JP2018198275A5 - - Google Patents

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Publication number
JP2018198275A5
JP2018198275A5 JP2017102816A JP2017102816A JP2018198275A5 JP 2018198275 A5 JP2018198275 A5 JP 2018198275A5 JP 2017102816 A JP2017102816 A JP 2017102816A JP 2017102816 A JP2017102816 A JP 2017102816A JP 2018198275 A5 JP2018198275 A5 JP 2018198275A5
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JP
Japan
Prior art keywords
view
coil
showing
manufacturing process
sectional
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Pending
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JP2017102816A
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English (en)
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JP2018198275A (ja
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Priority to JP2017102816A priority Critical patent/JP2018198275A/ja
Priority claimed from JP2017102816A external-priority patent/JP2018198275A/ja
Priority to US15/988,034 priority patent/US20180342342A1/en
Publication of JP2018198275A publication Critical patent/JP2018198275A/ja
Publication of JP2018198275A5 publication Critical patent/JP2018198275A5/ja
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本発明の一実施形態に係るコイル内蔵基板の側断面図 （Ａ）図１のＡ−Ａの切断面における第１の導体層の平断面図，（Ｂ）図１のＢ−Ｂの切断面における第２の導体層の平断面図 コイル内蔵基板の製造工程を示す側断面図 コイル内蔵基板の製造工程を示す側断面図 コイル内蔵基板の製造工程を示す側断面図 コイル内蔵基板の製造工程を示す側断面図 第２実施形態におけるコイル内蔵基板の側断面図
JP2017102816A 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法 Pending JP2018198275A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017102816A JP2018198275A (ja) 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法
US15/988,034 US20180342342A1 (en) 2017-05-24 2018-05-24 Coil built-in substrate and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017102816A JP2018198275A (ja) 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2018198275A JP2018198275A (ja) 2018-12-13
JP2018198275A5 true JP2018198275A5 (ja) 2019-03-22

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ID=64401123

Family Applications (1)

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JP2017102816A Pending JP2018198275A (ja) 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法

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US (1) US20180342342A1 (ja)
JP (1) JP2018198275A (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI655884B (zh) * 2017-09-15 2019-04-01 欣興電子股份有限公司 載板結構
KR102029582B1 (ko) * 2018-04-19 2019-10-08 삼성전기주식회사 코일부품 및 그 제조방법
JP7302276B2 (ja) * 2019-05-15 2023-07-04 株式会社デンソー インダクタ
KR102662853B1 (ko) * 2019-09-30 2024-05-03 삼성전기주식회사 인쇄회로기판
KR20210050741A (ko) * 2019-10-29 2021-05-10 삼성전기주식회사 인쇄회로기판
JP2021097129A (ja) * 2019-12-17 2021-06-24 イビデン株式会社 インダクタ内蔵基板
KR20220068712A (ko) * 2020-11-19 2022-05-26 삼성전기주식회사 인쇄회로기판

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10139707A1 (de) * 2001-08-11 2003-02-20 Philips Corp Intellectual Pty Leiterplatte
CN100517526C (zh) * 2002-10-31 2009-07-22 松下电器产业株式会社 电感部件和使用它的电子装置
JP2006032587A (ja) * 2004-07-15 2006-02-02 Matsushita Electric Ind Co Ltd インダクタンス部品およびその製造方法
TWI305479B (en) * 2006-02-13 2009-01-11 Advanced Semiconductor Eng Method of fabricating substrate with embedded component therein
CN103229605B (zh) * 2011-07-25 2016-06-08 日本特殊陶业株式会社 布线基板
US9101072B2 (en) * 2011-10-31 2015-08-04 Tripod Technology Corporation Method of embedding magnetic component in substrate
JP2014154813A (ja) * 2013-02-13 2014-08-25 Ibiden Co Ltd プリント配線板
JP2014232837A (ja) * 2013-05-30 2014-12-11 イビデン株式会社 配線板

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