JP2018202580A - Polishing device - Google Patents

Abstract

To provide a polishing device which adjusts a temperature of a region intended as a main temperature adjustment object in a polishing surface preferentially and efficiently without complicating a structure, and can suppress a partial change of the temperature of the polishing surface in polishing a workpiece, and accordingly can suppress partial deviation of polishing conditions.SOLUTION: A temperature adjustment structure 40 formed on a rear side of a polishing surface of a lower surface plate 2 includes a water supply port 41 for supplying a fluid for temperature adjustment, a drain port 42 from which the fluid for temperature adjustment is drained, a flow passage 43 arranged in a diameter direction of the lower surface plate 2 and extended along a plurality of concentric circles, and a partition wall 44 which extends in the diameter direction of the lower surface plate 2 and partitions the concentric circle. The fluid for temperature adjustment flows in a first direction in a third flow passage 43c along a third concentric circle R3 from the water supply port 41, flows in a fourth flow passage 43d along a fourth concentric circle R4 by folding back along the partition wall 44, flows in a direction opposite to the first direction in the fourth flow passage 43d, and is drained from the drain port 42.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a polishing apparatus in which a temperature adjusting structure in which a temperature adjusting fluid flows on the back side of a polishing surface is formed.

  Conventionally, in order to perform temperature adjustment such as cooling of a surface plate for polishing a workpiece such as a silicon wafer, a polishing apparatus provided with a temperature adjustment structure in which a temperature adjusting fluid flows on the back side of a polishing surface in contact with the workpiece is known. It has been. The temperature control structure in this polishing apparatus has, for example, a temperature control fluid flow path that spirally extends from a water supply port provided near the inner edge of the surface plate toward a drain port formed near the outer edge. (For example, refer to Patent Document 1) or a plurality of flow paths extending in the circumferential direction of the surface plate, and the temperature of the temperature adjusting fluid flowing through each flow path can be individually adjusted (for example, Patent Document 2 and 3).

Japanese Utility Model Publication No.59-151655 JP 2002-373875 A JP 2002-233948 A

However, in the temperature control structure having the fluid flow path extending in a spiral shape, the temperature control efficiency of the polishing surface gradually decreases from the center of the surface plate toward the outer edge. Therefore, it is not possible to preferentially and efficiently adjust the temperature of a region intended as a main temperature adjustment target such as a region where the contact ratio with the workpiece is high during workpiece polishing. For this reason, there arises a problem that the polishing surface partially rises in temperature due to the influence of the polishing heat generated along with the workpiece polishing, or the polishing conditions partially deviate in relation to this.
On the other hand, in a temperature control structure that can individually adjust the temperature of the temperature control fluid that flows through multiple flow paths, it is necessary to use multiple fluid supply / discharge paths, resulting in a larger device and complex control. The problem of becoming.

  The present invention has been made paying attention to the above-mentioned problem, and the temperature of a region intended as a main temperature adjustment target of the polishing surface is preferentially and efficiently adjusted without complicating the structure. It is an object of the present invention to provide a polishing apparatus capable of suppressing the temperature of the polishing surface from partially changing or the polishing conditions from partially deviating in relation thereto.

In order to achieve the above object, the present invention is a polishing apparatus comprising a surface plate in which a temperature adjusting structure through which a temperature adjusting fluid flows is formed on the back side of a polishing surface for polishing a workpiece.
The temperature control structure communicates the water supply port for supplying the temperature control fluid, the water discharge port for discharging the temperature control fluid, the water supply port and the water discharge port, and the radial direction of the surface plate. And a partition wall extending in a radial direction of the surface plate and partitioning the concentric circles.
Then, the temperature adjusting fluid supplied from the water supply port flows in the first direction in the flow path along the first concentric circle, and then returns along the partition wall to flow along the second concentric circle. It flows into the path, flows in the flow path along the second concentric circle in the direction opposite to the first direction, and is discharged from the drain port.

  As a result, the temperature of the intended region as the main temperature adjustment target of the polishing surface is preferentially and efficiently adjusted without complicating the structure, and the temperature of the polishing surface partially changes as the workpiece is polished, or In this connection, it is possible to prevent the polishing condition from partially deviating.

1 is a cross-sectional view schematically showing an overall configuration of a polishing apparatus of Example 1. FIG. FIG. 3 is a plan view showing a cooling structure of the polishing apparatus of Example 1. It is explanatory drawing explaining the area | region when the grinding | polishing surface of a surface plate is divided. It is a top view which shows the cooling structure of the grinding | polishing apparatus of a comparative example. It is explanatory drawing which shows the cooling state of the grinding | polishing surface by the cooling structure of a comparative example. It is explanatory drawing which shows the flow direction of the cooling water in the cooling structure of Example 1. FIG. FIG. 3 is an explanatory view showing a cooling state of a polished surface by the cooling structure of Example 1. 6 is a plan view showing a first modification of the cooling structure of Embodiment 1. FIG. 6 is a plan view showing a second modification of the cooling structure of Embodiment 1. FIG.

  Hereinafter, the form for implementing the polish device of the present invention is explained based on Example 1 shown in a drawing. In the following embodiments, the temperature control structure of the present invention will be described as a cooling structure.

Example 1
First, the configuration will be described.
The polishing apparatus 1 according to the first embodiment is a double-side polishing apparatus that polishes both front and back surfaces of a thin workpiece W such as a semiconductor wafer, a crystal wafer, a sapphire wafer, a glass wafer, or a ceramic wafer. Hereinafter, the configuration of the polishing apparatus 1 according to the first embodiment will be described by dividing it into “the overall configuration”, “the detailed configuration of the surface plate”, and “the detailed configuration of the cooling structure”.

[overall structure]
FIG. 1 is a cross-sectional view schematically illustrating the overall configuration of the polishing apparatus according to the first embodiment. Hereinafter, based on FIG. 1, the whole structure of the grinding | polishing apparatus of Example 1 is demonstrated.

  As shown in FIG. 1, the polishing apparatus 1 according to the first embodiment rotates around the lower surface plate 2 and the upper surface plate 3 that are arranged concentrically about the axis L <b> 1, and the center of the lower surface plate 2 and the upper surface plate 3. Arranged between the sun gear 4 freely arranged, the internal gear 5 arranged on the outer peripheral side of the lower surface plate 2 and the upper surface plate 3, and the work holding hole (not shown) ) Formed on the carrier plate 6. A polishing pad 2 a is attached to the upper surface of the lower surface plate 2, and a polishing pad 3 a is attached to the lower surface of the upper surface plate 3. In addition, the surface of each polishing pad 2a, 3a becomes a polishing surface for polishing the workpiece W.

