JPH11170162A - Surface polishing surface plate - Google Patents

Surface polishing surface plate

Info

Publication number
JPH11170162A
JPH11170162A JP36266697A JP36266697A JPH11170162A JP H11170162 A JPH11170162 A JP H11170162A JP 36266697 A JP36266697 A JP 36266697A JP 36266697 A JP36266697 A JP 36266697A JP H11170162 A JPH11170162 A JP H11170162A
Authority
JP
Japan
Prior art keywords
surface plate
circumferential grooves
cooling
refrigerant
cooling passages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP36266697A
Other languages
Japanese (ja)
Inventor
Shiro Furusawa
澤 四 郎 古
Yoshihiro Nakajo
條 吉 広 中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Priority to JP36266697A priority Critical patent/JPH11170162A/en
Publication of JPH11170162A publication Critical patent/JPH11170162A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily form a plurality of cooling passages having an equal passage length by concentrically forming a plurality of coolant passing circumferential grooves differed in size whose circumferences are partially discontinued around the center of a surface plate, and mutually connecting the inner and outer circumferential grooves by a proper number by communicating holes. SOLUTION: A plurality of coolant passing circumferential grooves 11-16 differed in size whose circumferences are partially discontinued are formed on the upper surface of a base concentrically around the central axial line L of a surface plate 1 at equal intervals, and a plurality of circumferential grooves situated on the inner and outer sides are mutually connected in series by communicating holes 17, 18, whereby a plurality of cooling passages 4, 5, 6 having an equal passage length are formed. Since a refrigerant is carried from the outer side of the surface plate 1 to the inner side in each cooling passage 4, 5, 6, the outer circumferential side can be locally cooled with high efficiency even if the temperature tends to become higher on the outer circumferential side according to the polishing of a work.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体ウエハや磁
気ディスク基板のようなワークの表面を研磨するための
定盤に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface plate for polishing a surface of a work such as a semiconductor wafer or a magnetic disk substrate.

【0002】[0002]

【従来の技術】ラッピング装置やポリッシング装置の等
の平面研磨装置においては、一般に、ワークを回転する
定盤に押し付けて研磨加工するとき、該定盤とワークと
の摩擦によってそれらの界面で発熱し、その熱によって
定盤が熱変形して研磨精度が低下するという問題があ
る。そこで、定盤の内部に冷却室を形成し、この冷却室
内に冷却水を流して定盤を冷却するようにしているが、
定盤の回転により冷却水の流れが乱されたり、定盤の外
周側に昇温した冷却水が滞留し易いため、均一な冷却が
行われにくく、十分な効果を得るには至っていない。
2. Description of the Related Art In a planar polishing apparatus such as a lapping apparatus or a polishing apparatus, when a work is pressed against a rotating platen and polished, heat is generated at an interface between the platen and the work due to friction between the platen and the work. In addition, there is a problem that the surface plate is thermally deformed by the heat and the polishing accuracy is reduced. Therefore, a cooling chamber is formed inside the surface plate, and cooling water is allowed to flow through the cooling room to cool the surface plate.
Since the flow of the cooling water is disturbed by the rotation of the surface plate, or the heated cooling water easily stays on the outer peripheral side of the surface plate, uniform cooling is hardly performed, and a sufficient effect has not been obtained.

【0003】このような問題を解決するため、例えば特
開平6−39704号公報には、定盤の内部に渦巻状を
した流路長の等しい2本の冷媒流路を形成し、一方の流
路には定盤の内側から外側に向かって冷媒を流し、他方
の流路には定盤の外側から内側に向かって冷媒を流すよ
うにしたものが開示されている。
In order to solve such a problem, for example, Japanese Unexamined Patent Publication No. Hei 6-39704 discloses a method in which two spiral refrigerant flow paths having the same flow path length are formed inside a surface plate. Disclosed is a configuration in which a refrigerant flows from the inside to the outside of the surface plate in the path, and the refrigerant flows from the outside to the inside of the surface plate in the other flow path.

【0004】この改良形の定盤によれば、流路長の等し
い2本の冷媒流路によって定盤全体に冷媒をほぼ均等に
流すことができるため、冷却効果も勝れているが、定盤
に渦巻状の溝を形成するのは非常に難しい加工技術であ
って、複数本の溝を定盤の内側から外側まで連続的且つ
均等に形成するとなると更に難しい加工技術を必要とす
る。
According to the improved platen, since the refrigerant can be almost uniformly flowed through the entire platen by the two refrigerant passages having the same flow path length, the cooling effect is also excellent. It is a very difficult processing technique to form a spiral groove on the board, and a more difficult processing technique is required if a plurality of grooves are continuously and uniformly formed from the inside to the outside of the platen.

