JP2018178237A5 - - Google Patents
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- Publication number
- JP2018178237A5 JP2018178237A5 JP2017084770A JP2017084770A JP2018178237A5 JP 2018178237 A5 JP2018178237 A5 JP 2018178237A5 JP 2017084770 A JP2017084770 A JP 2017084770A JP 2017084770 A JP2017084770 A JP 2017084770A JP 2018178237 A5 JP2018178237 A5 JP 2018178237A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive substrate
- plating
- conductive
- underlayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims 10
- 239000010410 layer Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 239000000463 material Substances 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 229910000929 Ru alloy Inorganic materials 0.000 claims 3
- 239000005092 Ruthenium Substances 0.000 claims 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 3
- 229910052707 ruthenium Inorganic materials 0.000 claims 3
- 229910007637 SnAg Inorganic materials 0.000 claims 2
- 229910008336 SnCo Inorganic materials 0.000 claims 2
- 229910008431 SnCu Inorganic materials 0.000 claims 2
- 229910006414 SnNi Inorganic materials 0.000 claims 2
- 229910007162 SnPd Inorganic materials 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017084770A JP6649915B2 (ja) | 2017-04-21 | 2017-04-21 | ルテニウムを含む積層めっき被覆材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017084770A JP6649915B2 (ja) | 2017-04-21 | 2017-04-21 | ルテニウムを含む積層めっき被覆材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018178237A JP2018178237A (ja) | 2018-11-15 |
| JP2018178237A5 true JP2018178237A5 (ru) | 2020-01-23 |
| JP6649915B2 JP6649915B2 (ja) | 2020-02-19 |
Family
ID=64282945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017084770A Active JP6649915B2 (ja) | 2017-04-21 | 2017-04-21 | ルテニウムを含む積層めっき被覆材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6649915B2 (ru) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102075469B1 (ko) | 2019-06-21 | 2020-02-10 | 사이먼앤코(주) | 커넥터 및 이의 제조방법 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628533A (ja) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | 金めつきされた電子部品パツケ−ジ |
| JP3213857B2 (ja) * | 1993-01-29 | 2001-10-02 | ぺんてる株式会社 | 貴金属めっきの製造方法 |
| JP3216341B2 (ja) * | 1993-06-29 | 2001-10-09 | ぺんてる株式会社 | 貴金属めっきの製造方法 |
| JPH10233121A (ja) * | 1997-02-18 | 1998-09-02 | Hitachi Cable Ltd | リードワイヤ |
| JP4000727B2 (ja) * | 1999-11-25 | 2007-10-31 | 松下電工株式会社 | 燃料電池用電極 |
| JP3802335B2 (ja) * | 2000-11-24 | 2006-07-26 | 株式会社村上開明堂 | 複合素子およびその製造方法 |
| JP3458843B2 (ja) * | 2001-02-20 | 2003-10-20 | 大阪府 | Ｎｉ−Ｗ−Ｐ合金の連続めっき方法 |
| US20020185716A1 (en) * | 2001-05-11 | 2002-12-12 | Abys Joseph Anthony | Metal article coated with multilayer finish inhibiting whisker growth |
| CN101096769A (zh) * | 2006-06-26 | 2008-01-02 | 比亚迪股份有限公司 | 一种电镀方法 |
| JP5854574B2 (ja) * | 2008-03-12 | 2016-02-09 | 古河電気工業株式会社 | 電気接点部品用金属材料 |
| JP2015045058A (ja) * | 2013-08-27 | 2015-03-12 | Jx日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品 |
| CN105018908A (zh) * | 2015-03-23 | 2015-11-04 | 深圳市贝加电子材料有限公司 | 用于线路板表面处理的化学镀钌溶液和线路板表面处理方法 |
| KR102186145B1 (ko) * | 2015-09-17 | 2020-12-03 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
| CN106048680B (zh) * | 2016-07-22 | 2018-05-22 | 东莞普瑞得五金塑胶制品有限公司 | 一种手机快充接口通电耐腐蚀的专用镀层 |
-
2017
- 2017-04-21 JP JP2017084770A patent/JP6649915B2/ja active Active
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