  The lower surface plate 2, the sun gear 4, and the internal gear 5 are connected to a driving device (not shown) via drive shafts 7a, 7b, and 7c, respectively, and are driven to rotate.

  The carrier plate 6 meshes with the sun gear 4 and the internal gear 5. The carrier plate 6 revolves around the axis L 1 while rotating by the rotation of the sun gear 4 and the internal gear 5. Due to the rotation and revolution of the carrier plate 6 and the rotation of the lower surface plate 2 and the upper surface plate 3, both surfaces of the work W arranged in the work holding hole are polished by the polishing pads 2a and 3a.

  The upper surface plate 3 is suspended and supported on the rod 8b of the lifting actuator 8 via a surface plate suspension 8a attached to the upper surface of the upper surface plate 3. Here, a centering bearing 8c is interposed at the tip of the rod 8b. As a result, the upper surface plate 3 is suspended and supported by the lifting / lowering actuator 8 so as to be swingable and rotatable.

  On the other hand, a driver drive shaft 9 rotated by a drive device (not shown) is inserted into the drive shaft 7b to which the sun gear 4 is fixed, and an upper end portion 9a of the driver drive shaft 9 is an upper end opening 7d of the drive shaft 7b. Protruding from. A driver 10 is fixed to the upper end portion 9a, and the driver 10 rotates integrally with the driver drive shaft 9. Further, a groove portion (not shown) that engages with a hook 3 b provided on the upper surface plate 3 is formed on the outer peripheral surface of the driver 10. Then, the rod 8b extends, the upper surface plate 3 moves downward, and the hook 3b engages with the groove portion of the driver 10, so that the upper surface plate 3 rotates integrally with the rotation of the driver 10. It has become.

  That is, the upper surface plate 3 moves up and down by the expansion and contraction operation of the rod 8 b and rotates by the rotation operation of the driver drive shaft 9. The upper surface plate 3 is provided with a supply hole (not shown) for supplying polishing slurry.

[Detailed configuration of surface plate]
The lower surface plate 2 of the polishing apparatus 1 of Example 1 has a cooling structure on the back side of the polishing surface in order to suppress a partial temperature change of the polishing surface (the surface of the polishing pad 2a) due to frictional heat generated during the polishing of the workpiece W. 40 (temperature control structure) is formed. As shown in FIG. 1, the lower surface plate 2 includes a lower flat plate member 21, a lower jacket member 22, and a lower surface plate receiving member 23.

  The lower flat plate member 21 is a plate member having a flat surface on which the polishing pad 2 a is attached, and is located on the uppermost surface of the lower surface plate 2. The lower flat plate member 21 is formed of a low thermal expansion material that has a small linear expansion coefficient and is difficult to be thermally deformed.

  The lower jacket member 22 is a plate member that is fixed to the back side (lower surface) of the lower flat plate member 21, and a cooling structure 40 is formed on the surface facing the lower flat plate member 21. The tip of the partition wall 46 (see FIG. 2) that partitions the flow path 43 of the cooling structure 40 is fixed to the lower flat plate member 21. The lower jacket member 22 is formed of stainless steel having a higher linear expansion coefficient and higher rigidity than the lower flat plate member 21 and the lower surface plate receiving member 23.

  The lower surface plate receiving member 23 is a plate member fixed to the back side (lower surface) of the lower jacket member 22 and the drive shaft 7a being fixed.

  The upper surface plate 3 of the polishing apparatus 1 of Example 1 is cooled to the back side of the polishing surface in order to suppress a partial temperature change of the polishing surface (the surface of the polishing pad 3a) due to frictional heat generated during the polishing of the workpiece W. A structure 40 (temperature control structure) is formed. As shown in FIG. 1, the upper surface plate 3 has an upper flat plate member 31 and an upper jacket member 32.

  The upper flat plate member 31 is a plate member having a flat surface on which the polishing pad 3 a is affixed, and is located on the lowermost surface of the upper surface plate 3. The upper flat plate member 31 is formed of a low thermal expansion material that has a small linear expansion coefficient and is difficult to be thermally deformed.

  The upper jacket member 32 is a plate member fixed to the back side (upper surface) of the upper flat plate member 31 and supported by being suspended by the surface plate suspension 8a. The upper jacket member 32 has a cooling structure 40 formed on the surface facing the upper flat plate member 31. The tip of the partition wall 46 that partitions the flow path 43 of the cooling structure 40 is fixed to the lower flat plate member 21. The upper jacket member 32 is formed of stainless steel having a higher linear expansion coefficient and higher rigidity than the upper flat plate member 31.

[Detailed structure of cooling structure]
FIG. 2 is a plan view illustrating a cooling structure of the polishing apparatus according to the first embodiment. Hereinafter, based on FIG. 2, the detailed structure of the cooling structure of Example 1 is demonstrated.

  A cooling structure 40 is formed on each of the lower jacket member 22 and the upper jacket member 32 of the first embodiment. The cooling structure 40 distributes heat between the cooling water and the lower flat plate member 21 or the upper flat plate member 31 by circulating cooling water (temperature adjusting fluid) supplied from a cooling water circulation device (not shown). Thus, the lower flat plate member 21 and the upper flat plate member 31 are cooled. Since the cooling structure 40 formed on the lower jacket member 22 and the cooling structure 40 formed on the upper jacket member 32 have the same configuration, the cooling structure formed on the lower jacket member 22 will be described below. 40 will be described.

  As shown in FIG. 2, the cooling structure 40 of the first embodiment includes a water supply port 41 that supplies cooling water, a drain port 42 that discharges cooling water, and a flow path that connects the water supply port 41 and the drain port 42. 43 and a partition wall 44 extending along the radial direction of the lower surface plate 2.

  The water supply port 41 is a vertical hole opening penetrating the lower jacket member 22 in the direction of the axis L1, and communicates with a water supply channel (not shown) connected to a water discharge port of a cooling water circulation device (not shown). The water supply path has a vertical hole extending in the axial direction inside the drive shaft 7a and a horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23.

  The drain port 42 is a vertical hole opening that penetrates the lower jacket member 22 in the direction of the axis L1, and communicates with a drain channel (not shown) connected to the water inlet of the cooling water circulation device. The opening area of the drain port 42 is set to the same size as the water supply port 41. The drainage channel has a vertical hole extending in the axial direction inside the drive shaft 7a and a horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23.