【0005】また、加工中に定盤全体が均一に発熱する
とは限らず、摩耗により変化する定盤の表面形状や、内
外周におけるワークとの摺接長差などによって発熱温度
が局部的に異なることが多く、特に、定盤の外周側の温
度が高くなり易い。従って、定盤全体にわたって温度の
均一化を図るには、局部的な温度の微調整が必要になる
が、上記公報に記載された従来の定盤は、渦巻状の冷媒
流路を定盤の内周端から外周端まで一続きに形成すると
共に、2本の冷媒流路に内側と外側から逆向きに冷媒を
流すようにしているため、定盤の温度を局部的に微調整
することは困難である。
Further, the entire surface plate does not always generate heat evenly during processing, and the heat generation temperature varies locally due to the surface shape of the surface plate which changes due to wear, the difference in sliding contact between the inner and outer circumferences with the work, and the like. In many cases, particularly, the temperature on the outer peripheral side of the platen tends to increase. Therefore, in order to make the temperature uniform over the entire surface plate, local fine temperature adjustment is necessary.However, the conventional surface plate described in the above publication has a spiral refrigerant flow path formed by the surface plate. Since the refrigerant is formed continuously from the inner peripheral end to the outer peripheral end and the refrigerant flows in the two refrigerant flow paths in the opposite directions from the inside and the outside, it is not possible to locally finely adjust the temperature of the surface plate. Have difficulty.

【0006】[0006]

【発明が解決しようとする課題】本発明の主たる技術的
課題は、渦巻状の溝を形成することなく、複数の円周状
の溝によって流路長の等しい複数の冷却流路を簡単に構
成することができる、加工及び製造が容易で冷却効果に
勝れた定盤を提供することにある。
The main technical problem of the present invention is that a plurality of cooling channels having the same channel length can be simply formed by a plurality of circumferential grooves without forming a spiral groove. An object of the present invention is to provide a surface plate that can be easily processed and manufactured and has an excellent cooling effect.

【0007】本発明の他の技術的課題は、上述した定盤
において、局部的な温度の微調整を行うことができるよ
うにすることにある。
Another technical object of the present invention is to make it possible to perform local fine adjustment of temperature on the above-mentioned surface plate.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
本発明の定盤は、円周の一部が不連続となった複数の大
きさが異なる冷媒流通用の円周溝を定盤中心の回りに同
心円状に形成し、内外適数ずつの円周溝を連通孔で相互
に接続することにより、流路長の等しい複数の冷却流路
を形成したことを特徴とするものである。
In order to solve the above-mentioned problems, a surface plate according to the present invention comprises a plurality of circumferential grooves, each part of which is discontinuous, for circulation of refrigerant having different sizes. , And a plurality of cooling channels having the same channel length are formed by connecting a suitable number of inner and outer circumferential grooves to each other through communication holes.

【0009】このような本発明によれば、同心円状に位
置する複数の円周溝を適数ずつ相互に接続するだけで、
流路長の等しい複数の冷却流路を形成することができ
る。このため、渦巻状をした複数の溝を定盤の内周端か
ら外周端まで連続的に形成した従来品に比べ、定盤の加
工及び製造が容易である。また、上記複数の冷却流路に
よって定盤全体に冷媒を均等に流すことができるため、
冷却効果に勝れる。
According to the present invention, a plurality of concentric circumferential grooves are connected to each other by an appropriate number,
A plurality of cooling channels having the same channel length can be formed. For this reason, the surface plate is easier to process and manufacture than a conventional product in which a plurality of spiral grooves are continuously formed from the inner peripheral end to the outer peripheral end of the surface plate. In addition, since the plurality of cooling channels allow the refrigerant to flow evenly over the entire surface plate,
Superior cooling effect.

【0010】本発明の1つの具体例では、上記円周溝が
等間隔で偶数本形成され、定盤の外周側及び内周側から
数えて同じ順位に位置する円周溝同士が互いに接続され
ている。
In one embodiment of the present invention, an even number of the circumferential grooves are formed at regular intervals, and the circumferential grooves located at the same order counted from the outer peripheral side and the inner peripheral side of the platen are connected to each other. ing.

