CN108878313B - 卤素去除模块及相关系统和方法 - Google Patents

卤素去除模块及相关系统和方法 Download PDF

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Publication number
CN108878313B
CN108878313B CN201810425448.6A CN201810425448A CN108878313B CN 108878313 B CN108878313 B CN 108878313B CN 201810425448 A CN201810425448 A CN 201810425448A CN 108878313 B CN108878313 B CN 108878313B
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China
Prior art keywords
substrate
gas
time
period
halogen
Prior art date
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CN201810425448.6A
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Chinese (zh)
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CN108878313A (zh
Inventor
特拉维斯·R·泰勒
亚当·贝特曼
托德·A·洛佩斯
尚卡拉纳拉亚南·拉维
西尔维亚·阿吉拉尔
德里克·威特科维基
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CN201810425448.6A 2017-05-12 2018-05-07 卤素去除模块及相关系统和方法 Active CN108878313B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/594,118 US10903065B2 (en) 2017-05-12 2017-05-12 Halogen removal module and associated systems and methods
US15/594,118 2017-05-12

Publications (2)

Publication Number Publication Date
CN108878313A CN108878313A (zh) 2018-11-23
CN108878313B true CN108878313B (zh) 2023-10-27

Family

ID=64097356

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810425448.6A Active CN108878313B (zh) 2017-05-12 2018-05-07 卤素去除模块及相关系统和方法

Country Status (4)

Country Link
US (1) US10903065B2 (https=)
JP (1) JP7211716B2 (https=)
KR (1) KR102521160B1 (https=)
CN (1) CN108878313B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2019361520B2 (en) 2018-10-17 2025-04-24 Nippon Chemiphar Co., Ltd. Novel pharmaceutical composition
US10777445B2 (en) * 2018-12-06 2020-09-15 Asm Ip Holding B.V. Substrate processing apparatus and substrate transfer method
FR3092436B1 (fr) * 2019-02-04 2021-02-12 Aloxtec Four d’oxydation latérale de VCSEL avec modification locale de la vitesse d’oxydation
JP7355615B2 (ja) * 2019-11-25 2023-10-03 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
GB202015527D0 (en) * 2020-09-30 2020-11-11 Lam Res Ag Apparatus for processing wafer-shaped articles
WO2022192460A1 (en) * 2021-03-11 2022-09-15 Applied Materials, Inc. Systems and methods for fabrication of micro-led displays
US11921422B2 (en) * 2021-04-09 2024-03-05 Applied Materials, Inc. Single-volume baking chamber for mask clean

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855024A (en) * 1971-11-01 1974-12-17 Western Electric Co Method of vapor-phase polishing a surface of a semiconductor
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
JPH08115886A (ja) * 1994-08-25 1996-05-07 Tokyo Electron Ltd 処理装置及びドライクリーニング方法
WO1997011482A2 (en) * 1995-09-05 1997-03-27 Lsi Logic Corporation Removal of halogens and photoresist from wafers
JP2007243014A (ja) * 2006-03-10 2007-09-20 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置
WO2012117943A1 (ja) * 2011-02-28 2012-09-07 東京エレクトロン株式会社 被処理基板処理用ハロゲン除去装置、被処理基板処理装置、および被処理基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4518986B2 (ja) * 2005-03-17 2010-08-04 東京エレクトロン株式会社 大気搬送室、被処理体の処理後搬送方法、プログラム及び記憶媒体
US7846845B2 (en) * 2006-10-26 2010-12-07 Applied Materials, Inc. Integrated method for removal of halogen residues from etched substrates in a processing system
JP4979079B2 (ja) * 2007-07-09 2012-07-18 東京エレクトロン株式会社 基板処理装置
US8616821B2 (en) * 2010-08-26 2013-12-31 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated apparatus to assure wafer quality and manufacturability
JP6767257B2 (ja) * 2016-12-22 2020-10-14 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3855024A (en) * 1971-11-01 1974-12-17 Western Electric Co Method of vapor-phase polishing a surface of a semiconductor
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
JPH08115886A (ja) * 1994-08-25 1996-05-07 Tokyo Electron Ltd 処理装置及びドライクリーニング方法
WO1997011482A2 (en) * 1995-09-05 1997-03-27 Lsi Logic Corporation Removal of halogens and photoresist from wafers
JP2007243014A (ja) * 2006-03-10 2007-09-20 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置
WO2012117943A1 (ja) * 2011-02-28 2012-09-07 東京エレクトロン株式会社 被処理基板処理用ハロゲン除去装置、被処理基板処理装置、および被処理基板処理方法

Also Published As

Publication number Publication date
KR20180124726A (ko) 2018-11-21
JP7211716B2 (ja) 2023-01-24
CN108878313A (zh) 2018-11-23
KR102521160B1 (ko) 2023-04-12
US10903065B2 (en) 2021-01-26
JP2018195810A (ja) 2018-12-06
US20180330942A1 (en) 2018-11-15

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