  The flow path 43 is a groove through which cooling water flows from the water supply port 41 toward the drain port 42. The flow path 43 is partitioned by a partition wall 46 formed in the lower jacket member 22, and extends along a plurality of concentric circles arranged in the radial direction of the lower surface plate 2. The flow paths 43 of the first embodiment are each along a plurality of concentric circles (here, five concentric circles, first concentric circle R1 to fifth concentric circle R5) arranged in order from the inner edge α to the outer edge β of the lower surface plate 2. The first flow path 43a, the second flow path 43b, the third flow path 43c, the fourth flow path 43d, and the fifth flow path 43e.

  A plurality of (in the extending direction of the first flow path 43a are arranged inside the first flow path 43a formed along the first concentric circle R1 located on the innermost circumference and closest to the inner edge α. Two drain ports 42 are formed here. Further, a plurality of (in the second flow path 43b adjacent to the first flow path 43a along the second concentric circle R2 positioned second from the innermost circumference are arranged in the extending direction of the second flow path 43b ( Two water supply ports 41 are formed here. That is, in the first embodiment, the drain port 42 is formed inside the lower surface plate 2 rather than the water supply port 41.

  The flow path 43 extends along the plurality of concentric circles (first concentric circle R1 to fifth concentric circle R5) and extends in the circumferential direction of the lower surface plate 2, but is turned back along the partition wall 44. . That is, among the flow paths 43, the second flow path 43b and the third flow path 43c communicate with each other through the first folding part 45a, and the third flow path 43c and the fourth flow path 43d communicate with each other through the second folding part 45b. The fourth flow path 43d and the fifth flow path 43e communicate with each other through the third folding part 45c, and the fifth flow path 43e and the first flow path 43a communicate with each other through the fourth folding part 45d. And the 1st-5th flow paths 43a-43e form the one cooling water route | root connected as a whole by the middle position along the circumferential direction of the lower surface plate 2 turning back.

The partition wall 44 is a wall surface extending in the radial direction of the lower surface plate 2. This partition wall 44 partitions the midpoint positions of a plurality of concentric circles (first concentric circle R1 to fifth concentric circle R5) along which the flow path 43 extends. The partition wall 44 of the first embodiment includes a first partition wall 44a that partitions all of the first concentric circle R1 to the fifth concentric circle R5, and a second partition that partitions the second, third, and fourth concentric circles R2, R3, and R4. Wall 44b.
That is, the first folded portion 45a and the third folded portion 45c are formed along the first partition wall 44a, and the second folded portion 45b is formed along the second partition wall 44b. Furthermore, the 4th folding | turning part 45d which connects the 5th flow path 43e and the 1st flow path 43a is formed between the 1st partition wall 44a and the 2nd partition wall 44b.

Next, the operation will be described.
First, the configuration and problems of the surface plate having the cooling structure of the comparative example will be described, and subsequently, the operation of the polishing apparatus of Example 1 will be described as “surface plate cooling operation during polishing”, “different material combination operation”, “ The description will be divided into “characteristic action depending on the formation position of the water supply port and drainage port” and “other characteristic actions”.

[Configuration and Problems of Surface Plate with Cooling Structure of Comparative Example]
FIG. 3 is an explanatory view showing a region where the polishing surface of the surface plate is divided, FIG. 4 is a plan view showing the cooling structure of the polishing apparatus of the comparative example, and FIG. 5 is the polishing surface by the cooling structure of the comparative example. It is explanatory drawing which shows surface temperature of this. Hereinafter, based on FIGS. 3-5, the structure and subject of the surface plate which have the cooling structure of a comparative example are demonstrated.

  Generally, in a polishing apparatus that polishes a workpiece such as a silicon wafer, a carrier plate is sandwiched between a lower surface plate and an upper surface plate, and the workpiece is placed inside a work holding hole formed in the carrier plate. Therefore, the movement range of the workpiece is limited by the carrier plate. On the other hand, the carrier plate meshes with the sun gear and the internal gear. Therefore, the work holding hole needs to be formed at a predetermined distance from the inner and outer peripheral edges of the carrier plate.

  Accordingly, as shown in FIG. 3, the surface plate polishing surface K has a central region A located at the center of the surface plate, an outer edge region C along the outer surface of the surface plate, and between the central region A and the outer edge region C. The intermediate region B having the highest rate of contact with the workpiece as the workpiece is polished is the central region due to frictional heat generated between the workpiece and the workpiece (hereinafter referred to as “processing heat”). It has been found that the temperature is higher than that of A and the outer edge region C.

  On the other hand, in the cooling structure 100 (temperature adjustment structure) of the comparative example, as shown in FIG. 4, the entire surface plate is radially divided into 15 parts by the divided wall surfaces 101 extending in the radial direction, and each divided area is divided into the divided areas. A water supply port 102 and a drainage port 103 and a flow path forming wall 104 extending from the inner edge portion α toward the outer edge portion β are formed. Here, the water supply port 102 and the drainage port 103 are positions where the flow path forming wall 104 is sandwiched, and both are formed in the vicinity of the inner edge portion α of the surface plate.

  In such a cooling structure 100 of the comparative example, the cooling water (temperature adjusting fluid) that flows out from the water supply port 102 flows along the flow path forming wall 104 as shown by arrows in FIG. It flows toward. The cooling water passes through the gap 106 between the flow path forming wall 104 and the outer peripheral wall 105 formed along the outer edge β, and then passes along the flow path forming wall 104 to the inner edge α of the surface plate. To the drain outlet 103.

  In other words, the cooling structure 100 of this comparative example is configured such that the cooling water flows in the radial direction in the radially divided divided regions and is turned back along the outer edge portion β. Therefore, the entire polishing surface of the surface plate X having the cooling structure 100 is cooled almost uniformly. Thereby, the polishing area of the surface plate X has an intermediate region B with a high probability of being in contact with the workpiece at about 23 ° C. to 24 ° C. as shown in FIG. Therefore, the temperature becomes higher than that of the central region A and the outer peripheral region C which are suppressed to 23 ° C. or lower. That is, in the surface plate X having the cooling structure 100 of this comparative example, the polishing surface temperature partially rises as the workpiece is polished, and a part of the polishing surface is thermally deformed and distorted, maintained or at a constant rate. The fine polishing conditions for which changes are desirable deviate locally. Moreover, there is a possibility that the surface modification of the polishing pad may be locally promoted. It is also conceivable that the work surface cannot be uniformly polished due to one or a combination of these phenomena, resulting in a decrease in polishing accuracy.