【0011】本発明の好ましい具体的な実施態様におい
ては、各冷却流路の相互に接続された内外の円周溝の不
連続部が放射方向の同じ位置にあって、放射方向に延び
る連通孔により相互に接続されると共に、複数の冷却流
路におけるこれらの不連続部及び連通孔が放射状に等角
度で配設される。
In a preferred specific embodiment of the present invention, the discontinuous portions of the mutually connected inner and outer circumferential grooves of the respective cooling passages are located at the same position in the radial direction, and the communication holes extend in the radial direction. And the discontinuous portions and the communication holes in the plurality of cooling channels are radially arranged at an equal angle.

【0012】本発明においては、上記複数の冷却流路を
共通の冷媒供給流路に接続しても、異なる冷媒供給流路
に接続しても良い。
In the present invention, the plurality of cooling passages may be connected to a common coolant supply passage or different coolant supply passages.

【0013】本発明の好ましい具体的な構成態様によれ
ば、各冷却流路における互いに接続された内外の円周溝
のうち、外側に位置する円周溝を冷媒供給流路に接続す
ることにより、定盤の外周側から内周側に向けて冷媒が
流れるように構成される。これにより、温度が高くなり
易い定盤の外周側を効率良く冷却することができて、定
盤全体を均一な温度にすることができる。
According to a preferred specific configuration of the present invention, the outer circumferential groove among the inner and outer circumferential grooves connected to each other in each cooling flow path is connected to the refrigerant supply flow path. The refrigerant is configured to flow from the outer peripheral side to the inner peripheral side of the platen. This makes it possible to efficiently cool the outer peripheral side of the surface plate, where the temperature is likely to increase, and to make the entire surface plate a uniform temperature.

【0014】本発明においては、定盤が上記冷却流路を
少なくとも3つ備えていることが望ましい。
In the present invention, it is preferable that the surface plate has at least three cooling channels.

【0015】[0015]

【発明の実施の形態】図1及び図2は本発明に係る定盤
の一実施例を示すもので、この定盤1は、ワークに直接
又はパッド等を介して摺接する定盤本体2をベース3の
上面に取り付けたものである。
1 and 2 show an embodiment of a surface plate according to the present invention. The surface plate 1 comprises a surface plate main body 2 which slides on a work directly or via a pad or the like. It is attached to the upper surface of the base 3.

【0016】上記ベース3の上面には、円周の一部が不
連続となった複数の大きさが異なる冷媒流通用の円周溝
11〜16が、定盤1の中心軸線Lの回りに同心円状に
等間隔で形成され、内外に位置する複数の円周溝が連通
孔17,18,19で互いに直列に接続されることによ
り、流路長の等しい複数の冷却流路4,5,6が形成さ
れている。更に具体的に説明すると、断面積の等しい第
1〜第6の6つの円周溝11,12,13,14,1
5,16が上記ベース3に形成されていて、定盤1の外
周側及び内周側から数えて同じ順位に位置する円周溝同
士、即ち、最外側に位置する第1円周溝11と最内側に
位置する第6円周溝16、外から2番目に位置する第2
円周溝12と内から2番目に位置する第5円周溝15、
外から3番目に位置する第3円周溝13と内から3番目
に位置する第4円周溝14がそれぞれ、上記連通孔1
7,18,19で接続されることにより、流路長の等し
い3つの冷却流路4,5,6が形成されている。
On the upper surface of the base 3, a plurality of circumferential grooves 11 to 16 of different sizes, each part of which is discontinuous, are formed around the central axis L of the surface plate 1. A plurality of circumferential grooves formed concentrically at equal intervals and located inside and outside are connected to each other in series by communication holes 17, 18, 19, so that a plurality of cooling passages 4, 5 having the same passage length are provided. 6 are formed. More specifically, six first to sixth circumferential grooves 11, 12, 13, 14, 1 having the same cross-sectional area are provided.
5 and 16 are formed in the base 3, and the circumferential grooves located in the same order counted from the outer circumferential side and the inner circumferential side of the surface plate 1, that is, the first circumferential groove 11 positioned on the outermost side and The sixth inner circumferential groove 16 located on the innermost side, and the second circumferential groove 16 located on the innermost side.
A circumferential groove 12 and a fifth circumferential groove 15 located second from the inside,
The third circumferential groove 13 located third from the outside and the fourth circumferential groove 14 located third from the inside are each formed with the communication hole 1.
The three cooling passages 4, 5, and 6 having the same passage length are formed by being connected by 7, 18, and 19.

