CN216362124U - Wafer chuck cooling device - Google Patents
Wafer chuck cooling device Download PDFInfo
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- CN216362124U CN216362124U CN202122617695.6U CN202122617695U CN216362124U CN 216362124 U CN216362124 U CN 216362124U CN 202122617695 U CN202122617695 U CN 202122617695U CN 216362124 U CN216362124 U CN 216362124U
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- wafer chuck
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Abstract
The utility model discloses a wafer chuck cooling device which comprises a water cooling disc, wherein the water cooling disc comprises a bottom plate, a hollow cover plate is integrally welded on the bottom plate, a snake-shaped flow channel is arranged in the water cooling disc, the width of the flow channel of the snake-shaped flow channel is gradually reduced along the radial direction of the bottom plate, the snake-shaped flow channel is connected with an external water inlet pipeline and an external water outlet pipeline through a water inlet and a water outlet on the cover plate so as to be used for cooling water to circulate, and the wafer chuck on the water cooling disc is cooled by the cooling water. The wafer chuck cooling device is used for realizing uniform heat dissipation of a high-temperature region and a low-temperature region of a wafer chuck and is beneficial to reducing thermal stress.
Description
Technical Field
The present invention relates to apparatus particularly adapted for processing wafers during the manufacture or processing of semiconductor or electrical solid state devices or components, and more particularly to a wafer chuck cooling apparatus.
Background
The processing procedure of the wafer is complicated and precise, and generally includes: many of the processes such as photolithography, etching, diffusion, ion implantation, and thin film belong to high temperature processes, and after a wafer is subjected to a high temperature process, the wafer generally needs to be rapidly cooled to room temperature or a wafer material temperature required by the process, and then a subsequent process can be performed.
Utility model patent with publication number CN202205717U discloses a wafer cooling device for cool off the wafer, wafer cooling device includes: a support; the flow equalizing plate is fixed on the support and is positioned above the wafer; and the gas injection element is fixed on the bracket and is positioned above the uniform flow plate. When the device is used, firstly, the gas supply unit is started, so that gas is blown out through the gas blowing element; then, the gas is blown to the surface of the wafer through the uniform flow plate, so that the surface of the wafer can be rapidly cooled. The method has the defects of high requirement on compressed air of plant service, need of continuously providing high-pressure air source, high energy consumption and high use cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a wafer chuck cooling device which can realize uniform heat dissipation of high and low temperature regions of a wafer chuck and is beneficial to reducing thermal stress.
In order to solve the technical problem, the application provides the following technical scheme:
the utility model discloses a wafer chuck cooling device which comprises a water cooling disc, wherein the water cooling disc comprises a bottom plate, a hollow cover plate is integrally welded on the bottom plate, a snake-shaped flow channel is arranged in the water cooling disc, the width of the flow channel of the snake-shaped flow channel is gradually reduced along the radial direction of the bottom plate, the snake-shaped flow channel is connected with an external water inlet pipeline and an external water outlet pipeline through a water inlet and a water outlet on the cover plate so as to be used for cooling water to circulate, and the wafer chuck on the water cooling disc is cooled by the cooling water.
The utility model relates to a wafer chuck cooling device, wherein a snakelike flow channel comprises an annular flow channel, a water outlet middle flow channel, a water inlet middle flow channel and an edge flow channel which are coaxial with a bottom plate and are sequentially arranged outwards along the radial direction of the bottom plate at equal intervals, the water inlet middle flow channel is communicated with a water inlet, the edge flow channel is communicated with a water outlet, and cooling water enters the annular flow channel and then flows out in a reversing way.
According to the wafer chuck cooling device, the inlet end of the annular flow channel and the water outlet end of the water inlet middle flow channel, the water outlet end of the water outlet middle flow channel and the water inlet end of the edge flow channel and the water inlet middle flow channel are communicated through the linear flow channels, and the adjacent linear flow channels are arranged in parallel at equal intervals.
The utility model relates to a wafer chuck cooling device, wherein a wafer chuck is connected above a cover plate through a first positioning pin and a second positioning pin.
The utility model relates to a wafer chuck cooling device, wherein a first pin hole and a second pin hole are formed in a cover plate, a third pin hole, a fourth pin hole and a blind hole which are matched with the first pin hole and the second pin hole are correspondingly formed in a bottom plate and a wafer chuck, and a first positioning pin and a second positioning pin are matched with the first pin hole, the second pin hole, the third pin hole, the fourth pin hole and the blind hole to position the wafer chuck on a water-cooling disk.