Further, in the cooling structure 100 of the comparative example, in order to form a flow path along the radial direction of the surface plate, the divided wall surface 101 and the flow path forming wall 104 extend in the radial direction of the surface plate. Therefore, when the surface plate X is suspended during conveyance, the bending moment force is applied to the divided wall surface 101 and the flow path forming wall 104. Here, when the divided wall surface 101 and the flow path forming wall 104 are formed in concentric circles, the bending moment force flows on the concentric circles, so that the force can be dispersed. However, in the case of the cooling structure 100 of the comparative example, the drag force against the bending moment force depends on the rigidity of the divided wall surface 101 and the flow path forming wall 104. Therefore, unless the rigidity of the divided wall surface 101 and the flow path forming wall 104 is increased, the platen tends to bend and deform.
Therefore, for example, it is necessary to devise a fixing method at the time of roughing the surface plate, to shorten the transport time (hanging time) during the surface plate manufacturing, or to require a predetermined curing time after machining. In addition, there is a problem that the quality of the surface plate X is affected by variations and a delay in delivery occurs.

  Further, in the cooling structure 100 of this comparative example, since the divided wall surface 101 and the flow path forming wall 104 extend in the radial direction of the surface plate, the distal ends of the divided wall surface 101 and the flow path forming wall 104 are cut. When this is done, the cut surface is continuous in the radial direction of the surface plate X. Therefore, there also arises a problem that the radial deflection of the surface plate X due to the influence of the residual stress generated by this cutting process increases.

[Surface plate cooling during polishing]
FIG. 6 is an explanatory view showing the flow direction of the cooling water in the cooling structure of the first embodiment, and FIG. 7 is an explanatory view showing the surface temperature of the polished surface by the cooling structure of the first embodiment. Hereinafter, based on FIG.6 and FIG.7, the surface plate cooling effect | action in the grinding | polishing process in the grinding | polishing apparatus 1 of Example 1 is demonstrated. The cooling structure 40 in the lower surface plate 2 and the cooling structure 40 in the upper surface plate 3 can exhibit the same action. Therefore, only the cooling structure 40 formed on the lower surface plate 2 will be described below.

  In the cooling structure 40 of the lower surface plate 2 included in the polishing apparatus 1 of the first embodiment, when cooling water is supplied from a cooling water circulation device (not shown), the cooling water is supplied to the lower jacket member 22 and the lower surface plate receiving member 23. It flows out from the water supply port 41 through a water supply channel (not shown) formed in the inside. At this time, a plurality (two) of water supply ports 41 are provided along the extending direction of the second flow path 43b, but the same amount of cooling water flows out of all the water supply ports 41 almost simultaneously.

  The cooling water flowing out from the water supply port 41 first fills the second flow channel 43b of the flow channel 43 in which the water supply port 41 is formed, and then, as shown by the arrow in FIG. Into the third flow path 43c. The cooling water that has flowed into the third flow path 43c flows in the third flow path 43c in the counterclockwise direction shown in FIG. 6, and then flows into the fourth flow path 43d through the second folded portion 45b. And the cooling water which flowed into the 4th flow path 43d flows through the inside of the 4th flow path 43d in the clockwise direction shown in FIG. 6, and flows into the 5th flow path 43e via the 3rd folding | turning part 45c. Furthermore, the cooling water that has flowed into the fifth flow path 43e flows in the fifth flow path 43e in the counterclockwise direction shown in FIG. 6, and then flows into the first flow path 43a through the fourth folded portion 45d.

  And the cooling water which flowed into the 1st flow path 43a is discharged | emitted from the drain port 42 formed in this 1st flow path 43a. At this time, a plurality of (two) drain ports 42 are provided along the extending direction of the first flow path 43a, but the same amount of cooling water is discharged from all the drain ports 42.

  And heat exchange is performed between the cooling water which flows through the flow path 43 in this way, and the lower flat plate member 21 provided with the polishing pad 2a, and the surface (polishing surface) of the polishing pad 2a is cooled.

  Here, in the cooling structure 40 of the first embodiment, the cooling water is supplied from the water supply port 41 → the second flow path 43b → the third flow path 43c → the fourth flow path 43d → the fifth flow path 43e → the first flow path 43a → It flows with the drain port 42. Therefore, the flow path 43 cools the entire polishing surface by one cooling route. Thereby, a water supply / drainage path can be made into a simple structure, and it can prevent that a structure becomes complicated. Moreover, since the flow path 43 is one route, the flow rate of the cooling water flowing through the flow path 43 can be improved. For this reason, the heat transfer rate by the cooling water is increased, and the temperature adjustment efficiency can be improved.

  Further, the third flow path 43c is formed along a third concentric circle R3 located third from the innermost periphery. The fourth flow path 43d is formed along a fourth concentric circle R4 located fourth from the innermost periphery. Here, the third flow path 43c and the fourth flow path 43d are flow paths formed at positions facing the intermediate region B (see FIG. 3) having the highest rate of contact with the work W during the work polishing. .

  On the other hand, in this cooling structure 40, the cooling water that has flowed out from the second flow path 43b in which the water supply port 41 is formed flows into the third flow path 43c, and then flows sequentially to the fourth flow path 43d. Yes. For this reason, in the cooling structure 40 according to the first embodiment, the cooling water having a relatively low temperature is opposed to the intermediate region B that becomes relatively high when the workpiece is polished (the third flow path 43c and the fourth flow path 43d). Can be shed. That is, the third flow path 43c and the fourth flow path 43d having high temperature control efficiency can be opposed to the intermediate area B of the polishing surface that is required to be efficiently cooled, and priority is given to the area with high cooling demand. Can be cooled.

  In addition, in the 2nd flow path 43b in which the water supply port 41 was formed, although cooling water temperature becomes the lowest, cooling water is simultaneously supplied from the several water supply port 41 located along the extension direction of the 1st flow path 43b. Therefore, the flow velocity is lower than that of the third flow path 43c and the fourth flow path 43d. That is, the platen temperature adjustment efficiency of the second flow path 43b is lower than that of the third flow path 43c and the fourth flow path 43d. However, since the 2nd flow path 43b with low temperature control efficiency is facing the center area | region A of the lower surface plate 2, it can prevent having a big influence on the cooling state of a grinding | polishing surface.

  In the cooling structure 40 of the first embodiment, the flow path 43 is folded back by the partition wall 44 that partitions a plurality of concentric circles (first concentric circle R1 to fifth concentric circle R5), and the cooling water flows along the partition wall 44. And then flow back. That is, the flow direction of the cooling water is reversed every time it flows in the circumferential direction of the surface plate. Therefore, for example, unlike the case where the flow path is formed in a spiral shape, the temperature distribution of the cooling water in an arbitrary circumferential region can be made uniform.

