiments will be described. The cutting method according to the first embodiment and the second embodiment performs the height measurement and the formation of the cutting groove 400 in order from the first division planned line 201 at the end of the plurality of first division planned lines 201, all of them. After the cutting groove 400 is formed in the first division line 201, the height measurement and the formation of the cutting groove 400 are performed in order from the second division line 202 at the end of the plurality of second division lines 202. To do. In the present invention, the order of the division lines 201 and 202 that form the cutting groove 400 is not limited to that described in the first and second embodiments. The cutting method of the package substrate according to the modified example of the first and second embodiments is to measure the height and form the cutting groove 400 in order from the central first division planned line 201 among the plurality of first division planned lines 201. Then, the height measurement and the formation of the cutting groove 400 are performed in order from the center second scheduled division line 202 among the plurality of second scheduled division lines 202. Thus, the cutting method of the package substrate of the present invention may arbitrarily select the order of the division lines 201 and 202 that form the cutting groove 400. In the present invention, the height of at least one scheduled division line 201, 202 is measured in the first measurement step ST2, and the height of at least one scheduled division line 201, 202 is measured in the first groove forming step. good. In short, the cutting method of the package substrate of the present invention may be such that the division lines 201 and 202 for measuring the height are two lines or more.

In addition, according to the cutting method of the package substrate which concerns on Embodiment 1 mentioned above, the following cutting devices are obtained.
(Appendix 1)
The division schedule is provided on a package substrate in which device chips are mounted in a plurality of regions partitioned by a first division schedule line extending in the first direction and a second division schedule line extending in the second direction. A cutting device for forming a cutting groove of a predetermined depth along a line,
A chuck table for holding the package substrate on a holding surface;
A measurement unit for measuring the height of the upper surface of the package substrate held by the chuck table;
A cutting unit for forming a cutting groove in the package substrate;
A control unit for controlling each component,
The control unit is
A first measurement step of measuring at least one line of the height of the upper surface of the package substrate held by the chuck table along the first division line;
Based on the height measured in the first measurement step, the division schedule in which the height is measured in the first measurement step with a cutting blade positioned at a height that forms the cutting groove of the predetermined depth. A first groove forming step for forming the cutting groove in the package substrate along a line;
A second measuring step of measuring the height of the upper surface of the uncut cutting line of the package substrate, the warpage of which has been relaxed by the first groove forming step;
Based on the height measured in the second measuring step, the division in which the height is measured in the second measuring step with the cutting blade positioned at a height that forms the cutting groove of the predetermined depth. A second groove forming step for forming the cutting groove in the package substrate along a predetermined line;
The cutting device characterized by implementing.

  The cutting apparatus performs the second measurement step ST4 after performing the first groove forming step ST3 after performing the first groove forming step ST3, as in the package substrate cutting method according to the first and second embodiments. Therefore, the depth of the cutting groove 400 can be kept constant over the entire length of the division lines 201 and 202, and the depth of the cutting groove 400 formed in the division lines 201 and 202 of the package substrate 200 can be maintained. Variations in thickness can be suppressed.

  In addition, this invention is not limited to the said embodiment and modification. That is, various modifications can be made without departing from the scope of the present invention.

10 chuck table 11 holding surface 22 cutting blade 70 measuring unit (laser displacement meter)
90 cutting blade 200 package substrate 201 first division planned line 202 second division planned line 203 region 204 device chip 210 metal frame 213 electrode 214 surface 220 resin sealing portion 222 distance (predetermined depth)
300 Package chip 400 Cutting groove (groove)
500 Dividing groove ST1 Holding step ST2 First measuring step ST3 First groove forming step ST4 Second measuring step ST5 Second groove forming step ST7 Dividing step

Claims (3)

The division schedule is provided on a package substrate in which device chips are mounted in a plurality of regions partitioned by a first division schedule line extending in the first direction and a second division schedule line extending in the second direction. A package substrate cutting method for forming a groove having a predetermined depth along a line,
A holding step for holding the package substrate on the holding surface of the chuck table;
A first measurement step of measuring at least one line of the height of the upper surface of the package substrate held by the chuck table along the first division line;
Based on the height measured in the first measurement step, the dividing line in which the height is measured in the first measurement step with a cutting blade positioned at a height at which the groove having the predetermined depth is formed. Forming a groove in the package substrate along the first groove forming step;
A second measuring step of measuring the height of the upper surface of the uncut cutting line of the package substrate, the warpage of which has been relaxed by the first groove forming step;
Based on the height measured in the second measuring step, the division schedule in which the height is measured in the second measuring step with the cutting blade positioned at a height at which the groove having the predetermined depth is formed. A second groove forming step for forming the groove in the package substrate along a line;
A package substrate cutting method comprising: a step of cutting the center of the groove with a cutting blade having a thickness smaller than the width of the groove to divide the package substrate into individual package chips.   The package substrate cutting method according to claim 1, wherein in the first measurement step and the second measurement step, the height of the package substrate is measured along the planned division line using a laser displacement meter.   The package substrate includes a metal frame provided with electrodes of a predetermined thickness protruding from the division line to the device chip side in each region on which the device chip is mounted, and the device chip mounted on the surface of the metal frame. And a resin sealing portion for sealing, and the cut surface of the electrode is formed in a stepped shape by the groove and the dividing groove formed in the dividing step, and the contact area of the adhesive applied to the electrode is increased. The cutting method of the package board | substrate of Claim 1 or Claim 2.

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