The utility model relates to a wafer chuck cooling device, wherein a first supporting fixing block and a second supporting fixing block are connected to the lower part of a cover plate through a bolt connecting assembly, a sleeve joint for connecting a water inlet pipeline and a water outlet pipeline system is respectively installed at a water inlet and a water outlet through sleeve joint holes, and the second supporting fixing block is located below the sleeve joint holes.
The utility model relates to a wafer chuck cooling device, wherein a bolt connecting assembly comprises a first supporting column, a second supporting column, a first fixing bolt and a second fixing bolt, wherein the first fixing bolt and the second fixing bolt are matched with the first supporting column and the second supporting column, the first fixing bolt is arranged at the edge of a cover plate in a penetrating mode, a second fixing bolt coaxial with the first fixing bolt is arranged in the middle of the first supporting fixing block and at the two ends of the second supporting fixing block in a penetrating mode, and a pair of the first fixing bolt and the second fixing bolt which are coaxial is coaxially connected in the first supporting column or the second supporting column in a threaded mode.
The utility model relates to a wafer chuck cooling device, wherein a plurality of first screw holes are formed in the circumferential direction of a cover plate at intervals, first fixing bolts penetrate into the first screw holes, and second fixing bolts are arranged in a reverse direction to the first fixing bolts.
The utility model relates to a wafer chuck cooling device, wherein a first support column and a second support column are supported between a cover plate and a first support fixing block and a second support fixing block.
The utility model relates to a wafer chuck cooling device, wherein a water cooling disc is made of aluminum alloy, and a wafer chuck is made of titanium alloy.
Compared with the prior art, the wafer chuck cooling device has the following beneficial effects:
1. the width of the annular flow passage in the central area of the water cooling disc is larger by a formula delta Q1=CWρWqWΔTWdt shows that the flow of cooling water flowing through the central area in unit time is increased, the absorbed heat is increased, and the rapid cooling of the central high-temperature area is facilitated.
In the above formula:
Cw-the specific heat capacity of the cooling water in the cooling channel;
ρw-cooling water density in the cooling channel;
qw-cooling water flow in the cooling channel;
Ap-the area of the cooling channel in contact with the cooling water;
Twand (4) a temperature change value (temperature change amount per unit time in practical situation) of the cooling water body in the cooling flow channel.
2. The water inlet middle flow passage is positioned between the water outlet middle flow passage and the edge flow passage, cooling water enters through the water inlet, flows into the water inlet middle flow passage firstly, then flows into the central annular flow passage, and finally flows into the edge flow passage and then flows out through the water outlet, therefore, the cooling water absorbs heat conducted by the wafer chuck when flowing in the water inlet middle flow passage, the temperature rises, when flowing into the annular flow passage, the temperature of the annular area of the wafer chuck is moderate, the temperature is between the high temperature of the central area and the low temperature of the edge area, the temperature difference of the contact part of the annular area and the cooling water is moderate, the cooling speed is stable, and the stress generation caused by overlarge temperature difference is avoided. Similarly, in the edge area, the temperature of the cooling water in the edge runner reaches the highest, the edge cooling effect is reduced, and the cooling rate is reduced, so that the temperature difference change of the contact part of the cooling water passing through the edge runner and the wafer chuck is gentle, the stress change caused by rapid cooling is avoided, and the integral cooling rate of the wafer chuck is relatively stable.
In a word, the snakelike cooling flow channel of this application makes heat exchange abundant between cooling water and the wafer chuck, and the cooling rate of the concentric circles region of each different temperature is unanimous relatively along the radial outside of bottom plate, and the whole cooling rate of wafer chuck is mild, has realized the even heat dissipation of wafer chuck high-low temperature district, is favorable to reducing the production of thermal stress.
The following describes a wafer chuck cooling device according to the present invention with reference to the accompanying drawings.