  As a result, the lower surface plate 2 of the polishing apparatus 1 according to the first embodiment can efficiently and preferentially cool a region (intermediate region B) having a high cooling requirement in the polishing surface. As shown in FIG. Even if processing heat is generated during polishing, the entire surface of the polishing pad 2a can be adjusted to an equal temperature of approximately 23 ° C. or lower. And it can control that the temperature of the surface (polishing surface) of polishing pad 2a changes partially (here rises), suppresses thermal deformation of lower surface plate 2, and / or polishes in a polisher. Fine polishing conditions on the entire surface (polishing surface) of the pad 2a can be maintained. Thereby, the bad influence to the workpiece | work W during grinding | polishing, such as a fall of grinding | polishing precision, can also be prevented.

[Combination of different materials]
Generally, a surface plate of a polishing apparatus such as a lower surface plate or an upper surface plate causes a change over time after a long time in units of years, and the polished surface may be distorted. In this case, it is necessary to remove the lower surface plate and the upper surface plate from the drive shaft for rotating the lower surface plate and the rod that supports the upper surface plate by hanging and correct the shape by re-wrapping the polished surface. .

  In contrast, the lower surface plate 2 of the polishing apparatus 1 of the first embodiment includes a lower flat plate member 21, a lower jacket member 22, and a lower surface plate receiving member 23. The lower flat plate member 21 and the lower surface plate receiving member 23 are formed of a low thermal expansion material having a smaller linear expansion coefficient than the lower jacket member 22, and the lower jacket member 22 has a linear expansion coefficient smaller than these. It is made of stainless steel that is large and has high rigidity.

  That is, in the lower surface plate 2, the lower flat plate member 21 that contacts the workpiece W and directly transmits the processing heat, and the lower jacket member that is fixed to the back side of the lower flat plate member 21 and has the cooling structure 40 formed thereon. 22 is formed of a material having a different linear expansion coefficient.

  Therefore, the entire lower surface plate 2 has a bimetallic structure in which two metal plates having different thermal expansion coefficients are bonded together. Thereby, the deflection amount of the lower surface plate 2 can be controlled by adjusting the temperature of the cooling water flowing through the cooling structure 40.

  The upper surface plate 3 of the polishing apparatus 1 according to the first embodiment includes an upper flat plate member 31 and an upper jacket member 32, and the upper flat plate member 31 has a low thermal expansion coefficient smaller than that of the upper jacket member 32. The upper jacket member 32 is made of an inflatable material, and is made of stainless steel having a higher linear expansion coefficient and higher rigidity.

  That is, in the upper surface plate 3, the upper flat plate member 31 that is in contact with the workpiece W and directly transmits machining heat, and the upper jacket member 32 that is fixed to the back side of the upper flat plate member 31 and has the cooling structure 40 formed thereon. Are formed of materials having different linear expansion coefficients.

  Therefore, the entire upper surface plate 3 also has a bimetallic structure in which two metal plates having different thermal expansion coefficients are bonded together. Thereby, the deflection amount of the upper surface plate 3 can be controlled by adjusting the temperature of the cooling water flowing through the cooling structure 40.

  In both the lower surface plate 2 and the upper surface plate 3, the amount of deflection of the surface plate can be controlled by adjusting the temperature of the cooling water. However, distortion can be alleviated by adjusting the temperature of the cooling water. For this reason, it is possible to eliminate the need for reworking the polishing surface.

  In the first embodiment, the lower flat plate member 21 has a smaller linear expansion coefficient than the lower jacket member 22, and the upper flat plate member 31 has a smaller linear expansion coefficient than the upper jacket member 32. That is, the lower flat plate member 21 and the upper flat plate member 31 that contact the workpiece W and directly transmit the frictional heat are formed of a material that is difficult to thermally deform and has a small linear expansion coefficient. Therefore, the lower plate member 21 and the upper plate member 31 are prevented from being thermally deformed by the processing heat generated during workpiece polishing, and the deformation of the lower platen 2 and the upper platen 3 is suppressed, and the control of the platen bending is controlled. Can be possible.

  Further, generally, stainless steel is an inexpensive material compared to a low thermal expansion material. Therefore, as compared with the case where the entire surface plate is formed of a low thermal expansion material, the lower jacket member 22 and the upper jacket member 32 are manufactured by substituting stainless steel as in the polishing apparatus 1 of Example 1, thereby reducing the cost. It is possible to go down.

  In the upper surface plate 3 of the first embodiment, the upper flat plate member 31 to which the processing heat during workpiece polishing is directly transmitted is formed of a low thermal expansion material having a small linear expansion coefficient and hardly thermally deformed, and the upper jacket member 32. Is made of inexpensive stainless steel. Thereby, in the upper surface plate 3, it becomes possible to aim at cost reduction, suppressing the thermal deformation of the upper side plate member 31. FIG.

  Further, the stainless steel forming the lower jacket member 22 and the upper jacket member 32 is a material having a relatively high rigidity. For this reason, the rigidity of the lower surface plate 2 and the upper surface plate 3 can be improved compared with the case where the lower jacket member 22 and the upper jacket member 32 are formed of a low thermal expansion material. Thereby, for example, even if the lower surface plate 2 and the upper surface plate 3 are suspended in the course of manufacturing, it is possible to suppress the bending and improve the ease of manufacturing.

[Characteristic action depending on the location of the water inlet and outlet]
In the first embodiment, a water supply path connected to a cooling water circulation device (not shown) includes a vertical hole formed in the drive shaft 7a in the vertical direction, a horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23, and have. The drainage channel has the same structure as the water supply channel, and has a vertical hole formed in the drive shaft 7a in the vertical direction and a horizontal hole extending in the horizontal direction in the lower surface plate receiving member 23. doing.

  On the other hand, in the cooling structure 40 of the first embodiment, as shown in FIG. 2, the drain port 42 is located closest to the inner edge α of the lower surface plate 2, that is, the innermost periphery of the lower surface plate 2. The first water supply port 41 is formed in the first flow path 43a along the first concentric circle R1, and the water supply port 41 extends along the second concentric circle R2 located second from the innermost circumference and adjacent to the first flow path 43a. Is formed. That is, both the water supply port 41 and the drain port 42 are formed in the vicinity of the drive shaft 7a.