【0017】上記各冷却流路4,5,6を構成する内外
2つの円周溝11と16、12と15、13と14は、
それらの不連続部20が放射方向の同じ位置にあるよう
に形成されていて、該不連続部20の左右同じ側に位置
する溝端部11aと16a、12aと15a、13aと
14aが、ベース3の内部に実質的に放射方向に穿設さ
れた上記連通孔17,18,19で相互に接続されてい
る。そして、3つの冷却流路4,5,6における各円周
溝の不連続部20及び連通孔17,18,19は、12
0度ずつの等角度を保って放射状に配置されている。上
記連通孔17,18,19は、ベース3の周側面から穿
設されていて、外側の不要な部分をプラグ部材25で閉
塞することにより構成されている。
The two inner and outer circumferential grooves 11 and 16, 12 and 15, 13 and 14 constituting the cooling channels 4, 5 and 6 are
The discontinuous portions 20 are formed so as to be at the same position in the radial direction, and the groove ends 11a and 16a, 12a and 15a, 13a and 14a located on the same left and right sides of the discontinuous portion 20 Are connected to each other by the communication holes 17, 18, and 19, which are formed substantially radially in the inside of the. The discontinuous portions 20 and the communication holes 17, 18, 19 of the respective circumferential grooves in the three cooling passages 4, 5, 6 are 12
They are arranged radially at equal angles of 0 degrees each. The communication holes 17, 18, and 19 are formed from the peripheral side surface of the base 3, and are configured by closing unnecessary portions on the outside with a plug member 25.

【0018】上記各冷却流路4,5,6においては、外
側に位置する第1円周溝11、第2円周溝12、第3円
周溝13の他方の溝端部にそれぞれ冷媒の入口21が形
成され、内側に位置する第6円周溝16、第5円周溝1
5、第4円周溝14の端部にそれぞれ冷媒の出口22が
形成されていて、これらの各入口21が、水やガスなど
の冷媒の供給源に通じる共通の冷媒供給流路23に接続
されると共に、各出口22が共通の冷媒排出流路24に
接続されることにより、各冷却流路4,5,6を定盤1
の外側から内側に向かって冷媒が流れるようになってい
る。
In each of the cooling passages 4, 5, and 6, a refrigerant inlet is provided at the other end of each of the first, second, and third circumferential grooves 11, 12, and 13 located outside. 21 are formed, and the sixth circumferential groove 16 and the fifth circumferential groove 1 located on the inside are formed.
5. An outlet 22 for the refrigerant is formed at each end of the fourth circumferential groove 14, and each of the inlets 21 is connected to a common refrigerant supply passage 23 which leads to a supply source of the refrigerant such as water or gas. At the same time, the outlets 22 are connected to the common refrigerant discharge passage 24 so that the cooling passages 4, 5, 6
The refrigerant flows from the outside toward the inside.

【0019】上記構成を有する定盤1は、同心円状に位
置する複数の円周溝11,12,13,14,15,1
6を適数ずつ相互に接続するだけで、流路長の等しい複
数の冷却流路4,5,6を形成することができるため、
渦巻状をした複数の溝を定盤の内周端から外周端まで連
続的に形成した従来品に比べ、該定盤の加工及び製造が
非常に容易である。
The surface plate 1 having the above-described structure is composed of a plurality of circumferential grooves 11, 12, 13, 14, 15, 1 positioned concentrically.
Since a plurality of cooling passages 4, 5, and 6 having the same passage length can be formed only by connecting a suitable number of them to each other,
Processing and manufacturing of the platen are very easy as compared with a conventional product in which a plurality of spiral grooves are continuously formed from the inner peripheral end to the outer peripheral end of the platen.

