JP2018190978A5 - - Google Patents
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- Publication number
- JP2018190978A5 JP2018190978A5 JP2018087886A JP2018087886A JP2018190978A5 JP 2018190978 A5 JP2018190978 A5 JP 2018190978A5 JP 2018087886 A JP2018087886 A JP 2018087886A JP 2018087886 A JP2018087886 A JP 2018087886A JP 2018190978 A5 JP2018190978 A5 JP 2018190978A5
- Authority
- JP
- Japan
- Prior art keywords
- power distribution
- processing chamber
- semi
- recursive
- circular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- -1 polytetrafluoroethylene Polymers 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762500120P | 2017-05-02 | 2017-05-02 | |
| US62/500,120 | 2017-05-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018190978A JP2018190978A (ja) | 2018-11-29 |
| JP2018190978A5 true JP2018190978A5 (enExample) | 2021-05-20 |
Family
ID=64015476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018087886A Pending JP2018190978A (ja) | 2017-05-02 | 2018-04-29 | 対称的な給電構造を有する補助電極を用いてプラズマ処理チャンバ内のウェハエッジシースを変調する方法および受動的な方法で動作するとき制御可能なインピーダンスを接地し、能動的に電力を供給するときプラズマへの対称ｒｆ電力入力を可能とするドライブ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20180323042A1 (enExample) |
| JP (1) | JP2018190978A (enExample) |
| KR (1) | KR20180122295A (enExample) |
| CN (2) | CN209266350U (enExample) |
| TW (1) | TW201907439A (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| WO2016060712A1 (en) | 2014-10-17 | 2016-04-21 | Applied Materials, Inc. | Cmp pad construction with composite material properties using additive manufacturing processes |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| JP6960390B2 (ja) * | 2018-12-14 | 2021-11-05 | 東京エレクトロン株式会社 | 給電構造及びプラズマ処理装置 |
| WO2020146034A1 (en) * | 2019-01-08 | 2020-07-16 | Applied Materials, Inc. | Recursive coils for inductively coupled plasmas |
| CN114743854B (zh) | 2019-05-14 | 2025-02-25 | 玛特森技术公司 | 末端执行器和用于处理工件的系统 |
| KR102848754B1 (ko) * | 2019-07-29 | 2025-08-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 고온 척킹을 갖는 반도체 기판 지지부들 |
| JP2021103641A (ja) * | 2019-12-25 | 2021-07-15 | 東京エレクトロン株式会社 | プラズマ発生源の検査方法及び負荷 |
| JP7454961B2 (ja) * | 2020-03-05 | 2024-03-25 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7344821B2 (ja) * | 2020-03-17 | 2023-09-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| CN112331607B (zh) * | 2020-10-28 | 2024-03-26 | 北京北方华创微电子装备有限公司 | 静电卡盘及半导体工艺设备 |
| JP7544450B2 (ja) * | 2021-03-17 | 2024-09-03 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7557429B2 (ja) * | 2021-05-27 | 2024-09-27 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR102932754B1 (ko) * | 2021-12-24 | 2026-03-04 | 삼성전자주식회사 | 에지 링 어셈블리를 포함하는 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
| WO2025164456A1 (ja) * | 2024-02-02 | 2025-08-07 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US12463075B2 (en) * | 2024-02-23 | 2025-11-04 | Applied Materials, Inc. | Cathode assembly for integration of embedded electrostatic chuck (ESC) |
| US20250299929A1 (en) * | 2024-03-25 | 2025-09-25 | Applied Materials, Inc. | Substrate support assembly having an edge voltage delivery system |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5822171A (en) * | 1994-02-22 | 1998-10-13 | Applied Materials, Inc. | Electrostatic chuck with improved erosion resistance |
| US5633073A (en) * | 1995-07-14 | 1997-05-27 | Applied Materials, Inc. | Ceramic susceptor with embedded metal electrode and eutectic connection |
| KR100796830B1 (ko) * | 2000-04-12 | 2008-01-22 | 아익스트론 아게 | 기판코팅방법 수행용 반응실 |
| US7311784B2 (en) * | 2002-11-26 | 2007-12-25 | Tokyo Electron Limited | Plasma processing device |
| US7572737B1 (en) * | 2006-06-30 | 2009-08-11 | Lam Research Corporation | Apparatus and methods for adjusting an edge ring potential substrate processing |
| US9536711B2 (en) * | 2007-03-30 | 2017-01-03 | Lam Research Corporation | Method and apparatus for DC voltage control on RF-powered electrode |
| US8691047B2 (en) * | 2009-11-17 | 2014-04-08 | Applied Materials, Inc. | Large area plasma processing chamber with at-electrode RF matching |
| US9443753B2 (en) * | 2010-07-30 | 2016-09-13 | Applied Materials, Inc. | Apparatus for controlling the flow of a gas in a process chamber |
| KR101202957B1 (ko) * | 2010-10-19 | 2012-11-20 | 주성엔지니어링(주) | 플라즈마 발생용 안테나 및 이를 포함하는 기판처리장치 |
| US9412579B2 (en) * | 2012-04-26 | 2016-08-09 | Applied Materials, Inc. | Methods and apparatus for controlling substrate uniformity |
| US10580623B2 (en) * | 2013-11-19 | 2020-03-03 | Applied Materials, Inc. | Plasma processing using multiple radio frequency power feeds for improved uniformity |
-
2018
- 2018-04-19 US US15/957,054 patent/US20180323042A1/en not_active Abandoned
- 2018-04-29 JP JP2018087886A patent/JP2018190978A/ja active Pending
- 2018-05-02 CN CN201820642742.8U patent/CN209266350U/zh not_active Expired - Fee Related
- 2018-05-02 TW TW107114804A patent/TW201907439A/zh unknown
- 2018-05-02 CN CN201810410921.3A patent/CN108807125A/zh active Pending
- 2018-05-02 KR KR1020180050689A patent/KR20180122295A/ko not_active Ceased
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