Drawings
FIG. 1 is an assembly view of a wafer chuck cooling device and a wafer chuck according to the present invention;
FIG. 2 is a schematic structural diagram of a wafer chuck cooling device according to the present invention;
FIG. 3 is a bottom view of a wafer chuck cooling device according to the present invention;
FIG. 4 is a side view of a wafer chuck cooling device according to the present invention;
FIG. 5 is a partial cross-sectional view of a wafer chuck cooling device of the present invention (two right-angled arrows indicate cooling water flow);
FIG. 6a is a cross-sectional view taken along line A-A of FIG. 5;
FIG. 6b is an enlarged view of a portion of FIG. 6a at C;
FIG. 7a is a cross-sectional view taken along line B-B of FIG. 5;
FIG. 7b is an enlarged view of a portion of FIG. 7a at D;
FIG. 8 is an exploded view of a wafer chuck cooling device and wafer chuck assembly in accordance with the present invention.
Detailed Description
As shown in fig. 1, the cooling device for the wafer chuck of the present invention includes a water-cooled plate 1, and a wafer chuck 2 is placed on the water-cooled plate 1 with a cooling water channel for cooling and buffering. In this embodiment, the water-cooling disc 1 is made of aluminum alloy, and the aluminum alloy has high thermal conductivity and avoids metal pollution. The wafer chuck 2 is made of titanium alloy and comprises an inner disc 21 and an outer disc 22.
As shown in fig. 2 to 5, the water cooling disc 1 of the present application includes a bottom plate 11, the bottom plate 11 is a flat plate, a cover plate 12 is integrally welded on the bottom plate 11, the cover plate 12 is a hollow shell with a downward opening, and the cover plate 12 and the bottom plate 11 are welded at an edge portion to form an enclosure. The water-cooling disc 1 is internally provided with a snake-shaped flow passage 16 for cooling water to flow, the snake-shaped flow passage 16 is formed by one-time processing of a milling cutter on the cover plate 12, and the cooling water cools the wafer chuck 2 on the water-cooling disc 1. As shown in fig. 4 and 8, one side of the cover plate 12 is provided with a water inlet 18 and a water outlet 19, which are adjacent to each other, and the water inlet 18 and the water outlet 19 are respectively provided with a ferrule adapter 8 for connecting a water inlet pipeline and a water outlet pipeline system through a ferrule adapter hole 111, so that the cooling device can be conveniently and rapidly connected into a cooling system pipeline. Radially outward along the bottom plate 11, the serpentine channel 16 sequentially includes an annular channel 163, an outlet intermediate channel 164, an inlet intermediate channel 165, and an edge channel 166, and the annular channel 163, the outlet intermediate channel 164, the inlet intermediate channel 165, and the edge channel 166 are all arranged on the bottom plate 11 coaxially with the bottom plate 11 and at equal intervals. The annular flow passage 163 is located at the center of the bottom plate 11, and the edge flow passage 166 is located at the outermost circle. In comparison, the annular flow passage 163 has the widest flow passage width, the outlet middle flow passage 164 has the second widest flow passage width, and the inlet middle flow passage 165 and the edge flow passage 166 have the narrowest flow passage width. The water inlet end of the water inlet middle flow passage 165 is communicated with the water inlet 18 through the straight flow passage 167, the water outlet end of the water inlet middle flow passage is communicated with the water inlet end of the annular flow passage 163 through the straight flow passage 167, the water outlet end of the annular flow passage 163 is communicated with the water inlet end of the water outlet middle flow passage 164, the water outlet end of the water outlet middle flow passage 164 is communicated with the water inlet end of the edge flow passage 166 through the straight flow passage 167, the water outlet end of the edge flow passage 166 is communicated with the water outlet 19, the adjacent straight flow passages 167 are arranged in parallel and at equal intervals, cooling water enters the water inlet middle flow passage 165 from the water inlet 18 and then enters the annular flow passage 163 to be reversed, the cooling water sequentially flows through the water outlet middle flow passage 164 and the edge flow passage 166 and finally flows out from the water outlet 19, and smooth flowing of the cooling water is guaranteed.
As shown in fig. 5, 7a and 8, the wafer chuck 2 is connected to the top of the cover plate 12 by a first positioning pin 3 and a second positioning pin 4. The center of a circle of the cover plate 12 is provided with a first pin hole 121, one side of the first pin hole 121 is provided with a second pin hole 122, the bottom plate 11 is provided with a third pin hole 112 and a fourth pin hole 113 corresponding to the first pin hole 121 and the second pin hole 122 respectively, the bottom of the wafer chuck 2 is provided with blind holes corresponding to the first pin hole 121 and the second pin hole 122, the first positioning pin 3 is inserted into the first pin hole 121 and the third pin hole 112, and the end of the first positioning pin enters the blind hole at the center of a circle of the wafer chuck 2, so that the water-cooling disc 1 and the wafer chuck 2 are coaxial and the wafer chuck 2 is positioned. Meanwhile, the second positioning pin 4 is inserted into the second pin hole 122 and the fourth pin hole 113, and the end of the second positioning pin enters into another blind hole in the wafer chuck 2, so that the wafer chuck 2 is prevented from rotating relative to the water-cooled disc 1, and the positioning of the wafer chuck 2 is further realized.