【0020】また、流路長の等しい複数の冷却流路4,
5,6によって定盤全体に冷媒を均等に流すことができ
るため、冷却効果に勝れる。特に、各冷却流路4,5,
6中を定盤1の外側から内側に向かって冷媒を流すよう
にしているため、ワークの研磨に伴って定盤1の温度が
上昇し、ワークとの摺接長差等によって外周側ほど温度
上昇が大きくなる傾向を示しても、外周側を局部的に効
率良く冷却することができる。しかも、定盤1を冷却す
ることにより熱を吸収して最も温度が上昇する最外周の
第1円周溝11内の冷媒を、最も温度上昇の少ない最内
周の第6円周溝16に導き、上記第1円周溝11より温
度上昇の少ない第2円周溝12内の冷媒を、上記第6円
周溝16より温度上昇の大きい第5円周溝15に導き、
上記第2円周溝12より温度上昇の少ない第3円周溝1
3内の冷媒を、上記第5円周溝15より温度上昇の大き
い第4円周溝14に導くことにより、定盤全体の温度を
簡単且つ効率良く均一化することができる。
Further, a plurality of cooling passages 4 having the same passage length,
Since the refrigerant can be uniformly flowed through the entire surface plate by the steps 5 and 6, the cooling effect can be improved. In particular, each cooling channel 4, 5,
6, the temperature of the platen 1 rises as the work is polished, and the temperature of the platen 1 increases toward the outer peripheral side due to a difference in sliding contact with the work. Even if the rise tends to increase, the outer peripheral side can be locally and efficiently cooled. In addition, the coolant in the outermost first circumferential groove 11, which absorbs heat by cooling the surface plate 1 and has the highest temperature, is transferred to the innermost sixth circumferential groove 16, which has the lowest temperature rise. Guiding the refrigerant in the second circumferential groove 12 whose temperature rise is smaller than that of the first circumferential groove 11 to the fifth circumferential groove 15 whose temperature rise is larger than that of the sixth circumferential groove 16,
Third circumferential groove 1 having a lower temperature rise than second circumferential groove 12
By guiding the refrigerant in 3 to the fourth circumferential groove 14 whose temperature rise is larger than that of the fifth circumferential groove 15, the temperature of the entire surface plate can be simply and efficiently uniformized.

【0021】上記実施例では、各冷却流路4,5,6を
共通の冷媒供給流路23に接続して同じ種類及び同じ温
度の冷媒を供給するようにしているが、何れか1つ又は
2つの冷却流路を他とは異なる冷媒供給流路に接続して
も良く、これにより、水とガスといったように異なる種
類の冷媒を供給したり、同種又は異種で異なる温度ある
いは異なる流速の冷媒を供給することができる。そして
このように、冷却流路4,5,6に異なる温度や異なる
流速の冷媒を供給することにより、これらの各冷却流路
4,5,6における冷媒入口21が定盤1の半径方向の
異なる位置に設けられていることと相俟って、該定盤の
温度の局部的な微調整を、共通の冷媒を供給する場合よ
りも一層簡単且つ確実に行うことができる。
In the above embodiment, the cooling channels 4, 5, and 6 are connected to the common refrigerant supply channel 23 so that the same type and the same temperature of the refrigerant are supplied. The two cooling passages may be connected to different refrigerant supply passages to supply different types of refrigerants such as water and gas, or to supply the same or different refrigerants having different temperatures or different flow rates. Can be supplied. By supplying the coolants having different temperatures and different flow rates to the cooling passages 4, 5, and 6, the coolant inlets 21 in the cooling passages 4, 5, and 6 are arranged in the radial direction of the platen 1 in the radial direction. Combined with being provided at different positions, local fine adjustment of the temperature of the platen can be performed more easily and more reliably than when a common refrigerant is supplied.

【0022】また、上記冷却流路4,5,6は、図示し
た実施例のように3つである必要はなく、2つであって
も、4つ以上であっても良く、それらは定盤の大きさや
円周溝の断面積等によって決められる。
The number of the cooling channels 4, 5, 6 does not need to be three as in the illustrated embodiment, but may be two or four or more. It is determined by the size of the board and the cross-sectional area of the circumferential groove.

【0023】更に、図示した実施例では、各冷却流路
4,5,6における内外2つの円周溝を接続するに当
り、不連続部20の左右同じ側に位置する溝端部同士を
相互に接続することにより、内外の円周溝で冷媒が逆向
きに流れるようにしているが、不連続部20の左右反対
側に位置する溝端部同士を接続しても良く、これによ
り、内外の円周溝における冷媒の流れの方向を同じにす
ることができる。
Further, in the illustrated embodiment, in connecting the two inner and outer circumferential grooves in each of the cooling flow paths 4, 5, 6, the groove ends located on the same left and right sides of the discontinuous portion 20 are mutually connected. The connection allows the refrigerant to flow in the inner and outer circumferential grooves in the opposite directions. However, the groove ends located on the left and right opposite sides of the discontinuous portion 20 may be connected to each other, thereby forming the inner and outer circles. The direction of the flow of the refrigerant in the circumferential groove can be made the same.