  Thereby, compared with the case where the water supply port 41 and the drain port 42 are formed in the vicinity of the outer edge part β of the lower surface plate 2, the horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23 in the water channel and the water channel. The length of the part can be shortened. That is, the cooling structure 40 can be further prevented from becoming complicated, and the ease of making the surface plate can be improved.

  In particular, if the water supply port 41 and the drain port 42 are formed in the vicinity of the outer edge β of the lower surface plate 2 in the large lower surface plate 2 having a diameter dimension exceeding 2 meters, the inside of the lower surface plate receiving member 23 is formed. Long horizontal holes extending in the horizontal direction are required. However, it is very difficult to form a long horizontal hole, and even if it can be realized, an increase in processing cost cannot be avoided. However, in the polishing apparatus 1 according to the first embodiment, since the water supply port 41 and the drain port 42 are formed in the vicinity of the inner edge portion α, there is no need for a long horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23. Thus, the increase in processing costs can be suppressed.

  Further, in the first embodiment, a plurality of (two) water supply ports 41 and drain ports 42 are formed. Then, the same amount of cooling water flows from all the water supply ports 41 almost simultaneously, and the same amount of cooling water is discharged from all the water discharge ports 42 almost simultaneously. This is only in accordance with the restrictions on the water channel design in the machine up to the surface plate water supply port and the water channel design in the machine from the drain port. Therefore, it is not necessarily limited to this number. That is, it is essential that the number of the water supply ports 41 and the drain ports 42 is designed to obtain a desired flow rate and flow velocity within an allowable pressure resistance.

  Moreover, in this Example 1, the some water supply port 41 is formed along with the extension direction of the 2nd flow path 43a in which this water supply port 41 was formed. Therefore, the interference of the cooling water flowing out from the plurality of water supply ports 41 can be suppressed so that the smooth flow of the cooling water is not hindered. And since a cooling water flows smoothly, a flow rate can be ensured and the surface plate temperature control efficiency can be improved.

  Further, the plurality of drain ports 42 are also formed side by side in the extending direction of the first flow path 43a in which the drain ports 42 are formed, and can be quickly discharged without disturbing the flow of the cooling water. It becomes. As a result, the smooth flow rate of the cooling water is not hindered and the flow rate of the cooling water can be secured to further improve the platen temperature adjustment efficiency.

[Other characteristic effects]
In the cooling structure 40 of the first embodiment, the flow path 43 is formed along a plurality of concentric circles (first concentric circle R1 to fifth concentric circle R5) arranged in the radial direction of the lower surface plate 2. Therefore, the partition walls 46 that respectively partition the first flow path 43 a to the fifth flow path 43 e extend in the circumferential direction of the lower surface plate 2.

  The partition wall 46 extends in the circumferential direction of the lower surface plate 2, so that the suspension position when the lower surface plate 2 is suspended, the inner edge α of the lower surface plate 2, and the outer edge β And do not continue. Thereby, the bending deformation of the surface plate radial direction when conveying the lower surface plate 2 can be suppressed. That is, the deformation of the lower surface plate 2 being manufactured can be reduced, and the manufacturing time of the lower surface plate 2 can be shortened and the ease of manufacturing can be improved.

  Furthermore, in the cooling structure 40 of the first embodiment, since the flow path 43 is along a plurality of concentric circles (first concentric circle R1 to fifth concentric circle R5) aligned in the radial direction of the lower surface plate 2, the first flow path 43a. The tip of the partition wall 46 that partitions each of the fifth flow paths 43e is discontinuous in the surface plate radial direction. Therefore, the influence of the residual stress generated when cutting the tip of the partition wall 46 can be reduced, and the radial deflection of the lower surface plate 2 can be further suppressed.

Next, the effect will be described.
In the polishing apparatus 1 of Example 1, the effects listed below can be obtained.

(1) Polishing provided with a surface plate (lower surface plate 2, upper surface plate 3) in which a cooling structure 40 through which cooling water flows is formed on the back side of the polishing surface (surface of the polishing pads 2a, 3a) for polishing the workpiece W In device 1,
The cooling structure 40 communicates the water supply port 41 for supplying the cooling water, the drain port 42 for discharging the cooling water, the water supply port 41 and the drain port 42, and the surface plate (lower surface plate). 2, a flow path 43 extending along a plurality of concentric circles (first concentric circle R1 to fifth concentric circle R5) arranged in the radial direction of the upper surface plate 3), and the surface plate (lower surface plate 2, upper surface plate 3). And a partition wall 44 extending in the radial direction and partitioning the concentric circles (first concentric circle R1 to fifth concentric circle R5),
The cooling water supplied from the water supply port 41 flows in the first direction (counterclockwise direction) in the flow path (third flow path 43c) along the first concentric circle (third concentric circle R3). It folds along the partition wall 44 and flows into the flow path (fourth flow path 43d) along the second concentric circle (fourth concentric circle R4), and flows along the second concentric circle (fourth concentric circle R4). The inside of the (fourth flow path 43d) flows in the direction (clockwise direction) opposite to the first direction (counterclockwise direction) and is discharged from the drain port 42.
As a result, the region (intermediate region B) intended as the main temperature adjustment target of the polishing surface is preferentially and efficiently adjusted without complicating the structure, and the temperature of the polishing surface is partially increased as the workpiece is polished. It is possible to prevent the polishing condition from being partially deviated in relation to the change to the above.

(2) The water supply port 41 is formed in a second flow path 43b along a concentric circle (second concentric circle R2) located second from the innermost circumference of the surface plate (lower surface plate 2, upper surface plate 3). ,
When the water supply port 41 is formed in the second flow path 43b, the drain port 42 is a concentric circle (first concentric circle R1) located on the innermost periphery of the surface plate (lower surface plate 2, upper surface plate 3). ) Along the first flow path 43a.
Thereby, in addition to the effect of (1), the length of the horizontal water supply channel and drainage channel formed inside the surface plate can be shortened, and the complication of the cooling structure 40 can be further suppressed.

(3) A plurality of the water supply ports 41 are formed side by side in the extending direction of the flow path (second flow path 43b) along a predetermined concentric circle (second concentric circle R2).
Thereby, in addition to the effect of (1) or (2), the load due to the cooling water pressure can be reduced and the cooling water can flow smoothly.

(4) A plurality of the drain ports 42 are formed side by side in the extending direction of the flow path (first flow path 43a) along a predetermined concentric circle (first concentric circle R1).
Thereby, in addition to the effect of any one of (1) to (3), it is possible to further reduce the load due to the cooling water pressure and further smooth the flow of the cooling water.