As shown in fig. 2 to 8, a first supporting fixing block 9 and a second supporting fixing block 10 are connected to the lower side of the cover plate 12 through a bolt connection assembly, and the second supporting fixing block 10 is located below the ferrule connector hole 111. Specifically, the bolt connection assembly includes a first support column 5, a second support column 6, and a first fixing bolt 7 and a second fixing bolt 71 adapted to the first support column and the second support column. Four screw holes (123) are arranged at intervals in the circumferential direction of the cover plate 12, 4 screw holes (123) are internally provided with a first fixing bolt (7), the middle parts of two first support fixing blocks (9) are provided with a second fixing bolt (71), two ends of one second support fixing block (10) are respectively provided with a second fixing bolt (71), the second fixing bolts (71) and the first fixing bolts (7) are coaxially and reversely arranged, so that four groups of coaxial first fixing bolts (7) and second fixing bolts (71) are arranged corresponding to the 4 screw holes (123), a first support column (5) and a second support column (6) are supported and connected between the cover plate 12 and the first support fixing block (9) and the second support fixing block (10) below the cover plate, two ends of the first support column (5) and the top end of the second support column (6) are provided with boss parts (51), and the bottom of the cover plate (12), the top of the first support fixing block (9) and the top of the second support fixing block (10) are provided with recessed parts (52) matched with the boss parts (51), the two ends of the first supporting column 5 are embedded into the concave portions 52, the top end of the second supporting column 6 is also embedded into the corresponding concave portions 52 on the cover plate 12, threads matched with the first fixing bolt 7 and the second fixing bolt 71 are arranged on the inner walls of the first supporting column 5 and the second supporting column 6, the end portions of the first fixing bolt 7 and the second fixing bolt 71 coaxially extend into the first supporting column 5 or the second supporting column 6 and are coaxially and threadedly connected with the first supporting column 5 or the second supporting column 6, therefore, the first supporting fixing block 9 is connected with the cover plate 12 through the first supporting column 5, the two ends of the second supporting fixing block 10 are respectively connected with the cover plate 12 through the first supporting column 5 and the second supporting column 6, finally, for the first four screw holes 123, the first supporting fixing block 10 is jointly installed at the first screw holes 123 close to the ferrule connector hole 111, and the first supporting fixing blocks 9 are installed at the first screw holes 123. The number of the first screw holes 123 can be adjusted as required, and the number of the first fixing bolts 7, the second fixing bolts 71, the first supporting and fixing blocks 9 and the second supporting and fixing blocks 10 can be adaptively adjusted along with the number of the first screw holes 123, which is not listed here.
The cooling water flow channel adopts the serpentine flow channel 16, the flow channel is formed by one-time processing through a milling machine, and the annular flow channel 163, the water outlet middle flow channel 164, the water inlet middle flow channel 165 and the edge flow channel 166 have different flow channel widths, so that different cooling rates are provided for different temperature areas in the radial direction of the wafer chuck, the whole wafer chuck 2 is slowly and uniformly cooled, different cooling rates are not formed due to different temperatures of different areas, and the problems of stress deformation and the like caused by nonuniform cooling of the wafer chuck 2 are effectively solved.
The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solution of the present invention by those skilled in the art should fall within the protection scope defined by the claims of the present invention without departing from the spirit of the present invention.
Claims (10)
1. The utility model provides a wafer chuck cooling device, includes water-cooling disc (1), water-cooling disc (1) includes bottom plate (11), and hollow apron (12) of integrative welding on bottom plate (11), its characterized in that, water-cooling disc (1) inside is provided with snakelike runner (16), radially outwards along bottom plate (11), the runner width of snakelike runner (16) reduces gradually, snakelike runner (16) are connected with outside inlet channel, outlet pipe way through water inlet (18), delivery port (19) on apron (12) and circulate with the cooling water, the cooling water is to being located wafer chuck (2) on water-cooling disc (1) cools off.
