JP2018157196A5 - - Google Patents

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Publication number
JP2018157196A5
JP2018157196A5 JP2018013532A JP2018013532A JP2018157196A5 JP 2018157196 A5 JP2018157196 A5 JP 2018157196A5 JP 2018013532 A JP2018013532 A JP 2018013532A JP 2018013532 A JP2018013532 A JP 2018013532A JP 2018157196 A5 JP2018157196 A5 JP 2018157196A5
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JP
Japan
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width
gas
degrees
curved
injection channel
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JP2018013532A
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English (en)
Japanese (ja)
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JP7094113B2 (ja
JP2018157196A (ja
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Publication of JP2018157196A5 publication Critical patent/JP2018157196A5/ja
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JP2018013532A 2017-02-06 2018-01-30 改良型の半角ノズル Active JP7094113B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022099299A JP7407867B2 (ja) 2017-02-06 2022-06-21 改良型の半角ノズル

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762455282P 2017-02-06 2017-02-06
US62/455,282 2017-02-06

Related Child Applications (1)

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JP2022099299A Division JP7407867B2 (ja) 2017-02-06 2022-06-21 改良型の半角ノズル

Publications (3)

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JP2018157196A JP2018157196A (ja) 2018-10-04
JP2018157196A5 true JP2018157196A5 (https=) 2021-03-04
JP7094113B2 JP7094113B2 (ja) 2022-07-01

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JP2018013532A Active JP7094113B2 (ja) 2017-02-06 2018-01-30 改良型の半角ノズル
JP2022099299A Active JP7407867B2 (ja) 2017-02-06 2022-06-21 改良型の半角ノズル

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JP2022099299A Active JP7407867B2 (ja) 2017-02-06 2022-06-21 改良型の半角ノズル

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US (3) US10752991B2 (https=)
JP (2) JP7094113B2 (https=)
KR (2) KR102555394B1 (https=)
CN (2) CN108400102B (https=)
TW (3) TWI702672B (https=)

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US11486038B2 (en) 2019-01-30 2022-11-01 Applied Materials, Inc. Asymmetric injection for better wafer uniformity
US11032945B2 (en) * 2019-07-12 2021-06-08 Applied Materials, Inc. Heat shield assembly for an epitaxy chamber
TWI861210B (zh) 2019-09-09 2024-11-11 美商應用材料股份有限公司 輸送反應氣體之處理系統與方法
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TW202235675A (zh) 2020-11-30 2022-09-16 荷蘭商Asm Ip私人控股有限公司 注入器、及基板處理設備
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CN116646231A (zh) * 2023-06-06 2023-08-25 北京屹唐半导体科技股份有限公司 反应腔室及氧化设备
US20250087506A1 (en) * 2023-09-08 2025-03-13 Applied Materials, Inc. Targeted gas delivery via side gas injection
CN119050005A (zh) * 2024-08-08 2024-11-29 江苏天芯微半导体设备有限公司 一种衬套组件及具有该衬套组件的半导体外延设备

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