(5) The platen (lower platen 2 and upper platen 3) includes a flat plate member (lower flat plate member 21, upper flat plate member 31) on which the polished surface is formed, and the flat plate member (lower flat plate member 21). A jacket member (lower jacket member 22, upper jacket member 32) that is fixed to the upper plate member 31) and has the cooling structure 40 formed thereon,
The flat plate member (lower flat plate member 21, upper flat plate member 31) and the jacket member (lower jacket member 22, upper jacket member 32) are formed of materials having different linear expansion coefficients.
As a result, in addition to any of the effects (1) to (4), the amount of deflection of the surface plate can be controlled by adjusting the temperature of the cooling water flowing through the cooling structure 40, and the distortion of the surface plate due to secular change can be eliminated. can do.

(6) The flat plate member (the lower flat plate member 21, the upper flat plate member 31) is formed of a material having a smaller linear expansion coefficient than the jacket member (the lower jacket member 22, the upper jacket member 32). did.
Thereby, in addition to the effect of (5), the thermal deformation of the flat plate member that contacts the workpiece W and directly transmits the frictional heat can be suppressed, and the deformation of the surface plate can be further prevented.

(7) The surface plate (lower surface plate 2) includes the jacket member (lower jacket member 22), and further includes a surface plate receiving member (lower surface plate receiving member 23) that supports them. It is also possible to design.
In this case, the change control unit amount can be arbitrarily set depending on the linear expansion coefficient design of the upper board receiving member (lower surface board receiving member 23). Thereby, in addition to the effect of (5), the degree of suppression of thermal deformation of the surface plate can be prepared.

  As described above, the polishing apparatus of the present invention has been described based on the first embodiment. However, the specific configuration is not limited to this embodiment, and the gist of the invention according to each claim of the claims is described. Unless it deviates, design changes and additions are allowed.

In Example 1, the drainage port 42 is formed in the 1st flow path 43a located in the innermost periphery of a surface plate, and the water supply port 41 is formed in the 2nd flow path 43b adjacent to this 1st flow path 43a. Indicated. However, the present invention is not limited to this. For example, the water supply port 41 may be formed in the first flow path 43a, and the drainage port 42 may be formed in the second flow path 43b. In this case, the cooling water filled in the first flow path 43a flows in the order of the fifth flow path 43e → the fourth flow path 43d → the third flow path 43c, and finally flows into the second flow path 43b. As described above, by reversing the water supply port 41 and the discharge port 42 without changing the cooling structure 40, it is possible to change the region where temperature adjustment is to be performed preferentially.
However, also at this time, the water supply port 41 and the drain port 42 are formed in the vicinity of the drive shaft 7a, and the length of the horizontal hole extending in the horizontal direction inside the lower surface plate receiving member 23 is shortened. Thus, the cooling structure 40 can be further suppressed from becoming complicated.

  Further, in the cooling structure 40 of the first embodiment, the cooling water is supplied from the water supply port 41 → the second flow path 43b (cooling water filling) → the third flow path 43c (counterclockwise) → the fourth flow path 43d (clockwise). → The fifth flow path 43e (counterclockwise) → the first flow path 43a (cooling water discharge) → the drain port 42 is shown as an example. However, the present invention is not limited to this. For example, the cooling structure of FIG. 6 is reversed left and right, and the flow of the cooling water is reversed (water supply port 41 → second flow path 43b (cooling water filling) → third flow path. 43c (clockwise) → fourth channel 43d (counterclockwise) → fifth channel 43e (clockwise) → first channel 43a (cooling water discharge) → drain port 42). Thereby, a water supply / drainage path can be made into a simple structure, and it can prevent that a structure becomes complicated. Moreover, since the flow path 43 is one route, the flow rate of the cooling water flowing through the flow path 43 can be improved. For this reason, the heat transfer rate by the cooling water is increased, and the temperature adjustment efficiency can be improved. Further, since the direction of the flow path can be reversed without changing the structure, it is possible to change the region where temperature adjustment is to be performed preferentially.

  Further, the water supply port 41 and the drain port 42 may be formed in the fifth flow path 43e located on the outermost periphery of the surface plate. In addition, when the water supply port 41 or the drain port 42 is formed at the outermost peripheral position of the surface plate, a horizontal hole for water supply / drainage is not formed in the lower surface plate receiving member 23 or the like, and the tube routed outside the surface plate The cooling water may be supplied and drained using

  In the first embodiment, an example in which two water supply ports 41 and two water discharge ports 42 are formed is shown, but the present invention is not limited thereto. The water supply port 41 and the drain port 42 may be one, or may be formed by an arbitrary number of two or more. Further, the number of water supply ports 41 and the number of drain ports 42 may be different. Further, the opening area of the water supply port 41 may be different from the opening area of the drainage port 42, the opening areas of the plurality of water supply ports 41 may be different from each other, or the opening areas of the plurality of drainage ports 42 may be different from each other. May be.

  The flow path 43 extends along a plurality of concentric circles (first concentric circle R1 to fifth concentric circle R5) arranged in the radial direction of the surface plate (lower surface plate 2, upper surface plate 3), and the plurality of these The concentric circles (the first concentric circle R1 to the fifth concentric circle R5) may be partitioned by the partition wall 44. For this reason, the flow path shape is not limited to that shown in the first embodiment, and is, for example, the cooling structure 40A of the first modification shown in FIG. 8 or the cooling structure 40B of the second modification shown in FIG. May be.

  That is, in the cooling structure 40A as the first modified example, the water supply port 41 and the drain port 42 are formed in the first flow path 43a located on the innermost periphery of the surface plate. Further, as the partition wall 47, a first partition wall 47a that partitions all of the first concentric circle R1 to the fifth concentric circle R5, a second partition wall 47b that partitions the first concentric circle R1 to the fourth concentric circle R4, and second and third. A third partition wall 47c that partitions the concentric circles R2 and R3 and a fourth partition wall 47d that partitions the first and second concentric circles R1 and R2 are formed.

  A first folded portion 48a that communicates the first flow path 43a and the third flow path 43c is formed between the first partition wall 47a and the fourth partition wall 47d, and the first partition wall 47c is formed along the third partition wall 47c. A second folded portion 48b that communicates the second flow path 43b and the third flow path 43c is formed, and a third folded portion 48c that communicates the first flow path 43a and the second flow path 43b along the fourth partition wall 47d. A fourth folded portion 48d that communicates the first flow path 43a and the fourth flow path 43d is formed between the second partition wall 47b and the third partition wall 47c, and is formed along the first partition wall 47a. A fifth folded portion 48e that communicates the fourth flow path 43d and the fifth flow path 43e is formed, and the first flow path 43a and the fifth flow path 43e are provided between the first partition wall 47a and the second partition wall 47b. A sixth folded portion 48f that communicates with each other is formed. At this time, the water supply port 41 is formed in the first folded portion 48a, and the drain port 42 is formed in the sixth folded portion 48f.

