JP2018195810A5 - - Google Patents

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Publication number
JP2018195810A5
JP2018195810A5 JP2018088537A JP2018088537A JP2018195810A5 JP 2018195810 A5 JP2018195810 A5 JP 2018195810A5 JP 2018088537 A JP2018088537 A JP 2018088537A JP 2018088537 A JP2018088537 A JP 2018088537A JP 2018195810 A5 JP2018195810 A5 JP 2018195810A5
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JP
Japan
Prior art keywords
substrate
chamber
processing region
gas
period
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JP2018088537A
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English (en)
Japanese (ja)
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JP7211716B2 (ja
JP2018195810A (ja
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Priority claimed from US15/594,118 external-priority patent/US10903065B2/en
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Publication of JP2018195810A5 publication Critical patent/JP2018195810A5/ja
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JP2018088537A 2017-05-12 2018-05-02 ハロゲン除去モジュールならびに関連のシステムおよび方法 Active JP7211716B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/594,118 US10903065B2 (en) 2017-05-12 2017-05-12 Halogen removal module and associated systems and methods
US15/594,118 2017-05-12

Publications (3)

Publication Number Publication Date
JP2018195810A JP2018195810A (ja) 2018-12-06
JP2018195810A5 true JP2018195810A5 (https=) 2022-09-21
JP7211716B2 JP7211716B2 (ja) 2023-01-24

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ID=64097356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018088537A Active JP7211716B2 (ja) 2017-05-12 2018-05-02 ハロゲン除去モジュールならびに関連のシステムおよび方法

Country Status (4)

Country Link
US (1) US10903065B2 (https=)
JP (1) JP7211716B2 (https=)
KR (1) KR102521160B1 (https=)
CN (1) CN108878313B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2019361520B2 (en) 2018-10-17 2025-04-24 Nippon Chemiphar Co., Ltd. Novel pharmaceutical composition
US10777445B2 (en) * 2018-12-06 2020-09-15 Asm Ip Holding B.V. Substrate processing apparatus and substrate transfer method
FR3092436B1 (fr) * 2019-02-04 2021-02-12 Aloxtec Four d’oxydation latérale de VCSEL avec modification locale de la vitesse d’oxydation
JP7355615B2 (ja) * 2019-11-25 2023-10-03 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
GB202015527D0 (en) * 2020-09-30 2020-11-11 Lam Res Ag Apparatus for processing wafer-shaped articles
WO2022192460A1 (en) * 2021-03-11 2022-09-15 Applied Materials, Inc. Systems and methods for fabrication of micro-led displays
US11921422B2 (en) * 2021-04-09 2024-03-05 Applied Materials, Inc. Single-volume baking chamber for mask clean

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855024A (en) * 1971-11-01 1974-12-17 Western Electric Co Method of vapor-phase polishing a surface of a semiconductor
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
JP3247270B2 (ja) * 1994-08-25 2002-01-15 東京エレクトロン株式会社 処理装置及びドライクリーニング方法
WO1997011482A2 (en) * 1995-09-05 1997-03-27 Lsi Logic Corporation Removal of halogens and photoresist from wafers
JP4518986B2 (ja) * 2005-03-17 2010-08-04 東京エレクトロン株式会社 大気搬送室、被処理体の処理後搬送方法、プログラム及び記憶媒体
JP2007243014A (ja) * 2006-03-10 2007-09-20 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置
US7846845B2 (en) * 2006-10-26 2010-12-07 Applied Materials, Inc. Integrated method for removal of halogen residues from etched substrates in a processing system
JP4979079B2 (ja) * 2007-07-09 2012-07-18 東京エレクトロン株式会社 基板処理装置
US8616821B2 (en) * 2010-08-26 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated apparatus to assure wafer quality and manufacturability
WO2012117943A1 (ja) * 2011-02-28 2012-09-07 東京エレクトロン株式会社 被処理基板処理用ハロゲン除去装置、被処理基板処理装置、および被処理基板処理方法
JP6767257B2 (ja) * 2016-12-22 2020-10-14 東京エレクトロン株式会社 基板処理装置及び基板処理方法

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