【0024】[0024]

【発明の効果】このように本発明によれば、渦巻状の溝
を形成することなく、同心円状の複数の円周溝を形成し
て内外の円周溝を接続することにより、流路長の等しい
複数の冷却流路を簡単に構成することができ、このため
定盤の加工及び製造が容易で、冷却効果にも勝れる。ま
た、各冷却流路に異なる温度又は流速の冷媒を供給する
ことにより、定盤の温度を局部的に微調整することがで
きる。
As described above, according to the present invention, a plurality of concentric circumferential grooves are formed and inner and outer circumferential grooves are connected to each other without forming spiral grooves. A plurality of cooling passages having the same diameter can be easily formed, so that the working and manufacturing of the surface plate are easy, and the cooling effect is superior. In addition, by supplying a coolant having a different temperature or flow rate to each cooling channel, the temperature of the platen can be locally finely adjusted.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る定盤の一実施例を示す断面図であ
る。
FIG. 1 is a sectional view showing an embodiment of a surface plate according to the present invention.

【図2】図1におけるA−A線での断面図である。FIG. 2 is a sectional view taken along line AA in FIG.

【符号の説明】[Explanation of symbols]

1 定盤 4,5,6 冷
却流路 11,12,13,14,15,16 円周溝 17,18,19 連通孔 20 不連続部 23 冷媒供給流路
DESCRIPTION OF SYMBOLS 1 Surface plate 4,5,6 Cooling flow path 11,12,13,14,15,16 Circumferential groove 17,18,19 Communication hole 20 Discontinuous part 23 Refrigerant supply flow path

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】円周の一部が不連続となった複数の大きさ
が異なる冷媒流通用の円周溝を定盤中心の回りに同心円
状に形成し、内外適数ずつの円周溝を連通孔で相互に接
続することにより、流路長の等しい複数の冷却流路を形
成したことを特徴とする平面研磨用定盤。
1. A plurality of circumferential grooves, each having a discontinuous part of the circumference, for flowing refrigerant having different sizes are formed concentrically around the center of the platen, and a suitable number of circumferential grooves are formed inside and outside the plate. Characterized in that a plurality of cooling passages having the same passage length are formed by connecting the plurality of cooling passages with each other through communication holes.
【請求項2】円周の一部が不連続となった偶数本の大き
さが異なる冷媒流通用の円周溝を、定盤中心の回りに同
心円状に等間隔で形成し、定盤の外周側及び内周側から
数えて同じ順位に位置する円周溝同士を連通孔で相互に
接続することにより、流路長の等しい複数の冷却流路を
形成したことを特徴とする平面研磨用定盤。
2. An even number of circumferential grooves, each part of which has a discontinuous circumference, for refrigerant flow, are formed concentrically at equal intervals around the center of the platen. A plurality of cooling passages having the same passage length are formed by connecting the circumferential grooves located at the same order from the outer peripheral side and the inner peripheral side with communication holes, thereby forming a plurality of cooling passages having the same passage length. Surface plate.
【請求項3】請求項1又は2に記載の定盤において、1
つの冷却流路を形成する内外の円周溝の不連続部が放射
方向の同じ位置にあって、実質的に放射方向に延びる上
記連通孔により相互に接続されると共に、複数の冷却流
路におけるこれらの不連続部及び連通孔が放射状に等角
度で配設されていることを特徴とするもの。
3. The platen according to claim 1, wherein 1
The discontinuous portions of the inner and outer circumferential grooves forming the two cooling passages are located at the same position in the radial direction, are connected to each other by the communication holes extending substantially in the radial direction, and have a plurality of cooling passages. The discontinuous portion and the communication hole are radially arranged at an equal angle.
【請求項4】請求項1ないし3の何れかに記載の定盤に
おいて、上記複数の冷却流路が互いに共通の冷媒供給流
路に接続されていることを特徴とするもの。
4. The surface plate according to claim 1, wherein said plurality of cooling channels are connected to a common coolant supply channel.
【請求項5】請求項1ないし3の何れかに記載の定盤に
おいて、上記複数の冷却流路のうちの少なくとも1つが
他とは異なる冷媒供給流路に接続されていることを特徴
とするもの。
5. The surface plate according to claim 1, wherein at least one of the plurality of cooling channels is connected to a coolant supply channel different from the others. thing.
【請求項6】請求項4又は5に記載の定盤において、各
冷却流路における互いに接続された内外の円周溝のうち
外側に位置する円周溝が冷媒供給流路に接続されること
により、定盤の外周側から内周側に向けて冷媒が流れる
ように構成されていることを特徴とするもの。
6. The surface plate according to claim 4, wherein an outer one of the inner and outer circumferential grooves connected to each other in each cooling flow path is connected to the refrigerant supply flow path. Thus, the refrigerant is configured to flow from the outer peripheral side to the inner peripheral side of the surface plate.
【請求項7】請求項1ないし6の何れかに記載の定盤に
おいて、少なくとも3つの冷却流路を有することを特徴
とするもの。
7. The platen according to claim 1, wherein the platen has at least three cooling passages.
JP36266697A 1997-12-12 1997-12-12 Surface polishing surface plate Withdrawn JPH11170162A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36266697A JPH11170162A (en) 1997-12-12 1997-12-12 Surface polishing surface plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36266697A JPH11170162A (en) 1997-12-12 1997-12-12 Surface polishing surface plate