  Thereby, in the cooling structure 40A of the first modified example, the cooling water flowing out from the water supply port 41 is supplied from the water supply port 41 → the first return part 48a → the third flow path 43c → the second return part 48b → the second flow path. 43b → third folding part 48c → first flow path 43a → fourth folding part 48d → fourth flow path 43d → fifth folding part 48e → fifth flow path 43e → sixth folding part 48f → drain port 42 Go.

  In the cooling structure 40B as the second modified example, the water supply port 41 is formed in the first flow path 43a located on the innermost periphery of the surface plate, and the water is discharged into the fifth flow path 43e located on the outermost periphery of the surface plate. A mouth 42 is formed. Moreover, the partition wall 49 only partitions all of the first concentric circle R1 to the fifth concentric circle R5.

  And the 1st folding | returning part 50a, the 2nd folding | returning part 50b, the 3rd folding | returning part 50c, and the 4th folding | returning part 50d are alternately formed on both sides of the partition wall 49. FIG. The first and second flow paths 43a and 43b are communicated via the first folding part 50a, the second and third flow paths 43b and 43c are communicated via the second folding part 50b, and the third folding part. The third and fourth flow paths 43c and 43d are communicated via 50c, and the fourth and fifth flow paths 43d and 43e are communicated via the fourth folded portion 50d.

  Thereby, in the cooling structure 40B of the second modified example, the cooling water flowing out from the water supply port 41 is supplied from the water supply port 41 → the first flow path 43a → the first return part 50a → the second flow path 43b → the second return part. 50b → the third flow path 43c → the third return part 50c → the fourth flow path 43d → the fourth return part 50d → the fifth flow path 43e → the drain port 42.

Moreover, in Example 1, the lower flat plate member 21 of the lower surface plate 2 is formed of a low thermal expansion material having a small linear expansion coefficient, and the lower jacket member 22 is formed of stainless steel having a large linear expansion coefficient. However, the present invention is not limited to this, and when the lower flat plate member 21, the lower jacket member 22, and the like are selected from materials having a large linear expansion coefficient, for example, they may be arbitrarily selected from cast iron, aluminum, stainless steel, and the like. Further, when selecting from a material having a small linear expansion coefficient, it may be arbitrarily selected from ceramic, granite, carbon fiber reinforcing material, silicon carbide fiber reinforcing material, Invar alloy material, and the like. Further, depending on the combination, the unit strain amount can be set and controlled according to the adjustment accuracy of the cooling water temperature according to the difference in linear expansion coefficient between the lower flat plate member 21 and the lower jacket member 22. Become. That is, selection and combination may be made in consideration of deformation control characteristics, rigidity desired for the device configuration, and the like. The same applies to the upper surface plate 3.
Further, as in the example shown in the first embodiment, the lower surface plate receiving member 23 is further provided below the lower jacket member 22, and the material thereof is different from that of the lower jacket member 22. Deformation characteristics can also be formulated.

  In the first embodiment, the cooling structure is exemplified as the temperature adjustment structure. However, the present invention can be applied to a heating structure in which a heating fluid that raises the temperature of the polishing surface flows.

  Further, in the first embodiment, the double-side polishing apparatus having the lower surface plate 2 and the upper surface plate 3 and capable of simultaneously polishing both surfaces of the workpiece W is shown, but this is a single-side polishing device for polishing only one surface of the workpiece W. Also, the present invention can be applied.

  Furthermore, in the first embodiment, the number of concentric circles along which the flow path 43 extends is five. However, the number is not limited to this, and an arbitrary number of concentric circles can be set.

DESCRIPTION OF SYMBOLS 1 Polishing apparatus 2 Lower surface plate 2a Polishing pad 3 Upper surface plate 3a Polishing pad 3b Hook 4 Sun gear 5 Internal gear 6 Carrier plate 21 Lower plate member 22 Lower jacket member 23 Lower surface plate receiving member 31 Upper plate member 32 Upper Jacket member 40 Cooling structure (temperature control structure)
41 Water supply port 42 Drain port 43 Channel 43a First channel 43b Second channel 43c Third channel 43d Fourth channel 43e Fifth channel 44 Partition wall 45a First folding part 45b Second folding part 45c Third Return part 45d Fourth return part

Claims (6)

In a polishing apparatus having a surface plate on which a temperature adjusting structure through which a temperature adjusting fluid flows is formed on the back side of a polishing surface for polishing a workpiece,
The temperature control structure communicates the water supply port for supplying the temperature control fluid, the water discharge port for discharging the temperature control fluid, the water supply port and the water discharge port, and the radial direction of the surface plate. A flow path extending along a plurality of concentric circles arranged in a row, and a partition wall extending in the radial direction of the surface plate and partitioning the concentric circles,
The temperature adjusting fluid supplied from the water supply port flows in the first direction along the flow path along the first concentric circle and then folds along the partition wall to form a flow path along the second concentric circle. A polishing apparatus, wherein the polishing apparatus flows in, flows in a flow path along the second concentric circle in a direction opposite to the first direction, and is discharged from the drain port. The polishing apparatus according to claim 1, wherein
The water supply port is either a first flow path along a concentric circle located on the innermost circumference of the surface plate, or a second flow path along a concentric circle located second from the innermost circumference of the surface plate Formed into
The drain port is formed in the second flow channel when the water supply port is formed in the first flow channel, and the first flow channel is formed when the water supply port is formed in the second flow channel. A polishing apparatus characterized by being formed in a path. In the polishing apparatus according to claim 1 or 2,
The polishing apparatus according to claim 1, wherein a plurality of the water supply ports are formed side by side in the extending direction of the flow path along a predetermined concentric circle. In the polishing apparatus according to any one of claims 1 to 3,
A polishing apparatus, wherein a plurality of the drain outlets are formed side by side in a direction in which the flow path extends along a predetermined concentric circle. The polishing apparatus according to any one of claims 1 to 4, wherein
The surface plate includes a flat plate member on which the polished surface is formed, and a jacket member that is fixed to the flat plate member and on which the temperature adjustment structure is formed.
The flat plate member and the jacket member are made of materials having different linear expansion coefficients. The polishing apparatus according to claim 5, wherein
The flat plate member is formed of a material having a smaller linear expansion coefficient than the jacket member.