2. The wafer chuck cooling device according to claim 1, wherein the serpentine flow channel (16) comprises an annular flow channel (163), an outlet intermediate flow channel (164), an inlet intermediate flow channel (165) and an edge flow channel (166) which are coaxial with the bottom plate (11) and are sequentially arranged along the bottom plate (11) radially outwards at equal intervals, the inlet intermediate flow channel (165) is communicated with the water inlet (18), the edge flow channel (166) is communicated with the water outlet (19), and the cooling water enters the annular flow channel (163) and then flows out in a reversing manner.
3. A wafer chuck cooling device according to claim 2, wherein the inlet end of the annular flow passage (163) and the outlet end of the water inlet intermediate flow passage (165), the outlet end of the water outlet intermediate flow passage (164) and the inlet end of the edge flow passage (166), and the inlet intermediate flow passage (165) and the water inlet (18) are communicated through straight flow passages (167), and the adjacent straight flow passages (167) are arranged in parallel and at equal intervals.
4. A wafer chuck cooling device according to any one of claims 1-3, characterized in that the wafer chuck (2) is connected above the cover plate (12) by a first positioning pin (3) and a second positioning pin (4).
5. The wafer chuck cooling device according to claim 4, wherein the cover plate (12) is provided with a first pin hole (121) and a second pin hole (122), the base plate (11) and the wafer chuck (2) are correspondingly provided with a third pin hole (112), a fourth pin hole (113) and a blind hole, which are matched with the first pin hole (121) and the second pin hole (122), and the first positioning pin (3) and the second positioning pin (4) are matched with the first pin hole (121), the second pin hole (122), the third pin hole (112), the fourth pin hole (113) and the blind hole to position the wafer chuck (2) on the water-cooling disk (1).
6. A wafer chuck cooling device according to claim 5, characterized in that a first supporting fixing block (9) and a second supporting fixing block (10) are connected below the cover plate (12) through bolt connection assemblies, the water inlet (18) and the water outlet (19) are respectively provided with a ferrule connector (8) for connecting the water inlet pipeline and the water outlet pipeline system through a ferrule connector hole (111), and the second supporting fixing block (10) is located below the ferrule connector hole (111).
7. The wafer chuck cooling device according to claim 6, wherein the bolt connection assembly comprises a first support column (5), a second support column (6), and a first fixing bolt (7) and a second fixing bolt (71) which are matched with the first support column and the second support column, the first fixing bolt (7) is arranged at the edge of the cover plate (12), the second fixing bolt (71) which is coaxial with the first fixing bolt (7) is arranged in the middle of the first support fixing block (9) and at the two ends of the second support fixing block (10) in a penetrating manner, and the first fixing bolt (7) and the second fixing bolt (71) are coaxially connected in the first support column (5) or the second support column (6) in a threaded manner.
8. A wafer chuck cooling device according to claim 7, wherein said cover plate (12) is provided with a plurality of first screw holes (123) at intervals in the circumferential direction, said first fixing bolts (7) penetrate into said first screw holes (123), and said second fixing bolts (71) are arranged opposite to said first fixing bolts (7).
9. The wafer chuck cooling device according to claim 8, wherein the first support column (5) and the second support column (6) are supported between the cover plate (12) and the first support fixing block (9) and the second support fixing block (10).
10. A wafer chuck cooling device according to claim 9, characterized in that the water-cooled plate (1) is made of aluminum alloy and the wafer chuck (2) is made of titanium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122617695.6U CN216362124U (en) | 2021-10-29 | 2021-10-29 | Wafer chuck cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122617695.6U CN216362124U (en) | 2021-10-29 | 2021-10-29 | Wafer chuck cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216362124U true CN216362124U (en) | 2022-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122617695.6U Active CN216362124U (en) | 2021-10-29 | 2021-10-29 | Wafer chuck cooling device |
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| CN (1) | CN216362124U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115579715A (en) * | 2022-11-18 | 2023-01-06 | 中国航天三江集团有限公司 | Optical element, cooling device and method, cooling flow channel structure and manufacturing method thereof |
-
2021
- 2021-10-29 CN CN202122617695.6U patent/CN216362124U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115579715A (en) * | 2022-11-18 | 2023-01-06 | 中国航天三江集团有限公司 | Optical element, cooling device and method, cooling flow channel structure and manufacturing method thereof |
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