Publications (1)

Publication Number Publication Date
JPH11170162A true JPH11170162A (en) 1999-06-29

Family

ID=18477444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36266697A Withdrawn JPH11170162A (en) 1997-12-12 1997-12-12 Surface polishing surface plate

Country Status (1)

Country Link
JP (1) JPH11170162A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100722935B1 (en) 2005-12-14 2007-05-30 삼성전자주식회사 Apparatus for treating substrates
JP2011524264A (en) * 2008-06-16 2011-09-01 ノベラス・システムズ・インコーポレーテッド Chemical mechanical polishing with slurry delivery to multiple zones
KR101296388B1 (en) * 2011-12-26 2013-08-22 일진디스플레이(주) Device for processing wafer
CN109015343A (en) * 2017-06-08 2018-12-18 创技股份有限公司 Grinding device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100722935B1 (en) 2005-12-14 2007-05-30 삼성전자주식회사 Apparatus for treating substrates
JP2011524264A (en) * 2008-06-16 2011-09-01 ノベラス・システムズ・インコーポレーテッド Chemical mechanical polishing with slurry delivery to multiple zones
KR101296388B1 (en) * 2011-12-26 2013-08-22 일진디스플레이(주) Device for processing wafer
CN109015343A (en) * 2017-06-08 2018-12-18 创技股份有限公司 Grinding device
CN109015343B (en) * 2017-06-08 2021-09-10 创技股份有限公司 Grinding device

Similar Documents

Publication Publication Date Title
JP5119297B2 (en) Substrate processing equipment
US6499533B2 (en) Cooling disk unit for use in a wafer chucking device
US6544111B1 (en) Polishing apparatus and polishing table therefor
JP2019537267A (en) Design of a two-zone flow cooling plate with concentric or spiral channels for efficient gas distribution assembly cooling
JP7221737B2 (en) Wafer placement device
CN205465663U (en) Chemical mechanical grinding device
JPH11170162A (en) Surface polishing surface plate
CN107134877B (en) Motor and electric automobile
JP2010141081A (en) Wafer processor
JP3727049B2 (en) Wafer chuck cooling or heating plate and wafer chuck
CN218658139U (en) Wafer grinding workbench and wafer grinding device
US20050018376A1 (en) Electrostatic chuck for wafer
CN115101444B (en) Bearing device and semiconductor process equipment
CN216362124U (en) Wafer chuck cooling device
CN212991070U (en) Electrostatic chuck and semiconductor device
JPH11262862A (en) Double side polishing device and slurry supply method
JP3201833B2 (en) Processing surface plate for polishing
JP3235970B2 (en) Rotary platen temperature holding structure
JP2006032701A (en) Temperature adjustment stage
US11493197B2 (en) Light source unit and light irradiation device
JP5128816B2 (en) Vestibule assembly for heat treatment furnace
JP2020129443A (en) Induction heating coil and method of manufacturing the same
JP7217202B2 (en) Temperature controller and polisher
CN212527291U (en) Water-cooled fixed disc of single-side polishing machine
US9960059B2 (en) Honeycomb heaters for integrated circuit manufacturing

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20050301